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Электронный компонент: EE-SX1108

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Ultra-Compact Photomicrosensors
with Surface-Mount Design
s
Surface mount design, and tape and reel
packaging facilitate automated PCB
assembly
s
Compact size makes these sensors ideal
for use in applications with restricted
space
s
High-resolution sensing with
phototransistor output
s
Dual channel model that is ideal for
encoder applications (EE-SX1131)
Ordering Information
Appearance
Sensing method
Slot width
Slot depth
Sensing object
Weight
Part number
Transmissive
1 mm
2 mm
Opaque
0.05 g
EE-SX1107
0.15 x 0.6 mm min.
2 mm
2.8 mm
Opaque
0.1 g
EE-SX1108
0.3 x 1.0 mm min.
3 mm
3.5 mm
Opaque
0.1 g
EE-SX1109
0.5 x 1.0 mm min.
Dual channel
2 mm
2.8 mm
Opaque
0.1 g
EE-SX1131
transmissive
0.3 x 1.0 mm min.
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
2
EE-SX1107/1108/1109/1131
s
ABSOLUTE MAXIMUM RATING (T
A
=25
C)
Item
Symbol
Rated value
Emitter
Forward current
I
F
25 mA (see note)
Pulse forward current
I
FP
100 mA (duty: 1/100, pulse width: 0.1 ms)
Reverse voltage
V
R
5 V
Detector
Collector-emitter voltage
V
CEO
20 V
Emitter-collector voltage
V
ECO
5 V
Collector current
I
C
20 mA
Collector dissipation
P
C
75 mW (see note)
Ambient temperature
Operating
Topr
-30
to 85
C
Storage
Tstg
-40
to 90
C
Soldering (manual)
Tsol
300
C (3 second max.)
Soldering (reflow)
Tsol
240
C (10 second max)
Specifications
s
CHARACTERISTICS (T
A
=25
C)
Note:
Refer to Engineering Data if the ambient temperature is not within the normal room temperature range.
Item
Symbol
Value
Condition
Emitter
Forward voltage
V
F
1.1 V typ., 1.3 V max.
I
F
= 5 mA
Reverse current
I
R
10
A max.
V
R
= 5 V
Peak emission wavelength
P
(L)
940 nm typ.
I
F
= 20 mA
Detector
Dark current
I
D
100 nA max.
V
CE
= 10 V, 0
l
x
Peak spectral sensitivity
P
(P)
900 nm typ.
--
wavelength
Combination
Light current (collector-current)
I
L
50
A min., 150
A typ.,
I
F
= 5 mA, V
CE
= 5 V
500
A max.
Collector-emitter
V
CE
(sat)
0.1 V typ., 0.4 V max.
I
F
= 20 mA, I
L
= 50
A
saturation voltage
Rising time
tr
10
s typ. (see note)
V
CC
= 5 V, R
L
= 1K
Falling time
tf
10
s typ. (see note)
I
L
= 100
A
Note:
The following figures show the rising time (tr) and falling time (tf).
Input
Output
t
t
90%
10%
tr
tf
Input
Output
V
CC
I
L
R
L
3
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
Engineering Data
Note:
The operating conditions of the photomicrosensor must be within the absolute maximum rating ranges.
140
120
80
40
20
0
-40
-20
0
20
40
60
80
100
Collector dissipation P
C

(mW)
Ambient temperature Ta (
C)
100
60
50
40
30
20
0
-40
-20
0
20
40
60
80
100
Forward current I
F

(mA)
Ambient temperature Ta (
C)
10
50
40
30
20
0
1.0
1.1
1.2
1.3
1.4
1.6
Forward current I
F

(mA)
Forward voltage V
F
(V)
10
1.5
Ta=25
C
910
510
310
10
0
10
30
40
50
Light
current
I
L
(
A)
Forward current I
F
(mA)
20
Ta=25
C
V
CE
=5 V
810
710
610
410
210
110
910
410
210
10
0
10
30
40
50
Light
current
I
L
(
A)
Forward current I
F
(mA)
20
Ta=25
C
V
CE
=5 V
810
610
710
510
310
110
600
100
0
0
2
8
10
12
14
Light
current
I
L
(
A)
Collector-emitter voltage V
CE
(V)
4
6
500
400
300
200
700
5 mA
10 mA
Ta=25
C
600
100
0
0
2
8
10
12
14
Light
current
I
L
(
A)
Collector-emitter voltage V
CE
(V)
4
6
500
400
300
200
700
5 mA
10 mA
Ta=25
C
100
0
0
2
8
10
12
14
Light
current
I
L
(
A)
Collector-emitter voltage V
CE
(V)
4
6
600
500
400
300
200
700
5 mA
10 mA
Ta=25
C
100
60
0
-40
-20
0
20
40
60
80
100
Llight
current
I
L

(%)
Ambient temperature Ta (
C)
V
CE
=5 V
I
F
=5 mA
120
140
160
40
20
80
100
10
0.1
-40
-20
0
20
40
60
80
100
Dark current I
D

(nA)
Ambient temperature Ta (
C)
V
CE
=2 V
1000
1
V
CE
=10 V
1
1
10
100
Response
time
t r
,
t f
(
s)
Load resistance R
L
(K
)
1000
100
10
Input
Input
Output
Output
0
0
t
t
tr tf
V
CC
I
L
R
L
90%
10%
s
TEMPERATURE CHARACTERISTICS
s
INPUT CHARACTERISTICS
(TYPICAL)
s
INPUT/OUTPUT CHARACTERISTICS (TYPICAL)
EE-SX1107
EE-SX1108/1131
EE-SX1109
10
0
10
30
40
50
Light
current
I
L
(
A)
Forward current I
F
(mA)
20
Ta=25
C
V
CE
=5 V
910
410
210
810
610
710
510
310
110
s
OUTPUT CHARACTERISTICS (TYPICAL)
EE-SX1107
EE-SX1108/1131
EE-SX1109
s
LIGHT CURRENT
TEMPERATURE
DEPENDENCY (TYPICAL)
s
DARK CURRENT
TEMPERATURE
DEPENDENCY(TYPICAL)
s
RESPONSE TIME
CHARACTERISTICS
(TYPICAL)
EE-SX1107/1108/1109/1131
4
EE-SX1107/1108/1109/1131
120
80
40
0
-1.2
-0.6
0.6
1.2
Relative
light
current
I
L

(%)
Distance: d (mm)
100
60
20
0
d
V
CE
=5 V
I
F
=5 mA
120
100
60
40
20
0
-1.2
-0.6
0
0.6
1.2
Relative light current I
L
(%)
Distance: d (mm)
80
d
V
CE
=5 V
I
F
=5 mA
120
100
60
40
20
0
-0.6
-0.4
-0.2
0.2
0.4
0.6
Relative
light
current
I
L

(%)
Distance: d (mm)
80
d
V
CE
=5 V
I
F
=5 mA
0
120
100
60
40
20
0
-0.6
-0.4
-0.2
0.2
0.4
0.6
Relative
light
current
I
L

(%)
Distance: d (mm)
80
d
V
CE
=5 V
I
F
=5 mA
0
120
100
60
40
20
0
-0.6
-0.4
0.4
0.6
Relative
light
current
I
L

(%)
Distance: d (mm)
80
d
V
CE
=5 V
I
F
=5 mA
0.2
-0.2
0
120
100
60
40
20
0
-0.6
-0.4
0.4
0.6
Relative
light
current
I
L
(%)
Distance: d (mm)
80
d
V
CE
=5 V
I
F
=5 mA
0.2
-0.2
0
Dimensions
Unit: mm (inch)
s
EE-SX1107
Note:
1. Unless otherwise specified, tolerances are
0.15 mm.
2. The values in brackets are relative dimensions.
EE-SX1107
s
SENSING POSITION CHARACTERISTICS (TYPICAL)
EE-SX1108/1109/1131
s
SENSING POSITION CHARACTERISTICS (TYPICAL)
EE-SX1108
EE-SX1109
EE-SX1131
A
K
C
E
3.0 (0.12)
3.4 (0.13)
A
A
[0.5 (0.02)]
1.0
+0.2
(0.04)
1.2 (0.05)
1.0
(0.04)
2.0 (0.08)
3.0 (0.12)
[0.5 (0.02)]
[0.5 (0.02)]
Optical
axis
0
1.6 (0.06)
1.2 (0.05)
1.0
(0.04)
R 0.3
(0.01)
0.15
0.05 (0.01)
0.6 (0.02)
(Cross section AA view)
White stripe
5
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
2.0
+0.2
(0.08)
1.5
(0.06)
A
A
1.0 (0.04)
4.0
(0.16)
2.8
(0.11)
[0.5 (0.02)]
[0.5 (0.02)]
Optical
axis
[1.0 (0.04)]
0
s
EE-SX1108
Note:
1. Unless otherwise specified, tolerances are
0.15 mm.
2. The values in brackets are relative dimensions.
1.2
(0.05)
1.2
(0.05)
1.8 (0.07)
1.8 (0.07)
1.8 (0.07)
0.4 (0.02)
Pin assignment
Recommended soldering pattern
A
K
C
E
Anode
Cathode
Collector
Emitter
E
C
K
A
2.0 (0.08)
3.0 (0.12)
2.0 (0.08)
1.6
(0.06)
1.6
(0.06)
0.6 (0.02)
A
K
C
E
5.0 (0.20)
4.0
(0.16)
Pin assignment
2.2 (0.09)
1.0 (0.04)
1.6 (0.06)
R 0.3
(0.01)
E
C
K
A
C
E
Anode
Cathode
Collector
Emitter
E
C
K
A
Recommended soldering pattern
0.3
0.05 (0.01)
1.0 (0.04)
(Cross section AA view)
White stripe
EE-SX1107/1108/1109/1131
6
EE-SX1107/1108/1109/1131
Unit: mm (inch)
s
EE-SX1109
0.6 (0.02)
1.6 (0.06)
1.6 (0.06)
2.0 (0.08)
2.0 (0.08)
4.0 (0.16)
3.0
+0.2
(0.12)
1.5
(0.06)
[1.5
(0.06)]
A
1.0 (0.04)
Optical
axis
5.0
(0.20)
3.5
(0.14)
A
[0.5 (0.02)]
[0.5 (0.02)]
0
1.0 (0.04)
R 0.3
(0.01)
2.2 (0.09)
1.6 (0.06)
Pin assignment
A
K
C
E
4.0
(0.16)
6.0 (0.24)
A
K
C
E
Anode
Cathode
Collector
Emitter
E
C
K
A
Recommended soldering pattern
(Cross section AA view)
1.0
(0.04)
0.5
0.05 (0.02)
Note:
1. Unless otherwise specified, tolerances are
0.15 mm.
2. The values in brackets are relative dimensions.
White stripe
7
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
s
EE-SX1131
Note:
1. Unless otherwise specified, tolerances are
0.15 mm.
2. The values in brackets are relative dimensions.
A
NC
K
C
E1
E2
4.0
(0.16)
6.0 (0.24)
Pin assignment
1.4 (0.06)
1.4 (0.06)
1.0 (0.04)
1.0 (0.04)
R 0.3
(0.01)
1.0 (0.04)
1.0 (0.04)
2.0 (0.08)
2.0 (0.08)
3.0 (0.12)
0.4 (0.02)
0.4 (0.02)
1.0 (0.04)
2.8
(0.11)
[0.5 (0.02)]
2.0
+0.2
(0.08)
1.5
(0.06)
1.0 (0.04)
[1.0 (0.04)]
A
A
Optical
axis
[0.5 (0.02)]
4.0
(0.16)
0
Recommended soldering pattern
Anode
No connection
Cathode
NC
A
C
E1
E2
Collector
Emitter 1
Emitter 2
K
K
E1
E2
NC
C
A
(Cross section AA view)
0.8
0.05 (0.03)
0.3
0.05 (0.01)
1.0 (0.04)
White stripe
EE-SX1107/1108/1109/1131
8
EE-SX1107/1108/1109/1131
s
TAPE AND REEL
Reel
dia. 21.0
0.8 (0.83)
dia. 13.0
0.5 (0.51)
Label
dia.
80.0
1.0
(3.50)
dia.
330.0
2.0
(13.00)
12.4
+0.2
(0.49)
18.4 max. (0.73)
0
2.0
0.5
(0.08)
Tape
Unit: mm (inch)
A
K
C
E
0.3 (0.01)
h
l
m
4.0 (0.16)
dia. 1.5
(0.06)
1.75 (0.07)
5.5
(0.22)
12.0
(0.47)
Tape configuration
more than 40 mm (1.58)
n
more than 400 mm (15.76)
more than 40 mm (1.58)
Empty
Parts mounted
Leading part
Empty
Part number
Pieces per reel
EE-SX1107
2500
EE-SX1108/EE-SX1131
2000
EE-SX1109
1000
Quantity per reel
Figure 1
A
K
C
E
0.3 (0.01)
h
l
4.0 (0.16)
dia. 1.5
(0.06)
1.75 (0.07)
5.5
(0.22)
12.0
(0.47)
8.0 (0.32)
n
Figure 2
m
Part number
h
l
m
n
EE-SX1109
5.2 (0.20)
6.2 (0.24)
0.25 (0.01)
4.2 (0.17)
Part number
h
l
m
n
EE-SX1107
3.2 (0.13)
3.6 (0.14)
0.9 (0.04)
3.2 (0.13)
EE-SX1108
4.2 (0.17)
5.2 (0.20)
0.25 (0.01)
4.2 (0.17)
EE-SX1131
4.2 (0.17)
5.2 (0.20)
0.25 (0.01)
4.2 (0.17)
12.0
(0.47)
9
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
Manual soldering
"Sn 60" (60% tin and 40% lead) or solder with silver content
is recommended.
Use a soldering iron of less than 25W. The temperature of
the iron tip must be kept above 300
C (572
F).
Solder each land for a maximum of 3 seconds.
Precautions
s
SOLDERING INFORMATION
Reflow soldering
Reflow soldering must be done within 48 hours after opening
the aluminum envelope. The component must be stored
under 30
C at 80% RH.
The following soldering paste is recommended:
Melting temperature: 178~192
C
Composition: Sn 63%, Pb 37%
Recommended thickness of metal mask is between 0.2 mm
and 0.25 mm for screen printing.
The following chart illustrates the maximum temperature
limits for soldering:
140~160
C
60~120 sec.
250
200
150
100
T
emperature (
C)
Time
10 sec. max.
40 sec. max.
230
C max.
4
C/sec. max.
4
C/sec. max.
OMRON ELECTRONICS LLC
OMRON CANADA, INC.
One East Commerce Drive
885 Milner Avenue
Schaumburg, IL 60173
Scarborough, Ontario M1B 5V8
1-800-55-OMRON
416-286-6465
Cat. No. E02DAD2
3/01
Specifications subject to change without notice.
Printed in the U.S.A.