LO Q996
Hyper CHIPLED
Hyper-Bright LED
Abgekndigt nach OS-PD-2003-007 - wird durch
LO Q976 ersetzt werden
Obsolete acc. to OS-PD-2003-007 - will be
replaced by LO Q976
2003-08-28
1
Besondere Merkmale
Gehusetyp: 0603
Besonderheit des Bauteils: kleinste Bauform
1,6 mm x 0,8 mm x 0,8 mm
Wellenlnge: 606 nm (orange)
Abstrahlwinkel: extrem breite
Abstrahlcharakteristik (160)
Technologie: InGaAlP
optischer Wirkungsgrad: 11 lm/W
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 4000/Rolle, 180 mm
Anwendungen
Informationsanzeigen im Auenbereich
Flache Hinterleuchtung (LCD, Handy, Schalter,
Display)
Signal- und Symbolleuchten
Markierungsbeleuchtung (z.B. Stufen,
Fluchtwege, u..)
Features
package: 0603
feature of the device: smallest package
1.6 mm x 0.8 mm x 0.8 mm
wavelength: 606 nm (orange)
viewing angle: extremely wide (160)
technology: InGaAlP
optical efficiency: 11 lm/W
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 4000/reel, 180 mm
Applications
outdoor displays
flat backlighting (LCD, cellular phones,
switches, displays)
signal and symbol luminaire
marker lights (e.g. steps, exit ways, etc.)
2003-08-28
2
LO Q996
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
s
Abgekndigt nach OS-PD-2003-007 - wird durch LO Q976 ersetzt werden
Obsolete acc. to OS-PD-2003-007 - will be replaced by LO Q976
Letzte Bestellung / Last Order: 2003-10-31
Letzte Lieferung / Last Delivery: 2004-03-31
Anm.: -25 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Die Standardlieferform von Serientypen beinhaltet alle Gruppen. Einzelne Gruppen sind nicht
erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe enthalten.
Note: -25 Total color tolerance range, delivery in single groups (please see page 5)
The standard shipping format for serial types includes all groups. Individual groups are not
available.
No packing unit / tape ever contains more than one luminous intensity group.
Typ
Type
Emissionsfarbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 20 mA
I
V
(mcd)
Bestellnummer
Ordering Code
min.
typ.
s
LO Q996-25
orange
colorless clear
35.5
70
Q62702P5337
LO Q996
2003-08-28
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
30 ... + 85
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 85
C
Sperrschichttemperatur
Junction temperature
T
j
+ 95
C
Durchlassstrom
Forward current
I
F
25
mA
Stostrom
Surge current
t
10
s,
D
= 0.1
I
FM
0.1
A
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
P
tot
65
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Ltpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgre
5 mm
2
)
mounted on PC board FR 4 (pad size
5 mm
2
)
R
th JA
R
th JS
900
510
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2003-08-28
4
LO Q996
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 20 mA
peak
610
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
=20 mA
dom
606
6
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 20 mA
16
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
160
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
(max.)
I
F
= 20 mA
V
F
V
F
2.0
2.5
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 20 mA; 10C
T
100C
TC
peak
0.13
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 20 mA; 10C
T
100C
TC
dom
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 20 mA; 10C
T
100C
TC
V
1.7
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 20 mA
opt
11
lm/W
1)
Wellenlngengruppen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelength groups are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LO Q996
2003-08-28
5
1)
Wellenlngengruppen
Wavelength groups
Gruppe
Group
Wellenlnge
Wavelength
Einheit
Unit
min.
max.
2
600
603
nm
3
603
606
nm
4
606
609
nm
5
609
612
nm
2003-08-28
6
LO Q996
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 20 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
OHL01485
400
0
20
40
60
80
100
450
500
550
600
650
700
nm
%
I
rel
V
orange
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL00408
50
60
70
80
90
100
0
20
40
60
80
100
120
LO Q996
2003-08-28
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(20 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 20 mA
OHL00232
10
-1
1.4
1.8
2.2
2.6
3 V 3.4
0
10
1
10
10
2
5
5
mA
5
1
F
V
F
I
T
OHL00873
0
F
I
0
20
40
60
80 C 100
mA
5
10
15
20
25
30
temp. solder point
temp. ambient
T
T
S
A
T
A
T
S
V
V (20 mA)
10
-1
0
10
10
1
2
10
mA
10
-3
5
OHL01271
F
I
5
-2
10
5
-1
10
0
10
1
10
I
I
5
5
OHL01273
0
-20
0
20
40
60
C 100
0.4
0.8
1.2
2
V
I
V (25 C)
I
1.6
A
T
2003-08-28
8
LO Q996
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 1.4 mg
GEOY6023
Cathode mark
1.7 (0.067)
Cathode mark
0.9 (0.035)
0.9 (0.035)
0.7 (0.028)
1.5 (0.059)
0.7 (0.028)
0.4 (0.016)
0.2 (0.008)
0.2 (0.008)
0.4 (0.016)
1.3 (0.051)
1.1 (0.043)
1.0 (0.039)
1.2 (0.047)
LO Q996
2003-08-28
9
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLA0685
0:00
0
T
t
C
min
50
100
150
200
250
0:30
1:00
1:30
2:00
2:30
3:00
3:30
4:00
4:30
5:00
5:30
2-3 K/s
2-3 K/s
T
= 183 C
= 70 s
t
max
T
= 245 C
2003-08-28
10
LO Q996
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Empfohlenes Ltpaddesign verwendbar fr Hyper CHIPLED und Chipled - Bauform 0603
IR Reflow Lten
Recommended Solder Pad useable for Hyper CHIPLED and Chipled - Package 0603
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Empfohlene Ltpastendicke: 120 m/ recommended thickness of solder paste: 120 m
0.8 (0.031)
0.7 (0.028)
OHAPY606
0.8 (0.031)
0.8 (0.031)
OHPY0203
2.25 (0.089)
0.65 (0.026)
0.3 (0.012)
0.5 (0.020)
0.8 (0.031)
0.35 (0.014)
0.225 (0.009)
LO Q996
2003-08-28
11
Gurtung / Polaritt und Lage
Verpackungseinheit 4000/Rolle, 180 mm
Method of Taping / Polarity and Orientation Packing unit 4000/reel, 180 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY0531
Cathode mark
A
C
1.5 (0.059)
2 (0.079)
4 (0.157)
8 (0.315)
1.85 (0.073)
1.75 (0.069)
3.5 (0.138)
1 (0.039)
4 (0.157)
2003-08-28
12
LO Q996
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2003-08-28
Date of change
Previous Version:
2003-08-18
Page
Subjects (major changes since last revision)
10
recommended solder pad
4
forward voltage
3
pad size from 16 mm
2
to 5 mm
2
2
changed to new SAP designation system
2002-06-28
12
annotations
2002-07-23
3, 4
value (reverse voltage from 3 V to 12 V)
2002-09-18
all
not for new designs
2003-08-18
1, 2
obsolete
2003-08-28
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