ChipFind - документация

Электронный компонент: MSM6404A

Скачать:  PDF   ZIP
1/25
MSM6404A/6404VS
Semiconductor
GENERAL DESCRIPTION
The MSM6404A microcontroller is a low-power device implemented in complementary metal-
oxide semiconductor technology. The MSM6404A is optimized for high-speed processing and
complicated-control applications.
The MSM6404VS is a CMOS 4-bit microcontroller that employs an external EPROM using a
piggy-back package in place of the program memory (ROM) internal to the MSM6404A.
The MSM6404VS can be used for program development verification because the programs can
be modified by programming an external EPROM 2732 equivalent or 2764A equivalent.
FEATURES
Mask ROM (MSM6404A)
: 4000 words 8 bits
External ROM (MSM6404VS)
: 8196 words 8 bits
RAM (including the stack area)
: 256 words 4 bits
I/O port
Input-output port
: 8 ports 4 bits
Input port
: 1 port 4 bits
4 bits are for input ports having a latch; the other 32 bits are input/output ports that allow
bit manipulation
Three built-in counters
: 12-bit time-base counter
12-bit programmable timer
8-bit high-speed programmable timer/event
counter
Built-in 8-bit serial I/O register (with 3-bit counter)
Five interrupts with five priority levels (4 internal, 1 external)
32 stacks (in RAM)
Power-down features
Minimum instruction execution time
: 952 ns @ 4.2 MHz clock
Instruction systems suitable for control
Fully static operation
Low power consumption
Single 5 V supply
Package options:
MSM6404A
42-pin plastic DIP (DIP42-P-600-2.54)
: (Product name : MSM6404A-RS)
44-pin plastic QFP (QFP44-P-910-0.80-K)
: (Product name : MSM6404A-GS-K)
44-pin plastic QFP (QFP44-P-910-0.80-2K) : (Product name : MSM6404A-GS-2K)
MSM6404VS
42-pin ceramic piggyback (ADIP42-C-600-2.54) : (Product name : MSM6404VS)
indicates a code number.
Semiconductor
MSM6404A/6404VS
High speed and High performance 4-Bit Microcontroller
E2E0013-38-93
This version: Sep. 1998
Previous version: Mar. 1996
2/25
MSM6404A/6404VS
Semiconductor
BLOCK DIAGRAM
MSM6404A
3 2 1 0
P8
3 2 1 0
P7
3 2 1 0
P6
3 2 1 0
P5
3 2 1 0
P4
3 2 1 0
P3
3 2 1 0
P2
3 2 1 0
P1
3 2 1 0
P0
RAM
16 16 4 bits
DEC
H
L
SP
12-bit Timer
8-bit T/C
P9
8-bit SR
PA
C
ALU
ACC
INSTR
DEC
F
PC
PB
0
DEC
ROM
4000 8 bits
Timing
&
Control
Interrupt
Control
PC INTE
PD IRQ
12-bit TBC
OSC
0
OSC
1
TEST
RESET
V
DD
GND
INT
CIN
TMO
TCK
SCK, CTO, CLK
SI
SO
11
3/25
MSM6404A/6404VS
Semiconductor
BLOCK DIAGRAM (continued)
MSM6404VS
3 2 1 0
P8
3 2 1 0
P7
3 2 1 0
P6
3 2 1 0
P5
3 2 1 0
P4
3 2 1 0
P3
3 2 1 0
P2
3 2 1 0
P1
3 2 1 0
P0
RAM
16 16 4 bits
DEC
H
L
SP
12-bit Timer
8-bit T/C
P9
8-bit SR
PA
C
ALU
ACC
INSTR
DEC
F
PC
PB
0
Timing
&
Control
Interrupt
Control
PC INTE
PD IRQ
12-bit TBC
OSC
0
OSC
1
TEST
RESET
V
DD
GND
INT
CIN
TMO
TCK
SCK, CTO, CLK
SI
SO
12
RV
DV
I
0
to I
7
A
0
to A
12
4/25
MSM6404A/6404VS
Semiconductor
PIN CONFIGURATION (TOP VIEW)
20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
P0.3
P4.0
P4.1
P4.2
P4.3
P3.0
P3.1
P3.2
P3.3
OSC
0
OSC
1
RESET
TEST
P2.0
P2.1
P2.2
P2.3
P0.0
P0.1
P0.2
P1.1
V
DD
P5.3
P5.2
P5.1
P5.0
P6.3
P6.2
P6.1
P6.0
P7.3
P7.2
P7.1
P7.0
P8.3
P8.2
P8.1
P8.0
P1.3
P1.2
23
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
21
GND
P1.0
22
42-Pin Plastic DIP
5/25
MSM6404A/6404VS
Semiconductor
PIN CONFIGURATION (TOP VIEW) (continued)
NC: No-connection pin
44-Pin Plastic QFP
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
P3.1
P3.2
P3.3
OSC
0
OSC
1
RESET
TEST
P2.0
P2.1
P2.2
P2.3
P6.2
P6.1
P6.0
NC
P7.3
P7.2
P7.1
P7.0
P8.3
P8.2
P8.1
44
43
42
41
40
39
38
37
36
35
34
P3.0
P4.3
P4.2
P4.1
P4.0
V
DD
P5.3
P5.2
P5.1
P5.0
P6.3
12
13
14
15
16
17
18
19
20
21
22
P0.0
P0.1
P0.2
P0.3
GND
NC
P1.0
P1.1
P1.2
P1.3
P8.0
6/25
MSM6404A/6404VS
Semiconductor
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
P4.0
P4.1
P4.2
P4.3
P3.0
P3.1
P3.2
P3.3
OSC
0
OSC
1
RESET
TEST
P2.0/INT
P2.1
P2.2
P2.3
P0.0
P0.1/SCK
P0.2/SO
P0.3/SI
GND
V
DD
P5.3
P5.2
P5.1
P5.0
P6.3
P6.2
P6.1
P6.0
P7.3
P7.2
P7.1
P7.0
P8.3
P8.2
P8.1
P8.0
P1.3
P1.2/TCK
P1.1/TMO
P1.0/CIN
qV
PP
/V
DD
wA12
eA7
rA6
tA5
yA4
uA3
iA2
oA1
!0A0
!1I0
!2I1
!3I2
!4GND
V
DD
@8
PGM/V
DD
@7
V
DD
@6
A8@5
A9@4
A11@3
OE/GND@2
A10@1
CE/GND@0
I6!8
I5!7
I4!6
I3!5
I7!9
PIN CONFIGURATION (TOP VIEW) (continued)
42-Pin Ceramic Piggyback
7/25
MSM6404A/6404VS
Semiconductor
PIN DESCRIPTIONS
Symbol
Type
Description
During reset
P0.0
I/O
"1"
P0.1/SCK
P0.2/SO
P0.3/SI
P1.0/CIN
I/O
P1.0 is shared with counter input (CIN).
"1"
P1.1/TMO
P1.1 is shared with timer output (TMO).
P1.2/TCK
P1.3
P2.0/INT
I
P2.0 is shared with external interrupt input (INT).
The latch is
reset.
P2.1
Input port with a latch, built-in pull-up resistor
P2.2
P2.3
P3.0 to 3.3
"0"
P4.0 to 4.3
P5.0 to 5.3
P6.0 to 6.3
P7.0 to 7.3
I/O
"0"
P8.0 to 8.3
OSC
0
I
Oscillation
waveform
Crystal connection pins for clock oscillation
TEST
O
Pulse output
(Test pin for manufacturer)
RESET
I
V
DD
Power supply voltage pins
GND
P0.1 is shared with serial clock (SCK) input/output.
P0.2 is shared with serial data (SO) output.
P0.3 is shared with serial data (SI) input.
P1.2 is shared with timer clock input (TCK).
I/O
I/O
I/O
I/O
"1"
"0"
"0"
OSC
1
Input pin for system reset
--
--
--
--
O
--
--
--
8-bit output ports (at OPT instruction execution)
I/O
Note: 1. The ports except for pins P2.0 to P2.3 are pseudo bidirectional ports.
2. When each port is used for output, the MSM6404A can drive one TTL (one input) and
the MSM6404VS can drive one LS TTL (one input).
Upper Pins for MSM6404VS
Symbol
Type
Description
A0 to A12
I0 to I7
CE/GND
I
OE/GND
I
O
I
Data input
Chip enable input
Output enable input
Address output
I
PGM/V
DD
Program input
--
V
DD
Power supply voltage pins
GND
--
V
PP
/V
DD
Programed power supply voltage pin
8/25
MSM6404A/6404VS
Semiconductor
ABSOLUTE MAXIMUM RATINGS (MSM6404A)
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
V
DD
Ta = 25C
0.3 to +7
V
Input Voltage
V
I
0.3 to V
DD
V
Output Voltage
V
O
0.3 to V
DD
V
Power Dissipation
P
D
200 max.
mW
Ta = 25C per output
50 max.
mW
Ta = 25C per package
Storage Temperature
T
STG
--
55 to +150
C
RECOMMENDED OPERATING CONDITIONS (MSM6404A)
Note: Refer to the f
OSC
-V
DD
characteristic in OPERATING CHARACTERISTICS for the
relation-ship between power supply voltage and operating frequency.
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
V
DD
f
OSC
1 MHz
3 to 6
V
4.5 to 5.5
V
f
OSC
4.2 MHz
Data-Hold Voltage
V
DDH
2 to 6
V
f
OSC
= 0 Hz
Operating Temperature
T
op
40 to +85
C
--
Fan Out
N
15
--
MOS load
TTL load
1
9/25
MSM6404A/6404VS
Semiconductor
ELECTRICAL CHARACTERISTICS (MSM6404A)
DC Characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage*1, *2
V
IH
--
2.4
--
V
DD
V
"H" Input Voltage*3, *4
V
IH
--
3.6
--
V
DD
V
"L" Input Voltage
V
IL
--
0.3
--
+0.8
V
"H" Output Voltage*1, *5
V
OH
I
O
= 15 mA
4.2
--
--
V
V
OL
I
O
= 1.6 mA
--
--
0.4
V
V
OL
I
O
= 15 mA
--
--
0.4
V
Input Current*3
I
IH
/I
IL
V
I
= V
DD
/0 V
--
--
15/15
mA
Input Current*2, *4
--
--
1/30
"H" Output Current*1
I
OH
V
O
= 2.4 V
0.1
--
--
mA
I
OH
V
O
= 0.4 V
--
--
1.2
mA
Input Capacitance
C
I
f = 1 MHz, Ta = 25C
--
5
--
pF
Output Capacitance
C
O
--
7
--
Power Supply Current
(In Stop Mode)
I
DDS
V
DD
= 2 V, no load, Ta = 25C
--
0.2
5
mA
No load
--
1
100
mA
Power Supply Current
I
DD
Crystal oscillation
f = 4.194304 MHz, no load
--
6
12
mA
"L" Output Voltage*1
"L" Output Voltage*5
"H" Output Current*1
I
IH
/I
IL
V
I
= V
DD
/0 V
mA
(V
DD
= 5 V 10%, Ta = 40 to +85C)
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8.
*2 Applied to P2.
*3 Applied to OSC
0
.
*4 Applied to RESET.
*5 Applied to OSC
1
.
10/25
MSM6404A/6404VS
Semiconductor
AC Characteristics (MSM6404A)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Clock (OSC
0
) Pulse Width
tf
W
--
119
--
--
ns
Cycle Time
t
CY
--
952
--
--
ns
Input Data Setup Time
t
DS
--
120
--
--
ns
Input Data Hold Time
t
DH
--
120
--
--
ns
SR/TM Clock Pulse Width
t
WS
/t
WT
--
120
--
--
ns
CT Clock Pulse Width
P2 Input Data Clock Pulse Width
t
WP
--
120
--
--
ns
(V
DD
= 5 V 10%, Ta = 40 to +85C)
SR Data Setup Time
t
SS
--
120
--
--
ns
SR Data Hold Time
t
SH
--
120
--
--
ns
Data Delay Time
t
DR
C
L
= 15 pF
--
--
t
CY
+ 300
ns
Data Delay Time at Mode
Switching
t
DCR
C
L
= 15 pF
--
--
7/8 t
CY
+ 300
ns
t
DI1
C
L
= 15 pF
--
--
6/8 t
CY
+ 300
ns
t
WC
--
2/8 t
CY
+ 120
--
--
ns
Data Delay Time at OPT
Instruction
CT/TM Data Delay Time Using
TBC Clock
SR/TM Data Delay Time Using
PORT Clock
CT Data Delay Time Using
PORT Clock
CT Data Delay Time Using
External Clock
SR/TM Data Delay Time Using
External Clock
SR Clock Invalid Time
INT Invalid Time
t
DI2
C
L
= 15 pF
--
--
7/8 t
CY
+ 300
ns
t
CT
/t
TT
C
L
= 15 pF
--
--
2/8 t
CY
+ 360
ns
t
SR
/t
TR
C
L
= 15 pF
--
--
t
CY
+ 480
ns
t
CR
C
L
= 15 pF
--
--
10/8 t
CY
+ 480
ns
t
CP
C
L
= 15 pF
--
--
2/8 t
CY
+ 360
ns
t
SP
/t
TP
C
L
= 15 pF
--
--
360
ns
t
SINH
--
2/8 t
CY
--
--
ns
t
IINH
--
1/8 t
CY
--
--
ns
Data Delay Time at OPT
Instruction
11/25
MSM6404A/6404VS
Semiconductor
Timing Diagrams (MSM6404A)
Output Conditions
1MC
t
CY
t
DR
t
DCR
t
DI1
t
DI2
t
CT
t
TT
t
SR
t
TR
t
CR
t
CP
t
SP
t
TP
OSC
0
0, 1, 3
4, 5, 6
7 or 8
PA =
P0, P1, P3
P4, P5, P6
P7, P8
PA = 9 or A
P0.1
P0.2
P0.3
OPT INST.
P4
OPT INST.
P5
TBC clock
P0.1
P1.1
CT
TM
P0.2 P0.1 clock* SR
P1.1 P1.2 clock* TM
P0.1 P1.0 clock* CT
P0.1 EXT clock
P1.0 P1.2 EXT clock
P0.1 CT
P0.2 SR
P1.1 TM
*
Output data to port is clock for SR, TM or CT.
12/25
MSM6404A/6404VS
Semiconductor
Input Conditions
t
SINH
1MC
t
IINH
t
SS
t
SH
INPUT
DATA
t
WC
t
WS
t
DS
t
DH
INPUT
DATA
t
fW
t
fW
1MC
OSC
0
P0, P1, P2
P3, P4, P5
P6, P7, P8
P0.1 SR clock
P1.2 TM clock
P2
P1.0 CT clock
P0.1 SR clock
P0.3 SI
OSC
0
t
WT
t
WP
t
SINH
:
P0.1 (SR clock) INH period during LMSR INST.
(Note : P0.1 is used for clock of SR.)
t
IINH
:
P2.0 (interrupt) INH period during RPB and RPBD INST.
13/25
MSM6404A/6404VS
Semiconductor
0
1
2
3
4
5
6
7
8
9 10
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
I
OH
(mA)
V
OH
(V)
0
1
2
3
4
5
6
7
8
9 10
2
4
6
8
10
12
14
16
18
20
I
OL
(mA)
V
OL
(V)
0
1
2
3
4
5
6
7
8
9 10
1
2
3
4
5
6
7
8
9
10
f
OSC
(MHz)
V
DD
(V)
0
40 20 0 20 40 60 80 100120
1
2
3
4
5
6
7
8
9
10
f
OSC
(MHz)
Ta (C)
1
2
3
4
5
6
7
8
9 10
V
DD
(V)
0
100 n
1 m
10 m
100 m
1 m
10 m
I
DD
(A)
2 MHz
f
OSC
= 4 MHz
0 Hz
V
DD
= 5 V
V
DD
= 5 V
6 V
4 V
3 V
V
DD
= 6 V
5 V
4 V
3 V
100 kHz
Ta = 25C
Ta = 25C
CL = 15 pF
Ta = 25C, CL =1 5 pF
Ta = 25C, no load
500 kHz
1 MHz
Operating Characteristics (MSM6404A)
Current (I
OH
) vs Voltage (V
OH
) for High State
Output
Current (I
OL
) vs Voltage (V
OL
) for Low State
Output
Maximum Clock Frequency (f
OSC
) vs
Temperature (Ta)
Supply Current (I
DD
) vs Supply Voltage
(V
DD
)
Maximum Clock Frequency (f
OSC
) vs Supply
Voltage (V
DD
)
14/25
MSM6404A/6404VS
Semiconductor
ABSOLUTE MAXIMUM RATINGS (MSM6404VS)
RECOMMENDED OPERATING CONDITIONS (MSM6404VS)
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
V
DD
Ta = 25C
0.3 to +7
V
Input Voltage
V
I
0.3 to V
DD
V
Output Voltage
V
O
0.3 to V
DD
V
Power Dissipation
P
D
200 max.
mW
Ta = 25C per output
50 max.
mW
Ta = 25C per package
Storage Temperature
T
STG
--
55 to +150
C
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
V
DD
f
OSC
1 MHz
3 to 6
V
4.75 to 5.25
V
f
OSC
4.2 MHz
Data-Hold Voltage
V
DDH
2 to 6
V
f
OSC
= 0 Hz
Operating Temperature
T
op
0 to +40
C
--
Fan Out
N
15
--
MOS load
LSTTL load
1
15/25
MSM6404A/6404VS
Semiconductor
ELECTRICAL CHARACTERISTICS (MSM6404VS)
DC Characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage*1, *2
V
IH
--
3.6
--
V
DD
V
"H" Input Voltage*3, *4
V
IH
--
3.6
--
V
DD
V
"L" Input Voltage
V
IL
--
0.3
--
+0.8
V
"H" Output Voltage*1, *5
V
OH
I
O
= 15 mA
4.2
--
--
V
V
OL
I
O
= 0.4 mA
--
--
0.4
V
V
OL
I
O
= 15 mA
--
--
0.4
V
Input Current*3
I
IH
/I
IL
V
I
= V
DD
/0 V
--
--
15/15
mA
Input Current*2, *4
--
--
1/30
"H" Output Current*1
I
OH
V
O
= 2.4 V
0.1
--
--
mA
I
OH
V
O
= 0.4 V
--
--
1.2
mA
Input Capacitance
C
I
f = 1 MHz, Ta = 25C
--
5
--
pF
Output Capacitance
C
O
--
7
--
Power Supply Current*6
(In Stop Mode)
I
DDS
V
DD
= 2 V, no load, Ta = 25C
--
1
5
mA
No load
--
10
100
mA
Power Supply Current*6
I
DD
Crystal oscillation
f = 4.2 MHz, no load
--
6
12
mA
"L" Output Voltage*1
"L" Output Voltage*5
"H" Output Current*1
I
IH
/I
IL
V
I
= V
DD
/0 V
mA
(V
DD
= 5 V 5%, Ta = 0 to +40C)
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8.
*2 Applied to P2.
*3 Applied to OSC
0
.
*4 Applied to RESET.
*5 Applied to OSC
1
.
*6 The EPROM current is not included.
16/25
MSM6404A/6404VS
Semiconductor
AC Characteristics (MSM6404VS)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Clock (OSC
0
) Pulse Width
tf
W
--
119
--
--
ns
Cycle Time
t
CY
--
952
--
--
ns
Input Data Setup Time
t
DS
--
120
--
--
ns
Input Data Hold Time
t
DH
--
120
--
--
ns
SR/TM Clock Pulse Width
t
WS
/t
WT
--
120
--
--
ns
CT Clock Pulse Width
P2 Input Data Clock Pulse Width
t
WP
--
120
--
--
ns
(V
DD
= 5 V 5%, Ta = 0 to +40C)
SR Data Setup Time
t
SS
--
120
--
--
ns
SR Data Hold Time
t
SH
--
120
--
--
ns
Data Delay Time
t
DR
C
L
= 15 pF
--
--
t
CY
+ 300
ns
Data Delay Time at Mode
Switching
t
DCR
C
L
= 15 pF
--
--
7/8 t
CY
+ 300
ns
t
DI1
C
L
= 15 pF
--
--
6/8 t
CY
+ 300
ns
t
WC
--
2/8 t
CY
+ 120
--
--
ns
Data Delay Time at OPT
Instruction
CT/TM Data Delay Time Using
TBC Clock
SR/TM Data Delay Time Using
PORT Clock
CT Data Delay Time Using
PORT Clock
CT Data Delay Time Using
External Clock
SR/TM Data Delay Time Using
External Clock
SR Clock Invalid Time
INT Invalid Time
t
DI2
C
L
= 15 pF
--
--
7/8 t
CY
+ 300
ns
t
CT
/t
TT
C
L
= 15 pF
--
--
2/8 t
CY
+ 360
ns
t
SR
/t
TR
C
L
= 15 pF
--
--
t
CY
+ 480
ns
t
CR
C
L
= 15 pF
--
--
10/8 t
CY
+ 480
ns
t
CP
C
L
= 15 pF
--
--
2/8 t
CY
+ 360
ns
t
SP
/t
TP
C
L
= 15 pF
--
--
360
ns
t
SINH
--
2/8 t
CY
--
--
ns
t
IINH
--
1/8 t
CY
--
--
ns
Data Delay Time at OPT
Instruction
17/25
MSM6404A/6404VS
Semiconductor
Timing Diagrams (MSM6404VS)
Output Conditions
t
CY
t
DR
t
DCR
t
DI1
t
DI2
t
CT
t
TT
t
SR
t
TR
t
CR
t
CP
t
SP
t
TP
OSC
0
P0, P1, P3
P4, P5, P6
P7, P8
P0.1
P0.2
P1.1
OPT INST.
P4
OPT INST.
P5
TBC clock
P0.1/CTO
P1.1/TMO
P0.2/SO
P1.1/TMO
P0.1/CTO P1.0
clock
P0.1
EXT clock
P1.0, P1.2
EXT clock
P0.1 clock
P1.2 clock
P0.1/CTO
P0.2/SO
P1.1/TMO
1MC
1MC
t
IINH
OSC
0
t
SINH
t
SINH
:
P0.1/SCK inhibit period during LMSR INST.
t
IINH
:
P2.0/INT inhibit period during RPB and RPBD INST.
18/25
MSM6404A/6404VS
Semiconductor
Input Conditions
t
SS
t
SH
INPUT
DATA
t
WC
t
WS
INPUT
DATA
t
fW
t
fW
1MC
OSC
0
P0, P1, P2
P3, P4, P5
P6, P7, P8
P0.1 SR clock
P1.2 TM clock
P2
P1.0 CT clock
P0.1/SCK
P0.3/SI
t
WT
t
WP
t
DS
t
DH
19/25
MSM6404A/6404VS
Semiconductor
Operating Characteristics (MSM6404VS)
Current (I
OH
) vs Voltage (V
OH
) for High State
Output
Current (I
OL
) vs Voltage (V
OL
) for Low State
Output
0
1
2
3
4
5
6
7
8
9 10
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
I
OH
(mA)
V
OH
(V)
0
1
2
3
4
5
6
7
8
9 10
2
4
6
8
10
12
14
16
18
20
I
OL
(mA)
V
OL
(V)
1
2
3
4
5
6
7
8
9 10
V
DD
(V)
0
100 n
1 m
10 m
100 m
1 m
10 m
I
DD
(A)
2 MHz
f
OSC
= 4 MHz
0 Hz
V
DD
= 6 V
5 V
4 V
3 V
V
DD
= 6 V
5 V
4 V
3 V
1 MHz
500 kHz
100 kHz
Ta = 25C, excluding pins A
0
-A
12
Ta = 25C
0
1
2
3
4
5
6
7
8
9 10
1
2
3
4
5
6
7
8
9
10
f
OSC
(MHz)
V
DD
(V)
Ta = 25C, C
L
= 15 pF
Ta = 25C, no load,
excluding EPROM current
0
40 20 0 20 40 60 80 100120
1
2
3
4
5
6
7
8
9
10
f
OSC
(MHz)
Ta (C)
V
DD
= 5 V, C
L
= 15 pF
500 n
5 m
50 m
500 m
5 m
Maximum Clock Frequency (f
OSC
) vs Supply
Voltage (V
DD
)
Supply Current (I
DD
) vs Supply Voltage
(V
DD
)
Maximum Clock Frequency (f
OSC
) vs
Temperature (Ta)
20/25
MSM6404A/6404VS
Semiconductor
FUNCTIONAL DESCRIPTION
MSM6404VS Interface to EPROM
EPROM insertion method
2732
2764A
2732 EPROM
2764A EPROM
EPROM read timing
t
ACC
Read Data
Address
1MC
T1
T2
T3
T4
T1
t
fW
t
fW
I
0 to
I
7
A
0 to
A
12
OSC
0
CE, OE
Use EPROM with t
ACC
of less than 357 ns.
Read data is read into the instruction register in the first half of the T1 state.
21/25
MSM6404A/6404VS
Semiconductor
Differences between MSM6404A and MSM6404VS (PIGGYBACK)
Item
MSM6404A
MSM6404VS (Piggyback)
1.
Ports P0, 1, 3 are set to "1" and ports P2, 4,
5, 6, 7, 8 are reset to "0" directly by the reset
input signal.
Ports P0, 1, 3 are set to "1" and ports P2, 4,
5, 6, 7, 8 are initialized during reset cycle.
After being reset, the timer continues to stop
until data is set in it.
It is undefined whether the timer starts or
not after being reset. Therefore, the timer
should be initialized by software.
Serial out F/F (SOF/F) is set to "0" after being
reset.
It is undefined whether serial out F/F
(SOF/F) is "0" or "1" after being reset.
Therefore the serial out F/F should be
initialized by software.
Port
initialization
during reset
2. Timer
operation
3. Shift register
Internal clock
Internal clock
Port
input/output
timing
4.
Input
Data are input
at this time.
Input
Data are input
at this time.
Internal clock
Synchronized
with falling edge
Data are output
at this time.
Data are output
at this time.
Output
TTL FO = "1"
(I
OL
= 1.6 mA @ 0.4 V)
LSTTL FO = "1"
(I
OL
= 0.4 mA @ 0.4 V)
Port
input/output
characteristics
5.
P2.0-3
P2.0-3
V
DD
V
DD
V
DD
TTL compatible input
CMOS input
P0.0-P8.3
P0.0-P8.3
(Except P2.0-3)
(Except P2.0-3)
Up to 4 Kbytes
Up to 8 Kbytes accessible
Available ROM
capacity
Not available
Available
LJP a
13
, LCAL a
13
instruction
Internal clock
Output
6.
7.
22/25
MSM6404A/6404VS
Semiconductor
(Unit : mm)
PACKAGE DIMENSIONS
DIP42-P-600-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
6.20 TYP.
23/25
MSM6404A/6404VS
Semiconductor
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP44-P-910-0.80-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Mirror finish
24/25
MSM6404A/6404VS
Semiconductor
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.41 TYP.
QFP44-P-910-0.80-2K
Mirror finish
25/25
MSM6404A/6404VS
Semiconductor
(Unit : mm)
42-PIN CERAMIC PIGGYBACK
ADIP42-C-600-2.54