DATA SHEET
Product specification
File under Integrated Circuits, IC06
2000 Mar 15
INTEGRATED CIRCUITS
74AHC123A; 74AHCT123A
Dual retriggerable monostable
multivibrator with reset
2000 Mar 15
2
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
FEATURES
ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
CDM EIA/JESD22-C101 exceeds 1000 V
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than V
CC
For AHC only: operates with CMOS input levels
For AHCT only: operates with TTL input levels
Specified from
-
40 to +85
C and
-
40 to +125
C
DC triggered from active HIGH or active LOW inputs
Retriggerable for very long pulses up to 100% duty
factor
Direct reset terminates output pulse
Output capability: standard (except for nR
EXT
/C
EXT
).
DESCRIPTION
The 74AHC/AHCT123A are high-speed Si-gate CMOS
devices and are pin compatible with Low power Schottky
TTL (LSTTL). They are specified in compliance with
JEDEC standard no.7A.
The 74AHC/AHCT123A are dual retriggerable monostable
multivibrators with output pulse width control by three
methods. The basic pulse time is programmed by
selection of an external resistor (R
EXT
) and capacitor
(C
EXT
). The external resistor and capacitor are normally
connected as shown in Fig.6.
Once triggered, the basic output pulse width may be
extended by retriggering the gated active LOW-going edge
input (nA) or the active HIGH-going edge input (nB).
By repeating this process, the output pulse period
(nQ = HIGH, nQ = LOW) can be made as long as desired.
Alternatively an output delay can be terminated at any time
by a LOW-going edge on input nR
D
, which also inhibits the
triggering.
An internal connection from nR
D
to the input gate makes it
possible to trigger the circuit by a positive-going signal at
input nR
D
as shown in the function table. Figs 8 and 9
illustrate pulse control by retriggering and early reset. The
basic output pulse width is essentially determined by the
value of the external timing components R
EXT
and C
EXT
.
When C
EXT
10 nF, the typical output pulse width is
defined as: t
W
= R
EXT
C
EXT
where t
W
= pulse width in ns;
R
EXT
= external resistor in k
; C
EXT
= external capacitor
in pF. Schmitt-trigger action at all inputs makes the circuit
highly tolerant to slower input rise and fall times. The `123'
is identical to the `423' but can be triggered via the reset
input.
2000 Mar 15
3
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
QUICK REFERENCE DATA
GND = 0 V; T
amb
= 25
C; t
r
= t
f
3.0 ns.
Notes
1. C
PD
is used to determine the dynamic power dissipation (P
D
in
W).
P
D
= C
PD
V
CC
2
f
i
+
(C
L
V
CC
2
f
o
)
C
EXT
V
CC
2
f
o
+ D
16
V
CC
where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
(C
L
V
CC
2
f
o
) = sum of outputs;
D = duty factor in %;
C
L
= output load capacitance in pF;
C
EXT
= timing capacitance in pF;
V
CC
= supply voltage in Volts.
2. The condition is V
I
= GND to V
CC
.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
AHC
AHCT
t
PHL
/t
PLH
propagation delay
C
L
= 15 pF; V
CC
= 5 V;
R
EXT
= 5 k
;
C
EXT
= 0 pF
nA, nB to nQ, nQ
5.1
5.0
ns
nR
D
to nQ, nQ
5.6
5.2
ns
C
I
input capacitance
V
I
= V
CC
or GND
5
3
pF
C
O
output capacitance
4
4
pF
C
PD
power dissipation capacitance
C
L
= 50 pF; f = 1 MHz; notes 1
and 2
57
58
pF
2000 Mar 15
4
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
FUNCTION TABLE
See note 1.
Notes
1
H = HIGH voltage level;
L = LOW voltage level;
X = don't care;
= LOW-to-HIGH CP transition;
= HIGH-to-LOW CP transition.
2
If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as
programmed.
3
One HIGH-level output pulse.
4
One LOW-level output pulse.
ORDERING INFORMATION
INPUTS
OUTPUTS
nR
D
nA
nB
nQ
nQ
L
X
X
L
H
X
H
X
L
(2)
H
(2)
X
X
L
L
(2)
H
(2)
H
L
(3)
(4)
H
H
(3)
(4)
L
H
(3)
(4)
TYPE NUMBER
PACKAGES
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
74AHC123AD
-
40 to +125
C
16
SO
plastic
SOT109-1
74AHC123APW
16
TSSOP
plastic
SOT403-1
74AHCT123AD
16
SO
plastic
SOT109-1
74AHCT123APW
16
TSSOP
plastic
SOT403-1
2000 Mar 15
5
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
PINNING
PIN
SYMBOL
DESCRIPTION
1, 9
1A, 2A
trigger inputs (negative-edge triggered)
2, 10
1B, 2B
trigger inputs (positive-edge triggered)
3, 11
1R
D
, 2R
D
direct reset LOW and trigger action at positive edge
4, 12
1Q, 2Q
outputs (active LOW)
5, 13
2Q, 1Q
outputs (active HIGH)
6, 14
2C
EXT
, 1C
EXT
external capacitor connection
7, 15
2R
EXT
/C
EXT
, 1R
EXT
/C
EXT
external resistor/capacitor connection
8
GND
ground (0 V)
16
V
CC
DC supply voltage
handbook, halfpage
1A
1B
1RD
1Q
2Q
2CEXT
2REXT/CEXT
GND
VCC
1REXT/CEXT
1CEXT
1Q
2RD
2B
2Q
2A
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
123
MNA514
Fig.1 Pin configuration.
handbook, halfpage
1Q
Q
2RD
RD
S
2REXT/CEXT
13
7
1REXT/CEXT 15
2CEXT
6
1CEXT 14
2Q
5
1Q
Q
4
2Q 12
9
MNA515
1RD
2A
1 1A
10 2B
2
11
3
1B
T
Fig.2 Logic diagram.
2000 Mar 15
6
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, halfpage
MNA516
CX
&
6
5
12
RCX
R
7
9
11
10
CX
&
14
13
4
RCX
R
15
1
3
2
Fig.3 IEC logic symbol.
handbook, halfpage
1Q
Q
2RD
RD
S
2REXT/CEXT
13
7
1REXT/CEXT 15
2CEXT
6
1CEXT 14
2Q
5
1Q
Q
4
2Q 12
9
MNA517
1RD
2A
1 1A
10 2B
2
11
3
1B
T
Fig.4 Functional diagram.
2000 Mar 15
7
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, full pagewidth
MNA518
nREXT/CEXT
VCC
VCC
VCC
R
RD
A
B
R
CL
CL
CL
CL
CL
Q
Q
R
R
Fig.5 Logic diagram (one flip-flop).
For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND).
2000 Mar 15
8
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, halfpage
VCC
REXT
to nCEXT
(pin 14 or 6)
to nREXT/CEXT
(pin 15 or 7)
CEXT
MNA519
Fig.6 Timing component connections.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
74AHC
74AHCT
UNIT
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
V
CC
DC supply voltage
2.0
5.0
5.5
4.5
5.0
5.5
V
V
I
input voltage
0
-
5.5
0
-
5.5
V
V
O
output voltage
0
-
V
CC
0
-
V
CC
V
T
amb
operating ambient
temperature
see DC and AC
characteristics per device
-
40
+25
+85
-
40
+25
+85
C
-
40
+25
+125
-
40
+25
+125
C
t
r
, t
f
input rise and fall
time ratios
V
CC
= 3.3
0.3 V
-
-
100
-
-
-
ns/V
V
CC
= 5
0.5 V
-
-
20
-
-
20
ns/V
R
EXT
external timing
resistor
V
CC
= 2 V
5
-
-
5
-
-
k
V
CC
> 3 V
1
-
-
1
-
-
k
C
EXT
external timing
capacitor
no limits
pF
2000 Mar 15
9
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70
C the value of P
D
derates linearly with 8 mW/K.
For TSSOP packages: above 60
C the value of P
D
derates linearly with 5.5 mW/K.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
DC supply voltage
-
0.5
+7.0
V
V
I
input voltage
-
0.5
+7.0
V
I
IK
DC input diode current
V
I
<
-
0.5 V; note 1
-
-
20
mA
I
OK
DC output clamping diode current
V
O
<
-
0.5 V or V
O
> V
CC
+ 0.5
V; note 1
-
20
mA
I
O
DC output sink current
-
0.5 V < V
O
< V
CC
+ 0.5 V
-
25
mA
I
CC
DC V
CC
or GND current
-
75
mA
T
stg
storage temperature
-
65
+150
C
P
D
power dissipation per package
for temperature range:
-
40 to +125
C; note 2
-
500
mW
2000 Mar 15
10
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
DC CHARACTERISTICS
Family 74AHC
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Note
1. Voltage on pin nR
EXT
/C
EXT
= 0.5
V
CC
and pin R
EXT
/C
EXT
in OFF-state during test.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
OTHER
V
CC
(V)
25
-
40 to +85
-
40 to +125
MIN.
TYP.
MAX.
MIN.
MAX.
MIN.
MAX.
V
IH
HIGH-level input
voltage
2.0
1.5
-
-
1.5
-
1.5
-
V
3.0
2.1
-
-
2.1
-
2.1
-
V
5.5
3.85
-
-
3.85
-
3.85
-
V
V
IL
LOW-level input
voltage
2.0
-
-
0.5
-
0.5
-
0.5
V
3.0
-
-
0.9
-
0.9
-
0.9
V
5.5
-
-
1.65
-
1.65
-
1.65
V
V
OH
HIGH-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
=
-
50
A
2.0
1.9
2.0
-
1.9
-
1.9
-
V
3.0
2.9
3.0
-
2.9
-
2.9
-
V
4.5
4.4
4.5
-
4.4
-
4.4
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
4.0 mA
3.0
2.58
-
-
2.48
-
2.40
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
8.0 mA
4.5
3.94
-
-
3.8
-
3.70
-
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
= 50
A
2.0
-
0
0.1
-
0.1
-
0.1
V
3.0
-
0
0.1
-
0.1
-
0.1
V
4.5
-
0
0.1
-
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 4.0 mA
3.0
-
-
0.36
-
0.44
-
0.55
V
V
I
= V
IH
or V
IL
;
I
O
= 8.0 mA
4.5
-
-
0.36
-
0.44
-
0.55
V
I
I
input leakage
current;
R
EXT
/C
EXT
V
I
= V
CC
or GND; note 1
5.5
-
-
0.25
-
2.5
-
10.0
A
input leakage
current;
nA, nB, nR
D
V
I
= V
CC
or GND
5.5
-
-
0.1
-
1.0
-
2.0
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0
5.5
-
-
4.0
-
40
-
80
A
quiescent supply
current active
state (per circuit)
V
I
= V
CC
or GND; note 1
3
-
160
250
-
280
-
280
A
4.5
-
380
500
-
650
-
650
A
5.5
-
560
750
-
975
-
975
A
C
I
input capacitance
-
-
5
10
-
10
-
10
pF
2000 Mar 15
11
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Family 74AHCT
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
Note
1. Voltage on pin nR
EXT
/C
EXT
= 0.5
V
CC
and pin R
EXT
/C
EXT
in OFF-state during test.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
OTHER
V
CC
(V)
25
-
40 to +85
-
40 to +125
MIN.
TYP.
MAX.
MIN.
MAX.
MIN.
MAX.
V
IH
HIGH-level input
voltage
4.5 to 5.5 2.0
-
-
2.0
-
2.0
-
V
V
IL
LOW-level input
voltage
4.5 to 5.5
-
-
0.8
-
0.8
-
0.8
V
V
OH
HIGH-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
=
-
50
A
4.5
4.4
4.5
-
4.4
-
4.4
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
8.0 mA
4.5
3.94
-
-
3.8
-
3.70
-
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
= 50
A
4.5
-
0
0.1
-
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 8.0 mA
4.5
-
-
0.36
-
0.44
-
0.55
V
I
I
input leakage
current;
R
EXT
/C
EXT
V
I
= V
CC
or GND; note 1
5.5
-
-
0.25
-
2.5
-
10.0
A
input leakage
current;
nA, nB, nR
D
V
I
= V
CC
or GND
5.5
-
-
0.1
-
1.0
-
2.0
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0
5.5
-
-
4.0
-
40
-
80
A
quiescent supply
current active
state (per circuit)
V
I
= V
CC
or GND; note 1
4.5
-
380
500
-
650
-
650
A
5.5
-
560
750
-
975
-
975
A
C
I
input capacitance
-
-
3
10
-
10
-
10
pF
2000 Mar 15
12
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
AC CHARACTERISTICS
Type 74AHC123A
GND = 0 V; t
r
= t
f
3.0 ns.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
C
L
25
-
40 to +85
-
40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
V
CC
= 3.0 to 3.6 V; note 1
t
PHL
/t
PLH
propagation delay;
nA, nB to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
15 pF
-
7.4
20.6
1.0
24.0
1.0
26.0
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
8.2
22.4
1.0
26.0
1.0
26.0
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
6.4
15.8
1.0
18.5
1.0
20.0
ns
propagation delay;
nA, nB to nQ , nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
50 pF
-
10.5
24.1
1.0
27.5
1.0
30.0
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
11.7
25.9
1.0
29.5
1.0
32.0
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
9.2
19.3
1.0
22.0
1.0
24.5
ns
t
W
trigger pulse
width; nA = LOW
see Fig 8
5.0
-
-
5.0
-
5.0
-
ns
trigger pulse
width; nB = HIGH
see Fig 8
5.0
-
-
5.0
-
5.0
-
ns
reset pulse width;
nR
D
= LOW
see Fig 9
5.0
-
-
5.0
-
5.0
-
ns
output pulse
width; nQ = HIGH;
nQ = LOW
C
EXT
= 28 pF;
R
EXT
= 2 k
;
note 3; see Figs 8,
9 and 10
-
115
240
-
300
-
300
ns
C
EXT
= 0.01
F;
R
EXT
= 10 k
;
note 3; see Figs 8,
9 and 10
90
100
110
90
110
85
115
s
C
EXT
= 0.1
F;
R
EXT
= 10 k
;
note 3; see Figs 8,
9 and 10
0.9
1
1.1
0.9
1.1
0.85
1.15
ms
2000 Mar 15
13
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
V
CC
= 3.0 to 3.6 V; note 1
t
rt
retrigger time;
nA to nB
C
EXT
= 100 pF;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
50 pF
-
60
-
-
-
-
-
ns
C
EXT
= 0.01
F;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
-
1.5
-
-
-
-
-
s
V
CC
= 4.5 to 5.5 V; note 2
t
PHL
/t
PLH
propagation delay;
nA, nB to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
15 pF
-
5.1
12
1.0
14.0
1.0
15.5
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
5.6
12.9
1.0
15.0
1.0
16.5
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
4.4
9.4
1.0
11.0
1.0
12.0
ns
propagation delay;
nA, nB to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
50 pF
-
7.3
14
1.0
16.0
1.0
17.5
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
8.1
14.9
1.0
17.0
1.0
19.0
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
;
see Figs 7 and 11
-
6.3
11.4
1.0
13.0
1.0
14.5
ns
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
C
L
25
-
40 to +85
-
40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15
14
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Notes
1. Typical values are measured at V
CC
= 3.3 V and T
amb
= 25
C.
2. Typical values are measured at V
CC
= 5.0 V and T
amb
= 25
C.
3. For C
EXT
10 nF the typical value of the pulse width t
W
(
s) = R
EXT
(k
)
C
EXT
(nF).
V
CC
= 4.5 to 5.5 V; note 2
t
W
trigger pulse
width; nA = LOW
see Fig 8
50 pF 5.0
-
-
5.0
-
5.0
-
ns
trigger pulse
width; nB = HIGH
see Fig 8
5.0
-
-
5.0
-
5.0
-
ns
reset pulse width;
nR
D
= LOW
see Fig 9
5.0
-
-
5.0
-
5.0
-
ns
output pulse
width; nQ = HIGH;
nQ = LOW
C
EXT
= 28 pF;
R
EXT
= 2 k
;
note 3; see Figs 8,
9 and 10
-
100
200
-
240
-
240
ns
C
EXT
= 0.01
F;
R
EXT
= 10 k
;
note 3; see
Figs 8, 9 and 10
90
100
110
90
110
85
115
s
C
EXT
= 0.1
F;
R
EXT
= 10 k
;
note 3; see Figs 8,
9 and 10
0.9
1
1.1
0.9
1.1
0.85
1.15
ms
t
rt
retrigger time;
nA to nB
C
EXT
= 100 pF;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
-
39
-
-
-
-
-
ns
C
EXT
= 0.01
F;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
-
1.2
-
-
-
-
-
s
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
C
L
25
-
40 to +85
-
40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15
15
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Type 74AHCT123A
GND = 0 V; t
r
= t
f
3.0 ns.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
C
L
25
-
40 to +85
-
40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
V
CC
= 4.5 to 5.5 V; note 1
t
PHL
/t
PLH
propagation delay;
nA, nB to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
15 pF
-
5.0
12
1.0
14
1.0
15.5
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
-
5.2
12.9
1.0
15.0
1.0
16.5
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
-
4.7
9.4
1.0
11
1.0
12.0
ns
propagation delay;
nA, nB to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
50 pF
-
7.1
14
1.0
16
1.0
17.5
ns
propagation delay;
nR
D
to nQ, nQ
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
-
7.5
14.9
1.0
17.0
1.0
18.5
ns
propagation delay;
nR
D
to nQ, nQ
(reset)
C
EXT
= 0 pF;
R
EXT
= 5 k
; see
Figs 7 and 11
-
6.7
11.4
1.0
13
1.0
14.5
ns
t
W
trigger pulse
width; nA = LOW
see Fig 8
50 pF
5.0
-
-
5.0
-
5.0
-
ns
trigger pulse
width; nB = HIGH
see Fig 8
5.0
-
-
5.0
-
5.0
-
ns
reset pulse width;
nR
D
= LOW
see Fig 9
5.0
-
-
5.0
-
5.0
-
ns
output pulse width;
nQ = HIGH;
nQ = LOW
C
EXT
= 28 pF;
R
EXT
= 2 k
; note 2;
see Figs 8, 9 and 10
-
100
200
-
240
-
240
ns
C
EXT
= 0.01
F;
R
EXT
= 10 k
;
note 2; see
Figs 8, 9 and 10
90
100
110
90
110
85
115
s
C
EXT
= 0.1
F;
R
EXT
= 10 k
;
note 2; see
Figs 8, 9 and 10
0.9
1
1.1
0.9
1.1
0.85
1.15
ms
2000 Mar 15
16
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Notes
1. Typical values are measured at V
CC
= 5.0 V and T
amb
= 25
C.
2. For C
EXT
10 nF the typical value of the pulse width t
W
(
s) = R
EXT
(k
)
C
EXT
(nF).
V
CC
= 4.5 to 5.5 V; note 1
t
rt
retrigger time;
nA to nB
C
EXT
= 100 pF;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
50 pF
-
60
-
-
-
-
-
ns
C
EXT
= 0.01
F;
R
EXT
= 1 k
; see
Figs 8, 9 and 10
-
1.5
-
-
-
-
-
s
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
C
L
25
-
40 to +85
-
40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2000 Mar 15
17
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
AC WAVEFORMS
handbook, full pagewidth
tPHL
tPHL
tPLH
tPHL
tPLH
tPLH
VM
(1)
VM
(2)
VM
(2)
VM
(1)
VM
(1)
VM
(1)
tW
tW
tW
tW
tW
tW
+
trt
trt
MNA520
nB input
nA input
nRD input
nQ output
nQ output
Fig.7
Input (nA, nB, nR
D
) to output (nQ, nQ) propagation delays, the input and output pulse widths and the input
retrigger time.
FAMILY
V
I
INPUT
REQUIREMENTS
V
M
(1)
INPUT
V
M
(2)
OUTPUT
AHC
GND to V
CC
50% V
CC
50% V
CC
AHCT
GND to 3.0 V
1.5 V
50% V
CC
2000 Mar 15
18
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, full pagewidth
MNA521
tW
tW
tW
tW
trt
tW
nB input
nA input
nQ output
Fig.8 Output pulse control using retrigger pulse; nR
D
= HIGH.
handbook, full pagewidth
MNA522
tW
tW
tW
nB input
nRD input
nQ output
Fig.9 Output pulse control using reset input nR
D
; nA = LOW.
2000 Mar 15
19
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, full pagewidth
tW
+
trt
tW
tW
trt
MNA523
nB input
nA input
nRD input
nREXT/CEXT
nQ output
nQ output
Fig.10 Input and output timing.
Fig.11 Load circuitry for switching times.
TEST
S1
t
PLH
/t
PHL
open
t
PLZ
/t
PZL
V
CC
t
PHZ
/t
PZH
GND
handbook, full pagewidth
open
GND
VCC
VCC
VI
VO
MNA183
D.U.T.
CL
RT
1000
PULSE
GENERATOR
S1
Definitions for test circuit.
C
L
= load capacitance including jig and probe capacitance (See Chapter "AC characteristics").
R
T
= termination resistance should be equal to the output impedance Z
o
of the pulse generator.
2000 Mar 15
20
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
PACKAGE OUTLINES
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1
97-05-22
99-12-27
076E07
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.050
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
2000 Mar 15
21
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
95-04-04
99-12-27
w
M
b
p
D
Z
e
0.25
1
8
16
9
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.10
pin 1 index
2000 Mar 15
22
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2000 Mar 15
23
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000
69
Philips Semiconductors a worldwide company
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
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Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands
613507/01/pp
24
Date of release:
2000 Mar 15
Document order number:
9397 750 06696
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