PNP Silicon General Purpose
Amplifier Transistor
This PNP transistor is designed for general purpose amplifier
applications. This device is housed in the SOT416/SC90 package
which is designed for low power surface mount applications, where
board space is at a premium.
Reduces Board Space
High hFE, 210460 (typical)
Low VCE(sat), < 0.5 V
Available in 8 mm, 7inch/3000 Unit Tape and Reel
MAXIMUM RATINGS
(TA = 25
C)
Rating
Symbol
Value
Unit
CollectorBase Voltage
V(BR)CBO
60
Vdc
CollectorEmitter Voltage
V(BR)CEO
50
Vdc
EmitterBase Voltage
V(BR)EBO
6.0
Vdc
Collector Current -- Continuous
IC
100
mAdc
DEVICE MARKING
2SA1774 = F9
THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Power Dissipation(1)
PD
150
mW
Junction Temperature
TJ
150
C
Storage Temperature Range
Tstg
55 ~ +150
C
ELECTRICAL CHARACTERISTICS
(TA = 25
C)
Characteristic
Symbol
Min
Typ
Max
Unit
CollectorBase Breakdown Voltage (IC = 50
Adc, IE = 0)
V(BR)CBO
60
--
--
Vdc
CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)
V(BR)CEO
50
--
--
Vdc
EmitterBase Breakdown Voltage (IE = 50
Adc, IE = 0)
V(BR)EBO
6.0
--
--
Vdc
CollectorBase Cutoff Current (VCB = 30 Vdc, IE = 0)
ICBO
--
--
0.5
nA
EmitterBase Cutoff Current (VEB = 5.0 Vdc, IB = 0)
IEBO
--
--
0.5
A
CollectorEmitter Saturation Voltage(2)
(IC = 50 mAdc, IB = 5.0 mAdc)
VCE(sat)
--
--
0.5
Vdc
DC Current Gain(2)
(VCE = 6.0 Vdc, IC = 1.0 mAdc)
hFE
120
--
560
--
Transition Frequency
(VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz)
fT
--
140
--
MHz
Output Capacitance (VCB = 12 Vdc, IE = 0 Adc, f = 1 MHz)
COB
--
3.5
--
pF
1. Device mounted on a FR4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width
300
s, D.C.
2%.
ON Semiconductort
Semiconductor Components Industries, LLC, 2001
November, 2001 Rev. 4
1
Publication Order Number:
2SA1774/D
2SA1774
PNP GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
CASE 46301, STYLE 1
SOT416/SC90
1
2
3
COLLECTOR
3
1
BASE
2
EMITTER
2SA1774
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2
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 1. IC VCE
VCE, COLLECTOR VOLTAGE (V)
Figure 2. DC Current Gain
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
IB, BASE CURRENT (mA)
Figure 4. On Voltage
IC, COLLECTOR CURRENT (mA)
I C
, COLLECTOR CURRENT (mA)
0
120
90
60
30
0
3
6
9
15
DC CURRENT GAIN
1000
0.1
100
10
1
10
100
TA = 25
C
TA = -25
C
TA = 75
C
VCE = 10 V
V CE
, COLLECTOREMITTER VOL
T
AGE (V)
2
0.01
1.5
1
0.5
0
0.1
1
10
100
TA = 25
C
COLLECTOR VOL
T
AGE (mV)
900
0.2
800
700
600
500
400
300
200
100
0.5
1
5
10
20
40
60
80 100 150 200
TA = 25
C
VCE = 5 V
12
0
TA = 25
C
300
A
IB = 50
A
100
150
200
250
Figure 5. Capacitance
VCB (V)
Figure 6. Capacitance
VEB (V)
13
0
12
11
10
9
6
1
2
3
4
14
0
C ib
,
INPUT
CAPACIT
ANCE
(
p
F)
12
10
8
6
4
0
10
20
30
40
C ob
, CAP
ACIT
ANCE (pF)
8
7
2
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3
1.4
1
0.5 min. (3x)
0.5 min. (3x)
TYPICAL
0.5
SOLDERING PATTERN
Unit: mm
PD =
TJ(max) TA
R
JA
PD =
150
C 25
C
833
C/W
= 150 milliwatts
The soldering temperature and time should not
exceed 260
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5
C or less.
After soldering has been completed, the device
should be allowed to cool naturally for at least three
minutes. Gradual cooling should be used as the use of
forced cooling will increase the temperature gradient
and result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied dur-
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
INFORMATION FOR USING THE SOT416 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the to-
tal design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
SOT416/SC90 POWER DISSIPATION
The power dissipation of the SOT416/SC90 is a func-
tion of the pad size. This can vary from the minimum pad
size for soldering to the pad size given for maximum pow-
er dissipation. Power dissipation for a surface mount de-
vice is determined by TJ(max), the maximum rated junction
temperature of the die, R
JA, the thermal resistance from
the device junction to ambient; and the operating tempera-
ture, TA. Using the values provided on the data sheet, PD
can be calculated as follows.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into
the equation for an ambient temperature TA of 25
C, one
can calculate the power dissipation of the device which in
this case is 125 milliwatts.
The 833
C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve
a power dissipation of 150 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad
TM
. Using a board material
such as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the
rated temperature of the device. When the entire device is
heated to a high temperature, failure to complete soldering
within a short time could result in device failure. There-
fore, the following items should always be observed in
order to minimize the thermal stress to which the devices
are subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
C or less.*
When preheating and soldering, the temperature of
the leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of
10
C.
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4
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
STEP 7
COOLING
200
C
150
C
100
C
50
C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
TO 219
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
C
150
C
160
C
140
C
Figure 7. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170
C
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating "profile" for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on
a high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system
was used to generate this profile. The type of solder used
was 62/36/2 Tin Lead Silver with a melting point between
177189
C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large
surface area, absorbs the thermal energy more efficiently,
then distributes this energy to the components. Because of
this effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
2SA1774
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5
PACKAGE DIMENSIONS
CASE 46301
ISSUE B
SC75 (SC90, SOT416)
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
0.70
0.80
0.028
0.031
B
1.40
1.80
0.055
0.071
C
0.60
0.90
0.024
0.035
D
0.15
0.30
0.006
0.012
G
1.00 BSC
0.039 BSC
H
---
0.10
---
0.004
J
0.10
0.25
0.004
0.010
K
1.45
1.75
0.057
0.069
L
0.10
0.20
0.004
0.008
S
0.50 BSC
0.020 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
M
0.20 (0.008)
B
A
B
S
D
G
3 PL
0.20 (0.008) A
K
J
L
C
H
3
2
1
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
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Notes
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Notes
2SA1774
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be
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PUBLICATION ORDERING INFORMATION
JAPAN: ON Semiconductor, Japan Customer Focus Center
4321 NishiGotanda, Shinagawaku, Tokyo, Japan 1410031
Phone: 81357402700
Email: r14525@onsemi.com
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For additional information, please contact your local
Sales Representative.
2SA1774/D
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