OKI Semiconductor

FEDL6585-03

Issue Date: Aug. 25, 2004

MSM6585

ADPCM Voice Synthesis IC

GENERAL DESCRIPTION

The MSM6585 is an version-up product of the MSM5205 voice synthesis IC. Mainly improved points
are improvement for the precision of an internal DA converter, a built-in low-pass filter, and
expansion on the sampling frequency. The MSM6585 does not include a control circuit to drive an
external memory similar to the MSM5205. Therefore, the MSM6585 can be connected with not only
semiconductor memories, but other memory media (CD-ROM, etc.) by the control of CPU.

FEATURES

· 4-bit ADPCM method
· Built-in 12-bit DA converter
· Built-in low-pass filter (LPF) (40dB/oct)
· Sampling frequencies: 4k/8k/16k/32kHz
· Master clock frequency (ceramic oscillator) : 640kHz

Voice data synthesis: Supported by voice analysis editing tool AR207

Package options:

18-pin plastic DIP (DIP18-P-300-2.54) (MSM6585RS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (MSM6585MAZXXX)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (MSM6585MBZXXX)

DIFFERENCES BETWEEN MSM6585 AND MSM5205

MSM6585

MSM5205

· Master clock frequency:

640kHz

384kHz

· Sampling frequency:

4k/8k/16k/32kHz

4k/6k/8kHz

· ADPCM bit length:

4-bit

3-bit/4-bit

· DA Converter:

12-bit

10-bit

· Low-pass filter:

Included (40dB/oct)

Not included

· Overflow preventing circuit:

Included

Not included

· Power supply voltage:

4.5 to 5.5V

3.0 to 6.0V

· Operating current consumption:

10mA

4mA

· Operating temperature:

40 to +85

30 to +70

· D3 to D0 input timing

VCK (O)

D3 - D0

input timing

ADPCM Data

MSM6585

MSM5205

¡ Semiconductor

MSM6585

PIN CONFIGURATION (TOP VIEW)

18-Pin Plastic DIP

GND

XT
XT

RESET

VCK
T2

DAO

AOUT

1
2
3
4
5
6
7
8
9

10
11
12

S1
S2

D1
D2

GND

XT
XT
NC
RESET
NC
VCK
T2
T1
NC
DAO
AOUT

24
23
22
21
20
19
18
17
16
15
14
13

NC : No connection

24-Pin Plastic SOP

1
2
3
4
5
6
7
8
9

10
11
12

S1
S2

NC
NC
NC

D0
D1
D2
D3

NC
NC

XT
NC
NC
NC
XT
RESET
VCK
T2
T1
NC
NC

30
29
28
27
26
25
24
23
22
21
20
19

NC : No connection

30-Pin Plastic SSOP

13
14
15

GND

NC
DAO
AOUT

18
17
16

¡ Semiconductor

MSM6585

PIN DESCRIPTION

Symbol Type

Description

Pins to determine the sampling frequency.
The sampling frequencies of 32k, 16k, 8k, and 4kHz can be selected by
combinations. (See the sampling frequencies in FUNCTIONAL
DESCRIPTION on the selection of combinations.)

Pin to test the internal circuit. Set this pin to a high level or make it open
because it has a built-in pull-up resistor.

D0-D3

Input pins for ADPCM data.

Pin to test the internal circuit. Make this pin open.

GND

Ground pin

AOUT

Pin to output the analog voice from the low-pass filter. Connect a 0.01 mF
capacitor to this pin. (See the AOUT connecting circuit in FUNCTIONAL
DESCRIPTION on the connecting circuit.)

DAO

Pin to output the analog voice from the DA converter.

Pins to test the internal circuit. Set these pins to a low level or make them
open because pull-down resistors are included.

VCK

This pin outputs the sampling frequency selected by the combinations of
S1 and S2.
The voice synthesis starts or stops by synchronizing with VCK.

RESET

Reset pin. The voice synthesis circuit is initialized by synchronizing with
VCK. If this pin is set to a high level, the D0 to D3 data inputs are disabled
by synchronizing with VCK. The AOUT and DA0 pins output 1/2 V

and

become the state of no voice.

Pin to connect an oscillator. When the external clock is used, input it
from this pin.

Pin to connect an oscillator.
When the external clock is used, make this pin open.

Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
this pin and the GND pin.

DIP SOP SSOP

4-7

5, 7,

8, 10

7-10

Pin

Pin to test the internal circuit. Make this pin open.

¡ Semiconductor

MSM6585

ABSOLUTE MAXIMUM RATINGS

Condition

Ta = 25°C
Ta = 25°C

Rating

0.3 to +7.0

0.3 to V

+0.3

55 to +150

Unit

V
V

°C

Symbol

STG

Parameter

Power Supply Voltage
Input Voltage
Storage Temperature

(GND=0 V)

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

DC Characteristics

Min.

0.8¥V

0.1

0.4

--
20
--
--

400

--
--
10
50

Typ.

--
--
--
--

150

--
--

120

--
--
--

Max.

+0.1

0.2¥V

0.4

400

10
20

--
10
40
40
--

"H" Input Voltage

Condition

Unit

V
V
V
V

mA
mV

kW
kW

Symbol

--
--

VCK: IOH = 40mA

VCK: IOL = 40mA

T1, T2, RESET: V

= V

S1, S2, D0 - D3, T3: V

= V

XT: V

= V

T3: V

= 0V

S1, S2, D0 - D3, T1, T2,

RESET: V

=0V

XT=V

=0V

fosc=640kHz, No load

No load

--
--

Parameter

"L" Input Voltage
"H" Output Voltage
"L" Output Voltage
"H" Input Current
"H" Input Current
"H" Input Current
"L" Input Current

"L" Input Current

"L" Input Current
Current Consumption
DA Output Relative Error
DA Output Impedance
LPF Load Resistance

IH1

IH2

IH3

IL1

IL2

IL3

| V

DAE

DAO

AOUT

=4.5 to 5.5V, GND=0V, Ta=40 to +85°C)

Condition

Range

Unit

Symbol

Parameter

Power Supply Voltage
Operating Temperature
Master Clock Frequency

4.5 to 5.5

40 to +85

°C

oscillator connection

640

kHz

OSC

(GND = 0V)

¡ Semiconductor

MSM6585

AC Characteristics

Min.

Typ. Max.

Parameter

Unit

Symbol

Condition

VCK

= 250ms

= 125ms

= 62.5ms

=31.25ms

SAM

= 4kHz ...

= 8kHz ...

=16kHz ...

=32kHz ...

Original Oscillation
Duty Cycle
RESET Input Pulse Width
Data Setup Time
Data Hold Time

W(RST)

duty

2¥t

VCK

--
--
--

When data is shared with the MSM5205, note that the D3 to D0 selection timings of the MSM6585
and MSM5205 are different. (Refer to DIFFERENCES BETWEEN MSM6585 AND MSM5205.)

TIMING DIAGRAM

The VCK clock rising and falling edges are reversed between the MSM5205 and the MSM6588, as
indicated in DIFFERENCES BETWEEN MSM6585 AND MSM5205.
Note that the MSM6585 cannot accept data if the MSM5205 controls to repeat valid and invalid each
half cycle, when the MSM5205 is replaced with the MSM6585.

VCK

W(RST)

VCK/8

VCK (O)

RESET (I)

D3 - D0 (I)

IC internalD3 - D0

selection timings

AOUT, DAO (O)

ADPCM1 ADPCM2

ADPCMN

ADPCM

N+1

¡ Semiconductor

MSM6585

FUNCTIONAL DESCRIPTION

Sampling Frequency

The relationship of the sampling frequencies on S1 and S2, and the cutoff frequencies are
listed below.

Cutoff frequency (f

CUT

)

1.6 kHz
3.2 kHz
6.4 kHz
12.8 kHz

Sampling frequency (f

SAM

)

4 kHz
8 kHz
16 kHz
32 kHz

L
L

H
H

AOUT Connecting Circuit

Connect a 0.01mF capacitor to the AOUT pin. The circuit diagram is as shown below.

AOUT

0.01mF

MSM6585

Amplifier

Speaker

Even when the DAO pin is used, connect a 0.01mF capacitor to the AOUT pin. This capacitor is used
for the improvement of a voice quality.

Voice Output

The MSM6585 has two voice output pins. The DAO is direct output pin from the internal DA
converter. The AOUT is a pin to output a voice after which the DAO output passed a built-in LPF.

3.1

DA Converter Output Waveform

The output amplitude from the DA converter is max. (4095/4096) ¥ V

and becomes a stair step

waveform synchronized with the sampling frequency. The DAO output impedance varies in the
ranges from 10kW to 40kW. Therefore, determine the filter constant so that the resistor variation does
not have influence on the cutoff frequency of the filter.

¡ Semiconductor

MSM6585

3.2

Low-pass Filter Output

The cutoff frequency of the low-pass filter varies in proportion to the sampling frequency.
The following figure shows the low-pass filter characteristics in the sampling frequency
8kHz.

Oscillation

Following show external circuit diagrams using a ceramic resonator, KBR-640B made by
Kyocera Corp. and CSB640P made by Murata MFG. Co., Ltd.

100

10k

Frequency (Hz)

Damping factor (dB)

640kHz

220pF

MSM6585

220pF

Kyocera Corp.

KBR-640B used

640kHz

100pF

MSM6585

100pF

Murata MFG. Corp.

CSB640P used

1MW

¡ Semiconductor

MSM6585

APPLICATION CIRCUITS

Centronics Interface Circuit (sampling frequency : 8kHz)

BUSY

STROBE

RESET

D0
D1
D2
D3
D4
D5
D6
D7

0.1mF

7
5
3
1
6
4
2

13
12
11
10

9 13

1
6
3
5
8
7

AOUT

640kHz

D1 D0

0.01mF

AMP

MSM6585

ADPCM

DECODER

MSM4013

MSM4019

+5V

0.1mF

DAO

RESET

VCK
T4
T1
S2
GND
T2

Centronics Timing Chart

RESET

RES

DATA

STROBE

VCK

BUSY

MIN250msec

125msec

First byte

High nibble

Low nibble

¡ Semiconductor

MSM6585

Example of Interface Circuit with 256K-bit EPROM

The circuit example and timing diagram that used the 256K-bit EPROM are shown below.

MSM27256

A0 - A10

A11 A12 A13 A14

O0 O4 O1 O5 O2 O6 O3 O7

O0 - O11

O12

B1 A1

RESET

B2 A2 B3

MSM4019

KA D1

D2 D3

Q2 D2 Q2

CL1

CL2

MSM4013

R1D1S2 Q1R2

D1 D2

MSM6585

RESET S2 S1

AOUT

640kHz

0.01mF

100kW

Q2 Q3

MSM4040

RESET

START SW

10kW

0.1mF

100kW

(MSM4025)

M6585 VCK (O)

START SW

M4013 S1

M4013 Q1

M4013 Q2

M4040 Q1

Q12

M4040 Q3

(M6585 RESET)

(Lower 4-bit)

(Upper 4-bit)

VCK

MSM4040

¡ Semiconductor

MSM6585

PAD CONFIGURATION

Pad Layout

Product name

MSM6585

Function

ADPCM voice synthesis IC

Die size

¥ = 2.92 mm, Y = 3.58 mm

Die thickness

350

Pad size

130

m ¥ 130

Substrate voltage

GND

Pad Coordiantes
(The die center is located at X=0, Y=0)

PAD No.

PAD Name

X-axis

Y-axis

PAD No.

PAD Name

X-axis

Y-axis

377

1635

AOUT

1635

819

1635

DAO

1125

1635

1305

1635

1305

1579

1305

943

1305

1009

1305

VCK

1305

1095

RESET

1305

818

1305

1635

1281

1635

830

1635

529

1635

447

1580

299

1549

(Unit: mm)

267

1580

119

1549

¡ Semiconductor

MSM6585

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

SOP24-P-430-1.27-K

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.

Mirror finish

¡ Semiconductor

MSM6585

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

SSOP30-P-56-0.65-K

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.

Mirror finish

1Semiconductor

MSM6585

REVISION HISTORY

Page

Document

No.

Date

Edition

Current

Edition

Description

E2D0011-39-91

Sep. 1999

Final edition 1

Final edition 2

1 1

Changed the voice analysis editing tools from
AR203 and AR204 to AR207.

FEDL6585-02

Jun. 30, 2004

1 1

Changed the package product names from
MSM6585GS-K and MSM6585GS-AK to
MSM6585MAZXXX and MSM6585MBZXXX,
respectively.

FEDL6585-03

Aug. 25, 2004

10 10

Changed the product name of the circuit block in
the upper-left portion of the block diagram from
MSM4013 to MSM4040.

1Semiconductor

MSM6585

NOTICE

1. The information contained herein can change without notice owing to product and/or technical

improvements. Before using the product, please make sure that the information being referred to is
up-to-date.

2. The outline of action and examples for application circuits described herein have been chosen as an

explanation for the standard action and performance of the product. When planning to use the product,
please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.

When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation

resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the
specified maximum ratings or operation outside the specified operating range.

5. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is

granted by us in connection with the use of the product and/or the information and drawings contained
herein. No responsibility is assumed by us for any infringement of a third party's right which may result
from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment for commercial

applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any
system or application where the failure of such system or application may result in the loss or damage of
property, or death or injury to humans.

Such applications include, but are not limited to, traffic and automotive equipment, safety devices,
aerospace equipment, nuclear power control, medical equipment, and life-support systems.

Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MSM6585RS

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MSM6585RS