JFET Chopper Transistors
NChannel -- Depletion
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
DrainGate Voltage
VDG
35
Vdc
GateSource Voltage
VGS
35
Vdc
Gate Current
IG
50
mAdc
Total Device Dissipation @ TA = 25
C
Derate above 25
C
PD
350
2.8
mW
mW/
C
Lead Temperature
TL
300
C
Operating and Storage Junction
Temperature Range
TJ, Tstg
65 to +150
C
ELECTRICAL CHARACTERISTICS
(TA = 25
C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
GateSource Breakdown Voltage
(IG = 1.0
Adc)
V(BR)GSS
35
--
Vdc
Gate Reverse Current
(VGS = 15 Vdc)
IGSS
--
1.0
nAdc
Gate Source Cutoff Voltage
(VDS = 5.0 Vdc, ID = 1.0
Adc)
J111
J112
J113
VGS(off)
3.0
1.0
0.5
10
5.0
3.0
Vdc
DrainCutoff Current
(VDS = 5.0 Vdc, VGS = 10 Vdc)
ID(off)
--
1.0
nAdc
ON CHARACTERISTICS
ZeroGateVoltage Drain Current(1)
(VDS = 15 Vdc)
J111
J112
J113
IDSS
20
5.0
2.0
--
--
--
mAdc
Static DrainSource On Resistance
(VDS = 0.1 Vdc)
J111
J112
J113
rDS(on)
--
--
--
30
50
100
Drain Gate and Source Gate OnCapacitance
(VDS = VGS = 0, f = 1.0 MHz)
Cdg(on)
+
Csg(on)
--
28
pF
Drain Gate OffCapacitance
(VGS = 10 Vdc, f = 1.0 MHz)
Cdg(off)
--
5.0
pF
Source Gate OffCapacitance
(VGS = 10 Vdc, f = 1.0 MHz)
Csg(off)
--
5.0
pF
1. Pulse Width = 300
s, Duty Cycle = 3.0%.
ON Semiconductort
Semiconductor Components Industries, LLC, 2001
June, 2001 Rev. 1
1
Publication Order Number:
J111/D
J111
J112
J113
CASE 2911, STYLE 5
TO92 (TO226AA)
1
2
3
1 DRAIN
2 SOURCE
3
GATE
J111 J112 J113
http://onsemi.com
2
t f
, F
ALL
TIME (ns)
t r
, RISE
TIME (ns)
t d(on)
,
TURN-ON DELA
Y
TIME (ns)
1000
1.0
2.0
5.0
10
20
50
100
200
500
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30
50
ID, DRAIN CURRENT (mA)
Figure 1. TurnOn Delay Time
RK = 0
TJ = 25
C
J111
J112
J113
VGS(off) = 12 V
= 7.0 V
= 5.0 V
RK = RD
1000
1.0
2.0
5.0
10
20
50
100
200
500
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30
50
ID, DRAIN CURRENT (mA)
Figure 2. Rise Time
RK = RD
RK = 0
TJ = 25
C
J111
J112
J113
VGS(off) = 12 V
= 7.0 V
= 5.0 V
1000
1.0
2.0
5.0
10
20
50
100
200
500
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30
50
ID, DRAIN CURRENT (mA)
Figure 3. TurnOff Delay Time
RK = RD
RK = 0
TJ = 25
C
J111
J112
J113
VGS(off) = 12 V
= 7.0 V
= 5.0 V
t d(of
f),
TURN-OFF DELA
Y
TIME (ns)
1000
1.0
2.0
5.0
10
20
50
100
200
500
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30
50
ID, DRAIN CURRENT (mA)
Figure 4. Fall Time
RK = RD
RK = 0
TJ = 25
C
J111
J112
J113
VGS(off) = 12 V
= 7.0 V
= 5.0 V
TYPICAL SWITCHING CHARACTERISTICS
NOTE 1
The switching characteristics shown above were measured using a test cir-
cuit similar to Figure 5. At the beginning of the switching interval, the gate
voltage is at Gate Supply Voltage (VGG). The DrainSource Voltage
(VDS) is slightly lower than Drain Supply Voltage (VDD) due to the voltage
divider. Thus Reverse Transfer Capacitance (Crss) or GateDrain Capaci-
tance (Cgd) is charged to VGG + VDS.
During the turnon interval, GateSource Capacitance (Cgs) discharges
through the series combination of RGen and RK. Cgd must discharge to
VDS(on) through RG and RK in series with the parallel combination of ef-
fective load impedance (R
D) and DrainSource Resistance (rds). During
the turnoff, this charge flow is reversed.
Predicting turnon time is somewhat difficult as the channel resistance
rds is a function of the gatesource voltage. While Cgs discharges, VGS ap-
proaches zero and rds decreases. Since Cgd discharges through rds, turnon
time is nonlinear. During turnoff, the situation is reversed with rds in-
creasing as Cgd charges.
The above switching curves show two impedance conditions; 1) RK is
equal to RD, which simulates the switching behavior of cascaded stages
where the driving source impedance is normally the load impedance of the
previous stage, and 2) RK = 0 (low impedance) the driving source imped-
ance is that of the generator.
RGEN
50
VGEN
INPUT RK
50
RGG
VGG
50
OUTPUT
RD
+VDD
RT
SET VDS(off) = 10 V
INPUT PULSE
tr
tf
PULSE WIDTH
DUTY CYCLE
0.25 ns
0.5 ns
= 2.0
s
2.0%
RGG & RK
RD +
RD(RT ) 50)
RD ) RT ) 50
Figure 5. Switching Time Test Circuit
J111 J112 J113
http://onsemi.com
3
r ds(on)
, DRAIN-SOURCE ON-ST
A
T
E
RESIST
ANCE (OHMS)
NOTE 2
The ZeroGateVoltage Drain Current (IDSS), is the principle de-
terminant of other J-FET characteristics. Figure 10 shows the
relationship of GateSource Off Voltage (VGS(off) and Drain
Source On Resistance (rds(on)) to IDSS. Most of the devices will
be within
10% of the values shown in Figure 10. This data will
be useful in predicting the characteristic variations for a given
part number.
For example:
Unknown
rds(on) and VGS range for an J112
The electrical characteristics table indicates that an J112 has
an IDSS range of 25 to 75 mA. Figure 10, shows rds(on) = 52 Ohms
for IDSS = 25 mA and 30 Ohms for IDSS = 75 mA. The corre-
sponding VGS values are 2.2 volts and 4.8 volts.
y fs
, FOR
W
ARD
TRANSFER
ADMITT
ANCE (mmho
s
C, CAP
ACIT
ANCE (pF)
r ds(on)
, DRAIN-SOURCE ON-ST
A
T
E
RESIST
ANCE (OHMS)
r ds(on)
, DRAIN-SOURCE ON-ST
A
T
E
RESIST
ANCE (NORMALIZED)
2.0
3.0
5.0
7.0
10
20
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30
50
ID, DRAIN CURRENT (mA)
Figure 6. Typical Forward Transfer Admittance
1.0
1.5
2.0
3.0
5.0
7.0
10
15
0.03 0.05 0.1
0.3 0.5
1.0
3.0 5.0
10
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Capacitance
200
160
120
80
40
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
VGS, GATE-SOURCE VOLTAGE (VOLTS)
Figure 8. Effect of GateSource Voltage
On DrainSource Resistance
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-70
-40
-10
20
50
80
110
140
170
Tchannel, CHANNEL TEMPERATURE (
C)
Figure 9. Effect of Temperature On
DrainSource OnState Resistance
J113
J112
J111
Tchannel = 25
C
VDS = 15 V
Cgs
Cgd
Tchannel = 25
C
(Cds IS NEGLIGIBLE)
IDSS
= 10
mA
25
mA
50 mA 75 mA 100 mA
125 mA
Tchannel = 25
C
ID = 1.0 mA
VGS = 0
10
IDSS, ZERO-GATE-VOLTAGE DRAIN CURRENT (mA)
Figure 10. Effect of IDSS On DrainSource
Resistance and GateSource Voltage
20 30 40 50 60 70 80 90 100 110 120 130 140 150
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
100
90
80
70
60
50
40
30
20
10
0
V GS
, GA
TE-SOURCE VOL
T
AGE (VOL
TS)
Tchannel = 25
C
rDS(on) @ VGS = 0
VGS(off)
J111 J112 J113
http://onsemi.com
4
PACKAGE DIMENSIONS
CASE 2911
ISSUE AL
TO92 (TO226)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION XX
C
V
D
N
N
X X
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.175
0.205
4.45
5.20
B
0.170
0.210
4.32
5.33
C
0.125
0.165
3.18
4.19
D
0.016
0.021
0.407
0.533
G
0.045
0.055
1.15
1.39
H
0.095
0.105
2.42
2.66
J
0.015
0.020
0.39
0.50
K
0.500
---
12.70
---
L
0.250
---
6.35
---
N
0.080
0.105
2.04
2.66
P
---
0.100
---
2.54
R
0.115
---
2.93
---
V
0.135
---
3.43
---
1
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