Semiconductor
MSM7510
1/12
GENERAL DESCRIPTION
The MSM7510 is useful for the ITU-T V.21 modem, for examples, low cost built-in modems,
telecontrol systems, home security systems, etc.
The family version, MSM7512B for ITU-T V.23, will be available following this device.
Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these
devices need two power supplies, +5 V for digital and +12 V for analog.
New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power
consumption.
FEATURES
Conforms to ITU-T V.21, 300 bps Full Duplex
ITU-T V.25 Answer Tone (2100 Hz) with Generator/Detector
Single Power Supply : +3 V to +5 V
Low Power Consumption
Operating Mode:
25 mW Typ.
Power Down Mode :
0.1 mW Max.
Line Hybrid Circuit on Chip (direct drive capability of 600W)
ALB (AnalogLoop back) with test mode.
3.579545 MHz Crystal Oscillator
Digital Interface:
TTL
Package options:
16-pin plastic DIP
(DIP16-P-300-2.45)
(Product name: MSM7510RS)
24-pin plastic SOP
(SOP24-P-430-1.27-K)
(Product name: MSM7510GS-K)
Semiconductor
MSM7510
300 bps Full Duplex FSK Modem ITU-T V.21
E2A0013-16-X1
This version: Jan. 1998
Previous version: Nov. 1996
Semiconductor
MSM7510
2/12
BLOCK DIAGRAM
AI
(2)
X1
(6)
X2
(7)
V
DD
(1)
CLK
(8)
RD
(9)
CD
(10)
XD
(11)
RS
(12)
CONT.
Demodulator
Modulator
+
*R1
*R2
AO
(3)
*R3
*R2
AOG
*R2
EAI
(4)
O/A
(13)
MOD1
(14)
MOD2
(15)
AOG
(16)
CLK GEN.
OSC
SG GEN.
GND
(5)
* R1 to R3
50 kW
( ) : for MSM7510RS
*R1
FSK & ANS
Bandpass
Filter
+
Semiconductor
MSM7510
3/12
PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
V
DD
AI
AO
EAI
GND
X1
X2
CLK
AOG
MOD2
MOD1
O/A
RS
XD
CD
RD
16-Pin Plastic DIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
V
DD
NC
AI
AO
EAI
X1
NC
X2
AOG
NC
MOD2
NC
NC
CD
NC
CLK
NC
RD
24-Pin Plastic SOP
NC: No connect pin
NC
GND
MOD1
O/A
RS
XD
Semiconductor
MSM7510
4/12
PIN DESCRIPTION
Note :
I* : Internally pulled-up input pin.
1
1
V
DD
--
+3 V to +5 V Power Supply
2
3
AI
I
Analog receive signal input.
3
5
AO
O
Analog transmit signal output.
4
6
EAI
I
External analog signal input.
The signal applied to this pin is transmitted from AO via transmit output
amplifier. When not using this pin, it should be left opened.
5
7
GND
--
Ground, 0 V.
6
8
X1
I
3.579545 MHz crystal resonator should be connected to X1 and X2.
When applying external clock 3.579545 MHz to the device, it should be
applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1
has to be opened.
7
10
X2
O
8
12
CLK
O
3.579545 MHz clock signal output.
9
13
RD
O
Modem receive serial data output.
Digital "1" and "0" correspond to "Mark" and "Space", respectively. When
CD (Carrier Detect) is off, RD is held at "Mark" state.
10
15
CD
O
FSK receive signal and answer tone detect.
Digital "0" and "1" represent "Detect" and "Non-detect", respectively.
11
17
XD
I*
Modem transmit serial data input.
Digital "1" and "0" correspond to "Mark" and "Space", respectively.
12
18
RS
I*
FSK signal and answer tone transmit enable.
When digital "0" is applied to RS, transmitting becomes enable.
13
19
O/A
I*
Originate/Answer mode select.
Digital "1"
Originate mode
Digital "0"
Answer mode
14
20
MOD1
I*
Operation mode select.
Refer to Table 1.
15
22
MOD2
I*
16
24
AOG
I*
Analog transmit signal amplitude select.
Digital "1"
10 dBm Typ. at AO
Digital "0"
4 dBm Typ. at AO
Description
Name
I/O
RS GS-VK
No.
Semiconductor
MSM7510
5/12
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
DC Characteristics
*
Internally pulled-up pins
( V
DD
= +2.7 V to +5.5 V, Top = 40C to +85C)
Power Supply Current
I
DD
Operating Mode
--
5.0
10.0
mA
I
SS
Power Down Mode
--
5.0
20.0
mA
Digital Input Voltage
V
IL
--
0
--
0.8
V
V
IH
--
2.2
--
V
DD
V
Digital Input Leakage Current
I
IL
V
I
= 0 V *
80
--
10
mA
I
IH
V
I
= 5 V
10
--
10
mA
Digital Output Voltage
V
OL
I
OL
= 1.6 mA
0
0.2
0.4
V
V
OH
I
OH
= 0.4 mA
2.4
--
V
DD
V
Symbol
Condition
Min.
Typ.
Max.
Unit
Parameter
Power Supply Voltage
V
DD
Ta = 25C,
With respect to GND
0.3 to +7
V
Input Voltage
V
IN
0.3 to V
DD
+ 0.3
V
Storage Temperature
T
STG
55 to +150
C
--
Symbol
Condition
Rating
Unit
Parameter
Unit
Max.
Typ.
Min.
Condition
Symbol
Power Supply Voltage
V
+5.5
--
+2.7
--
V
DD
Operating Temperature
C
+85
--
40
--
Top
Input Clock Frequency
%
+0.1
--
0.1
To 3.579545 MHz
f
CLK
V
DD
Bypass Capacitor
mF
--
--
10
V
DD
GND
C
VDD
Oscillation Frequency
MHz
--
3.579545
--
--
--
Frequency Deviation
ppm
+100
--
100
+25C 5C
--
Temperature Characteristics
ppm
+50
--
50
40C to +85C
--
Equivalent Series Resistance
W
50
--
--
--
--
Load Capacitance
pF
--
16
--
--
--
Crystal
Parameter
Semiconductor
MSM7510
6/12
AC Characteristics
Modulator/analog output (AO) characteristics
*
0 dBm = 0.775 Vrms
(V
DD
= +2.7 V to +5.5 V, Top = 40C to +85C)
f
OM
f
OS
Originate Mode
XD = "1"
XD = "0"
976
1176
980
1180
984
1184
Hz
Hz
f
AM
f
AS
Answer Mode
XD = "1"
XD = "0"
1646
1846
1650
1850
1654
1854
Hz
Hz
FSK Transmit
Signal Frequency
Answer Tone Mode RS = "0"
2096
2100
2104
Hz
f
AST
V. 25 Answer Tone
Frequency
FSK Transmit
Signal, Answer
Tone Amplitude
V
AO1
V
AO2
AO
AOG = "0"
AOG = "1"
6
12
4
10
2
8
dBm
dBm
V
EA1
V
EA2
V
AO
V
EAI
AOG = "0"
AOG = "1"
2
8
0
6
2
4
dB
dB
Analog External
Input Signal Gain
FSK Transmit
Signal Amplitude
Ratio
V
AO
(MARK) V
AO
(SPACE)
2
0
2
dB
V
AOD
V
SPS
P : In-band Signal
Energy
(0.3 kHz to 3.4 kHz)
4 kHz to 8 kHz
8 kHz to 12 kHz
--
--
--
--
P20
P20
dB
dB
More than12 kHz
--
--
P60
dB
Out-of-band
Energy
To V
DD
/2
150
--
+150
mV
V
OFF
Output Offset Voltage
--
600
--
--
W
R
AO
Output Load
Resistance
Symbol
Condition
Min.
Typ.
Max.
Unit
Parameter
Semiconductor
MSM7510
7/12
Demodulator/analog input (Al, EAI) characteristics
*
0 dBm = 0.775 Vrms
AI
t
CDD
CD
t
CDH
Figure 1 Carrier Detect (CD) Timing
( V
DD
= +2.7 V to +5.5 V, Top = 40C to +85C)
V
ON
V
OFF
--
2
--
dB
V
HYS
Hysteresis (CD)
AI
--
10
--
M
W
R
AI
Input Resistance
Symbol
Condition
Min.
Typ.
Max.
Unit
Parameter
FSK Signal, at AI
--
--
6
dBm
V
AI
Receive Signal
Amplitude
V
ON
V
OFF
FSK Signal, at AI
I/O Alternative Pattern
OFF
ON
OFF
OFF
--
48
--
--
42
dBm
dBm
Receive Signal
Detect Amplitude (CD)
--
See Fig. 1
FSK Signal, Answer Tone
5
15
20
ms
t
CDD
CD Delay Time
20
40
60
ms
t
CDH
CD Hold Time
300 bps, I/O Alternative Pattern
10
--
10
%
D
BS
Receive Data (RD)
Bias Distortion
2100 Hz
20
--
20
Hz
f
ASR
Answer Tone Detect
(CD) Freq.
Detect, at AI
46
--
6
V
AON
Answer Tone Detect,
Non-Detect Amplitude
(CD)
Non-Detect, at AI
--
--
60
F
AOF
dB
EAI
20
--
--
k
W
R
EAI
Semiconductor
MSM7510
8/12
Figure 3 Analog Loop Back Test Mode
AI
AO
Phone
Line
Receive Filter
RD
XD
DTE
Transmit Filter
Demodulator
Modulator
Phone
Line
AI
AO
RD
XD
DTE
SG
Receive Filter
Transmit Filter
Demodulator
Modulator
Figure 2 FSK Modem Normal Mode
OPERATION MODE
Table 1 Operation Mode
* Answer Tone Transmit: RS = "0"
Enable
RS = "1"
Disable
Answer Tone Detect:
Detect
CD = "0"
Non-detect
CD = "1"
When transmitting the answer tone, CD is held at digital "1".
MOD2
MOD1
0
0
FSK Modem Normal Mode (Fig.2)
0
1
Analog Loop Back Test Mode (Fig.3)
1
0
Answer Tone Transmit/Detect Mode*
1
1
Power Down Mode
Mode
Semiconductor
MSM7510
9/12
APPLICATION CIRCUIT
MSM7510RS
1
AO
AI
V
DD
10
mF
EAI
GND
X1
X2
MOD1
MOD2
AOG
O/A
RS
XD
CD
CLK
RD
+
16
3.58 MHz
CONT.
8
9
2.2
mF
600
W
Lone
600
W : 600 W
+
To other circuit
MSM7510RS
1
AO
AI
V
DD
EAI
GND
X1
X2
MOD1
MOD2
AOG
O/A
RS
XD
CD
CLK
RD
16
CONT.
8
9
2.2
mF
600
W
Line
600
W : 600 W
2.2
mF
External Analog
Transmit Signal
100 pF
External Clock
3.58 MHz
10
mF
+
+
Semiconductor
MSM7510
10/12
An Example of the External Adjustment for a Transmitting Level and Detecting Level
If you desire to change the transmitting level or detecting level, adjust the external circuit
by referring to the following circuit.
Line transmitting level : V
AOL
= V
AO
(R2/R1)
IC input level
: V
AI
= V
AIL
(R4/R3)
Line
2.2
mF
51 k
W
51 k
W
600
W
R2
AI
600
W
R4
R3
R1
VAOL
VAO
VAI
AO
2.2
mF
51 k
W
51 k
W
VAIL
+
+
+
Semiconductor
MSM7510
11/12
(Unit : mm)
PACKAGE DIMENSIONS
DIP16-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
0.99 TYP.
Semiconductor
MSM7510
12/12
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
0.58 TYP.
Mirror finish
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