MSM7577
Semiconductor
1/8
GENERAL DESCRIPTION
The MSM7577 is an LSI for Audio Signal Level adjustment for telephone set, etc.
Conventionally, its circuit has been made within individual unit, such as amplifiers, resistors and
switches. However, using this LSI allows for simple mounting and economically small space.
FEATURES
Receiving system
Built-in electrical volume
Digital control (3 bit / 8 step)
For transmission voice, with side tone route available.
Mute function available.
Transmitting system
Built-in operational amplifier for transmission signal level adjustment.
Mute function available.
Single +2.7 V to +5.25 V power supply
Power down function
Package:
16-pin plastic SOP
(SOP16-P-300-1.27-K) (Product name : MSM7577MS-K)
APPLICATION
Cellular handset, cordless telephone, etc.
Semiconductor
MSM7577
Voice Signal Level Control LSI
E2A0045-16-X1
This version: Jan. 1998
Previous version: Nov. 1996
MSM7577
Semiconductor
2/8
BLOCK DIAGRAM
PIN CONFIGURATION (TOP VIEW)
RAUD
ATT0
ATT1
ATT2
ATTE
200 kW
AO3
AN3
MIC
200 kW
ATT0
ATT
ATT1
ATT2
ATTE
i
o
10 kW
56 kW
150 kW
35 kW
35 kW
RCV1
AN2
RCV2
TAUD
V
DD
GND
PD
+
+
+
+
+
SG
SG
SG
SG
SG
SG
TAUD 1
AN2 2
PD 3
RCV2 4
RCV1 5
NC 6
RAUD 7
GND 8
15 AO3
16 V
DD
14 MIC
13 AN3
12 ATTE
11 ATT2
10 ATT1
9
ATT0
16-Pin Plastic SOP
NC : No connect pin
MSM7577
Semiconductor
3/8
PIN DESCRIPTION
Pin No.
Name
I/O
Description
1
TAUD
O
Output pin of transmitting voice.
2
AN2
I
Receive voice input.
Gain control should be connected by a resistor between AN2 pin RCV2 pin.
4
RCV2
O
Output pin of receiving voice.
Gain control should be connected by a resistor between AN2 and RCV2 pin.
RCV2 signal is opposite phase to RCV1 signal.
6
NC
--
No Connection.
7
RAUD
I
Receive voice input.
8
GND
--
Ground (0 V).
9
10
11
ATT0
ATT1
ATT2
I
Volume control.
ATT2
ATT1
ATT0
Loss level (dB)
0
0
0
0 0.3
0
0
1
2 0.3
0
1
0
4 0.3
0
1
1
7 0.3
1
0
0
10 0.3
1
0
1
13 0.3
1
1
0
16 0.3
1
1
1
19 0.3
12
ATTE
I
Mute signal input.
H : Mute mode
L : Operating mode
13
AN3
I
Gain control and frequency responce control.
Gain control should be controlled by a resistor between AN3 and AO3.
14
MIC
I
Input pin of Microphone signal.
15
AO3
O
Gain control and frequency responce control.
Gain control should be controlled by a resistor between AN3 and AO3.
16
V
DD
--
Power supply (+3 V).
3
PD
1
Power down control.
H : Power down
L : Power on
5
RCV1
O
Receive voice input.
RCV1 signal is opposite phase to RCV2 signal.
MSM7577
Semiconductor
4/8
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min.
Max.
Unit
Power Supply Voltage
V
DD
0.3
+7.0
V
Digital Input Voltage
V
IND
0.3
V
DD
+ 0.3
V
Analog Input Voltage
V
INA
0.3
V
DD
+ 0.3
V
Storage Temperature
T
STG
55
+150
C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating Temperature
Ta
20
25
70
C
--
Power Supply Voltage
V
DD
+2.7
+3.00
+5.25
V
V
DD
Analog Output Load
Resistance 1
R
LA1
600
--
--
W
TAUD
Analog Output Load
Resistance 2
R
LA2
10
--
--
kW
Except TAUD pin.
MSM7577
Semiconductor
5/8
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Power Supply Current
I
DD
--
1.2
2.4
mA
V
DD
= 3.0 V
Low Level Input
Voltage
V
IL
0
--
0.3
VDD
V
ATT0 to ATT2
ATTE, PD
High Level Input
Voltage
V
IH
0.7
VDD
--
V
DD
V
ATT0 to ATT2
ATTE, PD
Digital Input Leakage
Current
I
IL
10
--
+10
mA
V
I
= GND
I
IH
V
I
= V
DD
Analog Input
Voltage Level
V
IA
--
--
1.2
V
P-P
RAUD, MIC
AN2, AN3
Analog Input
Resistance
R
IA
--
200
--
kW
RAUD
MIC
Analog Output
Level Range 1
V
01
1.2
--
--
V
P-P
RCV1, RCV2, AO3
R
L
= 5 kW (to SG level)
Analog Output
Level Range 2
V
02
1.2
--
--
V
P-P
TAUD
R
L
= 600 W (to SG level)
( Ta = 20C to 70C, V
DD
= 2.7 V to 5.25 V )
*V
DD
= 5.0 V
--
10.0
20
PD = V
DD
--
0.1
0.2
Power Down Current
--
mA
MSM7577
Semiconductor
6/8
Analog Interface Characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
RX-AUDIO
Path Gain
V
RXA
+14
+15
+16
dB
RAUD-RCV1
ATT = 0 dB
ATTE = L
RX-AUDIO
Loss Level (Mute)
L
RXA
40
--
--
dB
RAUD-RCV1
RAUD = 20 dBV
ATTE = 0 dB
ATTE = LH
MIC Path Gain
V
RTA
9.5
8.5
7.5
dB
MIC-RCV1
AO3 and AN3 are connected
( Ta = 20C to 70C, V
DD
= 2.7 V to 5.25 V )
TX-AUDIO
Loss Level
L
TXA
40
--
--
dB
MIC-TAUD
MIC = 20 dBV
ATTE = LH
TX-AUDIO
Path Gain
V
TXA
1.0
0
+1.0
dB
MIC-TAUD
AO3 and AN3 are connected
600 W load resistance
ATT
Establish Error
V
ATG
0.3
0
+0.3
dB
RAUD-RCV1
ATT0 to ATT2
TX-AUDIO
Distortion
--
--
--
8
%
MIC = 7.45 dBV
fi = 1 kHz
600 W load resistance
MSM7577
Semiconductor
7/8
R1 > 30 kW
R2 > 30 kW
C1 = 0.1 F
C2 = 1 F
C3 = 50 pF
C4 = 10 pF
Gain = R2/R1
Analog input
R3 > 10 kW
R4 > 10 kW
C5 > 1 F
C6 = 50 pF
Gain = R4/R3
R5 > 10 kW
R6 > 10 kW
C7 > 0.1 F
C8 > 1 F
C9 = 10 pF
Gain = 1 + (R5/R6)
Analog input
Receive voice data
Transmit voice data
R1
TAUD
V
DD
R2
AN2
PD
RCV2
RCV1
NC
RAUD
GND
AO3
MIC
AN3
ATTE
ATT2
ATT1
ATT0
C3
C1
C1
C2
MSM7577MS-K
+3 V
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C4
+
AN3
MIC
AO3
C9
C7
R6
C8
R5
+
MIC
AN3
AO3
R4
C5
C6
R3
In the Reverse Type
In the Same Phase Type
APPLICATION CIRCUIT
MSM7577
Semiconductor
8/8
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP16-P-300-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
0.21 TYP.
Mirror finish
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