Semiconductor Components Industries, LLC, 2000

May, 2000 Rev. 2

Publication Order Number:

MAC997/D

MAC997 Series

Preferred Device

Sensitive Gate Triacs

Silicon Bidirectional Thyristors

Designed for use in solid state relays, MPU interface, TTL logic and

any other light industrial or consumer application. Supplied in an
inexpensive TO92 package which is readily adaptable for use in
automatic insertion equipment.

OnePiece, InjectionMolded Package

Blocking Voltage to 600 Volts

Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for all

possible Combinations of Trigger Sources, and especially for Circuits
that Source Gate Drives

All Diffused and Glassivated Junctions for Maximum Uniformity of

Parameters and Reliability

Improved Noise Immunity (dv/dt Minimum of 20 V/

sec at 110

Commutating di/dt of 1.6 Amps/msec at 110

High Surge Current of 8 Amps

Device Marking: Device Type, e.g., for MAC997A6: MAC7A6, Date

Code

MAXIMUM RATINGS

(TJ = 25

C unless otherwise noted)

Rating

Symbol

Value

Unit

Peak Repetitive Off-State Voltage

(TJ = 40 to +110

C)(1)

Sine Wave 50 to 60 Hz, Gate Open

MAC997A6,B6
MAC997A8,B8

VDRM,

VRRM

400
600

Volts

On-State RMS Current

Full Cycle Sine Wave 50 to 60 Hz
(TC = +50

IT(RMS)

0.8

Amp

Peak NonRepetitive Surge Current

One Full Cycle, Sine Wave 60 Hz
(TC = 110

ITSM

8.0

Amps

Circuit Fusing Considerations (t = 8.3 ms)

I2t

.26

A2s

Peak Gate Voltage

2.0

s, TC = +80

VGM

5.0

Volts

Peak Gate Power

2.0

s, TC = +80

PGM

5.0

Watts

Average Gate Power

(TC = 80

C, t

8.3 ms)

PG(AV)

0.1

Watt

Peak Gate Current

2.0

s, TC = +80

IGM

1.0

Amp

Operating Junction Temperature Range

40 to

+110

Storage Temperature Range

Tstg

40 to

+150

(1) VDRM and VRRM for all types can be applied on a continuous basis. Blocking

voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.

TRIACS

0.8 AMPERE RMS

400 thru 600 VOLTS

Preferred devices are recommended choices for future use
and best overall value.

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See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.

ORDERING INFORMATION

MT1

MT2

TO92 (TO226AA)

CASE 029

STYLE 12

PIN ASSIGNMENT

Gate

Main Terminal 2

Main Terminal 1

MAC997 Series

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THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Case

C/W

Thermal Resistance, Junction to Ambient

200

C/W

Maximum Lead Temperature for Soldering Purposes for 10 Seconds

260

ELECTRICAL CHARACTERISTICS

(TC = 25

C unless otherwise noted; Electricals apply in both directions)

Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Peak Repetitive Blocking Current

(VD = Rated VDRM, VRRM; Gate Open)

TJ = 25

TJ = +110

IDRM, IRRM

--
--

100

ON CHARACTERISTICS

Peak OnState Voltage

(ITM =

.85 A Peak; Pulse Width

2.0 ms, Duty Cycle

2.0%)

VTM

1.9

Volts

Gate Trigger Current (Continuous dc)

(VD = 12 Vdc, RL = 100 Ohms)
MT2(+), G(+)

MAC997A6,A8

MT2(+), G()
MT2(), G()
MT2(), G(+)

MT2(+), G(+)

MAC997B6,B8

MT2(+), G()
MT2(), G()
MT2(), G(+)

IGT

--
--
--
--

5.0
5.0
5.0
7.0

3.0
3.0
3.0
5.0

Latching Current (VD = 12 V, IG = 10 mA)

MT2(+), G(+) All Types
MT2(+), G() All Types
MT2(), G() All Types
MT2(), G(+) All Types

--
--
--
--

1.6

10.5

1.5
2.5

15
20
15
15

Gate Trigger Voltage (Continuous dc)

(VD = 12 Vdc, RL = 100 Ohms)
MT2(+), G(+) All Types
MT2(+), G() All Types
MT2(), G() All Types
MT2(), G(+) All Types

VGT

--
--
--
--

.66
.77
.84
.88

2.0
2.0
2.0
2.5

Volts

Gate NonTrigger Voltage

(VD = 12 V, RL = 100 Ohms, TJ = 110

All Four Quadrants

VGD

0.1

Volts

Holding Current

(VD = 12 Vdc, Initiating Current = 200 mA, Gate Open)

1.5

Turn-On Time

(VD = Rated VDRM, ITM = 1.0 A pk, IG = 25 mA)

tgt

2.0

DYNAMIC CHARACTERISTICS

Rate of Change of Commutating Current

(VD = 400 V, ITM = .84 A, Commutating dv/dt = 1.5 V/

s, Gate Open,

TJ = 110

C, f = 250 Hz, with Snubber)

di/dt(c)

1.6

A/ms

Critical Rate of Rise of OffState Voltage

(VD = Rated VDRM, Exponential Waveform, Gate Open, TJ = 110

dv/dt

Repetitive Critical Rate of Rise of OnState Current

Pulse Width = 20

s, IPKmax = 15 A, diG/dt = 1 A/

s, f = 60 Hz

di/dt

MAC997 Series

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+ Current

+ Voltage

VTM

Symbol

Parameter

VDRM

Peak Repetitive Forward Off State Voltage

IDRM

Peak Forward Blocking Current

VRRM

Peak Repetitive Reverse Off State Voltage

IRRM

Peak Reverse Blocking Current

Voltage Current Characteristic of Triacs

(Bidirectional Device)

IDRM at VDRM

on state

off state

IRRM at VRRM

Quadrant 1
MainTerminal 2 +

Quadrant 3
MainTerminal 2

VTM

Maximum On State Voltage

Holding Current

MT1

(+) IGT

GATE

(+) MT2

REF

MT1

() IGT

GATE

(+) MT2

REF

MT1

(+) IGT

GATE

() MT2

REF

MT1

() IGT

GATE

() MT2

REF

MT2 NEGATIVE

(Negative Half Cycle)

MT2 POSITIVE

(Positive Half Cycle)

Quadrant III

Quadrant IV

Quadrant II

Quadrant I

Quadrant Definitions for a Triac

IGT

+ IGT

All polarities are referenced to MT1.
With inphase signals (using standard AC lines) quadrants I and III are used.

MAC997 Series

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= CONDUCTION ANGLE

0.5

0.6

0.7

0.8

0.1

0.2

0.3

0.4

110

100

IT(RMS), RMS ONSTATE CURRENT (AMPS)

T ,

AXI

ALLO

ABLE CA

E TE

(
C

)

T = 30

180

120

Figure 1. RMS Current Derating

Figure 2. RMS Current Derating

= CONDUCTION ANGLE

0.25

0.3

0.35

0.4

0.05

0.1

0.15

0.2

IT(RMS), RMS ONSTATE CURRENT (AMPS)

100

110

T = 30

180

120

, MAXIMUM

ALLOW

ABLE

AMBIENT

TEMPERA

TURE ( C)

T(RMS)I

Figure 3. Power Dissipation

0.4

0.5

0.6

0.7

0.1

0.2

0.3

0.6

0.4

0.2

IT(RMS), RMS ONSTATE CURRENT (AMPS)

0.8

= CONDUCTION ANGLE

0.8

1.0

1.2

AXI

AGE PO

TION

T = 30

180

120

0.006

0.01

0.02

0.04

0.06

0.1

0.2

0.4

0.6

1.0

2.0

4.0

6.0

TJ = 110

I TM

, INST

ANT

ANEOUS

ON-ST

CURRENT

(AMP)

0.4

1.2

2.0

2.8

3.6

4.4

5.2

6.0

VTM, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)

Figure 4. OnState Characteristics

MAC997 Series

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Figure 5. Transient Thermal Response

Figure 6. Maximum Allowable Surge Current

0.1

1.0

100

1.0

t, TIME (ms)

0.1

0.01

S103

S104

3.0

1.0

2.0

100

3.0

2.0

1.0

NUMBER OF CYCLES

5.0

ZQJC(t) = RQJC(t) @ r(t)

5.0

Surge is preceded and followed by rated current.

TJ = 110

f = 60 Hz

CYCLE

I , PEAK SURGE CURRENT

(AMPS)

TSM

R ,

TRANSIENT

THERMAL

RESIST

ANCE

(NORMALIZED)

(t)

Figure 7. Typical Gate Trigger Current versus

Junction Temperature

Figure 8. Typical Gate Trigger Voltage versus

Junction Temperature

Figure 9. Typical Latching Current versus

Junction Temperature

Figure 10. Typical Holding Current versus

Junction Temperature

100

TJ, JUNCTION TEMPERATURE (

1.2

0.4

TJ, JUNCTION TEMPERATURE (

0.3

TJ, JUNCTION TEMPERATURE (

0.1

110

40 25

110

, GA

TRIGGER

CURRENT

(mA)

, GA

TRIGGER

VOL

T
AGE

(V)

, LA

TCHING

CURRENT

(mA)

0.5

0.6

0.7

0.8

0.9

1.0

1.1

100

110

, HOLDING CURRENT

(mA)

MT2 Negative

MT2 Positive

MAC997 Series

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TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2A

H2B

H4 H5

Figure 12. Device Positioning on Tape

Specification

Inches

Millimeter

Symbol

Item

Min

Max

Min

Max

Tape Feedhole Diameter

0.1496

0.1653

3.8

4.2

Component Lead Thickness Dimension

0.015

0.020

0.38

0.51

F1, F2

Component Lead Pitch

0.0945

0.110

2.4

2.8

Bottom of Component to Seating Plane

.059

.156

1.5

4.0

Feedhole Location

0.3346

0.3741

8.5

9.5

H2A

Deflection Left or Right

0.039

1.0

H2B

Deflection Front or Rear

0.051

1.0

Feedhole to Bottom of Component

0.7086

0.768

19.5

Feedhole to Seating Plane

0.610

0.649

15.5

16.5

Defective Unit Clipped Dimension

0.3346

0.433

8.5

Lead Wire Enclosure

0.09842

2.5

Feedhole Pitch

0.4921

0.5079

12.5

12.9

Feedhole Center to Center Lead

0.2342

0.2658

5.95

6.75

First Lead Spacing Dimension

0.1397

0.1556

3.55

3.95

Adhesive Tape Thickness

0.06

0.08

0.15

0.20

Overall Taped Package Thickness

0.0567

1.44

Carrier Strip Thickness

0.014

0.027

0.35

0.65

Carrier Strip Width

0.6889

0.7481

17.5

Adhesive Tape Width

0.2165

0.2841

5.5

6.3

Adhesive Tape Position

.0059

0.01968

.15

0.5

NOTES:

1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.

MAC997 Series

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION XX

X X

SEATING
PLANE

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

0.175

0.205

4.45

5.20

0.170

0.210

4.32

5.33

0.125

0.165

3.18

4.19

0.016

0.021

0.407

0.533

0.045

0.055

1.15

1.39

0.095

0.105

2.42

2.66

0.015

0.020

0.39

0.50

0.500

12.70

0.250

6.35

0.080

0.105

2.04

2.66

0.100

2.54

0.115

2.93

0.135

3.43

TO92 (TO226AA)

CASE 02911

ISSUE AJ

STYLE 12:

PIN 1. MAIN TERMINAL 1

2. GATE
3. MAIN TERMINAL 2

MAC997 Series

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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be
validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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PUBLICATION ORDERING INFORMATION

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JAPAN: ON Semiconductor, Japan Customer Focus Center

4321 NishiGotanda, Shinagawaku, Tokyo, Japan 1410031
Phone: 81357402745
Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local
Sales Representative.

MAC997/D

NORTH AMERICA Literature Fulfillment:

Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
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*Available from Germany, France, Italy, England, Ireland

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