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Электронный компонент: NB6L11D

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Semiconductor Components Industries, LLC, 2004
April, 2004 - Rev. 2
1
Publication Order Number:
NB6L11/D
NB6L11
2.5V/3.3V Multilevel Input to
Differential LVPECL/LVNECL
1:2 Clock or Data
Fanout Buffer/Translator
The NB6L11 is an enhanced differential 1:2 clock or data fanout
buffer/translator. The device has the same pinout and is functionally
equivalent to the LVEL11, EP11, LVEP11 devices. Moreover, the
device is optimized for the systems that require LOW skew, LOW
jitter and LOW power consumption.
Differential input can be configured to accept single-ended signal
by applying an external reference voltage to unused complimentary
input pin. Input accept LVNECL, LVPECL, LVTTL, LVCMOS,
CML, or LVDS. The outputs are 800 mV ECL signals.
Maximum Input Clock Frequency
w 6 GHz Typical
Maximum Input Data Rate
w 6 Gb/s Typical
Low 14 mA Typical Power Supply Current
150 ps Typical Propagation Delay
5 ps Typical Within Device Skew
75 ps Typical Rise/Fall Times
PECL Mode Operating Range: V
CC
= 2.375 V to 3.465 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= -2.375 V to -3.465 V
Open Input Default State
Q Outputs Will Default LOW with Inputs Open or at V
EE
LVDS, LVPECL, LVNECL, LCMOS, LVTTL and CML Input
Compatible
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
*For additional marking information, refer to
Application Note AND8002/D.
SO-8
D SUFFIX
CASE 751
MARKING DIAGRAMS*
TSSOP-8
DT SUFFIX
CASE 948R
Device
Package
Shipping
ORDERING INFORMATION
NB6L11D
SO-8
98 Units/Rail
NB6L11DR2
SO-8
2500/
Tape & Reel
NB6L11DT**
TSSOP-8
100 Units/Rail
NB6L11DTR2**
TSSOP-8
2500/
Tape & Reel
ALYW
6L11
ALYW
6L11
1
8
1
8
1
8
1
8
http://onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**Future Product - Contact factory for availability.
NB6L11
http://onsemi.com
2
1
2
3
4
5
6
7
8
D
V
EE
V
CC
Figure 1. Pinout (Top View) and Logic Diagram
Q0
D
Q1
Q1
Q0
R
2
R
2
R
1
R
1
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Default State
Description
1
Q0
ECL Output
-
Non-inverted differential clock/data output 0. Typically
terminated with 50
W
Resistor to V
TT
= V
CC
- 2 V.
2
Q0
ECL Output
-
Inverted differential clock/data output 0. Typically termi-
nated with 50
W
resistor to V
TT
= V
CC
- 2 V.
3
Q1
ECL Output
-
Non-inverted differential clock/data output 1. Typically
terminated with 50
W
resistor to V
TT
= V
CC
- 2 V.
4
Q1
ECL Output
-
Inverted differential clock/data output 1. Typically termi-
nated with 50
W
resistor to V
TT
= V
CC
- 2 V.
5
V
EE
-
-
Negative power supply voltage
6
D
LVDS, CML, LVPECL,
LVNECL, LVCMOS,
LVTTL Input
HIGH
Inverted differential clock/data input. Internal 37.5 k
W
to
V
CC
and 75 k
W
to V
EE
.
7
D
LVDS, CML, LVPECL,
LVNECL, LVCMOS,
LVTTL Input
LOW
Non-inverted differential clock/data input. Internal
75 k
W
to V
CC
and 37.5 k
W
to V
EE
.
8
V
CC
-
-
Positive power supply voltage
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Default State Resistor
(R
1
)
37.5 k
W
Internal Input Default State Resistor
(R
2
)
75 k
W
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 100 V
> 1 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V-0 @ 0.125 in
Transistor Count
167
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
NB6L11
http://onsemi.com
3
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
V
CC
Positive Power Supply
V
EE
= 0 V
3.6
V
V
EE
Negative Power Supply
V
CC
= 0 V
-3.6
V
V
I
Positive Input Voltage
Negative Input Voltage
V
EE
= 0 V
V
CC
= 0 V
V
I
v
V
CC
V
I
w
V
EE
3.6
-3.6
V
V
V
INPP
Differential Input Voltage
|D - D|
V
CC
- V
EE
w
2.8 V
V
CC
- V
EE
t
2.8 V
2.8
|V
CC
- V
EE
|
V
I
out
Output Current
Continuous
Surge
25
50
mA
mA
T
A
Operating Temperature Range
-40 to +85
C
T
stg
Storage Temperature Range
-65 to +150
C
q
JA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC-8
SOIC-8
190
130
C/W
C/W
q
JC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC-8
41 to 44
C/W
q
JA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
TSSOP-8
TSSOP-8
185
140
C/W
C/W
q
JC
Thermal Resistance (Junction-to-Case)
Standard Board
TSSOP-8
41 to 44
C/W
T
sol
Wave Solder
< 2 to 3 sec @ 248
C
265
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not im-
plied, damage may occur and reliability may be affected.
NB6L11
http://onsemi.com
4
Table 4. DC CHARACTERISTICS, PECL
V
CC
= 2.5 V, V
EE
= 0 V (Note 4)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current (Note 5)
5
14
20
5
14
20
5
14
20
mA
V
OH
Output HIGH Voltage (Note 6)
1350
1450
1550
1400
1500
1600
1450
1550
1650
mV
V
OL
Output LOW Voltage (Note 6)
630
750
870
680
800
920
730
850
970
mV
DIFFERENTIAL INPUT DRIVEN SINGLE-ENDED (Figures 10, 12)
V
th
Input Threshold Reference Voltage Range
(Note 2)
1125
V
CC
-75
1125
V
CC
-75
1125
V
CC
-75
mV
V
IH
Single-Ended Input HIGH Voltage
V
th
+75
V
CC
V
th
+75
V
CC
V
th
+75
V
CC
mV
V
IL
Single-Ended Input LOW Voltage
V
EE
V
th
-75
V
EE
V
th
-75
V
EE
V
th
-75
mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 11, 13)
V
IHD
Differential Input HIGH Voltage
1200
V
CC
1200
V
CC
1200
V
CC
mV
V
ILD
Differential Input LOW Voltage
V
EE
V
CC
-75
V
EE
V
CC
-75
V
EE
V
CC
-75
mV
V
CMR
Input Common Mode Range
(Differential Cross-Point Voltage) (Note 3)
1163
V
CC
-38
1163
V
CC
-38
1163
V
CC
-38
mV
V
ID
Differential Input Voltage (V
IHD
- V
ILD
)
75
2500
75
2500
75
2500
mV
I
IH
Input HIGH Current
D
D
50
10
150
150
50
10
150
150
50
10
150
150
m
A
I
IL
Input LOW Current
D
D
-150
-150
-5
-30
-150
-150
-5
-30
-150
-150
-5
-30
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
2. V
th
is applied to the complementary input when operating in single-ended mode.
3. V
CMR
minimum varies 1:1 with V
EE
, V
CMR
maximum varies 1:1 with V
CC
.
4. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.125 V to -1.3 V.
5. All input and output pins left open.
6. All loading with 50
W
to V
CC
- 2.0 V.
NB6L11
http://onsemi.com
5
Table 5. DC CHARACTERISTICS, PECL
V
CC
= 3.3 V, V
EE
= 0 V (Note 9)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current (Note 10)
5
14
20
5
14
20
5
14
20
mA
V
OH
Output HIGH Voltage (Note 11)
2150
2250
2350
2200
2300
2400
2250
2350
2450
mV
V
OL
Output LOW Voltage (Note 11)
1430
1550
1670
1480
1600
1720
1530
1650
1770
mV
DIFFERENTIAL INPUT DRIVEN SINGLE-ENDED (Figures 10, 12)
V
th
Input Threshold Reference Voltage Range
(Note 7)
1125
V
CC
-75
1125
V
CC
-75
1125
V
CC
-75
mV
V
IH
Single-Ended Input HIGH Voltage
V
th
+75
V
CC
V
th
+75
V
CC
V
th
+75
V
CC
mV
V
IL
Single-Ended Input LOW Voltage
V
EE
V
th
-75
V
EE
V
th
-75
V
EE
V
th
-75
mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 11, 13)
V
IHD
Differential Input HIGH Voltage
1200
V
CC
1200
V
CC
1200
V
CC
mV
V
ILD
Differential Input LOW Voltage
V
EE
V
CC
-75
V
EE
V
CC
-75
V
EE
V
CC
-75
mV
V
CMR
Input Common Mode Range
(Differential Cross-Point Voltage) (Note 8)
1163
V
CC
-38
1163
V
CC
-38
1163
V
CC
-38
mV
V
ID
Differential Input Voltage (V
IHD
- V
ILD
)
75
2500
75
2500
75
2500
mV
I
IH
Input HIGH Current
D
D
50
10
150
150
50
10
150
150
50
10
150
150
m
A
I
IL
Input LOW Current
D
D
-150
-150
-5
-30
-150
-150
-5
-30
-150
-150
-5
-30
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
7. V
th
is applied to the complementary input when operating in single-ended mode.
8. V
CMR
minimum varies 1:1 with V
EE
, V
CMR
maximum varies 1:1 with V
CC
.
9. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.3 V to -2.2 V.
10. All input and output pins left open.
11. All loading with 50
W
to V
CC
- 2.0 V.
NB6L11
http://onsemi.com
6
Table 6. DC CHARACTERISTICS, NECL
V
CC
= 0 V; V
EE
= -3.465 V to -2.375 V (Note 14)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Negative Power Supply Current
(Note 15)
5
14
20
5
14
20
5
14
20
mA
V
OH
Output HIGH Voltage (Note 16)
-1150
-1050
-950
-1100
-1000
-900
-1050
-950
-850
mV
V
OL
Output LOW Voltage (Note 16)
-1870
-1750
-1630
-1820
-1700
-1580
-1770
-1650
-1530
mV
DIFFERENTIAL INPUT DRIVEN SINGLE-ENDED (Figures 10, 12)
V
th
Input Threshold Reference Voltage
Range (Note 12)
V
EE
+1125
V
CC
-75
V
EE
+1125
V
CC
-75
V
EE
+1125
V
CC
-75
mV
V
IH
Single-Ended Input HIGH Voltage
V
th
+75
V
CC
V
th
+75
V
CC
V
th
+75
V
CC
mV
V
IL
Single-Ended Input LOW Voltage
V
EE
V
th
-75
V
EE
V
th
-75
V
EE
V
th
-75
mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 11, 13)
V
IHD
Differential Input HIGH Voltage
V
EE
+1200
V
CC
V
EE
+1200
V
CC
V
EE
+1200
V
CC
mV
V
ILD
Differential Input LOW Voltage
V
EE
V
CC
-75
V
EE
V
CC
-75
V
EE
V
CC
-75
mV
V
CMR
Input Common Mode Range
(Differential Cross-Point Voltage)
(Note 13)
V
EE
+1163
V
CC
-38
V
EE
+1163
V
CC
-38
V
EE
+1163
V
CC
-38
mV
V
ID
Differential Input Voltage (V
IHD
-
V
ILD
)
75
2500
75
2500
75
2500
mV
I
IH
Input HIGH Current
D
D
50
10
150
150
50
10
150
150
50
10
150
150
m
A
I
IL
Input LOW Current
D
D
-150
-150
-5
-30
-150
-150
-5
-30
-150
-150
-5
-30
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
12. V
th
is applied to the complementary input when operating in single-ended mode.
13. V
CMR
minimum varies 1:1 with V
EE
, V
CMR
maximum varies 1:1 with V
CC
14. Input and output parameters vary 1:1 with V
CC
.
15. Input and output pins left open.
16. All loading with 50
W
to V
CC
- 2.0 V.
NB6L11
http://onsemi.com
7
Table 7. AC CHARACTERISTICS
V
CC
= 0 V; V
EE
= -3.465 V to -2.375 V or V
CC
= 2.375 V to 3.465 V; V
EE
= 0 V (Note 17)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
V
OUTPP
Output Voltage Amplitude
f
in
v
3 GHz
(See Figures 2 & 3
)
f
in
v
6 GHz
480
270
700
300
480
270
700
300
480
270
700
300
mV
t
PLH
,
t
PHL
Propagation Delay to
Output Differential @ 1 GHz
D to Q, Q
110
150
190
110
150
200
120
160
220
ps
t
SKEW
Duty Cycle Skew
Within Device Skew
(Note 18)
Device-to-Device Skew
2
5
15
10
15
60
2
5
15
10
15
60
2
5
15
10
15
60
ps
t
JITTER
RMS Random Clock Jitter
(Note 19)
f
in
v
6 GHz
Peak-to-Peak Data Dependent Jitter
(Note 20)
f
in
v
6 Gb/s
0.2
2
1
12
0.2
2
1
12
0.2
2
1
12
ps
V
INPP
Input Voltage Swing / Sensitivity
(Differential Configuration) (Note 21)
75
700
2500
75
700
2500
75
700
2500
mV
t
r
t
f
Output Rise/Fall Times @ 1 GHz
Q, Q
(20% - 80%)
30
75
120
30
75
120
30
75
120
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
17. Measured using a 800 mV source, 50% duty cycle clock source. All loading with 50
W
to V
CC
- 2.0 V. Input edge rates 40 ps (20% - 80%).
18. See Figure 9 t
skew
= |t
PLH
- t
PHL
| for a nominal 50% differential clock input waveform. Skew is measured between outputs under identical
transitions and conditions @ 1 GHz.
19. Additive RMS jitter with 50% duty cycle clock signal at 6 GHz.
20. Additive Peak-to-Peak data dependent jitter with NRZ PRBS 2
23
-1 data rate at 6 Gb/s.
21. V
INPP(max)
cannot exceed V
CC
- V
EE
(applicable only when V
CC
- V
EE
< 2500 mV). Input voltage swing is a single-ended measurement
operating in differential mode
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1
2
4
5
6
7
8
3
OUTPUT
VOL
T
AGE
AMPLITUDE (V)
Figure 2. Output Voltage Amplitude (V
OUTPP
)
versus Input Clock Frequency (f
IN
) and
Temperature at V
CC
- V
EE
= 3.3 V
INPUT CLOCK FREQUENCY (GHz)
85
C
-40
C
25
C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1
2
3
4
5
6
7
8
OUTPUT
VOL
T
AGE
AMPLITUDE (V)
-40
C
85
C
25
C
Figure 3. Output Voltage Amplitude (V
OUTPP
)
versus Input Clock Frequency (f
IN
) and
Temperature at V
CC
- V
EE
= 2.5 V
INPUT CLOCK FREQUENCY (GHz)
NB6L11
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8
Figure 4. Typical Output Waveform at
2.488 Gb/s with PRBS 2
23
-1 (Total System
Pk-Pk Jitter is 17 ps. Device Pk-Pk Jitter
Contribution is 4 ps)
TIME (64 ps/div)
OUTPUT VOL
T
AGE AMPLITUDE
(100 mV/div)
Figure 5. Typical Output Waveform at
6.125 Gb/s with PRBS 2
23
-1 (Total System
Pk-Pk Jitter is 20 ps. Device Pk-Pk Jitter
Contribution is 5 ps)
TIME (32 ps/div)
OUTPUT VOL
T
AGE AMPLITUDE
(100 mV/div)
NOTE:
V
CC
- V
EE
= 3.3 V; V
IN
= 700 mV; T
A
= 25
C.
110
130
150
170
190
210
2.375
2.5
3.3
3.465
85
C
-40
C
25
C
PROP
AGA
TION DELA
Y
(ps)
Figure 6. Propagation Delay versus Power
Supply Voltage and Temperature
POWER SUPPLY VOLTAGE (V)
30
40
50
60
70
80
90
100
110
120
2.375
2.5
3.3
3.465
85
C
-40
C
25
C
Figure 7. Rise/Fall Time versus Power Supply
Voltage and Temperature
POWER SUPPLY VOLTAGE (V)
RISE/F
ALL
TIME
(ps)
5
8
11
14
17
20
-40
25
85
V
CC
- V
EE
= -3.465 V
V
CC
- V
EE
= -2.375 V
Figure 8. I
EE
Current versus Temperature and
Power Supply Voltage
TEMPERATURE (
C)
I
EE
CURRENT (mA)
NB6L11
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9
Figure 9. AC Reference Measurement
D
D
Q
Q
t
PHL
t
PLH
V
INPP
(D) = V
IH
(D) - V
IL
(D)
V
INPP
(D) = V
IH
(D) - V
IL
(D)
V
OUTPP
(Q) = V
OH
(Q) - V
OL
(Q)
V
OUTPP
(Q) = V
OH
(Q) - V
OL
(Q)
D
V
th
D
V
th
Figure 10. Differential Input Driven
Single-Ended
D
D
Figure 11. Differential Inputs Driven
Differentially
V
IHmax
V
ILmax
V
IH
V
th
V
IL
V
IHmin
V
ILmin
V
CC
V
thmax
V
thmin
GND
V
th
V
IHDmax
V
ILDmax
V
IHDmin
V
ILDmin
V
IHDtyp
V
ILDtyp
V
ID
= V
IHD
- V
ILD
V
CMR
V
CC
V
CMmax
V
CMmax
GND
Figure 12. V
th
Diagram
Figure 13. V
CMR
Diagram
Figure 14. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D - Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
Q
D
Q
D
Z
o
= 50
W
Z
o
= 50
W
50
W
50
W
V
TT
V
TT
= V
CC
- 2.0 V
NB6L11
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10
Resource Reference of Application Notes
AN1405
-
ECL Clock Distribution Techniques
AN1568
-
Interfacing Between LVDS and ECL
AN1650
-
Using Wire-OR Ties in ECLinPS De-
signs
AN1672
-
The ECL Translator Guide
AND8001
-
Odd Number Counters Design
AND8002
-
Marking and Date Codes
AND8003
-
Storage and Handling of Drypack Sur-
face Mount Device
AND8020
-
Termination of ECL Logic Devices
AND8072
-
Thermal Analysis and Reliability of
Wire Bonded ECL
AND8066
-
Interfacing with ECLinPS
AND8090
-
AC Characteristics of ECL Devices
For an updated list of Application Notes, please
see our website at http://onsemi.com.
NB6L11
http://onsemi.com
11
PACKAGE DIMENSIONS
SOIC-8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751-07
ISSUE AB
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
STANDARD IS 751-07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00
0.189
0.197
MILLIMETERS
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
M
0
8
0
8
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
-X-
-Y-
G
M
Y
M
0.25 (0.010)
-Z-
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
SO-8
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
NB6L11
http://onsemi.com
12
PACKAGE DIMENSIONS
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
0.80
1.10
0.031
0.043
D
0.05
0.15
0.002
0.006
F
0.40
0.70
0.016
0.028
G
0.65 BSC
0.026 BSC
L
4.90 BSC
0.193 BSC
M
0
6
0
6
_
_
_
_
SEATING
PLANE
PIN 1
1
4
8
5
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X
L/2
-U-
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V
S
T
0.10 (0.004)
-T-
-V-
-W-
0.25 (0.010)
8x REF
K
IDENT
K
0.25
0.40
0.010
0.016
TSSOP-8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R-02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
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