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Электронный компонент: NUF8401

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Semiconductor Components Industries, LLC, 2005
June, 2005 - Rev. 4
1
Publication Order Number:
NUF8401MN/D
NUF8401MN
Low Capacitance 8 Line EMI
Filter with ESD Protection
This device is an 8 line EMI filter array for wireless applications.
Greater than -25 dB attenuation is obtained at frequencies from
800 MHz to 2.2 GHz. It also offers ESD protection-clamping transients
from static discharges. ESD protection is provided across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 40 Discrete Components
Compliance with IEC61000-4-2 (Level 4)
> 14 kV (Contact)
DFN Package, 1.6 x 4.0 mm
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
Human Body Model = 3B
This is a Pb-Free Device*
Benefits
Reduces EMI/RFI Emmisions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass
Filter Response
Integrated Solution Improves System Reliability
Applications
EMI Filtering and ESD Protection for Data Lines
Wireless Phones
Handheld Products
Notebook Computers
LCD Displays
Figure 1. Pin Connections
4
3
2
1
(Bottom View)
GND
9
10
11
12
8
7
6
5
13
14
15
16
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF8401MNT4G
DFN16
(Pb-Free)
4000 / Tape & Reel
MARKING
DIAGRAM
http://onsemi.com
(Top View)
1
Cd
Cd
16
2
Cd
Cd
15
3
Cd
Cd
14
4
Cd
Cd
13
5
Cd
Cd
12
6
Cd
Cd
11
7
Cd
Cd
10
8
Cd
Cd
9
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
16
841 = Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb-Free Package
http://onsemi.com
1
841
AYW
G
DFN16
CASE 506AC
NUF8401MN
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2
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
ESD Discharge IEC61000-4-2
Contact Discharge
V
PP
14
kV
Steady-State Power per Resistor @ 25
C
P
R
328
mW
Operating Temperature Range
T
OP
-40 to 85
C
Storage Temperature Range
T
STG
-55 to 150
C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
T
L
260
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS
(T
J
= 25
C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Maximum Reverse Working Voltage
V
RWM
5.0
V
Breakdown Voltage
V
BR
I
R
= 1.0 mA
6.0
7.0
8.0
V
Leakage Current
I
R
V
RWM
= 3.3 V
100
nA
Resistance
R
A
I
R
= 20 mA
85
100
115
W
Capacitance (Notes 1 and 2)
Cd
10
12
15
pF
Cut-Off Frequency (Note 3)
f
3dB
Above this frequency,
appreciable attenuation occurs
175
MHz
1. Measured at 25
C, V
R
= 2.5 V, f = 1.0 MHz.
2. Total Line Capacitance is 2 times the Diode Capacitance (Cd).
3. 50
W
source and 50
W
load termination.
NUF8401MN
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3
TYPICAL PERFORMANCE CURVES
(T
A
= 25
C unless otherwise specified)
90
92
94
96
98
100
102
104
106
108
110
-40
-20
0
20
40
60
80
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
-50
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
S21 (dB)
0
0.5
1.0
1.5
2.0
0
1.0
2.0
3.0
4.0
5.0
Figure 2. Typical Insertion Loss Characteristic
(S21 Measurement)
REVERSE VOLTAGE (V)
NORMALIZED CAP
ACIT
ANCE
TEMPERATURE (
C)
RESIST
ANCE (
W
)
-60
-40
-50
-30
-20
-10
0
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
S41 (dB)
Figure 3. Analog Crosstalk Curve
(S41 Measurement)
Figure 4. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance Cd at 2.5 V)
Figure 5. Typical Resistance over Temperature
Channel 1,4,5 & 8
Channel 2,3,6 & 7
NUF8401MN
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4
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
4.00 BSC
D2
3.10
3.30
E
1.60 BSC
E2
0.30
0.50
e
0.50 BSC
K
0.20
---
L
0.20
0.40
0.15 C
D
E
B
A
2X
2X
16X
A
A1
(A3)
0.15 C
PIN ONE
REFERENCE
0.08 C
0.10 C
C
SEATING
PLANE
D2
E2
BOTTOM VIEW
b
e
16X
0.10
B
0.05
A
C
C
L
16X
K
16X
SIDE VIEW
TOP VIEW
NOTE 3
1
8
9
16
2X
0.25 x 0.40 mm
TEST PAD SIZE
(A3)
DFN16
CASE 506AC-01
ISSUE B
0.50
4.10
0.50 PITCH
14X
mm
inches
SCALE 16:1
1.91
0.51
16X
0.28
16X
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
NUF8401MN/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082-1312 USA
Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada
Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.