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Электронный компонент: NBSG16MMN

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Semiconductor Components Industries, LLC, 2004
April, 2004 - Rev. 3
1
Publication Order Number:
NBSG16M/D
NBSG16M
2.5V/3.3V Multilevel Input
to CML Clock/Data
Receiver/Driver/Translator
Buffer
The NBSG16M is a differential current mode logic (CML)
receiver/driver/translator buffer. The device is functionally equivalent
to the EP16, LVEP16, or SG16 devices with CML output structure and
lower EMI capabilities.
Inputs incorporate internal 50
W termination resistors and accept
LVNECL (Negative ECL), LVPECL (Positive ECL), LVTTL,
LVCMOS, CML, or LVDS. The CML output structure contains
internal 50
W source termination resistor to V
CC
. The device
generates 400 mV output amplitude with 50
W receiver resistor to
V
CC
.
The V
BB
pin is internally generated voltage supply available to this
device only. For all single-ended input conditions, the unused
complementary differential input is connected to V
BB
as a switching
reference voltage. V
BB
may also rebias AC coupled inputs. When
used, decouple V
BB
via a 0.01
mF capacitor and limit current sourcing
or sinking to 0.5 mA. When not used, V
BB
output should be left open.
Maximum Input Clock Frequency > 10 GHz Typical
Maximum Input Data Rate > 10 Gb/s Typical
120 ps Typical Propagation Delay
35 ps Typical Rise and Fall Times
Positive CML Output with Operating Range: V
CC
= 2.375 V to
3.465 V with V
EE
= 0 V
Negative CML Output with RSNECL or NECL Inputs with
Operating Range: V
CC
= 0 V with V
EE
= -2.375 V to -3.465 V
CML Output Level; 400 mV Peak-to-Peak Output with
50
W Receiver Resistor to V
CC
50
W Internal Input and Output Termination Resistors
Compatible with Existing 2.5 V/3.3 V LVEP, EP, LVEL
and SG Devices
V
BB
Reference Voltage Output
*For additional marking information, refer to
Application Note AND8002/D.
MARKING
DIAGRAM*
Device
Package
Shipping
ORDERING INFORMATION
http://onsemi.com
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
SG
16M
ALYW
QFN-16
MN SUFFIX
CASE 485G
NBSG16MMN
3x3 mm
QFN-16
123 Units / Rail
NBSG16MMNR2
3x3 mm
QFN-16
3000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NBSG16M
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2
V
CC
NC
V
EE
V
EE
V
CC
V
BB
V
EE
V
EE
V
CC
Q
Q
V
CC
VTD
D
D
VTD
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16M
Exposed Pad (EP)
Figure 1. QFN-16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
1
V
TD
-
Internal 50
W
Termination Pin. See Table 2. (Note 3)
2
D
LVDS, CML, ECL, LVTTL,
LVCMOS Input
Inverted Differential Input (Note 3)
3
D
LVDS, CML, ECL, LVTTL,
LVCMOS Input
Noninverted Differential Input. (Note 3)
4
V
TD
-
Internal 50
W
Termination Pin. See Table 2. (Note 3)
5
V
CC
-
Positive Supply Voltage. All V
CC
pins must be externally connected to Power Supply to guar-
antee proper operation.
6
NC
-
No Connect (Note 1)
7
V
EE
-
Negative Supply Voltage. All V
EE
pins must be externally connected to Power Supply to guar-
antee proper operation.
8
V
EE
-
Negative Supply Voltage. All V
EE
pins must be externally connected to Power Supply to guar-
antee proper operation.
9
V
CC
-
Positive Supply Voltage. All V
CC
pins must be externally connected to Power Supply to guar-
antee proper operation.
10
Q
CML Output
Noninverted CML Differential Output with Internal 50
W
Source Termination Resistor. (Note 2)
11
Q
CML Output
Inverted CML Differential Output with Internal 50
W
Source Termination Resistor. (Note 2)
12
V
CC
-
Positive Supply Voltage. All V
CC
pins must be externally connected to Power Supply to guar-
antee proper operation.
13
V
EE
-
Negative Supply Voltage. All V
EE
pins must be externally connected to Power Supply to guar-
antee proper operation.
14
V
EE
-
Negative Supply Voltage. All V
EE
pins must be externally connected to Power Supply to guar-
antee proper operation.
15
V
BB
-
Internally Generated ECL Reference Output Voltage
16
V
CC
-
Positive Supply Voltage. All V
CC
pins must be externally connected to Power Supply to guar-
antee proper operation.
-
EP
-
Exposed Pad. The thermally exposed pad (EP) on package bottom (see case drawing) must
be attached to a heat-sinking conduit.
1. The NC pins are electrically connected to the die and MUST be left open.
2. CML outputs require 50
W
receiver termination resistor to V
CC
for proper operation.
3. In the differential configuration when the input termination pin (V
TD
, V
TD
) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to self-oscillation.
NBSG16M
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3
50
W
50
W
VTD
D
D
VTD
Q
Q
V
BB
V
EE
V
CC
50
W
50
W
Figure 2. Logic Diagram
Q
Q
V
CC
16 mA
50
W
50
W
Figure 3. CML Output Structure
V
EE
Table 2. Interfacing Options
INTERFACING OPTIONS
CONNECTIONS
CML
Connect VTD and VTD to V
CC
LVDS
Connect VTD and VTD together
AC-COUPLED
Bias VTD and VTD Inputs within (V
IHCMR
)
Common Mode Range
RSECL, PECL, NECL
Standard ECL Termination Techniques
LVTTL, LVCMOS
An external voltage should be applied to the
unused complimentary differential input.
Nominal voltage 1.5 V for LVTTL and V
CC
/2 for
LVCMOS inputs.
Table 3. ATTRIBUTES
Characteristics
Value
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 1 kV
> 100 V
> 4 kV
Moisture Sensitivity (Note 4)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V-0 @ 0.125 in
Transistor Count
145
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
4. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
NBSG16M
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4
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
s
V
CC
Positive Power Supply
V
EE
= 0 V
3.6
V
V
EE
Negative Power Supply
V
CC
= 0 V
-3.6
V
V
I
Positive Input
Negative Input
V
EE
= 0 V
V
CC
= 0 V
V
I
v
V
CC
V
I
w
V
EE
3.6
-3.6
V
V
V
INPP
Differential Input Voltage |D - D|
V
CC
- V
EE
w
2.8 V
V
CC
- V
EE
< 2.8 V
2.8
|V
CC
- V
EE
|
V
I
IN
Input Current Through R
T
(50
W
Resistor)
Static
Surge
45
80
mA
mA
I
out
Output Current
Continuous
Surge
25
50
mA
mA
I
BB
V
BB
Sink/Source
1.0
mA
T
A
Operating Temperature Range
-40 to +85
C
T
stg
Storage Temperature Range
-65 to +150
C
q
JA
Thermal Resistance (Junction-to-Ambient)
(Note 5)
0 lfpm
500 lfpm
QFN-16
QFN-16
42
35
C/W
C/W
q
JC
Thermal Resistance (Junction-to-Case)
1S2P (Note 5)
QFN-16
4.0
C/W
T
sol
Wave Solder
< 15 sec.
225
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not im-
plied, damage may occur and reliability may be affected.
5. JEDEC standard multilayer board - 1S2P (1 signal, 2 power)
NBSG16M
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5
Table 5. DC CHARACTERISTICS, POSITIVE CML OUTPUT
V
CC
= 2.5 V; V
EE
= 0 V (Note 6)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
CC
Positive Power Supply Current
37
43
51
37
43
51
37
43
51
mA
V
OH
Output HIGH Voltage (Note 7)
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
mV
V
OL
Output LOW Voltage (Note 6)
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
mV
V
IH
Input HIGH Voltage
(Single-Ended) (Note 8)
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1..275
V
CC
-
1.0*
V
CC
V
V
IL
Input LOW Voltage
(Single-Ended) (Note 8)
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
V
BB
ECL Reference Voltage Output
1075
1170
1265
1075
1170
1265
1075
1170
1265
mV
V
IHCMR
Input HIGH Voltage Common Mode
Range (Note 8)
(Differential Configuration)
1.2
2.5
1.2
2.5
1.2
2.5
V
R
TIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
R
TOUT
Internal Output Termination
Resistor
45
50
55
45
50
55
45
50
55
W
I
IH
Input HIGH Current (@ V
IH
)
60
100
60
100
60
100
m
A
I
IL
Input LOW Current (@ V
IL
)
25
50
25
50
25
50
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.125 V to -0.965 V.
7. All loading with 50
W
to V
CC
.
8. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differen-
tial input signal.
*Typicals used for testing purposes.
NBSG16M
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6
Table 6. DC CHARACTERISTICS, POSITIVE CML OUTPUT
V
CC
= 3.3 V; V
EE
= 0 V (Note 9)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
CC
Positive Power Supply Current
37
43
51
37
43
51
37
43
51
mA
V
OH
Output HIGH Voltage (Note 10)
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
mV
V
OL
Output LOW Voltage (Note 9)
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
mV
V
IH
Input HIGH Voltage
(Single-Ended) (Note 11)
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
V
IL
Input LOW Voltage
(Single-Ended) (Note 11)
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
V
BB
ECL Reference Voltage Output
1875
1970
2065
1875
1970
2065
1875
1970
2065
mV
V
IHCMR
Input HIGH Voltage Common
Mode Range (Note 11)
(Differential Configuration)
1.2
3.3
1.2
3.3
1.2
3.3
V
R
TIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
R
TOUT
Internal Output Termination
Resistor
45
50
55
45
50
55
45
50
55
W
I
IH
Input HIGH Current (@ V
IH
)
60
100
60
100
60
100
m
A
I
IL
Input LOW Current (@ V
IL
)
25
50
25
50
25
50
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.925 V to -0.165 V.
10. All loading with 50
W
to V
CC
.
11. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differen-
tial input signal.
*Typicals used for testing purposes.
NBSG16M
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7
Table 7. DC CHARACTERISTICS, NEGATIVE CML OUTPUT
V
CC
= 0 V; V
EE
= -3.465 to -2.375 V (Note 12)
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
CC
Positive Power Supply Current
37
43
51
37
43
51
37
43
51
mA
V
OH
Output HIGH Voltage (Note 13)
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
V
CC
-
40
V
CC
-
10
V
CC
mV
V
OL
Output LOW Voltage (Note 12)
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
V
CC
-
400
V
CC
-
330
mV
V
IH
Input HIGH Voltage
(Single-Ended) (Note 13)
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
EE
+
1.275
V
CC
-
1.0*
V
CC
V
V
IL
Input LOW Voltage
(Single-Ended) (Note 13)
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
EE
V
CC
-
1.4*
V
IH
-
0.150
V
V
BB
ECL Reference Voltage Output
-1425
-1330
-1235
-1425
-1330
-1235
-1425
-1330
-1235
mV
V
IHCMR
Input HIGH Voltage Common
Mode Range (Note 14)
(Differential Configuration)
V
EE
+1.2
V
CC
V
EE
+1.2
V
CC
V
EE
+1.2
V
CC
V
R
TIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
R
TOUT
Internal Output Termination
Resistor
45
50
55
45
50
55
45
50
55
W
I
IH
Input HIGH Current (@ V
IH
)
60
100
60
100
60
100
m
A
I
IL
Input LOW Current (@ V
IL
)
25
50
25
50
25
50
m
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
12. Input and output parameters vary 1:1 with V
CC
.
13. All loading with 50
W
to V
CC
.
14. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differen-
tial input signal.
*Typicals used for testing purposes.
NBSG16M
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8
Table 8. AC CHARACTERISTICS
V
CC
= 0 V; V
EE
= -3.465 V to -2.375 V or V
CC
= 2.375 V to 3.465 V; V
EE
= 0 V
-40
C
25
C
85
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
V
OUTPP
Output Voltage Amplitude
f
in
< 7 GHz
(See Figure 4) (Note 15)
f
in
< 10 GHz
300
200
400
250
300
200
400
250
300
100
400
150
mV
t
PLH
,
t
PHL
Propagation Delay to
Output Differential
90
110
150
100
120
150
100
125
155
ps
t
SKEW
Duty Cycle Skew (Note 16)
3
15
3
15
3
15
ps
t
JITTER
RMS Random Clock Jitter (Note 18)
f
in
< 10 GHz
Peak-to-Peak Data Dependent Jitter (Note 19)
f
in
< 10 Gb/s
0.2
8
1
15
0.2
8
1
15
0.2
8
1.0
15
ps
V
INPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 17)
75
2500
75
2500
75
2500
mV
t
r
t
f
Output Rise/Fall Times @ 1 GHz
Q, Q
(20% - 80%)
21
35
53
21
35
53
21
35
53
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
15. Measured using a 400 mV source, 50% duty cycle clock source. All loading with 50
W
to V
CC
. Input edge rates 40 ps (20% - 80%).
16. See Figure 5 t
skew
= |t
PLH
- t
PHL
| for a nominal 50% differential clock input waveform.
17. V
INPP(max)
cannot exceed V
CC
- V
EE
. (Applicable only when V
CC
- V
EE
< 2500 mV). Input voltage swing is a single-ended measurement
operating in differential mode.
18. Additive RMS jitter with 50% duty cycle clock signal at 10GHz.
19. Additive Peak-to-Peak data dependent jitter with NRZ PRBS2
31
-1 data rate at 10 Gb/s.
Figure 4. Output Voltage Amplitude (V
OUTPP
) versus
Input Clock Frequency (f
in
) at Ambient Temperature (Typical)
0
50
100
150
200
250
300
350
400
450
500
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY (GHz)
OUTPUT
VOL
T
AGE
AMPLITUDE (mV)
V
CC
- V
EE
= 3.3 V
V
CC
- V
EE
= 2.5 V
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9
Figure 5. AC Reference Measurement
D
D
Q
Q
t
PHL
t
PLH
V
INPP
(D) = V
IH
(D) - D
IL
(D)
V
OUTPP
(Q) = V
OH
(Q) - V
OL
(Q)
V
INPP
(D) = V
IH
(D) - D
IL
(D)
V
OUTPP
(Q) = V
OH
(Q) - V
OL
(Q)
Driver
Device
Receiver
Device
Q
D
Figure 6. Typical Termination for Output Driver and Device Evaluation
(Refer to Application Note AND8020 - Termination of ECL Logic Devices)
Q
D
V
CC
50
W
50
W
Z
o
= 50
W
Z
o
= 50
W
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10
Application Information
All inputs can accept PECL, CML, and LVDS signal
levels. The input voltage can range from V
CC
to 1.2 V.
Examples interfaces are illustrated below in a 50
W
environment (Z = 50
W).
50
W
V
CC
D
D
50
W
SG16M
V
CC
V
TD
V
EE
V
CC
Q
50
W
50
W
SG16M
V
EE
Figure 7. CML to CML Interface
Z
Q
Z
Figure 8. LVDS to CML Receiver Interface
50
W
Z
V
CC
V
CC
LVDS
Driver
D
D
50
W
SG16M
V
EE
V
TD
V
EE
Figure 9. PECL to CML Receiver Interface
50
W
Z
Z
V
CC
V
CC
PECL
Driver
D
D
50
W
SG16M
V
EE
V
Bias
V
TD
V
EE
R
T
R
T
V
EE
V
CC
R
T
5.0 V 290
W
3.3 V 150
W
2.5 V
80
W
Recommended R
T
Values
50
W
50
W
V
TD
V
CC
V
TD
V
Bias
V
TD
Z
NBSG16M
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11
PACKAGE DIMENSIONS
QFN-16
MN SUFFIX
CASE 485G-01
ISSUE A
X
M
0.10 (0.004)
T
-T-
-X-
NOTE 3
SEATING
PLANE
L
A
M
-Y-
B
N
0.25 (0.010) T
0.25 (0.010) T
J
C
K
R
0.08 (0.003) T
G
E
H
F
P
D
Y
1
4
5
8
12
9
16
13
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
3.00 BSC
0.118 BSC
B
3.00 BSC
0.118 BSC
C
0.80
1.00
0.031
0.039
D
0.23
0.28
0.009
0.011
G
0.50 BSC
0.020 BSC
H
0.875
0.925
0.034
0.036
J
0.20 REF
0.008 REF
K
0.00
0.05
0.000
0.002
L
0.35
0.45
0.014
0.018
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION D APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
1.75
1.85
0.069
0.073
F
1.75
1.85
0.069
0.073
M
1.50 BSC
0.059 BSC
N
1.50 BSC
0.059 BSC
P
0.875
0.925
0.034
0.036
R
0.60
0.80
0.024
0.031
mm
inches
SCALE 10:1
0.50
0.02
0.575
0.022
1.50
0.059
3.25
0.128
QFN-16, 3x3 mm,
EP 2x2 mm
0.30
0.012
3.25
0.128
0.30
0.012
SOLDERING FOOTPRINT
NBSG16M
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12
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