Semiconductor Components Industries, LLC, 2004
December, 2004 - Rev. 2
1
Publication Order Number:
NUP4302MR6/D
NUP4302MR6
Schottky Diode Array for
Four Data Line
ESD Protection
The NUP4302MR6 is designed to protect high speed data line
interface from ESD, EFT and lighting.
Features
Very Low Forward Voltage Drop
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
ESD Rating of Class 3B (Exceeding 16 kV) per Human Body Model
and Class C (Exceeding 400 V) per Machine Model
IEC 61000-4-2 Level 4 ESD Protection
Flammability Rating: UL 94 V-0
Applications
Ultra High-Speed Switching
USB 1.1 and 2.0 Power and Data Line Protection
Digital Video Interface (DVI)
Monitors and Flat Panel Displays
Device
Package
Shipping
ORDERING INFORMATION
NUP4302MR6T1
TSOP-6
3000/Tape & Reel
MARKING DIAGRAM
TSOP-6
CASE 318G
PLASTIC
STYLE 12
http://onsemi.com
67
M
67 = Specific Device Code
M
= Date Code
6 I/O
5 V
CC
4 I/O
I/O 1
GND 2
1/O 3
PIN CONFIGURATION
AND SCHEMATIC
1
1
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NUP4302MR6
http://onsemi.com
2
MAXIMUM RATINGS
(T
J
= 25C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Reverse Breakdown Voltage
V
BR
30
V
Forward Power Dissipation (T
A
= 25C)
P
F
225
mW
Forward Continuous Current
I
F
200
mA
Junction Operating Temperature
T
J
-55 to +125
C
Storage Temperature Range
T
stg
-55 to +150
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS
(T
J
= 25C unless otherwise noted)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Reverse Breakdown Voltage
V
BR
I
R
= 100 mA
30
V
Reverse Leakage
I
R
V
R
= 25 V
30
mA
Forward Voltage
V
F
I
F
= 0.1 mAdc
0.28
V
Forward Voltage
V
F
I
F
= 1.0 mAdc
0.35
V
Forward Voltage
V
F
I
F
= 10 mAdc
0.45
V
Forward Voltage
V
F
I
F
= 100 mAdc
1.00
V
Total Capacitance
C
T
V
R
= 0 V, f = 1.0 MHz, I/O to Ground
V
R
= 0 V, f = 1.0 MHz, I/O to I/O
28
18
pF
Reverse Recovery Time
t
rr
I
F
= I
R
= 10 mA, I
R(REC)
= 1.0 mA (Figure 1)
5.0
ns
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
t
rr
+10 V
2 k
820 W
0.1 mF
DUT
V
R
100 mH
0.1 mF
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
t
r
t
p
t
10%
90%
I
F
I
R
t
rr
t
i
R(REC)
= 1 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; measured
at i
R(REC)
= 1 mA)
I
F
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
NUP4302MR6
http://onsemi.com
3
1000
0
V
F
, FORWARD VOLTAGE (VOLTS)
0.2
0.4
0.6
0.8
100
10
1
100
0
V
R
, REVERSE VOLTAGE (VOLTS)
0.1
5
10
15
20
25
0
V
R
, REVERSE VOLTAGE (VOLTS)
10
5
0
5
10
15
30
Figure 2. Forward Current as a Function of
Forward Voltage; Typical Values
Figure 3. Reverse Current as a Function of
Reverse Voltage; Typical Values
Figure 4. Diode Capacitance as a Function of
Reverse Voltage; Typical Values
1.0
1000
10,000
30
25
20
15
25
I
F
,
FOR
W
ARD CURRENT (mA)
85C
T
A
= 125C
25C
1
10
I
R
, REVERSE CURRENT (
m
A)
85C
T
A
= 125C
25C
C
D
, DIODE CAP
ACIT
ANCE
(pF)
20
30
35
40
f = 1 MHz
T
A
= 25C
NUP4302MR6
http://onsemi.com
4
PACKAGE DIMENSIONS
TSOP-6
CASE 318G-02
ISSUE M
2
3
4
5
6
A
L
1
S
G
D
B
H
C
0.05 (0.002)
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
0.1142 0.1220
2.90
3.10
B
0.0512 0.0669
1.30
1.70
C
0.0354 0.0433
0.90
1.10
D
0.0098 0.0197
0.25
0.50
G
0.0335 0.0413
0.85
1.05
H
0.0005 0.0040
0.013
0.100
J
0.0040 0.0102
0.10
0.26
K
0.0079 0.0236
0.20
0.60
L
0.0493 0.0610
1.25
1.55
M
0
10
0
10
S
0.0985 0.1181
2.50
3.00
_
_
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
M
J
K
STYLE 12:
PIN 1. I/O
2. GROUND
3. I/O
4. I/O
5. VCC
6. I/O
0.95
0.037
1.9
0.075
0.95
0.037
mm
inches
SCALE 10:1
1.0
0.039
2.4
0.094
0.7
0.028
SOLDERING FOOTPRINT
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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NUP4302MR6/D
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