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Электронный компонент: IPD2133

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2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
1
March 28, 2000-00
YELLOW
IPD2131
HIGH EFFICIENCY RED
IPD2132
HIGH EFFICIENCY GREEN
IPD2133
0.200" 8-Character 5 x 7 Dot Matrix X-Y Stackable
Alphanumeric Programmable DisplayTM
FEATURES
Eight 0.2" Dot Matrix Characters in a Ceramic
Package
True Hermetic Glass Flat Seal for all Colors
Internal ROM with 128 ASCII Characters
Internal RAM for up to 16 User Definable
Characters
Programmable Control Word Allows User to
Select from 8 Brightness Levels, Display Blink,
Character Flash, Self Test, or Clear Functions
Internal or External Clock Capability
8 Bit Bidirectional Data Bus Allows for
Read/Write Capability
Contains all Display Drive and Multiplexing
Circuitry
Reset Pin for Display Initialization, Multiple
Display Blinking and Flashing Synchronization
TTL Compatible
Operating Temperature Range: 55
to +100
C
Storage Temperature: 65
to +125
C
Categorized for Luminous Intensity and Color
X-Y Stackable
DESCRIPTION
The IPD2131 (yellow), IPD2132 (High Efficiency Red) and IPD2133
(High Efficiency Green) are eight-digit high reliability 5 x 7 dot matrix
Programmable Displays that are aimed at satisfying the most demand-
ing display requirements. They are designed for use in extremely
harsh environments where only the most reliable parts are accept-
able. The devices are constructed in ceramic packages with eight
0.2 inch high 5 x 7 dot matrix digits. The devices incorporate the latest
in CMOS technology which is the heart of the device intelligence. The
CMOS IC is controlled by a user supplied eight-bit data word on a bidi-
rectional BUS. The ASCII data and attribute data are word driven. This
approach allows the displays to interface using similar techniques as a
microprocessor peripheral.
Applications include: control panels, night viewing applications, cockpit
monitors, portable and vehicle technology as well as industrial controllers.
1.680 MAX. (42.7)
1.663 MIN.(42.2)
.210
(5.3)
.105
(2.7)
.39
(9.9)
.195
(4.9)
.191
(4.8)
.111 (2.8)
.210
REF.
(5.3)
.015
TYP.
(0.4)
.300
(7.6)
SEATING
PLANE
.250 MAX.
(6.3)
.070 TYP.
(1.8)
SEATING
PLANE
.240
(6.1)
.020 TYP.(0.5)
.500
(12.7)
.050 TYP.
(1.3)
.100 TYP.
(2.54)
NON-CUM.
.090 TYP.
(2.3)
.180
(4.6)
.045
(1.1)
.030 (0.8)
EIA DATE CODE
INTENSITY CODE
HUE CATEGORY
YYWW V Z
OSRAM
IPD213X
Dimensions in Inches (mm)
Tolerance= .XXX
0.015 (0.30)
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
2
March 28, 2000-00
Maximum Ratings
(
T
A
=25
C)
DC Supply Voltage,
V
CC
to GND
(max. voltage with no LEDs on) ...................0.3 to +7.0 VDC
Input Voltage Levels, All Inputs ................... 0.3 to (
V
CC
+0.3) V
Operating Temperature ................................... 55
C to +100
C
Storage Temperature ....................................... 65
C to +125
C
Relative Humidity (non-condensing) ....................................85%
Operating Voltage,
V
CC
to GND
(Max. voltage with 20 dots/digits on).............................. 5.5 V
Maximum Solder Temperature
(0.063" below Seating Plane, t<5.0 sec.) ...................... 260
C
ESD Protection at 1.5 k
, 100 pF...............V
Z
=4.0 kV (each pin)
Figure 1. Enlarged Character Font
Oscillator, Refresh, Flash and Self Test Characteristics
ESD Warning:
Standard precautions for CMOS
handling should be observed.
Parameters
Min.
Typ.
Max.
Units
Conditions
Clock I/O Frequency
28
57.34
81.14
kHz
V
CC
=4.5 V to 5.5 V
External Clock Frequency
25
--
640
kHz
V
CC
=4.5 V to 5.5 V
FM, Digit Multiplex Frequency
125
256
362.5
Hz
V
CC
=4.5 V to 5.5 V
Blinking Rate
0.98
2.0
2.83
Hz
--
Clock I/O Bus Loading
--
--
2.40
pF
--
Clock Out Rise Time
--
--
500
nsec
V
CC
=4.5 V,
V
OH
=2.4 V
Clock Out Fall Time
--
--
500
nsec
V
CC
=4.5 V,
V
OH
=0.4 V
0.112
(2.85)
0.030
(0.76)
typ.
0.026 (0.65) typ.
0.189
(4.81)
R1
R2
R3
R4
R5
R6
R7
C1 C2 C3 C4 C5
Dimensions in inches (mm)
Switching Specifications
(over operating temperature range and
V
CC
=4.5 V to 5.5 V)
Symbol
Description
Min.
Units
T
acc
Display Access Time--Write
210
ns
T
acc
Display Access Time--Read
230
ns
T
acs
Address Setup Time to CE
10
ns
T
ce
Chip Enable Active Time--Write
140
ns
T
ce
Chip Enable Active Time--Read
160
ns
T
ach
Address Hold Time to CE
20
ns
T
cer
Chip Enable Recovery Time
60
ns
T
ces
Chip Enable Active Prior to
Rising Edge--Write
140
ns
T
ces
Chip Enable Active Prior to
Rising Edge--Read
160
ns
T
ceh
Chip Enable Hold to Rising Edge
of Read/Write Signal
0
ns
T
w
Write Active Time
100
ns
T
wd
Data Valid Prior to
Rising Edge of Write Signal
50
ns
T
dh
Data Write Time
20
ns
T
r
Chip Enable Active Prior to Valid
Data
160
ns
T
rd
Read Active Prior to Valid Data
95
ns
T
df
Read Data Float Delay
10
ns
T
rc
Reset Active Time
300
ns
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
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OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
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March 28, 2000-00
Figure 2. Write Cycle Timing Diagram
Figure 3. Read Cycle Timing Diagram
Figure 4. Maximum Power Dissipation vs. Ambient
Temperature Derating Based on
T
J
max=125
C
Tacc
Twd
Tdh
Tw
Tces
Tcer
Tceh
Tacs
Tach
Tacs
A0-A3
FL
Tce
CE
WR
D0-D7
Input pulse levels --0.6 V to 2.4 v
Input pulse levels 0.6 V to 2.4 V
Tacc
Trd
Tdf
Tr
Tces
Tcer
Tceh
Tacs
Tach
Tacs
A0-A3
FL
Tce
CE
RD
D0-D7
4.0
3.0
2.0
1.0
0
25
35
45
55
65
75
85
95
105
P
D

Power Dissipation
--
W
T
A
C
R
JA
= 30C/W
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
4
March 28, 2000-00
Optical Characteristics at 25
C
(
V
CC
=5.0 V at full brightness)
Yellow IPD2131
High Efficiency Red IPD2132
High Efficiency Green IPD2133
Electrical Characteristics at 25
C
Notes:
1)
I
CC
is an average value.
2)
I
CC
is measured with the display at full brightness. Peak
I
CC
=
28
/
15
I
CC
average (#displayed).
Description
Symbol
Min.
Typ.
Units
Luminous Intensity
I
V
125
205
cd/dot
Peak Wavelength
peak
--
583
nm
Dominant Wavelength
dom
--
585
nm
Description
Symbol
Min.
Typ.
Units
Luminous Intensity
I
V
125
350
cd/dot
Peak Wavelength
peak
--
635
nm
Dominant Wavelength
dom
--
626
nm
Description
Symbol
Min.
Typ.
Units
Luminous Intensity
I
V
150
500
cd/dot
Peak Wavelength
peak
--
568
nm
Dominant Wavelength
dom
--
574
nm
Parameters
Limits
Conditions
Min.
Typ.
Max.
Units
V
CC
4.5
5.0
5.5
V
--
I
CC
Blank
--
0.5
1.0
mA
V
CC
=5.0 V,
V
IN
=5.0 V
I
CC
12 dots/digit on
(1) (2)
--
200
255
mA
V
CC
=5.0 V, "V" in all 8 digits
I
CC
20 dots/digit on
(1) (2)
--
300
370
mA
V
CC
=5.0 V, "#" in all 8 digits
I
ILP
(with pull-up)
Input Leakage
1.0
11
18
A
V
CC
=5.0 V,
V
N
=0 V to
V
CC
(WR, CE, FL, RST, RD, CLKSEL)
I
IL
(no pull-up)
Input Leakage
1.0
--
+1.0
A
V
CC
=5.0 V,
V
IN
=05.0 V
(CLK, A0A4, D0D7)
V
IH
Input Voltage High
2.0
--
V
CC
+0.3
V
V
CC
=4.5 V to 5.5 V
V
IL
Input Voltage Low
GND
0.3
--
0.8
V
V
CC
=4.5 V to 5.5 V
V
OL
(D0D7), Output Voltage Low
--
--
0.4
V
V
CC
=4.5 V,
I
OL
=1.6 mA
V
OL
(CLK), Output Voltage Low
--
--
0.4
V
V
CC
=4.5 V,
I
OL
=40
A
V
OH
Output Voltage High
2.4
--
--
V
V
CC
=4.5 V,
I
OH
=40
A
JC
Thermal Resistance,
Junction to Case
--
15
--
C/W
--
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
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March 28, 2000-00
Recommended Operating Conditions
(
T
A
=55
C to +100
C)
Pin Description
Parameter
Symbol
Min.
Max.
Units
Supply Voltage
V
CC
4.5
5.5
V
Input Voltage Low
V
IL
--
0.8
V
Input Voltage High
V
IH
2.0
--
V
Output Voltage Low
V
OL
--
0.4
V
Output Voltage High
V
OH
2.4
--
V
Pin No.
Function
Description
Explanation
1
CLS
Clock Select
Selects an internal or external clock source. CLS=1 the internal clock selected (mas-
ter clock), CLS=0 then external clock selected (slave operation).
2
CLK
Clock I/O
Inputs or outputs the clock as determined by the CLS pin.
3
WR
Write
Writes data into the display when WR=0 and CE=0.
4
CE
Chip Enable
Enables the read/write access when low.
5
RST
Reset
Initializes the display; clears the Character RAM (20 Hex), Flash RAM
(00 Hex), Control Word (00 Hex) and resets the internal counters. UDC Address
Register and UDC RAM are unaffected.
6
RD
Read
Outputs data from the display when RD=0 and CE=0.
7
No Pin
--
--
8
9
10
11
D0
Data Bus
8 bit bidirectional data bus. Character RAM and Control Word uses D7D0, UDC
Address Register uses D3D0, UDC RAM uses D4D0, and Flash RAM uses D0.
12
D1
13
D2
14
D3
15
NC
--
--
16
V
CC
--
Positive power supply.
17
GND
Supply
Analog ground for the LED drivers.
18
GND
Logic
Digital ground for the logic circuitry.
19
D4
Data Bus
8 bit bidirectional data bus. Character RAM and Control Word uses D7-D0, UDC
Address Register uses D3-D0, UDC RAM uses D4-D0, and Flash RAM uses D0.
20
D5
21
D6
22
D7
23
No Pin
--
--
24
25
26
27
FL
Flash
Accesses the Flash RAM. Address inputs, A2A0, select the digit address while
data bit D0 sets (D0=1) or resets (D0=0) the Flash bit. A4 and A3 are ignored.
28
A0
Address Inputs
A4 and A3 select a section of the display's memory. A2A0 select specific locations
in the different sections. If FL is low the Flash RAM is accessed regardless of the
status of A4 and A3.
29
A1
30
A2
31
A3
32
A4
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
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March 28, 2000-00
Figure 5. Character Set
Figure 6. Cascading Diagram
Cascading Displays
The display's oscillator is designed to drive up to 16 other dis-
play's with input loading of 15 pF each.
The following are the general requirements for cascading 16
displays together:
Determine the correct address for each display.
Use CE from an address decoder to select the correct display.
Select one of the Displays to provide the Clock for the other
displays. Connect CLKSEL to V
CC
for this display.
Tie CLKSEL to ground on other displays.
Use RST to synchronize the blinking between the displays.
ASCII
CODE
D0
D1
D2
D3
L
L
L
L
0
H
L
L
L
1
L
H
L
L
2
H
H
L
L
3
L
L
H
L
4
H
L
H
L
5
L
H
H
L
6
H
H
H
L
7
L
L
L
H
8
H
L
L
H
9
L
H
L
H
A
H
H
L
H
B
L
L
H
H
C
H
L
H
H
D
L
H
H
H
E
H
H
H
H
F
L
L
L
L
H
H
H
H
X
L
L
L
L
L
L
L
L
H
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
X
0
1
2
3
4
5
6
7
8
D6
D7
D5 D4 HEX
UDC
0
UDC
1
UDC
2
UDC
3
UDC
4
UDC
5
UDC
6
UDC
7
UDC
8
UDC
9
UDC
10
UDC
11
UDC
12
UDC
13
UDC
14
UDC
15
Notes:
1. Upon power up, the device will
initialize in a random state.
2. X=don't care.
RD WR FL RST CLK I/O CLKSEL
D0-D7 A0-A4 CE
Display
D0-D7 A0-A4 CE
Up to14 More Displays
in between
Address Decode Chip 1 to 14
Address
Data I/O
RD
WR
FL
RST
V
CC
A6
A7
A8
A9
Address
Decoder
RD WR FL RST CLK I/O CLKSEL
0
15
Display
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
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March 28, 2000-00
Figure 7. Block Diagram
Functional Description
The display's user interface is organized into five memory
areas. They are accessed using the Flash Input, FL, and
address lines, A3 and A4. All the listed RAMs and Registers
may be read or written through the data bus. See Table 1. Each
input pin is described in Pin Definitions.
Five Basic Memory Areas
Character RAM
Stores either ASCII (Katakana)
character data or an UDC RAM
address
Flash RAM
1 x 8 RAM which stores Flash data
User-Defined
Character RAM
(UDC RAM)
Stores dot pattern for custom
characters
User-Defined Address
Register (UDC
Address Register)
Provides address to UDC RAM
when user is writing or reading
custom character
Control Word
Register
Enables adjustment of display
brightness, flash individual charac-
ters, blink, self test or clearing
the display
7
Counter
128
Counter
3
Counter
OSC
Row
Drivers
Column
Drivers
8 Digit Display
Cursor
Controls
and
Display
MUX
D Latch
Holding
Register
ROM
Word
Decode
ROM
Column
Latch
M
a
s
t
e
r
S
l
a
v
e
Character
RAM
Decode
32
Counter
Character
RAM
UDC
Address
Register
Character
Decode
for Display
Character
Decode
(Read/Write)
UDC
RAM
Flash
RAM
Control
Word
Register
Self
Test
Data Bus
25
5
64
16
5
16
4
4
25
RST can be used to initialize display operation upon power up
or during normal operation. When activated, RST will clear the
Flash RAM and Control Word Register (00H) and reset the
internal counter. All eight display memory locations will be set
to 20H to show blanks in all digits.
FL pin enables access to the Flash RAM. The Flash RAM will
set (D0=1) or reset (D0=0) flashing of the character addressed
by A0A2.
The 1 x 8 bit Control Word Register is loaded with attribute
data if A3=0.
The Control Word Logic decodes attribute data for proper
implementation.
Character ROM is designed for 128 ASCII characters. The
ROM is Mask Programmable for custom fonts.
The Clock Source could either be the internal oscillator
(CLKSEL=1) of the device or an external clock (CLKSEL=0)
could be an input from another IPD213X display for synchroniz-
ing blinking for multiple displays.
The Display Multiplexer controls the Row Drivers so no addi-
tional logic is required for a display system.
The Display has eight digits. Each digit has 35 LEDs.
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
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OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
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March 28, 2000-00
Table 1. Memory Selection
Theory of Operation
The IPD213X Display is designed to work with all major micro-
processors. Data entry is via an eight bit parallel bus. Three bits
of address route the data to the proper digit location in the
RAM. Standard control signals like WR and CE allow the data
to be written into the display.
D0D7 data bits are used for both Character RAM and control
word data input. A3 acts as the mode selector.
If A3=1, character RAM is selected. Then input data bit D7 will
determine whether input data bits D0D6 is ASCII coded data
(D7=0) or UDC data (D7=1). See section on UDC Address Reg-
ister and RAM.
For normal operation FL pin should be held high. When FL is
held low, Flash RAM is accessed to set character blinking.
The seven bit ASCII code is decoded by the Character ROM to
generate Column data. Twenty columns worth of data is sent
out each display cycle, and it takes fourteen display cycles to
write into eight digits.
The rows are multiplexed in two sets of seven rows each.
The internal timing and control logic synchronizes the turning
on of rows and presentation of column data to assure proper
display operation.
Power Up Sequence
Upon power up the display will come on at random. Thus the
display should be reset on power-up. Reset will clear the
Flash RAM, Control Word Register and reset the internal
counter. All the digits will show blanks and display brightness
level will be 100%.
The display must not be accessed until three clock pulses (110
seconds minimum using the internal clock) after the rising
edge of the reset line.
FL
A4
A3
Section of Memory
A2A0
Data Bits Used
0
X
X
Flash RAM
Character Address
D0
1
0
0
UDC Address Register
Don't Care
D3D0
1
0
1
UDC RAM
Row Address
D4D0
1
1
1
Character RAM
Character Address
D7D0
1
1
0
Control Word Register
Don't Care
D7D0
Microprocessor Interface
The interface to a microprocessor is through the 8-bit data
bus (D0D7), the 4-bit address bus (A0A3) and control lines
FL , CE and WR.
To write data (ASCII/Control Word) into the display CE should
be held low, address and data signals stable and WR should
be brought low. The data is written on the low to high transi-
tion of WR.
The Control Word is decoded by the Control Word Decode
Logic. Each code has a different function. The code for display
brightness changes the duty cycle for the column drivers. The
peak LED current stays the same but the average LED current
diminishes depending on the intensity level.
The character Flash Enable causes 2.0 Hz coming out of the
counter to be ANDED with the column drive signal to make the
column driver cycle at 2.0 Hz. Thus the character flashes at
2.0 Hz.
The display Blink works the same way as the Flash Enable but
causes all twenty column drivers to cycle at 2.0 Hz thereby
making all eight digits blink at 2.0 Hz.
The Self Test function of the IC consists of two internal rou-
tines which exercise major portions of the IC and illuminates
all the LEDs.
Clear bit clears the character RAM and writes a blank into the
display memory. It however does not clear the control word.
ASCII Data or Control Word Data can be written into the dis-
play at this point. For multiple display operation, CLK I/O
must be properly selected. CLK I/O will output the internal
clock if CLKSEL=1, or will allow input from an external clock
if CLKSEL=0.
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
9
March 28, 2000-00
Character RAM
The Character RAM is selected when FL, A4 and A3 are set to
1,1,1 during a read or write cycle. The Character RAM is a 8 by
8 bit RAM with each of the eight locations corresponding to a
digit on the display. Digit 0 is on the left side of the display and
digit 7 is on the right side of the display. Address lines, A2A0
select the digit address with A2 being the most significant bit
and A0 being the least significant bit. The two types of data
stored in the Character RAM are the ASCII coded data and the
UDC Address Data. The type of data stored in the Character
RAM is determined by data bit, D7. If D7 is low, then ASCII
coded data is stored in data bits D6D0. If D7 is high, then UDC
Address Data is stored in data bit D3D0.
The ASCII coded data is a 7 bit code used to select one of 128
ASCII characters permanently stored in the ASCII ROM.
The UDC Address data is a 4 bit code used to select one of the
UDC characters in the UDC RAM. There are up to 16 charac-
ters available. See Figure 8.
UDC Address Register and UDC RAM
The UDC Address Register and UDC RAM allows the user to
generate and store up to 16 custom characters. Each custom
character is defined in 5 x 7 dot matrix pattern. It takes 8 write
cycles to define a custom character, one cycle to load the UDC
Address Register and 7 cycles to define the character. The con-
tents of the UDC Address Register will store the 4 bit address
for one of the 16 UDC RAM locations. The UDC RAM is used
to store the custom character.
Figure 8. Character RAM Access Logic
Figure 9. UDC Address Register and UDC Character RAM
RST
CE
WR
RD
FL
A4
A3
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
1
0
0
1
1
1
1
Character Address for
Digits 07
0
7 bit ASCII code for a Write Cycle
1
0
1
0
1
1
1
Character Address for
Digits 07
0
7 bit ASCII code read during a Read Cycle
1
0
0
1
1
0
0
Character Address for
Digits 07
1
D3D0=UDC address for a Write Cycle
1
0
1
0
1
0
0
Character Address for
Digits 07
1
D3D0=UDC address for Read Data
RST
CE
WR
RD
FL
A4
A3
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
1
0
0
1
1
0
0
Not used for UDC
Address Register
D3D0=UDC RAM Address Code for
Write Cycle
UDC
Address
Register
1
0
1
0
1
0
0
Not used for UDC
Address Register
D3D0=UDC RAM Address Code for
Read Cycle
1
0
0
1
1
0
1
A2A0=Character
Row Address
D4D0=Character Column Data for
Write Cycle
UDC
RAM
1
0
1
0
1
0
1
A2A0=Character
Row Address
D4D0=Character Column Data read
during a Read Cycle
UDC Address Register
The UDC Address Register is selected by setting FL=1, A4=0,
A3=0. It is a 4 bit register and uses data bits, D3D0 to store
the 4 bit address code (D7D4 are ignored). The address code
selects one of 16 UDC RAM locations for custom character
generation.
UDC RAM
The UDC RAM is selected by setting FL=1, A4=0, A3=1. The
RAM is comprised of a 7 x 5 bit RAM. As shown in Figure 10,
address lines, A2-A0 select one of the 7 rows of the custom
character. Data bits, D4-D0 determine the 5 bits of column data
in each row. Each data bit corresponds to a LED. If the data bit
is high, then the LED is on. If the data bit is low, the LED is off.
To create a character, each of the 7 rows of column data need
to be defined. See Figures 9 and 10 for logic.
Flash RAM
The Flash RAM allows the display to flash one or more of the
characters being displayed. The Flash Ram is accessed by set-
ting FL low. A4 and A3 are ignored. The Flash RAM is a 8 x 1 bit
RAM with each bit corresponding to a digit address. Digit 0 is
on the left side of the display and digit 7 is on the right side of
the display. Address lines, A2A0 select the digit address with
A2 being the most significant digit and A0 being the least sig-
nificant digit. Data bit, D0, sets and resets the flash bit for each
digit. When D0 is high, the flash bit is set; and when D0 is low,
it is reset. See Figure 11.
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
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March 28, 2000-00
Control Word
The Control Word is used to set up the attributes required by
the user. It is addressed by setting FL=1, A4=1, A3=0. The
Control Word is an 8 bit register and is accessed using data
bits, D7D0. See Figures 12 and 13 for the logic and attrib-
uted control. The Control Word has 5 functions. They are
brightness control, flashing character enable, blinking charac-
ter enable, self test, and clear (Flash and Character RAMS
only).
Brightness Control
Control Word bits, D2D0, control the brightness of the display
with a binary code of 000 being 100% brightness and 111
being display blank. See Figure 13 for brightness level versus
binary code. The average I
CC
can be calculated by multiplying
the 100% brightness level I
CC
value by the display's brightness
level. For example, a display set to 80% brightness with a
100% average I
CC
value of 200 mA will have an average I
CC
value of 200 mA x 80%=160 mA.
Figure 10. UDC Character Map
Figure 11. Flash RAM Access Logic
Figure 12. Control Word Access Logic
Row Data
A2
A1
A0
Row #
Column Data
C1
C2
C3
C4
C5
D4
D3
D2
D1
D0
0
0
0
1
5 x 7
Dot Matrix
Pattern
0
0
1
2
0
1
0
3
0
1
1
4
1
0
0
5
1
0
1
6
1
1
0
7
RST
CE
WR
RD
FL
A4
A3
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
1
0
0
1
0
X
X
Flash RAM Address for Digits 07
D0=Flash Data, 0=Flash Off and 1=Flash On
(Write Cycle)
1
0
1
0
0
X
X
Flash RAM Address for Digits 07
D0=Flash Data, 0=Flash Off and 1=Flash On
(Read Cycle)
RST
CE
WR
RD
FL
A4
A3
A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
1
0
0
1
1
1
0
Not used for Control Word
Control Word data for a Write Cycle,
see Figure 13
1
0
1
0
1
1
0
Not used for Control Word
Control Word data for a Read during a
Read Cycle
Flash Function
Control Word bit, D3, enables or disables the Flash Function.
When D3 is 1, the Flash Function is enabled and any digit with
its corresponding bit set in the Flash RAM will flash at approxi-
mately 2.0 hertz. When using an external clock, the flash rate
can be determined by dividing the clock rate by 28,672. When
D3 is 0, the Flash Function is disabled and the contents of the
Flash RAM is ignored. For synchronized flashing on multiple
displays, see the Reset Section.
Blink Function
Control Word bit, D4, enables or disables the Blink Function.
When D4 is 1, the Blink Function is enabled and all characters
on the display will blink at approximately 2.0 hertz. The Blink
Function will override the Flash Function if both functions are
enabled. When D4 is 0, the Blink Function is disabled. When
using an external clock, the blink rate can be determined by
dividing the clock rate by 28,672. For synchronized blinking on
multiple displays, see the Reset Section.
Self Test
Control Word bits, D6 and D5, are used for the Self Test Func-
tion. When D6 is 1, the Self Test is initiated. Results of the Self
Test are stored in bit D5. Control Word bit, D5, is a read only
bit. When D5 is 1, Self Test has passed. When D5 is 0, Self
Test failed is indicated. The Self Test function of the IC consists
of two internal routines which exercise major portions of the IC
and illuminates all of the LEDs. The first routine cycles the
ASCII decoder ROM through all states and performs a check
sum on the out-put. If the check sum is correct, D5 is set to a 1
(Pass).
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
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March 28, 2000-00
The second routine provides a visual test of the LEDs. This is
accomplished by writing checkered and inversed checkered
patterns to the display. Each pattern is displayed for approxi-
mately 2.0 seconds. During the self test function the display
must not be accessed. The time needed to execute the self
test function is calculated by multiplying the clock time by
262,144 (typical time
4.6 sec.). At the end of the self test, the
Character RAM is loaded with blanks; the Control Word Regis-
ter is set to zeroes except D5; the Flash RAM is cleared and
the UDC Address Register is set to all 1.0s.
Clear Function (see Figures 13 and 14)
Control Word bit, D7 clears the character RAM to 20 hex and
the flash RAM to all zeroes. The RAMs are cleared within three
clock cycles (110
s minimum, using the internal clock) when
D7 is set to 1. During the clear time the display must not be
accessed. When the clear function is finished, bit 7 of the Con-
trol Word RAM will be reset to a "0".
Figure 13. Control Word Data Definition
Figure 14. Clear Function
X=don't care
CE
WR
FL
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
Operation
0
0
0
0
1
1
0
0
X
X
X
X
X
X
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Clear disabled
Clear user RAM, flash RAM
and display
D7 D6 D5 D4 D3 D2 D1 D0
C ST ST BL FL Br Br Br
0 0 0 100% Brightness
0 0 1 80% Brightness
0 1 0 53% Brightness
0 1 1 40% Brightness
1 0 0 27% Brightness
1 0 1 20% Brightness
1 1 0 13% Brightness
1 1 1 Blank Display
0 Flash Function Disabled
1 Flash Function Enabled
0 Blink Function Disabled
1 Blink Function Enabled (overrides Flash Function)
X Normal Operation X=bit ignored
R Run Self Test, R=Test Result, R=1/pass, 0=fail
0
1
0 Normal Operation
1 Clear Flash RAM & Character RAM (Character RAM=20 Hex)
Key
C
Clear Function
ST
Self test
BL
Blink function
FL
Flash function
Br
Brightness control
Reset Function
The display should be reset on power up of the display
(RST=LOW). When the display is reset, the Character RAM,
Flash RAM, and Control Word Register are cleared.
The display's internal counters are reset. Reset cycle takes
three clock cycles (110
seconds minimum using the internal
clock). The display must not be accessed during this time.
To synchronize the flashing and blinking of multiple displays, it
is necessary for the display to use a common clock source and
reset all the displays at the same time to start the internal
counters at the same place.
While RST is low, the display must not be accessed by RD
nor WR.
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
12
March 28, 2000-00
Figure 15. Display Cycle Using Built-in ROM Example
Display message "Showtime." Digit 0 is leftmost--closest to pin 1.
Logic levels: 0=Low, 1=High, X=Don't care.
Figure 16. Displaying User Defined Character Example
Load character "A" into UDC-5 and then display it in digit 2.
Logic levels: 0=Low, 1=High, X=Don`t care
RST CE
WR RD
FL
A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 Operation
Display
0
X
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
Reset. No Read/Write
Within 3 Clock Cycles
All Blank
1
0
0
1
1
1
0
X
X
X
0
0
X
0
0
0
1
1
53% Brightness Selected
All Blank
1
0
0
1
1
1
1
0
0
0
0
1
0
1
0
0
1
1
Write "S" to Digit 0
S
1
0
0
1
1
1
1
0
0
1
0
1
0
0
1
0
0
0
Write "H" to Digit 1
SH
1
0
0
1
1
1
1
0
1
0
0
1
0
0
1
1
1
1
Write "O" to Digit 2
SHO
1
0
0
1
1
1
1
0
1
1
0
1
0
1
0
1
1
1
Write "W" to Digit 3
SHOW
1
0
0
1
1
1
1
1
0
0
0
1
0
1
0
1
0
0
Write "T" to Digit 4
SHOWT
1
0
0
1
1
1
1
1
0
1
0
1
0
0
1
0
0
1
Write "I" to Digit 5
SHOWTI
1
0
0
1
1
1
1
1
1
0
0
1
0
0
1
1
0
1
Write "M" to Digit 6
SHOWTIM
1
0
0
1
1
1
1
1
1
1
0
1
0
0
0
1
0
1
Write "E" to Digit 7
SHOWTIME
RST CE
WR RD
FL
A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 Operation
Display
0
X
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
Reset. No Read/Write
Within 3 Clock Cycles
All Blank
1
0
0
1
1
0
0
X
X
X
X
X
X
X
0
1
0
1
Select UDC-5
All Blank
1
0
0
1
1
0
1
0
0
0
X
X
X
0
1
1
1
0
Write into Row 1 of UDC-5
All Blank
1
0
0
1
1
0
1
0
0
1
X
X
X
1
0
0
0
1
Write into Row 2 of UDC-5
All Blank
1
0
0
1
1
0
1
0
1
0
X
X
X
1
0
0
0
1
Write into Row 3 of UDC-5
All Blank
1
0
0
1
1
0
1
0
1
1
X
X
X
1
1
1
1
1
Write into Row 4 of UDC-5
All Blank
1
0
0
1
1
0
1
1
0
0
X
X
X
1
0
0
0
1
Write into Row 5 of UDC-5
All Blank
1
0
0
1
1
0
1
1
0
1
X
X
X
1
0
0
0
1
Write into Row 6 of UDC-5
All Blank
1
0
0
1
1
0
1
1
1
0
X
X
X
1
0
0
0
1
Write into Row 7 of UDC-5
All Blank
1
0
0
1
1
1
1
0
1
0
1
X
X
X
0
1
0
1
Write UDC-5 into Digit 2
(Digit 2) A
2000 Infineon Technologies Corp. Optoelectronics Division San Jose, CA
IPD2131/2/3
www.infineon.com/opto 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG Regensburg, Germany
www.osram-os.com +49-941-202-7178
13
March 28, 2000-00
Electrical and Mechanical Considerations
Voltage Transient Suppression
For best results power the display and the components that
interface with the display to avoid logic inputs higher than V
CC
.
Additionally, the LEDs may cause transients in the power sup-
ply line while they change display states. The common practice
is to place a parallel combination of a .01
F and a 22
F capac-
itor between V
CC
and GND for all display packages.
ESD Protection
The input protection structure of the IPD2131X provides signifi-
cant protection against ESD damage. It is capable of withstand-
ing discharges greater than 4.0 kV. Take all the standard
precautions normal for CMOS components. These include
properly grounding personnel, tools, tables, and transport carri-
ers that come in contact with unshielded parts. If these condi-
tions are not, or cannot be met, keep the leads of the device
shorted together or the parts in anti-static packaging.
Soldering Considerations
The IPD213X can be hand soldered with SN63 solder using a
grounded iron set to 260
C.
Wave soldering is also possible. Use water soluble organic acid
flux or resin based RMA flux.
A wave temperature of 245
C
5
C with a dwell between 1.5
seconds to 3.0 seconds can be used. Exposure to the wave
should not exceed temperatures above 260
C for five seconds
at 0.063" below the seating plane. The packages should not be
immersed in the wave.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60
C) for
less than 15 minutes. Addition of mild saponifiers is accept-
able. Do not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Suggested solvents
include Freon TE, Freon TF, Genesolv DE-15, Genesolv DI-15,
and Genesolv DES.
An alternative to soldering and cleaning the display modules is
to use sockets. Multiple display assemblies are best handled
by longer SIP sockets or DIP sockets when available for uni-
form package alignment. Socket manufacturers are Aries Elec-
tronics, Inc., Frenchtown, NJ; Garry Manufacturing, New
Brunswick, NJ; Robinson-Nugent, New Albany, IN; and Samtec
Electronic Hardward, New Albany, IN.
For further information refer to Appnote 22 at www.infin-
eon.com/opto.
Optical Considerations
The .200" high character of the IPD213X gives readability up
to eight feet. Proper filter selection enhances readability over
this distance.
Using filters emphasizes the contrast ratio between a lit LED
and the character background. This will increase the discrimina-
tion of different characters. The only limitation is cost. Take into
consideration the ambient lighting environment for the best
cost/benefit ratio for filters.
Incandescent (with almost no green) or fluorescent (with
almost no red) lights do not have the flat spectral response of
sunlight. Plastic band-pass filters are an inexpensive and effec-
tive way to strengthen contrast ratios. The high efficiency red
displays should be matched with a long wavelength pass filter
in the 570 nm to 590 nm range. The IPD2133 should be
matched with a yellow-green band-pass filter that peaks at 565
nm. For displays of multiple colors, neutral density grey filters
offer the best compromise.
Additional contrast enhancement is gained by shading the dis-
plays. Plastic band-pass filters with built-in louvers offer the
next step up in contrast improvement. Plastic filters can be
improved further with anti-reflective coatings to reduce glare.
The trade-off is fuzzy characters. Mounting the filters close to
the display reduces this effect. Take care not to overheat the
plastic filter by allowing for proper air flow.
Optimal filter enhancements are gained by using circular polar-
ized, anti-reflective, band-pass filters. The circular polarizing fur-
ther enhances contrast by reducing the light that travels through
the filter and reflects back off the display to less than 1%.
Several filter manufacturers supply quality filter materials.
Some of them are: Panelgraphic Corporation, W. Caldwell, NJ;
SGL Homalite, Wilmington, DE; 3M Company, Visual Products
Division, St. Paul, MN; Polaroid Corporation, Polarizer Division,
Cambridge, MA; Marks Polarized Corporation, Deer Park, NY,
Hoya Optics, Inc., Fremont, CA.
One last note on mounting filters: recessing displays and bezel
assemblies is an inexpensive way to provide a shading effect in
overhead lighting situations. Several bezel manufacturers are:
R.M.F. Products, Batavia, IL; Nobex Components, Griffith Plas-
tic Corp., Burlingame, CA; Photo Chemical Products of Califor-
nia, Santa Monica, CA; I.E.E.-Atlas, Van Nuys, CA.