LG Y870
Micro SIDELED
Vorlufige Daten / Preliminary Data
2002-10-18
1
Besondere Merkmale
Gehusetyp: weies SMT-Gehuse
Besonderheit des Bauteils: kleine Bauform
mit extrem breiter Abstrahlcharakteristik; ideal
fr Hinterleuchtungen und Einkopplungen in
Lichtleiter
Wellenlnge: 570 nm
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: GaP
optischer Wirkungsgrad: 2 lm/W
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 3000/Rolle, 180 mm
oder 10000/Rolle, 330 mm
Anwendungen
optimale Einkopplung in Lichtleiter
Hinterleuchtung (LCD, Mobiltelefone, Tasten,
Allgemeinbeleuchtung, Werbebeleuchtung)
Signal- und Symbolleuchten
Automobilbereich (z. B.
Instrumentenbeleuchtung)
Features
package: white SMT package
feature of the device: small package with
extremely wide viewing angle; ideal for
backlighting and coupling in light guides
wavelength: 570 nm
viewing angle: Lambertian Emitter (120)
technology: GaP
optical efficiency: 2 lm/W
grouping parameter: luminous intensity
assembly methods: suitable for
all SMT assembly methods
soldering methods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 3000/reel, 180 mm
or 10000/reel, 330 mm
Applications
optimized coupling into light guides
backlighting (LCD, cellular phones, keys,
general lightning, illuminated advertising)
signal and symbol luminaire
automotive (e. g. car radio backlighting)
2002-10-18
2
LG Y870
Anm.: -1 gesamter Farbbereich (siehe Seite 4)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range (see page 4)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 10 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 10 mA
V
(mlm)
Bestellnummer
Ordering Code
LG Y870-J2K2-1
LG Y870-K2M1-1
green
colorless clear
5.6 ... 11.2
9.0 ... 22.4
25 (typ.)
45 (typ.)
Q62703Q6189
Q62703Q6190
LG Y870
2002-10-18
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
C
Durchlassstrom
Forward current
I
F
30
mA
Stostrom
Surge current
t
10
s,
D
= 0.005
I
FM
100
mA
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
P
tot
95
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/air
Sperrschicht/Ltpad
Junction/soldering point
Montage auf PC-Board FR 4 (Padgre
5 mm
2
)
mounted on PC board FR 4 (pad size
5 mm
2
)
R
th JA
R
th JS
530
300
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2002-10-18
4
LG Y870
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 10 mA
peak
572
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
1)
I
F
= 10 mA
dom
570
6
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 10 mA
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
2)
(max.)
I
F
= 10 mA
V
F
V
F
2.0
2.5
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 10 mA; 10C
T
100C
TC
peak
0.11
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 10 mA; 10C
T
100C
TC
dom
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 10 mA; 10C
T
100C
TC
V
1.4
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 10 mA
opt
2
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LG Y870
2002-10-18
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
J2
K1
K2
L1
L2
M1
5.6 ...
7.1
7.1 ...
9.0
9.0 ... 11.2
11.2 ... 14.0
14.0 ... 18.0
18.0 ... 22.4
19 (typ.)
24 (typ.)
30 (typ.)
40 (typ.)
50 (typ.)
60 (typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: L1
Example: L1
Lichtgruppe
Luminous Intensity Group
Halbgruppe
Half Group
L
1
2002-10-18
6
LG Y870
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 10 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
%
rel
OHL01098
100
80
60
40
20
0
400
450
500
550
600
650
700
nm
I
green
V
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LG Y870
2002-10-18
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
A
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(10 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V
(25 C)=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 10 mA
10
-1
V
5
OHL01263
I
F
F
V
0
10
1
10
2
10
5
mA
1
1.4
1.8
2.2
2.6
3
3.4
0
OHL00091
I
F
C
0
20
40
60
80
100
T
temp. solder point
temp. ambient
T
A
T
S
T
S
A
T
mA
5
10
15
20
25
30
35
V
V (10mA)
10
-1
0
10
10
1
2
10
mA
10
-3
5
OHL02313
F
I
5
-2
10
5
-1
10
0
10
1
10
I
I
5
5
green
green
0
OHL01101
C
A
T
0
20
40
60
80
100
V
V (25 C)
I
I
0.4
0.8
1.2
1.6
2
LG Y870
2002-10-18
8
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
OHL00682
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
0.02
0.04
0.06
0.08
0.12
0.10
OHL00683
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10
s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
0.02
0.04
0.06
0.08
0.12
0.10
LG Y870
2002-10-18
9
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 6 mg
GPLY6058
0 ... 0.1 (0 ... 0.004)
3.1 (0.122)
2.9 (0.114)
0.7 (0.028)
0.5 (0.020)
1.0 (0.039)
1.2 (0.047)
Cathode
0.3 (0.012)
0.5 (0.020)
(15
)
2.3 (0.091)
2.1 (0.083)
1.3 (0.051)
1.1 (0.043)
(0.4 (0.016))
(0.6 (0.024))
0.25 (0.010)
0.20 (0.008)
Light emitting area
typ. 1.7 0.7
2002-10-18
10
LG Y870
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
LG Y870
2002-10-18
11
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2002-10-18
12
LG Y870
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehuse hlt TTW-Lthitze aus / Package able to withstand TTW-soldering heat
Gurtung / Polaritt und Lage
Verpackungseinheit 3000/Rolle, 180 mm oder
10000/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 3000/reel, 180 mm
or 10000/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHPY1315
0.8 (0.031)
2.2 (0.087)
0.7 (0.028)
Component location on pad
Bauteil positioniert
Padgeometrie fr
C
A
verbesserte Wrmeableitung
heat dissipation
Paddesign for improved
Ltstopplack
Solder resist
C
A
OHAY1515
1.5 (0.059)
4 (0.157)
2 (0.079)
3.5 (0.138)
1.75 (0.069)
8.1 (0.319)
A
C
0.9 (0.035)
2.4 (0.094)
3.3 (0.130)
1.25 (0.049)
0.3 (0.012) max.
1.4 (0.055)
LG Y870
2002-10-18
13
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If
requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2002-10-18
Date of change
Previous Version:
2002-09-18
Page
Subjects (major changes since last revision)
3
pad size from 16 mm
2
to 5 mm
2
3 / 8
Surge current
13
annotations
2002-07-23
3, 4
value (reverse voltage from 5 V to 12 V)
2002-09-18
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