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Электронный компонент: SD05T1G

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Semiconductor Components Industries, LLC, 2005
January, 2005 - Rev. 1
1
Publication Order Number:
SD05T1/D
SD05T1 Series
Preferred Device
Transient Voltage
Suppressor Diode
SOD-323 Zeners for ESD Protection
These Zener diodes are designed for applications requiring transient
overvoltage protection capability. They are intended for use in voltage
and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment and other
applications. These devices are ideal for situations where board space is
at a premium.
Specification Features:
Steady State Power Routing of 200 mW
Peak Power - 350 W (8
20
ms)
Low Leakage
Cathode Indicated by Polarity Band
Package Weight: 4.507 mg/wmt
Meets IEC61000-4-2 Level 4, 15 kV (Air), 8 kV (Contact)
Meets IEC6100-4-4 Level 4, 40 A
Meets IEC6100-4-5 (Lightning), 24 A
Meets 16 kV Human Body Model ESD Requirements
Pb-Free Packages are Available
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V-0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260
C
Device Meets MSL 1 Requirements
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the "T1" with "T3" in the Device Number to order the
13 inch/10,000 unit reel.
http://onsemi.com
SOD-323
CASE 477
STYLE 1
MARKING DIAGRAM
xx = Specific Device Code
ZA = SD05T1
ZC = SD12T1
M = Date Code
Preferred devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
SD05T1
SOD-323
3000/Tape & Reel
SD12T1
SOD-323
3000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
xx M
SD05T1G
SOD-323
(Pb-Free)
3000/Tape & Reel
SD12T1G
SOD-323
(Pb-Free)
3000/Tape & Reel
SD05T1 Series
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2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ T
L
25C
P
pk
350
Watts
IEC 61000-4-2 (ESD)
Air
Contact
15
8.0
kV
IEC 61000-4-4 (EFT)
40
A
ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000-4-2)
V
PP
30
kV
Total Power Dissipation on FR-5 Board (Note 2) @ T
A
= 25C
Derate above 25C
P
D
200
1.6
mW
mW/C
Thermal Resistance Junction-to-Ambient
R
qJA
635
C/W
Junction and Storage Temperature Range
T
J
, T
stg
-55 to +150
C
Lead Solder Temperature - Maximum (10 Second Duration)
T
L
260
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
*Other voltages may be available upon request.
1. Nonrepetitive current pulse, per Figure 6.
2. FR-5 = 1.0 x 0.75 x 0.62 in.
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
BR
Breakdown Voltage @ I
T
I
T
Test Current
I
F
Forward Current
V
F
Forward Voltage @ I
F
Uni-Directional TVS
I
PP
I
F
V
I
I
R
I
T
V
RWM
V
C
V
BR
V
F
ELECTRICAL CHARACTERISTICS
V
BR
, Breakdown Voltage
(V)
V
C
@ I
PP
= 5 A
Max I
PP
V
C
@ Max I
PP
Max
Capacitance
(pF)
Device
V
RWM
(V)
I
R
@ V
RWM
(mA)
Min
Max
I
T
mA
V
C
@ I
PP
= 5 A
(Note 3)
(V)
Max I
PP
(Note 3)
(A)
V
C
@ Max I
PP
(Note 3)
(V)
V
R
= 0 V
f = 1.0 MHz
SD05T1, G
5.0
10
6.2
7.3
1.0
9.8
24
14.5
350
SD12T1, G
12
1.0
13.3
15.75
1.0
19
15
25
150
3. 8 20 ms pulse waveform.
SD05T1 Series
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3
TYPICAL CHARACTERISTICS
Figure 1. SD05 Typical Capacitance versus Bias
Voltage
-55
85
1000
Figure 2. SD12 Typical Capacitance versus
Bias Voltage
TEMPERATURE (C)
125 145
100
10
LEAKAGE CURRENT (nA)
0
1.5
3.5
5
280
220
180
160
120
100
C, CAP
ACIT
ANCE
(pF)
BIAS (V)
200
140
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
200
T
A
, AMBIENT TEMPERATURE (C)
PEAK
PULSE
DERA
TING IN % OF PEAK
POWER OR CURRENT @ T
A
= 25

C
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80
t, TIME (ms)
% OF PEAK PULSE CURRENT
t
P
t
r
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE I
RSM
@ 8 ms
HALF VALUE I
RSM
/2 @ 20 ms
0.5
2.5
4.5
65
45
25
5
-35
Figure 3. SD05 Typical Leakage Current
versus Temperature
-55
95
100
Figure 4. SD12 Typical Leakage Current
versus Temperature
TEMPERATURE (C)
120 145
10
1
0.1
LEAKAGE CURRENT (nA)
0
4
8
12
140
120
80
60
20
0
C, CAP
ACIT
ANCE
(pF)
BIAS (V)
100
40
2
6
10
70
45
20
-5
-30
240
260
1
2
3
4
-15
105
Figure 5. Pulse Derating Curve
Figure 6. 8 20 ms Pulse Waveform
SD05T1 Series
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD-323
CASE 477-02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
1.60
1.80
0.063
0.071
B
1.15
1.35
0.045
0.053
C
0.80
1.00
0.031
0.039
D
0.25
0.40
0.010
0.016
E
0.15 REF
0.006 REF
H
0.00
0.10
0.000
0.004
J
0.089
0.177
0.0035
0.0070
K
2.30
2.70
0.091
0.106
NOTE 3
A
K
1
2
D
B
E
H
C
J
L
0.075
---
0.003
---
NOTE 5
L
STYLE 1:
PIN 1. CATHODE
2. ANODE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.60
0.063
0.63
0.025
0.83
0.033
2.85
0.112
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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USA/Canada
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2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
SD05T1/D
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For additional information, please contact your
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