1/23

¡ Semiconductor

MSM65512A/65P512A

GENERAL DESCRIPTION

The MSM65512A is a high-performance 8-bit microcontroller that employs OKI original nX-8/
50 CPU core. With a minimum instruction execution time of 400 ns (10MHz clock), the
MSM65512A is capable of high-speed processing, and includes 8K bytes of program memory,
256 bytes of data memory, timers and serial ports. Also available are the MSM65P512A, which
replaces the MSM65512's built-in program memory with one-time PROM, and the MSM65X512A,
which uses external program memory.

FEATURES

· Operating range

Operating frequency

: 0 to 10 MHz (V

=4.5 to 5.5 V)

0 to 5 MHz (V

=2.7 to 5.5 V)

Operating voltage

: 2.7 to 5.5 V

Operating temperature

: 40 to +85

C (Operation at +125

C is

assured by the other specification.)

· Memory space

: 64K bytes

Internal program memory

: 8K bytes

Internal data memory

: 256 bytes

· Minimum instruction execution time

: 400 ns @ 10 MHz

· Powerful instruction set

: 83 basic instructions

8/16-bit operation instructions
Bit manipulation instructions
Compound function instructions

· Abundant addressing modes
· Multiplication/division operation functions

: 8 ¥ 8 Æ 16

16/8 Æ 16 ... 8

· I/O ports

Input-output port

: 4 ports ¥ 8 bits

· Timers

: 8-bit auto-reload timer ¥ 2

16-bit auto-reload timer ¥ 1
Watchdog timer ¥ 1

· Counters

: Time base counter ¥ 1

16-bit free-running counter ¥ 1

· Capture input

: 1 channel

· Compare output

: 2 channels

· Serial ports

: Shift register ¥ 1

Serial port with baud rate generator
(UART/synchronous) ¥ 1

· External interrupts

: 3

· Interrupt sources

: 15

· Package

40-pin plastic DIP (DIP40-P-600-2.54)

: (MSM65512A-¥¥¥RS,

MSM65P512A-¥¥¥RS)

44-pin plastic QFP (QFP44-P-910-0.80-2K)

: (MSM65512A-¥¥¥GS-2K,

MSM65P512A-xxxGS-2K)

44-pin plastic QFJ (PLCC) (QFJ44-P-S650-1.27): (MSM65512A-¥¥¥JS,

MSM65P512A-¥¥¥JS)
¥¥¥ indicates the code number.

¡ Semiconductor

MSM65512A/65P512A

High Performance 8-Bit Microcontroller

E2E1011-27-Y4

This version: Jan. 1998

Previous version: Nov. 1996

2/23

¡ Semiconductor

MSM65512A/65P512A

BLOCK DIAGRAM

OSC 0
OSC 1
RESET
HSTOP*

GND

OSC

CONT.

ROM

(8K bytes)

EXT.MEM.

CONT.

CPU CORE

INST.

DEC.

T/C

ALU

GMAR

PSW

LMAR

BUS
CONT.

I/O PORT

RAM

(256 bytes)

TBC

WDT

16-bit TIMER

16-bit FRC

CAP¥1, CMP¥2

SIO

AD0-7*

A8-15*

WR*
ALE

T2CK*

GATE*

CAP*
CMP0*

CMP1*

TXD*

RXD*

P0 P1 P2 P3

* Secondary functions of ports.
** One timer is used for the SIO
baud rate generator

8-bit TIMER¥3**

T1OUT*
T0CK*

8-bit SHIFT-REG.

INTERRUPT CONT.

SFTO*

SFTI*

SFTCK*

INT0*

INT1*

INT2*

MUL/DIV

3/23

¡ Semiconductor

MSM65512A/65P512A

PIN CONFIGURATION (TOP VIEW)

40-Pin Plastic DIP

GND

P3.0/T2CK

P3.1/CAP

P3.2/CMP0

P3.3/CMP1

P3.4/INT2

P3.5/SFTO

P3.6/SFTI

P3.7/SFTCK

RESET

P2.0/RXD

P2.1/TXD

P2.2/INT0

P2.3/INT1/GATE

P2.4/T0CK

P2.5/HSTOP

P2.6/WR

P2.7/T1OUT

OSC1

OSC0

P1.0/A8

P0.0/AD0

P0.1/AD1

P0.2/AD2

P0.3/AD3

P0.4/AD4

P0.5/AD5

P0.6/AD6

P0.7/AD7
EA
ALE
RD

P1.7/A15

P1.6/A14

P1.5/A13

P1.4/A12

P1.3/A11

P1.2/A10

P1.1/A9

4/23

¡ Semiconductor

MSM65512A/65P512A

PIN CONFIGURATION (TOP VIEW) (Continued)

P3.5/SFTO

P3.6/SFTI

P3.7/SFTCK

RESET

P2.0/RXD

P2.1/TXD

P2.2/INT0

P2.3/INT1/GATE

P2.4/T0CK

P2.5/HSTOP

P0.4/AD4

P0.5/AD5

P0.6/AD6

P0.7/AD7
EA

ALE
RD

P1.7/A15

P1.6/A14

P1.5/A13

P3.4/INT2

P3.3/CMP1

P3.2/CMP0

P3.1/CAP

P3.0/T2CK

P0.0/AD0

P0.1/AD1

P0.2/AD2

P0.3/AD3

P2.6/

P2.7/T1OUT

OSC1

OSC0

GND

P1.0/A8

P1.1/A9

P1.2/A10

P1.3/A11

P1.4/A12

* No-connection pin for MSM65P512A

NC: No-connection pin

44-Pin Plastic QFP

5/23

¡ Semiconductor

MSM65512A/65P512A

PIN CONFIGURATION (TOP VIEW) (Continued)

P0.3/AD3

P0.2/AD2

P0.1/AD1

P0.0/AD0

P3.0/T2CK

P3.1/CAP

P3.2/CMP0

P3.3/CMP1

P3.4/INT2

P1.4/A12

P1.3/A11

P1.2/A10

P1.1/A9

P1.0/A8

GND

OSC0
OSC1

P2.7/T1OUT

P2.6/WR

P3.5/SFTO

P3.6/SFTI

P3.7/SFTCK

RESET

P2.0/RXD

P2.1/TXD

P2.2/INT0

P2.3/INT1/GATE

P2.4/T0CK

P2.5/

HSTOP

P0.4/AD4

P0.5/AD5

P0.6/AD6

P0.7/AD7

ALE

P1.7/A15

P1.6/A14

P1.5/A13

NC: No-connection pin

44-Pin Plastic QFJ (PLCC)

6/23

¡ Semiconductor

MSM65512A/65P512A

PIN DESCRIPTIONS

Basic Functions

Function

Symbol

Type

Description

Power
Supply

+5V power supply

GND

0V digital ground

OSC0

Crystal oscillation input/external clock input

OSC1

Crystal oscillation output

RESET

System reset input (program starts from address 0040H);
internal pull-up resistor

Program memory select input pin.
"L" level input for external program memory; "H" level input
for internal program memory.

Read strobe signal during external memory access

ALE

Address latch signal during external memory access

PORT 0

8-bit Input-output port
During external memory access, becomes address/data bus for address
output, instruction fetch or data read/write along with ALE,
RD and WR pins

I/O

PORT 1

8-bit Input/output port
Address bus during external memory access

I/O

PORT 2
PORT 3

8-bit Input/output port ¥ 2. Secondary functions shown in following table are
added for ports 2 and 3.

I/O

Oscillation

Control

Port

7/23

¡ Semiconductor

MSM65512A/65P512A

Secondary Functions

Symbol

Type

Description

INT0

P2.2 secondary function
External interrupt 0 input pin.

INT1/GATE

P2.3 secondary functions
External interrupt 1 input pin. Also used as input pin for gate signal
for timer 0 count enable/disable.

T0CK

P2.4 secondary function
Timer 0 external clock input pin.

HSTOP

P2.5 secondary function
Hard stop mode input pin; stops system clock oscillation with "L" level input.

P2.6 secondary function
Write strobe signal output pin during external data memory access.

T1OUT

P2.7 secondary function
Output pin for signal obtained by dividing timer overflow by 2.

SFTO

P3.5 secondary function
Shift register data output pin.

SFTI

P3.6 secondary function
Shift register data input pin.

SFTCK

P3.7 secondary function
Shift register synchronizing clock input/output pin.

I/O

RXD

P2.0 secondary functions
UART: Input pin for serial port receive data.
Synchronous: Input/output pin for serial port transmit/receive data.

I/O

TXD

T2CK

P3.0 secondary function
Timer 2 external clock input pin.

CAP

P3.1 secondary function
Capture trigger input pin.

CMP0

P3.2 secondary function
Compare output channel 0 output pin.

CMP1

P3.3 secondary function
Compare output channel 1 output pin.

INT2

P3.4 secondary function
External interrupt 2 input pin

P2.1 secondary functions
UART: Output pin for serial port transmit data.
Synchronous: Output pin for serial port synchronizing clock.

8/23

¡ Semiconductor

MSM65512A/65P512A

Port Circuit Configuration

Type

Port

Electrical Characteristics

=5V)

P0.0/AD0-
P0.7/AD7

"H" Input Voltage:
· V

=2.4V

"L" Input Voltage:
· V

=0.8V

"H" Output Voltage:
· V

=3.75V

· I

=400mA

"L" Output Voltage:
· V

=0.4V

· I

=3.2mA

Circuit Configuration

P1.0/A8-
P1.7/A15

"H" Input Voltage:
· V

=2.4V

"L" Input Voltage:
· V

=0.8V

"H" Output Voltage:
· V

=3.75V

· I

=200mA

"L" Output Voltage:
· V

=0.4V

· I

=1.6mA

P0D

DIR

Data Bus

External Memory Control

PORT0

P1D

DIR

Data Bus

External Memory Control

PORT1

Data Bus

PxD

DIR

Secondary

Output

Function

(x=2 to 5)

MOD

PORTx

Secondary

Input

Function

"H" Input Voltage:
· V

=2.4V

"L" Input Voltage:
· V

=0.8V

P2.6/WR
"H" Output Voltage:
· V

=3.75V

· I

=400mA

"L" Output Voltage:
· V

=0.4V

· I

=3.2mA

Excluding P2.6/WR
"H" Output Voltage:
· V

=3.75V

· I

=200mA

"L" Output Voltage:
· V

=0.4V

· I

=1.6mA

P2.0/RXD,
P2.1/TXD,
P2.6/WR,
P2.7/T1OUT,
P3.2/CMP0,
P3.3/CMP1,
P3.5/SFT0,
P3.7/SFTCK

9/23

¡ Semiconductor

MSM65512A/65P512A

PxD

DIR

Data Bus

(x=2 to 5)

PORTx

Secondary

Input Function

Type

Port

Electrical Characteristics

=5V)

"H" Input Voltage:
· V

=2.4V

"L" Input Voltage:
· V

=0.8V

"H" Output Voltage:
· V

=3.75V

· I

=200mA

"L" Output Voltage:
· V

=0.4V

· I

=1.6mA

Circuit Configuration

P2.2/INT0,
P2.3/INT1/GATE,
P2.4/T0CK,
P2.5/HSTOP,
P3.0/T2CK,
P3.1/CAP,
P3.4/INT2,
P3.6/SFTI

Port Circuit Configuration (Continued)

10/23

¡ Semiconductor

MSM65512A/65P512A

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

Parameter

Unit

Supply Voltage

0.3 to 7.0

Symbol

Condition

Rating

Ta=25°C

Input Voltage

0.3 to V

+0.3

Output Voltage

0.3 to V

+0.3

Power Dissipation

400

Ta=25°C per package

Ta=25°C per output

Storage Temperature

STG

55 to +150

°C

*1 This is due to the standard of a crystal oscillator or ceramic resonator.

MEMORY MAPS

100H

80H

40H
30H
20H
10H

0FFFFH

2000H

100H

80H

40H
20H

Internal Memory

Local Memory Space

SFR

Data Memory

Local Register Set 3
Local Register Set 2
Local Register Set 1
Local Register Set 0

General Memory Space

External Memory

Program Memory

Vector Call Table Area

Program Memory

Interrupt Vector Table Area

Vector Call Table Area

17FH

Data Memory

Page 1

Page 0

Parameter

Unit

Supply Voltage

2.7 to 5.5

Symbol

Condition

Range

Refer to Figure 1.

Memory Hold Voltage

DDMH

2.0 to 5.5

OSC

=0 Hz

Oscillation Operating
Frequency *1

OSC

1 to 10

Refer to Figure 1.

External Clock Operating
Frequency

EXTCLK

0 to 10

Refer to Figure 1.

Operating Temperature

40 to +85

MHz

°C

12/23

¡ Semiconductor

MSM65512A/65P512A

ELECTRICAL CHARACTERISTICS

DC Characteristics 1 (V

=4.5 to 5.5V)

(GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

"H" Input Voltage 1

IH1

2.4

+0.3

"H" Input Voltage 2

IH2

0.7V

+0.3

"L" Input Voltage

0.3

0.8

"H" Output Voltage 1

OH1

IOH=200mA

0.75V

"H" Output Voltage 2

OH2

IOH=400mA

0.75V

"L" Output Voltage 1

OL1

IOL=1.6mA

0.4

"L" Output Voltage 2

OL2

IOL=3.2mA

0.4

Input Leakage Current 1

LI1

VI=V

/0V

±1

Input Leakage Current 2

LI2

VI=V

/0V

±10

"L" Input Current

VI=0V

200

400

Input Capacitance

f=1MHz, Ta=25°C

Current Consumption

DDS

5V, Stop mode

10MHz, 5V, no load

DDS

*1 Excluding OSC0 and RESET
*2 OSC0 and RESET
*3 Excluding P0, ALE, RD, P2.6/WR
*4 P0, ALE, RD, P2.6/WR
*5 EA
*6 Excluding RESET, EA
*7 RESET
*8 The ports configured as inputs should be coupled to V

or 0V. Other ports should not be

loaded.

*9 Refer to Figure 2.

13/23

¡ Semiconductor

MSM65512A/65P512A

DC Characteristics 2 (2.7

£ V

<4.5V)

*1 Excluding OSC0 and RESET
*2 OSC0 and RESET
*3 Excluding P0, ALE, RD, P2.6/WR
*4 P0, ALE, RD, P2.6/WR
*5 EA
*6 Excluding RESET, EA
*7 RESET
*8 The ports configured as inputs should be coupled to V

or 0V. Other ports should not be

loaded.

*9 Refer to Figure 2.

(GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

"H" Input Voltage 1

IH1

0.5V

+0.2

+0.3

"H" Input Voltage 2

IH2

0.6V

+0.4

+0.3

"L" Input Voltage

0.3

0.15V

+0.1

"H" Output Voltage 1

OH1

=10mA

0.75V

"H" Output Voltage 2

OH2

=20mA

0.75V

"L" Output Voltage 1

OL1

=10mA

0.1

"L" Output Voltage 2

OL2

=20mA

0.1

Input Leakage Current 1

LI1

/0V

±1

Input Leakage Current 2

LI2

/0V

±10

"L" Input Current

=2.7 to 3.3V, V

=0V

120

240

Input Capacitance

f=1MHz, Ta=25°C

Current Consumption

DDS

3V, Stop mode

5MHz, 3V, no load

15/23

¡ Semiconductor

MSM65512A/65P512A

AC Characteristics

· External memory control

=2.7 to 5.5V, GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Max.

Unit

Clock Cycle

=4.5 to 5.5V

100

"L" Clock Pulse Width

CLW

=2.7 to 5.5V

"H" Clock Pulse Width

CHW

=100pF

Clock Cycle

200

"L" Clock Pulse Width

CLW

"H" Clock Pulse Width

CHW

ALE Pulse Width

CHW

ALE Pulse Delay Time 1

ALD1

CLW

ALE Pulse Delay Time 2

ALD2

CLW

RD Pulse Width

CHW

RD Pulse Delay Time

CLW

+20

WR Pulse Width

CHW

WR Pulse Delay Time

CLW

+40

"L" Address Setup Time

LAS

"H" Address Setup Time

HAS

"L" Address Hold Time

LAH

CLW

Bus Float Time

LAZ

"H" Address Hold Time

HAHR

"H" Address Hold Time

HAHW

Read Data Access Time

RDAA

CLW

Read Data Access Time

RDAR

CHW

+10

Read Data Hold Time

RDH

Write Data Setup Time

WDS

CLH

Write Data Hold Time

WDH

CLW

17/23

¡ Semiconductor

MSM65512A/65P512A

· CPU control

*1 Excluding power ON, stop mode and hard stop mode.
*2 During power ON, in stop mode and hard stop mode.
*3 Oscillation stabilization time depends on resonator.

=2.7 to 5.5V, GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Max.

Unit

RESET Pulse Width *

RESW1

RESET Pulse Width *

RESW2

RESET pulse width

RESW1

RESET

· Peripheral control 1

* t

T0CLK

: Timer 0 count clock cycle selected by T0CON.

=2.7 to 5.5V, GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Max.

Unit

Clock Cycle

100

External Interrupt Pulse
Width

EXIW

4 t

External Clock Pulse
Width

T0CW

4 t

GATE Pulse Width

T0GW

1 t

TOCLK

OSC

EXI

External Clock Pulse
Width

T2CW

4 t

CAP Pulse Width

CAPW

12 t

CAP

=4.5 to 5.5V

200

=2.7 to 5.5V

19/23

¡ Semiconductor

MSM65512A/65P512A

· Peripheral control 2

=2.7 to 5.5V, GND=0V, Ta=40 to +85°C)

Parameter

Symbol

Condition

Min.

Max.

Unit

Clock Cycle

100

SFTCK Cycle

SFC

8 t

SFTCK "L" Pulse Width

SFCLW

4 t

SFTCK "H" Pulse Width

SFCHW

4 t

OSC

SFT

SFTCK Setup Time

SFOS

SFCLW

100

SFTO Hold Time

SFOH

SFCHW

100

SFTI Setup Time

SFIS

100

SFTI Hold Time

SFIH

100

=100pF

Synchronous Clock Cycle

SIC

8 t

Synchronous Clock "L"
Pulse Width

SICLW

4 t

Synchronous Clock "H"
Pulse Width

SICHW

4 t

Output Data Setup Time

SIOS

6 t

100

Output Data Hold Time

SIOH

2 t

100

Input Data Setup Time

SIIS

CLW

+100

Input Data Hold Time

SIIH

SIO

(Clock

Syn-

chro-

nous)

=4.5 to 5.5V

200

=2.7 to 5.5V

21/23

¡ Semiconductor

MSM65512A/65P512A

(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

DIP40-P-600-2.54

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
6.10 TYP.

22/23

¡ Semiconductor

MSM65512A/65P512A

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

Package material
Lead frame material
Pin treatment
Solder plate thickness

Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.41 TYP.

QFP44-P-910-0.80-2K

Mirror finish

23/23

¡ Semiconductor

MSM65512A/65P512A

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

QFJ44-P-S650-1.27

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
Cu alloy
Solder plating
5 mm or more
2.00 TYP.

Mirror finish

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MSM65512A-XXXJS