ChipFind - документация

Электронный компонент: ON2173

Скачать:  PDF   ZIP
1
Reflective Photosensors (Photo Reflectors)
CNB1009 (ON2173)
Reflective Photosensor
Features
Fast response : t
r
, t
f
= 6
s (typ.)
Small size, light weight
2-2.3
2.2
2-9.5
0.2
19.0
0.3
(4.0)
(1.0)
1.0
(15.5)
4.0
0.2
6.5
0.3
2
3
1
4
Unit : mm
Pin connection
12.0
0.3
T.R
LED
1.0
7.4
0.2
9.5
0.3
2.5 min.
(2.54)
1.0
1
4
3
2
;;
;
(Note) ( ) Dimension is reference
;;;;
;
;;
;;
;
;;;;
R
L
I
F
I
C
V
CC
d = 5 mm
Standard white paper (Reflective ratio 90%)
10%
90%
t
r
t
f
Absolute Maximum Ratings
(Ta = 25C)
Parameter
Symbol Ratings
Unit
Input (Light
Reverse voltage (DC)
V
R
3
V
emitting diode)
Forward current (DC)
I
F
50
mA
Power dissipation
P
D
*1
75
mW
Collector to emitter voltage
V
CEO
20
V
Output (Photo Emitter to collector voltage
V
ECO
5
V
transistor)
Collector current
I
C
30
mA
Collector power dissipation
P
C
*2
100
mW
Temperature
Operating ambient temperature
T
opr
25 to +85
C
Storage temperature
T
stg
30 to +100
C
Electrical Characteristics
(Ta = 25C)
Parameter
Symbol
Conditions
min
typ
max
Unit
Input
Forward voltage (DC)
V
F
I
F
= 50mA
1.2
1.5
V
characteristics
Reverse current (DC)
I
R
V
R
= 3V
10
A
Capacitance between pins
C
t
V
R
= 0V, f
= 1MHz
50
pF
Output characteristics Collector cutoff current
I
CEO
V
CE
= 10V
0.2
A
Collector to emitter capacitance
C
C
V
CE
= 10V, f= 1MHz
5
pF
Transfer
Collector current
I
C
*1
V
CC
= 10V, I
F
= 20mA, R
L
= 100
100
500
A
characteristics Response time
t
r
*2
, t
f
*3
V
CC
= 10V, I
C
= 1mA, R
L
= 100
6
s
Collector to emitter saturation voltage V
CE(sat)
I
F
= 50mA, I
C
= 0.1mA
0.3
V
*1
Transfer characteristics measurement circuit
(Ambient light is shut off completely)
*2
Time required for the collector current to increase from
10% to 90% of its final value.
*3
Time required for the collector
current to decrease from 90%
to 10% of its initial value.
Overview
CNB1009 is a photosensor detecting the change of reflective light
in which a high efficiency GaAs infrared light emitting diode is used
as the light emitting element, and a high sensitivity Si phototransistor
is used as the light detecting element. The two elements are located
parallel in the same direction and objects are detected when passing
in front of the device.
Applications
Detection of paper, film and cloth
Optical mark reading
Detection of coin and bill
Detection of position and edge
Start, end mark detection of magnetic tape
*1
Input power derating ratio is
1.0 mW/C at Ta
25C.
*2
Output power derating ratio is
1.34 mW/C at Ta
25C.
Note) The part number in the parenthesis shows conventional part number.
2
Reflective Photosensors (Photo Reflectors)
CNB1009
60
50
40
30
20
10
Ambient temperature Ta (C )
0
20
40
60
80
100
0
25
I
F
-- V
F
60
30
20
10
50
40
Forward voltage V
F
(V)
Forward current I
F
(mA)
0.4
0.8
1.2
1.6
2.4
2.0
0
0
Ta = 25C
V
F
-- Ta
1.6
1.2
0.8
0.4
Ambient temperature Ta (C )
Forward voltage V
F
(V)
0
20
40
60
80
100
0
40 20
0
20
40
60
80
100
40 20
0
20
40
60
80
100
40 20
I
C
-- I
F
10
2
10
1
10
1
Forward current I
F
(mA)
Collector current I
C
(mA)
1
10
10
2
10
2
10
1
V
CC
= 5V
Ta = 25C
R
L
= 100
I
C
-- V
CE
10
2
10
1
10
1
Collector to emitter voltage V
CE
(V)
Collector current I
C
(mA)
1
10
10
2
10
2
10
1
Ta = 25C
Relative output current I
C
(%)
I
C
-- Ta
160
120
80
40
Ambient temperature Ta (C )
0
V
CC
= 10V
I
F
= 20mA
R
L
= 100
I
CEO
-- Ta
10
10
1
10
2
1
Ambient temperature Ta (C )
V
CE
= 10V
Dark current I
CEO
(
A)
10
3
1
10
10
1
t
r
-- I
C
10
1
Collector current I
C
(mA)
Rise time t
r
(
s)
10
1
10
2
10
3
10
2
V
CC
= 10V
Ta = 25C
I
C
-- d
800
400
200
600
Distance d (mm)
Collector current I
C
(
A)
4
16
12
8
0
0
V
CC
= 10V
Ta = 25C
R
L
= 100
I
F
= 20mA
I
F
, I
C
-- Ta
Forward current, collector current I
F
, I
C
(mA)
I
F
I
C
10mA
1mA
I
F
= 50mA
I
F
= 30mA
20mA
10mA
R
L
= 1k
100
500
;
;
d
Caution for Safety
DANGER
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconduc-
tor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available product
types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information before
starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always
the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any
liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or
distributing this material to a third party, via the Internet or in any other way, is prohibited.
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the
products or technologies described in this material and controlled under the "Foreign Exchange and Foreign
Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting
of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic
equipment (such as office equipment, communications equipment, measuring instruments and household ap-
pliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion
equipment, life support systems and safety devices) in which exceptional quality and reliability are required,
or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without notice for
reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the prod-
ucts, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifi-
cations satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the
range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for
any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended, so that
such equipment may not violate relevant laws or regulations because of the function of our products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life and after-
unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission from our
company.
Gallium arsenide material (GaAs) is used
in this product.
Therefore, do not burn, destroy, cut, crush, or chemi-
cally decompose the product, since gallium arsenide
material in powder or vapor form is harmful to human
health.
Observe the relevant laws and regulations when dispos-
ing of the products. Do not mix them with ordinary in-
dustrial waste or household refuse when disposing of
GaAs-containing products.
2001 MAR