Surface Mount Relay

G6H2F

Low Profile, Miniature, Surface Mount
Relay

Ultra low profile only 5.2mm.

Can be soldered by VPS or IRS methods.

Impulse withstand voltage meets FCC and CCITT
rules.

Low power consumption, 140mW.

Available on tape for automatic insertion.

Ordering Information

Classification

Single-side stable

DPDT

Fully sealed

G6H-2F

Note:

1. When ordering, add the rated coil voltage to the model number.
Example: G6H-2F 12 VDC

2. When ordering tape packing, add `TR' to the model number.
Example: G6H-2F TR 12 VDC

3. `TR'is not part of the relay model number, it is not marked on the relay case.

Rated coil voltage

Tape packing

Model Number Legend:

Taped Version
TR:

Taped right

TL:

Taped left

Rated Coil Voltage
5, 12, 24 VDC

G6H2F -

Specifications

Coil Ratings

Single-side Stable Types

Rated voltage

5 VDC

12 VDC

24 VDC

Rated current

28.1 mA

11.7 mA

8.3 mA

Coil resistance

178

1,028

2,880

Coil inductance

Armature OFF

0.065

0.43

1.2

(H) (ref. value)

Armature ON

0.058

0.37

1.0

Must operate voltage

75% max. of rated voltage

Must release voltage

10% min. of rated voltage

Max. voltage

200% of rated voltage at 23

C, 150% at 70

170% of rated voltage at
23

C, 130% at 70

Power consumption

Approx. 140 mW

Approx. 200 mW

Note:

1. The rated current and coil resistance are measured at a coil temperature of 23

C with a tolerance of

10%.

2. Operating characteristics are measured at a coil temperature of 23

Contact Ratings

Load

Resistive load (cos

= 1)

Rated load

0.5 A at 125 VAC; 1 A at 30 VDC

Contact material

Ag (Au-clad)

Rated carry current

1 A

Max. switching voltage

125 VAC, 110 VDC

Max. switching current

1 A

Max. switching capacity

62.5 VA, 33 W

Min. permissible load

A at 10 mVDC

Note:

P level:

= 0.1 x 10

-6

/operation

Characteristics

Contact resistance

60 m

max.

Operate (set) time

3 ms max. (mean value: approx. 2 ms)

Release (reset) time

2 ms max. (mean value: approx. 1 ms)

Bounce time

Operate: 0.5 ms max.
Release: 0.5 ms max.

Max. operating frequency

Mechanical: 36,000 operations/hr
Electrical:

1,800 operations/hr (under rated load)

Insulation resistance

1,000 M

min. (at 500 VDC)

Dielectric withstand voltage

1,000 VAC, 50/60 Hz for 1 min between coil and contacts
1,000 VAC, 50/60 Hz for 1 min between contacts of different polarity
750 VAC, 50/60 Hz for 1 min between contacts of same polarity

Impulse withstand voltage

1,500 V 10 x 160

s between contacts of same polarity (conforms to FCC Part 68)

Vibration resistance

Destruction: 10 to 55 Hz, 5-mm double amplitude
Malfunction: 10 to 55 Hz, 3-mm double amplitude

Shock resistance

Destruction: 1,000 m/s

(approx. 100G)

Malfunction: 500 m/s

(approx. 50G)

Life expectancy

Mechanical: 100,000,000 operations min. (at 36,000 operations/hr)
Electrical:

200,000 operations min. (0.1 A at 110 VAC inductive load)

Ambient temperature

Operating: 40

C to 85

C (with no icing)

Ambient humidity

Operating: 35% to 85%

Weight

Approx. 1.5 g

Note:

The data shown above are initial values.

Approved by Standards

UL114, UL478 (File No. E41515)/CSA C22.2 No. 0, No. 14 (File No. LR24825)

Model

Contac tform

Contact form

G6H2F

DPDT

3 to 48 VDC

1A, 30 VDC
0.3A, 100 VDC
0.5A, 125 VDC

Engineering Data

Max. Switching Capacity

Life Expectancy

Switching current (A)

Switching voltage (V)

Switching current (A)

Life expectancy (x10 operations)

AC resistive load

DC resistive load

30-VDC resistive load

125-VAC resistive load

10,000

7,000

5,000

3,000

1,000

700

500

300

100

Dimensions

0.3

2.54

2.94

9.56

0.25

7.62

11.5

5.2

6.5

0.2

2.54

0.5

Note: Orientation marks are as follows:

Glue Pads

Precautions

Surface Temperature of PC Board VS. Recommended Soldering Time

1. VPS

2. IRS

Time (s)

215

C max.

Preheating

Soldering

Air
cooling

emperature ( C)

220
to
240

180
to
200

150

20 to 30

215

180
to
200

90
to
100

90 to 120

40 to 60

Preheating

Soldering

Air
cooling

90 to 120

3. Other Considerations

Soldering iron heat
Temperature at tip: 280

C to 300

Power: 30 W to 60 W
Heating time: 3 s to 5 s

When soldering with a pulse heater, hot air, or laser, take into
account such factors as heat stress, and test the process under
actual conditions.

Mounting

Can be mounted in any orientation.

Not suitable for socket mounting.

Do not reverse the coil polarity.

The diagram below the minimum spacing necessary when
mounting more than one relay on a printed circuit board.

2,54 mm min.

Surface Mounting Terminals

Terminals

L Terminals (G6H2F)

Characteristics

Soldering methods

IRS (Infrared radiation furnace)
VPS (Vapor phase)

Removal and replacement is simple.

Glue pads

Glue Pads

Glue pads are projections from the relay case where adhesive is
applied to temporarily attach the relay to the printed circuit board
before soldering. The soldering points are where solder is applied
during soldering.

Glue pads are for use with epoxy or UV adhesives. Glue pads
are located on the sides to allow UV illumination and adhesive
curing. Two points are provided for stability.

Orientation Marks

These marks are provided to properly position the relays when they
are supplied to the printed circuit board automatically. Two types of
orientation marks are provided.

Mechanical: A U-shaped impression along the top edge is used

for alignment.

Optical: A dark mark on the top surface is used for alignment.

Cleaning Methods

Brushing

Fine as long as the detergent has no chemical

Dipping

or electrical affect on the relay.

Spraying

Vapor

Hot water

Ultrasonic

Fine as long as the detergent has no chemical
or electrical affect on the relay. The model
number of the ultrasound cleaning-type relay
ends in "-U".

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