1/9
Semiconductor
MSM6597A-xxx
Semiconductor
MSM6597A-xxx
3-Mbit Serial Voice ROM
GENERAL DESCRIPTION
The MSM6597A is a MSM6597 short TAT process version.
The MSM6597A is a serial voice ROM with a 1,048,576-word 1-bit 3-bank configuration.
The MSM6597A has a built-in internal address-generating circuit. A single, external clock input
allows continuous, serial read operations. The internal addresses are automatically incremented
by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed
by inputting external serial addresses. Banks are switched with CS1, CS2, and CS3.
A read and playback device with predetermined messages can easily be configured by storing voice
data into the MSM6597A and by combining it with one of Oki's recording and playback ICs and with
one of Oki's serial registers.
A serial register is required to drive the MSM6597A when used with the MSM6388 or MSM6588. (The
MSM6597A does not operate without a serial register.)
The major differences between the MSM6597A and MSM6597 are shown below.
MSM6597A DC Characteristics
Parameter
Symbol
Condition
Min.
Max.
Unit
V
DD
= 3.5 to 5.5 V, Ta = 40 to +85C
Current Consumption (1)
I
DD
t
RDC
= 2.5 ms
--
20
mA
Current Consumption (2)
I
DS
CS1
= CS2
= CS3
= V
DD
0.2 V
Ta = 40
to +70C
10
mA
Typ.
9
--
Ta = 40
to +85C
50
--
--
--
MSM6597 DC Characteristics
For other detailes, refer to individual sections in this data sheet.
FEATURES
Configuration
:
1,048,576 words 1 bit 3 banks
Serial access
:
Read cycle time of 2.5 ms
Shorter-TAT processing
Power-supply voltage
:
5 V single supply
Package options :
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name : MSM6597A-xxxGS-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name : MSM6597A-xxxGS-AK)
E2D0040-39-22
Parameter
Symbol
Condition
Min.
Max.
Unit
Current Consumption (1)
I
DD
t
RDC
= 2.5 ms
--
15
mA
Typ.
--
Current Consumption (2)
I
DS
CS1
= CS2
= CS3
= V
DD
0.2 V
--
10
mA
--
Typical values are at V
DD
= 5.0 V, Ta = 25C
V
DD
= 3.5 to 5.5 V, Ta = 40 to +85C
This version: Feb. 1999
Previous version: May. 1997
2/9
Semiconductor
MSM6597A-xxx
SADY
SASY
CS2
CS1
NC
NC
NC
NC
SADX
SASX
TAS
V
DD
GND
CS3
DOUT
TESTO1
NC
NC
NC
NC
NC
RDCK
TESTO2
TEST
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
NC : No connection
24-Pin Plastic SOP
NC : No connection
30-Pin Plastic SSOP
SADY
SASY
CS2
NC
CS1
NC
NC
NC
NC
NC
NC
SADX
SASX
TAS
V
DD
GND
CS3
DOUT
TESTO1
NC
NC
NC
NC
NC
NC
NC
NC
RDCK
TESTO2
TEST
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
BLOCK DIAGRAM
PIN CONFIGURATION (TOP VIEW)
SADX
SASX
SADY
SASY
TAS
RDCK
CS2
CS1
X-ADDRESS
REGISTER
Sin
CK
Y-ADDRESS
REGISTER
Sin
CK
X-ADDRESS
COUNTER
LD
Y-ADDRESS
COUNTER
LD
CK
CK
10
10
X-DECODER
Y-DECODER
Memory Cell
Matrix
393216 x 8
MULTIPLEXER
V
DD
GND
TEST
TESTO1
TESTO2
DOUT
10
1
2
6
3
MULTIPLEXER
CS3
CS CONTROLLER
3/9
Semiconductor
MSM6597A-xxx
PIN DESCRIPTIONS
Type
Description
--
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the
GND pin.
--
Ground pin
I
(SERIAL ADDRESS) This pin inputs the starting X address of a read operation.
Addressing in units of 1024 words is possible. The 1024-word address data can be
input as 10-bit (AX0 - AX9) serial data via the SADX pin.
I
I
(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the
serial address data of the X address into the device's internal register.
(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the
serial address data of the Y address into the device's internal register.
I
(ADDRESS TRANSFER STROBE) This is the input pin for loading the serial address
data into the internal address counter.
The X and Y addresses are stored at the falling edge of TAS.
Symbol
V
DD
GND
SADX
SADY
SASX
TAS
(SERIAL ADDRESS) This pin inputs the starting Y address of a read operation.
Addressing in units of 1024 words is possible. The 1024-word address data can be
input as 10-bit (AY0 - AY9) serial data via the SADY pin.
I
SASY
I
(READ CLOCK) This is the clock input pin for reading information out of the data
register. Internal operation starts at the falling edge of RDCK. The information in the
data register is output on the DOUT pin. The internal address counter is automatically
incremented by 1 at the falling edge of RDCK.
RDCK
O
(DATA OUT) The data output pin is always kept in a high-impedance state when CS1,
CS2, and CS3 are all kept "H" or when RDCK is kept "H". This pin reflects the "H" or "L"
level data being read, and the current data is hold until RDCH is asserted High.
DOUT
I
(CHIP SELECT) When either CS1, CS2, or CS3 is "L", bank 1, bank 2, or bank 3 is
selected, respectively. Setting all three signals "H" disables all input and output
pins. These pins enable parallel use of multiple serial voice ROMs by connecting the
data output pins.
CS1
I
Pin for testing. Apply "L" level.
TEST
O
Pins for testing. Leave these pins open.
TESTO1
SSOP
SOP
15
12
30
24
12
9
1
1
13
10
2
2
14
11
18
15
28
22
CS2
CS3
5
3
29
4
3
23
TESTO2
16
13
27
21
17
14
Pin
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
V
DD
Ta = 25C
0.3 to +7.0
V
Input Voltage
V
IN
Ta = 25C
0.3 to V
DD
+0.3
V
Storage Temperature
T
STG
--
55 to +150
C
4/9
Semiconductor
MSM6597A-xxx
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
V
DD
GND=0V
3.5 to 5.5
V
Operating Temperature
T
op
--
40 to +85
C
Parameter
Symbol
Condition
Min.
Max.
Unit
V
DD
= 3.5 to 5.5 V, Ta = 40 to +85C
"H" Level Input Voltage
V
IH
--
0.8xV
DD
--
V
"L" Level Input Voltage
V
IL
--
--
0.8
V
"H" Level Output Voltage
V
OH
I
OH
= 40 mA
V
DD
0.3
--
V
"L" Level Output Voltage
V
OL
I
OL
= 2 mA
--
0.45
V
"H" Level Input Current
I
IH
V
IH
= V
DD
--
10
mA
"L" Level Input Current
I
IL
V
IL
= GND
10
--
mA
Current Consumption (1)
I
DD
t
RDC
= 2.5 ms
--
20
mA
Current Consumption (2)
I
DS
CS1
= CS2
= CS3
= V
DD
0.2 V
Ta = 40
to +70C
10
mA
Typ.
--
--
--
--
--
--
9
--
Ta = 40
to +85C
50
--
--
--
Typical values are at V
DD
= 5.0 V, Ta = 25
C
AC Characteristics
Parameter
Symbol
Min.
Max.
Unit
V
DD
= 3.5 to 5.5 V, Ta = 40 to +85C
CS, SAS Setup Time
t
CSS
1000
--
ns
SASX, SASY Cycle Time
t
SSC
500
--
ns
SASX, SASY Precharge Time
t
SAP
250
--
ns
SASX, SASY Pulse Width
t
SAS
250
--
ns
Address Setup Time
t
AS
100
--
ns
Address Hold Time
t
AH
100
--
ns
TAS Setup Time
t
ATS
500
--
ns
TAS, RDCK Setup Time
t
TRS
500
--
ns
TAS Pulse Width
t
TAS
250
--
ns
Read Cycle Time
t
RDC
2500
--
ns
Access Time
t
ACC
--
1500
ns
Output Turn-off Delay Time
t
OFF
0
200
ns
RDCK Precharge Time
t
RDP
1000
--
ns
RDCK Pulse Width
t
RD
1500
--
ns
5/9
Semiconductor
MSM6597A-xxx
TIMING DIAGRAMS
Serial Address Input Timing
,
,
CS2 (I)
SADX (I)
SASX (I)
SADY (I)
t
AH
TAS (I)
SASY (I)
AX1
AX2
AX3
AX4
AX5
AX6
AX7
AX8
AX9
t
AS
t
SAS
t
CSS
t
SSC
t
SAP
t
ATS
t
ATS
t
TAS
t
AS
t
AH
t
SAS
t
SAP
t
SSC
t
CSS
AX0
AY0
AY1
AY2
AY3
AY4
AY5
AY6
AY7
AY8
AY9
,
,
,
,
,
,
,
,
CS3 (I)
CS1 (I)
6/9
Semiconductor
MSM6597A-xxx
Read Access Timing
,
,
t
TAS
t
TRS
t
RDC
t
RD
t
RDP
t
OFF
t
ACC
X
n
Y
m
X
n
Y
m+1
X
n
Y
m+2
X
n
Y
1023
X
n+1
Y
0
X
n+1
Y
1
TAS (I)
RDCK (I)
DOUT (O)
7/9
Semiconductor
MSM6597A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
DV
DD
DV
DD'
AV
DD
D3
D2
D1
D0
RD
WR
CE
MCUM
TEST
RSEL1
RSEL2
TEST
TEST
TEST
TEST
RESET
MIN
MOUT
LIN
LOUT
AMON
FIN
FOUT
ADIN
SG
SAD
SAS
TAS
RWCK
WE
DIN
DOUT
AU/D
TEST
TEST
TEST
TEST
TEST
SAD
SAS
TAS
RWCK
WE
DI/O
CS1
CS2
CS3
CS4
MON
XT
XT
AOUT
MICROCONTROLLER
DGND AGND
V
DD
GND
GND
CS2
SADX
SASX
TAS
RDCK
DOUT
SASY
SADY
TEST
MSM6588
3-Mbit SERIAL VOICE ROM
MSM6597A-xxx
CS1
4.096 MHz
CS
+
+
V
DD
+
MSM6389
CS3
DGND
AGND
AV
DD
SPEAKER AMPLIFIER
Note: When the MSM6597A is driven by the MSM6388 or MSM6588, a serial register is required.
(The MSM6597A does not operate without it.)
8/9
Semiconductor
MSM6597A-xxx
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Mirror finish
9/9
Semiconductor
MSM6597A-xxx
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SSOP30-P-56-0.65-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.
Mirror finish
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party's industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party's right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
E2Y0002-29-11
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