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GENERAL DESCRIPTION
The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.
This IC has two user selectable playback algorithms, OKI Non-linear PCM and straight PCM. It
also contains a current mode 10-bit D/A converter and a low-pass filter.
External control has been made easy by the built-in edit ROM that can form sentences by linking
phrases. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control
Table can be easily set, created, edited, and evaluated.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM9802/03/
05 can support various applications.
FEATURES
Semiconductor
MSM9802/03/05-xxx
Voice Synthesis IC with Built-in Mask ROM
E2D0018-39-93
MSM9802
MSM9803
MSM9805
Speech period (sec)
f
SAM
=4.0 kHz
f
SAM
=6.4 kHz
f
SAM
=8.0 kHz
f
SAM
=16.0 kHz
ROM size*
512 Kbits
16.0
10.0
8.0
4.0
1 Mbit
32.4
20.2
16.2
8.1
2 Mbits
65.1
40.7
32.5
16.2
Device
*
Actual voice ROM area is smaller by 11 Kbits.
ROM custom
8-bit OKI nonlinear PCM method/8-bit straight PCM method
Built-in edit ROM
Random playback function
Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/
16.0 kHz
Note: If RC oscillation is selected, 10.6 kHz, 12.8 kHz, and
16.0 kHz cannot be selected.
Maximum number of phrases
: 63 (Microcontroller interface mode)
56 (Stand-alone mode)
Built-in current mode 10-bit D/A converter
Built-in low-pass filter
Standby function
RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable
Package options:
18-pin plastic DIP (DIP18-P-300-2.54)
(Product name: MSM9802-xxxRS/MSM9803-xxxRS/
MSM9805-xxxRS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9802-xxxGS-K/MSM9803-xxxGS-K/
MSM9805-xxxGS-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name: MSM9802-xxxGS-AK/MSM9803-xxxGS-
AK/MSM9805-xxxGS-AK)
xxx indicates code number.
Chip
Note: This data sheet explains a stand-alone mode and a microcontroller interface mode,
separately.
This version: Sep. 1999
Previous version: May. 1997
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CONTENTS
(1) Stand-alone Mode
BLOCK DIAGRAM ............................................................................................................................. 3
PIN CONFIGURATION ..................................................................................................................... 4
PIN DESCRIPTIONS ........................................................................................................................... 6
ABSOLUTE MAXIMUM RATINGS ................................................................................................. 8
RECOMMENDED OPERATING CONDITIONS ........................................................................... 8
ELECTRICAL CHARACTERISTICS ................................................................................................ 9
TIMING DIAGRAMS ....................................................................................................................... 12
FUNCTIONAL DESCRIPTION ....................................................................................................... 14
1. Playback Code Specification ............................................................................................. 14
2. Pull-up/Pull-down Resistor .............................................................................................. 14
3. Stand-alone Mode ............................................................................................................... 14
APPLICATION CIRCUITS .............................................................................................................. 19
(2) Microcontroller Interface Mode
BLOCK DIAGRAM ........................................................................................................................... 21
PIN CONFIGURATION ................................................................................................................... 22
PIN DESCRIPTIONS ......................................................................................................................... 24
ABSOLUTE MAXIMUM RATINGS ............................................................................................... 25
RECOMMENDED OPERATING CONDITIONS ......................................................................... 25
ELECTRICAL CHARACTERISTICS .............................................................................................. 26
TIMING DIAGRAMS ....................................................................................................................... 29
FUNCTIONAL DESCRIPTION ....................................................................................................... 31
1. Playback Code Specification ............................................................................................. 31
2. Address Data ....................................................................................................................... 31
3. Stop Code ............................................................................................................................. 32
4. Generating Pseudo - BUSY Signal through NAR pin.................................................... 33
APPLICATION CIRCUIT................................................................................................................. 34
(3) Common
1.
Sampling Frequency ........................................................................................................... 35
2.
Recording/Playback Time ................................................................................................. 35
3.
Playback Method ................................................................................................................ 36
4.
Phrase Control Table .......................................................................................................... 37
5.
RC Oscillation ...................................................................................................................... 39
6.
Ceramic Oscillation ............................................................................................................ 40
7.
Low-pass Filter .................................................................................................................... 42
8.
Standby Transition .............................................................................................................. 43
9.
Voice Output Unit Equivalent Circuit (AOUT, V
REF
Pins) .......................................... 44
D/A CONVERTER CURRENT CHARACTERISTICS ................................................................ 45
PAD CONFIGURATION ................................................................................................................. 46
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(1) STAND-ALONE MODE
(CPU/
STD
: "L" level)
BLOCK DIAGRAM
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
Multiplexer
Address &
Switching
Controller
6
PCM
Synthesizer
10
8
10-Bit
DAC
&
LPF
AOUT
DATA
Controller
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Timing Controller
GND
V
DD
RESET
Random
Circuit
I/O
Interface
OSC
XT/RC
XT/CR
A2
A1
A0
SW2
SW1
SW0
RND
BUSY
OSC1
OSC2
OSC3/TEST
CPU/STD
V
REF
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
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PIN CONFIGURATION (TOP VIEW)
18-Pin Plastic DIP
Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
A0
A1
A2
RESET
BUSY
GND
V
REF
AOUT
SW2
SW1
SW0
CPU/STD
OSC3/TEST
OSC2
OSC1
V
DD
XT/CR
RND
NC: No connection
24-Pin Plastic SOP
Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
V
DD
OSC1
OSC2
NC
OSC3/TEST
NC
RND
NC
AOUT
V
REF
GND
NC
BUSY
NC
RESET
NC
10
11
12
15
14
13
SW0
SW1
SW2
A2
A1
A0
CPU/STD
XT/CR
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1
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
22
V
DD
OSC1
OSC2
NC
NC
OSC3/TEST
NC
CPU/STD
NC
AOUT
V
REF
GND
NC
NC
BUSY
NC
XT/CR
NC
10
11
15
21
20
16
RND
NC
SW2
RESET
NC
A0
12
19
NC
NC
13
18
SW0
A2
14
17
SW1
A1
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
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PIN DESCRIPTIONS
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND
level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
RESET
I
Outputs "L" level while voice is being played back.
At power-on, this pin is at "H" level.
BUSY
O
XT/RC switching pin. Set to "H" level if ceramic oscillation is used.
Set to "L" level if RC oscillation is used.
XT/CR
I
Microcontroller interface/stand-alone mode switching pin.
Set to "L" level if the MSM9802/03/05 is used in stand-alone mode.
CPU/STD
I
Volume setting pin. If this pin is set to GND level, the maximum
current is forced in. If this pin is set to V
DD
level, the minimum current
is forced in. A pull-down resistor of approx. 10 W is internally
connected to this pin during operation.
V
REF
I
Voice output pin.
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
AOUT
O
Ground pin.
GND
--
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
V
DD
and GND pins.
V
DD
--
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
OSC1
I
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
Outputs "L" level in standby state.
OSC2
O
Leave this pin open when ceramic oscillation is used.
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
OSC3/TEST
O
Random playback starts if RND pin is set to "L" level.
Fetches addresses from random address generation circuit in the IC at
fall of RND. Set to "H" level when the random playback function is not
used. This pin has internal pull-up resistor.
RND
I
DIP
4
SOP
17
SSOP
21
6
20
25
5
18
23
14
7
8
8
23
29
9
24
30
7
22
28
10
1
1
11
2
2
12
3
3
13
5
6
15
8
10
Pin
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Symbol
Type
Description
Phrase input pins corresponding to playback sound.
If input changes, SW0 to SW2 pins fetch addresses after 16 ms and
start voice synthesis.
Each of these pins has internal pull-down resistor.
SW0 - SW2
I
Phrase input pins corresponding to playback sound.
Input logic of A0 pin becomes invalid if the random playback function
is used.
A0 - A2
I
DIP
SOP SSOP
16-18 10-12 13-15
1-3
13-15 16-18
Pin
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ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
Input Voltage
V
DD
Ta=25C
0.3 to +7.0
V
Storage Temperature
V
IN
0.3 to V
DD
+0.3
V
T
STG
55 to +150
C
--
(GND=0 V)
RECOMMENDED OPERATING CONDITIONS
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
V
DD
--
2.0 to 5.5
V
Master Clock Frequency 1
T
op
40 to +85
C
f
OSC1
Typ.
MHz
When crystal is selected
(GND=0 V)
Operating Temperature
--
Min.
Max.
4.096
3.5
4.5
256
200
300
Master Clock Frequency 2
f
OSC2
kHz
When RC is selected (*1)
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ELECTRICAL CHARACTERISTICS
DC Characteristics
*1 Applicable to SW0-SW2
*2 Applicable to RESET, RND
*3 Dynamic supply current (excluding DAC output current)
*4 Dynamic supply current at maximum output current
Parameter
Symbol
Condition
Unit
"H" Input Voltage
V
IH
--
--
V
V
IL
--
V
Typ.
(V
DD
=5.0 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
"L" Input Voltage
--
Min.
Max.
--
--
0.4
--
--
10
"H" Input Current 1
I
IH1
A
V
IH
=V
DD
4.6
--
--
0.8
4.2
--
V
OH
--
V
"H" Output Voltage
I
OH
=1 mA
V
OL
V
"L" Output Voltage
I
OL
=2 mA
90
30
200
"H" Input Current 2
I
IH2
A
Internal pull-down resistor
--
10
--
"L" Input Current 1
I
IL1
A
V
IL
=GND
90
200
30
"L" Input Current 2
I
IL2
A
Internal pull-up resistor
0.4
--
1
Dynamic Supply Current 1
I
DD1
mA
V
REF
=V
DD
,
AOUT bias voltage=0V
--
--
10
A
Ta=40 to +70C
*1
*2
10
7
13
V
REF
Pin Pull-down Resistance
R
VREF
kW
--
--
--
50
Standby Current
I
DS
A
Ta=70 to 85C
9.5
6
15
AOUT Output Current
I
AOUT
mA
At maximum output current,
V
REF
=GND,
AOUT bias voltage=0V
--
--
15
"H" Input Current 3
I
IH3
A
Applies to OSC1 pin only.
V
IH
=V
DD
*3
--
--
16
Dynamic Supply Current 2
I
DD2
mA
At maximum output current
V
REF
=GND,
AOUT bias voltage=0V
*4
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DC Characteristics
*1 Applicable to SW2-SW0
*2 Applicable to RESET, RND
*3 Dynamic supply current (excluding DAC output current)
*4 Dynamic supply current at maximum output current
Parameter
Symbol
Condition
Unit
"H" Input Voltage
V
IH
--
--
V
V
IL
--
V
Typ.
(V
DD
=3.1 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
"L" Input Voltage
--
Min.
Max.
--
--
0.4
--
--
10
"H" Input Current 1
I
IH1
A
V
IH
=V
DD
2.6
--
--
0.5
2.7
--
V
OH
--
V
"H" Output Voltage
I
OH
=1 mA
V
OL
V
"L" Output Voltage
I
OL
=2 mA
30
10
100
"H" Input Current 2
I
IH2
A
Internal pull-down resistor
--
10
--
"L" Input Current 1
I
IL1
A
V
IL
=GND
30
100
10
"L" Input Current 2
I
IL2
A
Internal pull-up resistor
0.15
--
0.5
Dynamic Supply Current 1
I
DD1
mA
V
REF
=V
DD
,
AOUT bias voltage=0V
10
7
13
V
REF
Pin Pull-down Resistance
R
VREF
kW
--
*1
*2
--
--
5
A
Ta=40 to +70C
--
--
20
Standby Current
I
DS
A
Ta=70 to 85C
3.2
1.4
5
AOUT Output Current
I
AOUT
mA
At maximum output current,
V
REF
=GND,
AOUT bias voltage=0V
--
--
15
"H" Input Current 3
I
IH3
A
Applies to OSC1 pin only.
V
IH
=V
DD
*3
--
--
5.5
Dynamic Supply Current 2
I
DD2
mA
At maximum output current
V
REF
=GND,
AOUT bias voltage=0V
*4
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AC Characteristics
Parameter
Symbol
Condition
Unit
Master Clock Duty Cycle
f
duty
--
50
%
t
w(RST)
--
s
Typ.
(V
DD
=5.0 V, GND=0 V, Ta=40 to +85C)
RESET Input Pulse Width
--
Min.
Max.
--
100
--
--
16
--
SW0-SW2 Input Pulse Width
t
w(SW)
ms
--
0
--
10
--
40
60
t
D(RST)
--
s
RESET Input Time After Power-on
--
t
w(RAN)
s
RND Input Pulse Width
--
--
--
10
BUSY Output Time
t
SBS
s
--
15
14
16
Chattering Prevention Time 1
t
CHA
ms
--
64
60
68
D/A Converter Change Time
t
DAR
, t
DAF
ms
--
250
200
300
Standby Transition Time
t
STB
ms
--
16
15
17
Random Address Fetch Time
t
RA
s
--
--
--
16
Chattering Prevention Time 2
t
CHB
ms
f
SAM
=8 kHz
375
350
500
Silence Time Between Phrases
t
BLN
s
--
(note)
(note)
(note)
(note)
(note)
(note)
(note)
(Note) Proportional to master the periods of oscillation frequencies f
OSC1
and f
OSC2
.
The rated values show values when the standard master oscillation frequency is used.
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TIMING DIAGRAMS
AC Characteristics at Power-On
AC Characteristics in Standby Status and when the IC is Activated
Repeated Playback Timing
SW0 (I)
BUSY (O)
AOUT (O)
t
BLN
SW2-SW0 (I)
A2-A0 (I)
First phrase
"000"
"000"
First phrase
Single phrase
playback
Single phrase
repeated playback
V
DD
RESET (I)
BUSY (O)
t
D(RST)
,
V
DD
Min
SW2-SW0 (I)
t
W(RST)
SW0 (I)
BUSY (O)
AOUT (O)
t
w(SW)
t
CHA
t
DAR
t
STB
t
DAF
t
SBS
Address data fetch
Oscillation start D/A converter change time
Standby status
Standby status
Standby transition time
,
SW2-SW0 (I)
A2-A0 (I)
,,,
First phrase
First phrase
"000"
"000"
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Timing when Changing from SW2 to SW0 During Playback
Repeated Playback Timing for Random Playback
RND (I)
BUSY (O)
AOUT (O)
First phrase
playback
Same phrase
repeated playback
Oscillation start
t
BLN
Timing when Changing from A2 to A0 During Playback
SW0 (I)
BUSY (O)
AOUT (O)
t
BLN
(Ex.)
A2-A0 (I)
First phrase
SW2-SW0 (I)
Second phrase
"000"
"000"
First phrase
First phrase
Second phrase
(Second phrase)
t
CHA
Address data fetch
First phrase
playback
Second phrase
playback
SW2 (I) "L"
SW1 (I)
SW0 (I)
BUSY (O)
AOUT (O)
t
BLN
First phrase playback stops
t
CHB
SW2-SW0 (I)
A2-A0 (I)
First phrase
"000"
"000"
First phrase
Second phrase
"000"
Second phrase
First phrase
playback
Second phrase
playback
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FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 56 phrases. Table 1.1 shows the settings by the A2-A0 and
SW2-SW0 pins.
Table 1.1 User-specified Phrases
A2-A0
Code Details
000
111
Inhibit code
User-specified phrase
(56 phrases)
SW2-SW0
000
001
111
Figure 3.1 SW Input Interface Single-Phrase Playback Timing
A2-A0 (I)
SW2-SW1 (I) "L"
SW0 (I)
BUSY (O)
AOUT (O)
t
w(SW)
Oscillation start
t
CHA
2. Pull-up/Pull-down Resistor
The RESET and RND pins have internal pull-up resistors and the SW2-SW0 pins have internal
pull-down resistors.
3. Stand-alone Mode
In a stand-alone mode, the SW input interface function and the random playback function can
be used.
3.1 SW input interface
With the SW input interface, speech synthesis starts when the state of the SW2-SW0 pins has
changed. To prevent chattering, the address data is latched 16 ms (t
CHA
) after the state of SW2-
SW0 has changed. Voice synthesis does not start if the state of the A2-A0 pins has changed. Set
the RND pin to "H" level if the random playback function is not used.
Set the A2-A0 pins to "L" level at power-on or at reset.
The SW input interface is effective when the MSM9802/03/05 is operated using a push-button
switch. Voice synthesis starts when an address is changed by pressing the push-button switch.
If the push-button switch is released during playback, then playback stops after the current
phrase is completed.
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If playback is attempted at an unused address in the phrases, AOUT goes to 1/2 I
AOUT
and
playback does not occur. Figure 3.2 shows the timing.
Figure 3.2 Timing when Playback is Attempted at an Unused Phrase Address
In the SW input interface, no phrase is triggered when SW2 to SW0 are all set to "0". Therefore,
when the circuit consists of a diode matrices that use push-button switches, the maximum
playback phrases are 56 phrases.
A2-A0 (I)
SW2-SW1 (I) "L"
SW0 (I)
BUSY (O)
AOUT (O)
Oscillation start
3.2 Random playback function
The random playback function randomly generates 15 different addresses corresponding to the
four bits of the addresses of A0 and SW2-SW0 (except ALL "L") on the IC, after which playback
commences.
Therefore, any input to A0 and SW2 to SW0 pins from external control is invalid. Hold these 4
pins either "H" or "L" level. SW2 to SW0 pins may be held open as they have internal pull-down
resistor.
Playback may not occur if all the 15 addresses have not been assigned a phrase. Care must be
taken when creating ROM data.
For example, when four phrases, "sunny", "rainy", "cloudy", and "snowy", are to be played
randomly, set the phrases as shown in Table 3.1 in which a phrase is assigned to all the 15
addresses. The four phrases are then played back at random as shown below.
000
001
002
111
A2-A0
8 codes
(000)
001
002
111
SW2-SW0
7 codes
= 56 Phrases
= 56
Code Prohibited
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RND (I)
BUSY (O)
AOUT (O)
t
W (RAN)
RESET (I)
Playback
(Address = 0001)
Playback
(Address = random)
t
W (RAN)
t
RA
Random address fixed time
Random address fixed time
t
RA
Oscillation start
Table 3.1 Random Address Setup Example
A2, A1
A0, SW2-SW0
Phrase
00
0001
0010
0011
0100
0101
1110
1111
sunny
rainy
cloudy
snowy
sunny
rainy
snowy
Random playback starts when the timing shown in Figure 3.3 is input to the RND pin. A random
address is fixed based on the "H" level time of the RND pin during IC oscillation. Random
address is captured at the fall of the RND pin, and voice playback commences. Therefore, when
power is turned on, or when RESET is input, the phrase at fixed address "0001" is played while
the random counter remains initialized until random playback is initiated.
Figure 3.3 Random Address Capture
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A2, A1
A0, SW2 to SW0
Phrase (Sample)
00
0001
0010
0011
0100
1111
Hit
Hit
Hit
Out
Out
01
0001
0010
0011
0100
1111
Hit
Out
Out
Out
Out
10
0001
0010
0011
0100
1111
White
Black
Red
Blue
Green
11
0001
1111
Table 3.2 Random Playback Address
For a random address, 15 phrases can be set for each logical condition of addresses A2 and A1
(i.e., "00", "01", "10", and "11").
In random playback, the four logic states ("000000", "010000", "100000" and "110000") in user-
specified phrases cannot be used. Take it into consideration when creating ROM data.
A random address is set by the "H" level time of the RND pin, so if the same pulse width is input
by microcontroller, the random address fixed time becomes constant, and a random phrase may
not be played under these conditions. The random address fixed time must be inconsistent in
order to produce random playback.
Figure 3.4 Timing when a Pulse is Input to the RND Pin During Random Playback
RND (I)
BUSY (O)
Invalid pulse
Pulse input during this time period is invalid
AOUT (O)
Oscillation start
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MSM9802/03/05-xxx
Semiconductor
Table 3.3 Random Playback and Stop Address
SW0
SW1
SW2
A0
A1
A2
RND
Figure 3.5 Circuit Example for Random Playback Stop
*
Address(es) corresponding to the A0 and SW2-SW0 pins
An unused user-specified address is used as a stop address, therefore the IC can enter standby
without voice playback, as shown in Figure 3.2.
A2, A1
A0, SW2-SW0*
Code Details
00
0001
1111
Random playback address
(15 addresses)
01
0001
Stop address
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Semiconductor
APPLICATION CIRCUITS
Address [HEX]
SW0
SW1
SW2
A0
A1
A2
1
0
0
0
0
0
S1
0
1
0
0
0
0
S2
0
0
1
0
0
0
S3
1
0
0
1
0
0
S1
0
1
0
1
0
0
S2
0
0
1
1
0
0
S3
S4="L"
S4="H"
01
02
04
09
0A
0C
S3
S2
S1
SW0
SW1
SW2
AOUT
V
DD
A0
A2
XT/CR
CPU/STD
GND
OSC3
OSC2
OSC1
S4
A1
RND
V
REF
BUSY
RESET
Application Circuit for Playing Six Phrases Using Four Switches
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MSM9802/03/05-xxx
Semiconductor
1234567
SW0
SW1
SW2
AOUT
V
DD
XT/
CR
CPU/
STD
RND
A0
A1
A2
GND
OSC3
OSC2
OSC1
V
REF
BUSY
RESET
Application Circuit Using Switches
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MSM9802/03/05-xxx
Semiconductor
(2) MICROCONTROLLER INTERFACE MODE
(CPU/
STD
: "H" level)
BLOCK DIAGRAM
ROM
(Including 11Kbit of
Edit ROM & Address ROM)
Multiplexer
Address
Controller
6
PCM
Synthesizer
10
8
10-Bit
DAC
&
LPF
AOUT
DATA
Controller
Address Counter
Timing Controller
GND
V
DD
RESET
I/O
Interface
OSC
XT/RC
XT/CR
I5
I4
I3
I2
I1
I0
ST
NAR
OSC1
OSC2
OSC3/TEST
CPU/STD
V
REF
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
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MSM9802/03/05-xxx
Semiconductor
PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
I3
I4
I5
RESET
NAR
GND
V
REF
AOUT
I2
I1
I0
CPU/STD
OSC3/TEST
OSC2
OSC1
V
DD
XT/CR
ST
18-Pin Plastic DIP
Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.
NC: No connection
24-Pin Plastic SOP
Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
V
DD
OSC1
OSC2
NC
OSC3/TEST
NC
ST
NC
CPU/STD
AOUT
V
REF
GND
NC
NAR
NC
RESET
NC
XT/CR
10
11
12
15
14
13
I0
I1
I2
I5
I4
I3
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MSM9802/03/05-xxx
Semiconductor
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
1
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
22
V
DD
OSC1
OSC2
NC
NC
OSC3/TEST
NC
CPU/STD
NC
AOUT
V
REF
GND
NC
NC
NAR
NC
XT/CR
NC
10
11
15
21
20
16
ST
NC
I2
RESET
NC
I3
12
19
NC
NC
13
18
I0
I5
14
17
I1
I4
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Semiconductor
PIN DESCRIPTIONS
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0 mA and becomes GND
level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
RESET
I
Signal output pin that indicates whether the 6-bit LATCH (see Block
Diagram) is idle. NAR at "H" level indicates that the LATCH is empty
and ST input is enabled.
NAR
O
XT/RC switching pin. Set to "H" level if ceramic oscillation is used.
Set to "L" level if RC oscillation is used.
XT/CR
I
Microcontroller interface/stand-alone mode switching pin. Set to "H"
level if the MSM9802/03/05 is used in microcontroller interface mode.
CPU/STD
I
Volume setting pin. If this pin is set to GND level, the maximum
current is forced in, and if set to V
DD
level, the minimum current is
forced in. An approx. 10 kW pull-down resistor is internally connected
to this pin during operation.
V
REF
I
Voice output pin.
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
AOUT
O
Ground pin.
GND
--
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
this pin and the GND pin.
V
DD
--
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
OSC1
I
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
Outputs "L" level in standby state.
OSC2
O
Leave this pin open when ceramic oscillation is used.
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
OSC3/TEST
O
Voice synthesis starts at fall of ST, and addresses I0 to I5 are fetched
at rise of ST. Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
ST
I
Phrase input pins corresponding to playback sound.
I0 - I5
I
DIP
SOP SSOP
4
17
21
6
20
25
5
18
23
14
7
8
8
23
29
9
24
30
7
22
28
10
1
1
11
2
2
12
3
3
13
5
6
15
8
10
16-18
1-3
10-15 13-18
Pin
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Semiconductor
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
Input Voltage
V
DD
Ta=25C
0.3 to +7.0
V
Storage Temperature
V
IN
0.3 to V
DD
+0.3
V
T
STG
55 to +150
C
--
(GND=0V)
RECOMMENDED OPERATING CONDITIONS
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
V
DD
--
2.0 to 5.5
V
Original Oscillation Frequency 1
T
op
40 to +85
C
f
OSC1
Typ.
MHz
When crystal is selected
(GND=0 V)
Operating Temperature
--
Min.
Max.
4.096
3.5
4.5
256
200
300
Original Oscillation Frequency 2
f
OSC2
kHz
When RC is selected (*1)
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Semiconductor
ELECTRICAL CHARACTERISTICS
DC Characteristics
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
Parameter
Symbol
Condition
Unit
"H" Input Voltage
V
IH
--
--
V
V
IL
--
V
Typ.
(V
DD
=5.0 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
"L" Input Voltage
--
Min.
Max.
--
--
0.4
--
--
10
"H" Input Current 1
I
IH1
A
V
IH
=V
DD
4.6
--
--
0.8
4.2
--
V
OH
--
V
"H" Output Voltage
I
OH
=1 mA
V
OL
V
"L" Output Voltage
I
OL
=2 mA
--
10
--
"L" Input Current 1
I
IL1
A
V
IL
=GND
90
200
30
"L" Input Current 2
I
IL2
A
Internal pull-up resistor
0.4
--
1
Dynamic Supply Current 1
I
DD1
mA
V
REF
=V
DD
,
AOUT bias voltage=0V
--
--
10
Standby Current
I
DS
A
Ta=40 to +70C
10
7
13
V
REF
Pin Pull-down Resistance
R
VREF
kW
--
--
--
50
A
Ta=70 to 85C
9.5
6
15
AOUT Output Current
I
AOUT
mA
At maximum output current,
V
REF
=GND,
AOUT bias voltage=0V
--
--
15
"H" Input Current 2
I
IH2
A
Applies to OSC1 pin only.
V
IH
=V
DD
*1
*2
--
--
16
Dynamic Supply Current 2
I
DD2
mA
At maximum output current
V
REF
=GND,
AOUT bias voltage=0V
*3
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MSM9802/03/05-xxx
Semiconductor
DC Characteristics
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
Parameter
Symbol
Condition
Unit
"H" Input Voltage
V
IH
--
--
V
V
IL
--
V
Typ.
(V
DD
=3.1 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
"L" Input Voltage
--
Min.
Max.
--
--
0.4
--
--
10
"H" Input Current 1
I
IH1
A
V
IH
=V
DD
2.6
--
--
0.5
2.7
--
V
OH
--
V
"H" Output Voltage
I
OH
=1 mA
V
OL
V
"L" Output Voltage
I
OL
=2 mA
--
10
--
"L" Input Current 1
I
IL1
A
V
IL
=GND
30
100
10
"L" Input Current 2
I
IL2
A
Internal pull-up resistor
0.15
--
0.5
Dynamic Supply Current 1
I
DD1
mA
V
REF
=V
DD
,
AOUT bias voltage=0V
10
7
13
V
REF
Pin Pull-down Resistance
R
VREF
kW
--
--
--
5
Standby Current
I
DS
A
Ta=40 to +70C
--
--
20
A
Ta=70 to 85C
3.2
1.4
5
AOUT Output Current
I
AOUT
mA
At maximum output current,
V
REF
=GND,
AOUT bias voltage=0V
--
--
15
"H" Input Current 2
I
IH2
A
Applies to OSC1 pin only.
V
IH
=V
DD
*1
*2
--
--
5.5
Dynamic Supply Current 2
I
DD2
mA
At maximum output current
V
REF
=GND,
AOUT bias voltage=0V
*3
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Semiconductor
AC Characteristics
Parameter
Symbol
Condition
Unit
Master Clock Duty Cycle
f
duty
--
50
%
t
w(RST)
--
s
Typ.
(V
DD
=5.0 V, GND=0 V, Ta=40 to +85C)
RESET Input Pulse Width
--
Min.
Max.
--
0.35
2000
--
1
--
Data Setup Time
t
DW
s
--
0
--
10
--
40
60
t
D(RST)
--
s
RESET Input Time After Power-on
--
t
(ST)
s
ST Input Pulse Width
--
--
--
10
NAR Output Time (1)
t
SNS
s
f
SAM
=8 kHz
375
350
400
NAR Output Time (2)
t
NAA
s
f
SAM
=8 kHz
440
315
500
NAR Output Time (3)
t
NAB
s
f
SAM
=8 kHz
375
350
500
NAR Output Time (4)
t
NAC
s
f
SAM
=8 kHz
64
60
68
D/A Converter Change Time
t
DAR
, t
DAF
ms
--
250
200
300
Standby Transition Time
(at end of voice output)
t
STB
ms
--
--
1
--
Data Hold Time
t
WD
s
--
--
--
t
SS
s
ST-ST Pulse Interval
Upon entering the stop code
--
--
t
STP
s
ST Signal Setup Time
At power-on
375
350
500
Silence Time Between Phrases
t
BLN
s
f
SAM
=8 kHz
40
1
(note)
(note)
(note)
(note)
(note)
(note)
(note)
(Note) Proportional to master the periods of oscillation frequencies f
OSC1
and f
OSC2
.
The rated values show values when the standard master oscillation frequency is used.
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Semiconductor
TIMING DIAGRAMS
AC Characteristics at Power-On
V
DD
RESET (I)
NAR (O)
t
D(RST)
V
DD
Min
ST (O)
,
t
W(RST)
t
STP
AC Characteristics in Standby Status and when the IC is Activated
AOUT (O)
t
DAR
t
STB
t
DAF
NAR (O)
ST ( I )
,
,,,
I5-I0 (I)
t
DW
t
WD
Voice playback
t
SNS
t
(ST)
t
NAA
Oscillation start
Standby transition time
D/A converter change time
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MSM9802/03/05-xxx
Semiconductor
Playback Timing
AOUT (O)
t
DAR
NAR (O)
ST ( I )
I5-I0 (I)
1st phrase address
2nd phrase address
3rd phrase address
1st phrase
playback
2nd phrase
playback
3rd phrase
playback
t
NAC
Oscillation start
t
NAB
t
BLN
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Semiconductor
FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 63 phrases. Table 1.1 shows the settings by the I5-I0 pins.
Table 1.1 User-specified Phrases
Code Details
Stop code
User-specified phrase
(63 Phrases)
I5-I0
000000
000001
111111
I5-I0 (I)
ST ( I )
NAR (O)
AOUT (O)
User phrase
Oscillation start
Voice end
2. Address Data
If a phrase is input at I5-I0 pins by address data, and if a ST pulse is then applied, voice playback
starts. Figure 2.1 shows voice start timing. Figure 2.2 shows timing when an address other than
a phrase is input.
Figure 2.1 Voice Start Timing
I5-I0 (I)
ST ( I )
NAR (O)
AOUT (O)
Address other than user phrase
Oscillation start
Figure 2.2 Timing when Address Other than a Phrase
is Input in Stand-by Mode
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Semiconductor
3. Stop Code
If I5-I0 are set to "000000" during voice playback, and a ST signal is input, playback stops
regardless of whether NAR is at "H" or "L" level, then AOUT becomes 1/2 I
AOUT
. Stop code
becomes valid at the falling edge of ST.
Figure 3.1 shows stop code input timing.
I5-I0 (I)
ST ( I )
NAR (O)
AOUT (O)
User phrase
"000000"
Voice stop
t
SS
The stop code does not initialize internal units but only stops playback. To initialize an internal
register, use the RESET pin.
Figure 3.1 Stop Code Input Timing
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Semiconductor
4. Generating Pseudo-BUSY Signal through NAR Pin
If the application in use requires a BUSY signal when this IC is used in microcontroller interface
mode, a pseudo-BUSY signal can be generated through the NAR pin by controlling signal timing,
as shown below.
4.1 When edit ROM is not used
I5-I0
ST
NAR
(Pseudo-BUSY)
AOUT
t
DAR
Phrase 1
01 (Phrase 1)
02 (Phrase 2)
03 (Phrase 3)
04 (Silence phrase of 32 ms or more)
30ms or more
30ms or more
30ms or more
t
NAB
t
NAB
t
NAB
Phrase 2
Phrase 3
t
DAF
t
STB
Silence
phrase
4.2 When edit ROM is used
I5-I0
ST
NAR
(Pseudo-BUSY)
AOUT
t
DAR
Phrase 1
01
(Phrases 1+2+3)
02 (Silence phrase of 32 ms or more)
30ms or more
t
BLN
t
NAB
Phrase 2
t
DAF
t
STB
Silence
phrase
t
BLN
Phrase
3
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MSM9802/03/05-xxx
Semiconductor
APPLICATION CIRCUIT
P2.2
P2.1
RESET
MSM83C154 (MCU)
MSM9802/03/05
ST
RESET
GND
V
DD
P1.0
I0
I5
I4
I3
I2
I1
P1.5
P1.4
P1.3
P1.2
P1.1
OSC2
V
REF
MSC1157 (Speaker AMP)
A
IN
GND
V
CC
SP
XTAL2
XTAL1
XT/CR
CPU/STD
OSC1
AOUT
P3.0
NAR
OSC3
STBY
VR
SEL
SP
+
+
Application Circuit in Microcontroller Interface
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Semiconductor
(3) Common
1. Sampling Frequency
As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.
Table 1.1 Sampling Frequency
Note: When RC oscillation is selected, 10.6 kHz, 12.8 kHz, and 16 kHz cannot be selected.
2. Recording/Playback Time
Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 11 Kbits of data area
is allocated for the Phrase Control Table, Phrase Data Control and Test Data.
Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 11
Kbits.
16.0 kHz
f
OSC1
/256
Unavailable
12.8 kHz
f
OSC1
/320
Unavailable
10.6 kHz
f
OSC1
/384
Unavailable
8.0 kHz
f
OSC1
/512
f
OSC2
/32
6.4 kHz
f
OSC1
/640
f
OSC2/
40
5.3 kHz
f
OSC1
/768
f
OSC2
/48
4.0 kHz
f
OSC1
/1024
f
OSC2
/64
Sampling Frequency
At standard
oscillation frequency
XT/CR="H"
Ceramic Oscillation
XT/CR="L"
CR Oscillation
Frequency diving ratio
Phrase Control Table Area
Pharase Data Control Area
Test Data Area
User's Area
4K bit
4K bit
3K bit
501K bit (MSM9802)
1013K bit (MSM9803)
2037K bit (MSM9805)
On-chip Mask ROM Capacity
512K bit (MSM9802)
1M bit (MSM9803)
2M bit (MSM9805)
Figure 2.1 Memory Allocation of On-chip Mask ROM
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Semiconductor
3. Playback Method
This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table
3.1 shows the relationship between playback methods and applicable sounds. It is recom-
mended to evaluate the sound quality before actual use.
Table 3.1 Relationship between playback methods and applicable sounds
The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.
Memory capacity [bit]
Bit rate [bps]
Memory capacity [bit]
Sampling frequency [Hz] 8 [bit]
Playback time [sec] =
=
(51211) 1024 [bit]
8000 [Hz] 8 [bit]
Playback time =
= 8.0 [sec]
For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the
maximum playback time is as follows.
Table 2.1 Maximum playback time
Playback method
Applicable sound
8-bit non-linear PCM algorithm Human voice
8-bit straight PCM algorithm
BEEP tone, sound effects
f
SAM
=16.0kHz
4.0
8.1
16.2
f
SAM
=8.0kHz
8.0
16.2
32.5
f
SAM
=6.4kHz
10.0
20.2
40.7
f
SAM
=4.0kHz
16.0
32.4
65.1
User's area
501K bit
1013K bit
2037K bit
ROM capacity
512K bit
1M bit
2M bit
Maximum playback time (sec)
Model
MSM9802
MSM9803
MSM9805
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Semiconductor
4. Phrase Control Table
Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in
succession by a single easy control operation like controlling a single regular phrase playback.
Up to 8 combined phrases including a silence can be registered in a single address in the Phrase
Control Table.
Further, you can use the maximum memory space for data storage because it is not required to
have the same phrase data.
To show an example, let's assume that your application needs to speak two similar sentences, "It
is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and
"today". What you have to do is to prepare these common sound data, not in sentences but in
words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and
Figure 4.1
Multiple phrases can be played continuously merely by specifying a desired phrase using an X
address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played,
and when address"02" is specified, "It is rainy" is played.
Phrase Control Table, a silence can be inserted without using the User's Area.
Minimum time for silence
32 ms
Maximum time for silence
2016 ms
Time unit for setting up silence
32 ms
Table 4.1 Matrix of the Phrase Control Table
No.
X-Address
(HEX)
Y-Address
(Up to 8 phrases)
Sound Data
1
01
2
02
3
03
62
3E
63
3F
[10]
Silence
[02]
[01]
[03]
[12]
Silence
[02]
[01]
[03]
[21]
[10]
[02]
[01]
[11] [12] [22] [03]
It is (silence) fine today.
It is (silence) rainy today.
It is fine becoming cloudy, rainy in some areas today.
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Semiconductor
Figure 4.1 Phrase Combination Matrix for Phrase Control Table
No. Y-Address
Phrase
1
01
2
02
3
03
16
10
17
11
18
12
19
13
32
20
33
21
34
22
63
3F
--
Phrase Data Registration Area
1
[01]
2
[02]
3
Silence (64ms)
4
[12]
5
[03]
6
--
7
--
8
--
Phrase Control Table Area
Phrase Addigned
0
Silence time
1
32 ms
2
64 ms
63
2016 ms
Silence time setting
(32ms
n)
No. X-Address
1
01
2
02
3
03
4
04
5
05
6
06
7
07
8
08
9
09
63
3F
it
is
today
fine
cloudy
rainy
snowy
ocasionally
becoming
in some areas
it
is
rainy
today
39/51
MSM9802/03/05-xxx
Semiconductor
Figure 5.1 RC Oscillation
5. RC Oscillation
Figure 5.1 shows an external circuit using RC oscillation. Figure 5.2 shows the RC oscillation
frequency characteristics.
OSC1
OSC2
OSC3
R1
R2
C
10
20
30
40
50
60
70
100
200
300
400
Oscillaiton Frequency f
OSC
(kHz)
Load Resistance R2 (kW)
V
DD
=5 V
C=30 pF
V
DD
=5 V
C=47 pF
150
250
350
450
0
50
500
V
DD
=3 V
C=47 pF
V
DD
=3 V
C=30 pF
R1=100 kW
Figure 5.2 RC Oscillation Frequency Characteristics
40/51
MSM9802/03/05-xxx
Semiconductor
5.1 Determining RC constants
The RC oscillation frequency characteristics are shown in Figure 5.2. If f
osc
is set to 256 kHz, use
the following values as a guide (see Figure 5.2) to set the C and R2 that fit the printed-circuit board
type used.
R1=100 kW, R2=30 kW, C=30 pF
When choosing RC oscillation, the RC oscillation frequency varies according to the fluctuation
of the external C and R2.
5.2 Fluctuation of RC oscillation frequencies
When choosing RC oscillation, the error of RC oscillation frequency due to process variations of
the IC is
4% maximum, and the fluctuation of the RC oscillation frequency when using a
capacitor (C) of
1% accuracy and a resistor (R2) of
2% accuracy is a maximum of
7%
approximately.
6. Ceramic Oscillation
Figure 6.1 shows an external circuit using a ceramic oscillator.
OSC1
OSC2
C1
C2
Figure 6.1 Ceramic Oscillation Diagram
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MSM9802/03/05-xxx
Semiconductor
For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., Kyocera Co., Ltd. and TDK Co., Ltd. are used.
Maker
Frequency
(MHz)
CSA4.09MGU
Type
Operating
temperature range
(C)
supply voltage range
(V)
C1 (pF)
C2 (pF)
Optimal load capacity
Ceramic oscillator
4.096
40 to +85
3.0 to 5.5
CST4.09MGWU
CSTCC4.00MG
3.6 to 5.5
CSTCC4.00MGU
4.0
2.7 to 5.5
PBRC4.00A
4.0
20 to +80
3.1 to 5.5
KBR-4.0MSB
PBRC4.00B
KBR-4.0MKC
CCR4.00MC3
4.0
40 to +85
2.4 to 5.5
Built in
Built in
15
15
33
33
Built in
Built in
Built in
Built in
Murata MFG.
Kyocera
TDK
30
30
(Note)
When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is
slower by 2 percent than that of an analysis tool or a demonstration board.
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MSM9802/03/05-xxx
Semiconductor
7. Low-Pass Filter
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table
7.2 show the LPF frequency characteristics and LPF cutoff frequency respectively.
Only the voice output through LPF is enabled in this IC.
0
20
40
60
[dB]
100
1k
10k
10
10
30
50
80
70
20
[Hz]
10
Figure. 7.1 LPF Frequency Characteristics (f
SAM
=8 kHz)
Table 7.2 LPF Cutoff Frequency
Sampling Frequency (kHz)
Cutoff Frequency (kHz)
(f
SAM
)
(f
CUT
)
1.2
1.6
4.0
5.3
2.0
6.4
2.5
8.0
3.2
10.6
4.0
12.8
5.0
16.0
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MSM9802/03/05-xxx
Semiconductor
8. Standby Transition
When playback of a phrase is finished, if playback of the next phrase does not start up within t
STB
(0.25 sec. typ.), the IC enters standby status and the entire operation stops.
A2 - A0
SW0
AOUT
BUSY
SW2 - SW1 "L"
Figure 8.1 Timing for Voice Playback during D/A Converter Change Time
(Stand-alone Mode)
I5 - I0
ST
AOUT
NAR
Figure 8.2 Timing for Voice Playback during D/A Converter Change Time
(Microcontroller Interface Mode)
If playback is attempted during D/A converter change time as shown in figures 8.1 and 8.2, the
IC exits from standby status and the output from the D/A converter begins going to the
1/2 I
AOUT
level. When the output reaches 1/2 I
AOUT
, voice playback starts.
44/51
MSM9802/03/05-xxx
Semiconductor
9. Voice Output Unit Equivalent Circuit (AOUT, F
REF
Pins)
Figure 9.1 Voice Output Unit Equivalent Circuit
PCM Value
V
DD
Current-Sourcing Type
D/A Converter
AOUT
Standby Signal
10kW
(TYP)
V
REF
(The above switch positions show those when the circuit is active.)
I
AOUT
45/51
MSM9802/03/05-xxx
Semiconductor
D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS
Power Supply Voltage vs. Output Current Characteristics (Ta=25
C, V
AOUT
=0V)
14
12
10
8
6
4
2
0
0
1
2
3
4
5
6
AOUT Output Current [mA]
Power Supply Voltage [V]
Temperature vs. Output Current Characteristics (V
DD
=5V, V
AOUT
=0V)
14
12
10
8
6
4
2
0
50
25
0
25
50
75
100
AOUT Output Current [mA]
Ambient Temperature Ta [C]
V
REF
Voltage vs. Output Current Characteristics (Ta=25
C, V
DD
=5V, V
AOUT
=0V)
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
V
REF
[V]
AOUT Output Current [mA]
46/51
MSM9802/03/05-xxx
Semiconductor
PAD CONFIGURATION
MSM9802
Pad Layout
Chip size
: X=3.22mm Y=3.17mm
Chip thickness
: 350
m
30
m
Pad size
: 110
m 110
m
Substrate potential
: GND
3
2
1
18
17
16
15
4
5
(NC)
6
7
8
9
10 11
12
14
13
MSM9802
Y-axis
X-axis
Pad Coordinates
(Chip center is located at X=0 and Y=0)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
415
1385
10
V
DD
462
1347
2
I4/ (A1)
816
1385
11
OSC1
742
1333
3
I5/ (A2)
1460
1385
12
OSC2
1349
1333
4
RESET
1460
1049
13
OSC3
1460
972
5
XT/CR
1458
20
14
CPU/STD
1389
183
6
NAR
1460
899
15
ST/(RND)
1389
1058
7
GND
1460
1375
16
I0/(SW0)
1389
1385
8
V
REF
1135
1333
17
I1/(SW1)
719
1385
9
AOUT
585
1333
18
I2/(SW2)
276
1385
(Unit: m)
Pad name in parentheses is for stand-alone mode.
47/51
MSM9802/03/05-xxx
Semiconductor
MSM9803
Pad Layout
Chip size
: X=3.22mm Y=4.06mm
Chip thickness
: 350
m
30
m
Pad size
: 110
m 110
m
Substrate potential
: GND
3
2
1
18
17
16
15
4
5
(NC)
6
7
8
9
10 11
12
14
13
MSM9803
Y-axis
X-axis
Pad Coordinates
(Chip center is located at X=0 and Y=0)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
415
1829
10
V
DD
452
1788
2
I4/ (A1)
816
1829
11
OSC1
742
1776
3
I5/ (A2)
1460
1829
12
OSC2
1349
1776
4
RESET
1460
1493
13
OSC3
1460
1415
5
XT/CR
1458
424
14
CPU/STD
1389
628
6
NAR
1460
1342
15
ST/(RND)
1389
1502
7
GND
1460
1818
16
I0/(SW0)
1389
1829
8
V
REF
1135
1776
17
I1/(SW1)
720
1829
9
AOUT
585
1776
18
I2/(SW2)
276
1829
(Unit: m)
Pad name in parentheses is for stand-alone mode.
48/51
MSM9802/03/05-xxx
Semiconductor
MSM9805
Pad Layout
Chip size
: X=3.22mm Y=5.96mm
Chip thickness
: 350
m
30
m
Pad size
: 110
m 110
m
Substrate potential
: GND
3
2
1
18
17
16
15
4
5
(NC)
6
7
8
9
10 11
12
14
13
MSM9805
Y-axis
X-axis
Pad Coordinates
(Chip center is located at X=0 and Y=0)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
415
2777
10
V
DD
452
2723
2
I4/ (A1)
816
2777
11
OSC1
742
2726
3
I5/ (A2)
1460
2777
12
OSC2
1349
2726
4
RESET
1460
882
13
OSC3
1460
1532
5
XT/CR
1458
364
14
CPU/STD
1453
267
6
NAR
1460
1546
15
ST/(RND)
1455
1338
7
GND
1460
2768
16
I0/(SW0)
1432
2777
8
V
REF
1136
2726
17
I1/(SW1)
754
2777
9
AOUT
585
2726
18
I2/(SW2)
312
2777
(Unit: m)
Pad name in parentheses is for stand-alone mode.
49/51
MSM9802/03/05-xxx
Semiconductor
(Unit : mm)
PACKAGE DIMENSIONS
DIP18-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.30 TYP.
50/51
MSM9802/03/05-xxx
Semiconductor
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Mirror finish
51/51
MSM9802/03/05-xxx
Semiconductor
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SSOP30-P-56-0.65-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.
Mirror finish
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party's industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party's right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
E2Y0002-29-62
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