ChipFind - документация

Электронный компонент: 2N6394

Скачать:  PDF   ZIP
Semiconductor Components Industries, LLC, 2001
April, 2001 Rev. 3
1
Publication Order Number:
2N6394/D
2N6394 Series
Preferred Device
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls and power supplies.
Glass Passivated Junctions with Center Gate Geometry for Greater
Parameter Uniformity and Stability
Small, Rugged, Thermowatt Construction for Low Thermal
Resistance, High Heat Dissipation and Durability
Blocking Voltage to 800 Volts
Device Marking: Logo, Device Type, e.g., 2N6394, Date Code
*MAXIMUM RATINGS
(T
J
= 25
C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Repetitive OffState Voltage (Note 1.)
(T
J
= 40 to 125
C, Sine Wave,
50 to 60 Hz, Gate Open)
2N6394
2N6395
2N6397
2N6399
V
DRM,
V
RRM
50
100
400
800
Volts
On-State RMS Current
(180
Conduction Angles; T
C
= 90
C)
I
T(RMS)
12
A
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave, 60 Hz, T
J
= 90
C)
I
TSM
100
A
Circuit Fusing (t = 8.3 ms)
I
2
t
40
A
2
s
Forward Peak Gate Power
(Pulse Width
1.0
s, T
C
= 90
C)
P
GM
20
Watts
Forward Average Gate Power
(t = 8.3 ms, T
C
= 90
C)
P
G(AV)
0.5
Watts
Forward Peak Gate Current
(Pulse Width
1.0
s, T
C
= 90
C)
I
GM
2.0
A
Operating Junction Temperature Range
T
J
40 to
+125
C
Storage Temperature Range
T
stg
40 to
+150
C
*Indicates JEDEC Registered Data
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
SCRs
12 AMPERES RMS
50 thru 800 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
2N6394
TO220AB
500/Box
2N6395
TO220AB
2N6397
TO220AB
http://onsemi.com
500/Box
500/Box
K
G
A
PIN ASSIGNMENT
1
2
3
Anode
Gate
Cathode
4
Anode
2N6399
TO220AB
500/Box
TO220AB
CASE 221A
STYLE 3
1
2
3
4
MARKING
DIAGRAM
YY WW
639x
x
= 4, 5, 7 or 9
YY = Year
WW = Work Week
2N6394 Series
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Case
R
JC
2.0
C/W
Maximum Lead Temperature for Soldering Purposes 1/8
from Case for 10 Seconds
T
L
260
C
ELECTRICAL CHARACTERISTICS
(T
C
= 25
C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
*Peak Repetitive Forward or Reverse Blocking Current
(V
AK
= Rated V
DRM
or V
RRM
, Gate Open)
T
J
= 25
C
T
J
= 125
C
I
DRM
, I
RRM


10
2.0
A
mA
ON CHARACTERISTICS
*Peak Forward OnState Voltage (Note 2.)
(I
TM
= 24 A Peak)
V
TM
1.7
2.2
Volts
*Gate Trigger Current (Continuous dc)
(V
D
= 12 Vdc, R
L
= 100 Ohms)
I
GT
5.0
30
mA
*Gate Trigger Voltage (Continuous dc)
(V
D
= 12 Vdc, R
L
= 100 Ohms)
V
GT
0.7
1.5
Volts
Gate NonTrigger Voltage
(V
D
= 12 Vdc, R
L
= 100 Ohms, T
J
= 125
C)
V
GD
0.2
Volts
*Holding Current
(V
D
= 12 Vdc, Initiating Current = 200 mA, Gate Open)
I
H
6.0
50
mA
Turn-On Time
(I
TM
= 12 A, I
GT
= 40 mAdc, V
D
= Rated V
DRM
)
t
gt
1.0
2.0
s
Turn-Off Time (V
D
= Rated V
DRM
)
(I
TM
= 12 A, I
R
= 12 A)
(I
TM
= 12 A, I
R
= 12 A, T
J
= 125
C)
t
q

15
35

s
DYNAMIC CHARACTERISTICS
Critical RateofRise of Off-State Voltage Exponential
(V
D
= Rated V
DRM
, T
J
= 125
C)
dv/dt
50
V/
s
*Indicates JEDEC Registered Data
2. Pulse Test: Pulse Width
300
sec, Duty Cycle
2%.
2N6394 Series
http://onsemi.com
3
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol
Parameter
V
DRM
Peak Repetitive Off State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak On State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode
Forward Blocking Region
I
RRM
at V
RRM
(off state)
CT , MAXIMUM
ALLOW
ABLE CASE
TEMPERA
TURE ( C)
6.0
120
90
100
110
130
60
= 30
0
1.0
2.0
3.0
8.0
= CONDUCTION ANGLE
I
T(AV)
, AVERAGE ON STATE FORWARD CURRENT (AMPS)
90
P
,
A
VERAGE POWER (W
A
TTS)
(A
V)
12
0
4.0
8.0
20
T
J
125
C
I
T(AV)
, AVERAGE ON STATE CURRENT (AMPS)
7.0
0
1.0
2.0
3.0
8.0
= CONDUCTION ANGLE
4.0
5.0
7.0
180
dc
10
2.0
6.0
18
14
16
4.0
5.0
6.0
60
= 30
90
180
dc
125
95
105
115
Figure 1. Current Derating
Figure 2. Maximum OnState Power Dissipation
2N6394 Series
http://onsemi.com
4
1.0
0.02
0.03
0.05
0.07
0.1
100
0.2
0.3
0.5
0.7
0.2 0.3
0.5
1.0
2.0
1.2
0.1
Z
JC(t)
= R
JC
r(t)
1.0
60
SURGE IS PRECEDED AND
FOLLOWED BY RATED CURRENT
T
J
= 125
C
f = 60 Hz
NUMBER OF CYCLES
70
80
90
100
20
2.0
3.0
4.0
6.0
8.0
10
0.1
0.4
0.01
t, TIME (ms)
3.0
5.0
50
0.2
0.3
0.5
0.7
7.0
5.0
1.0
2.0
10
50
3.0
20
30
70
v
TH
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
2.8
4.4
3.6
5.2
6.0
2.0
30
50
100
200 300 500
2.0 k
10
3.0 k 5.0 k
10 k
1.0 k
I , PEAK SURGE CURRENT
(AMP)
TSM
r(t), TRANSIENT
THERMAL

RESIST
ANCE
(NORMALIZED)
TMi
, INST
ANT
ANEOUS ON-ST
A
TE CURRENT
(AMPS)
T
J
= 25
C
125
C
1 CYCLE
55
65
75
85
95
Figure 3. OnState Characteristics
Figure 4. Maximum NonRepetitive Surge Current
Figure 5. Thermal Response
2N6394 Series
http://onsemi.com
5
I , HOLDING CURRENT
(mA)
H
TYPICAL CHARACTERISTICS
140
120
100
80
60
40
0
-60
30
-20
-40
20
T
J
, JUNCTION TEMPERATURE (
C)
20
10
3.0
3.0
1.0
0.7
0.5
0.3
5.0
2.0
OFF STATE VOLTAGE = 12 V
OFF STATE VOLTAGE = 12 V
30
50
20
10
5.0
70
7.0
140
120
100
80
60
40
0
-20
-40
20
T
J
, JUNCTION TEMPERATURE (
C)
200
100
50
20
10
5.0
0.2
1.0
0.5
2.0
PULSE WIDTH (ms)
I GTM
I GT
V GT
140
120
100
80
60
40
0
-60
1.0
-20
-40
20
T
J
, JUNCTION TEMPERATURE (
C)
0.8
0.6
0.4
0.5
, PEAK
G
A
TE
C
URRENT
(mA)
3.0
100
200
300
160
,
G
A
TE TRI
GG
ER V
O
LT
A
G
E (V
O
LT
S
)
0.7
1.1
0.9
OFF STATE VOLTAGE = 12 V
OFF STATE VOLTAGE = 12 V
7.0
T
J
= -40
C
25
C
100
C
, GA
TE
TRIGGER CURRENT
(NORMALIZED)
Figure 6. Typical Gate Trigger Current
versus Pulse Width
Figure 7. Typical Gate Trigger Current
versus Temperature
Figure 8. Typical Gate Trigger Voltage
versus Temperature
Figure 9. Typical Holding Current
versus Temperature