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Электронный компонент: 74AHC1G09GW

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1.
General description
The 74AHC1G09 is a high-speed Si-gate CMOS device.
The 74AHC1G09 provides the 2-input AND function with open-drain output.
The output of the 74AHC1G09 is an open drain and can be connected to other open-drain
outputs to implement active-LOW, wired-OR or active-HIGH wired-AND functions. For
digital operation this device must have a pull-up resistor to establish a logic HIGH level.
2.
Features
s
High noise immunity
s
ESD protection:
x
HBM JESD22-A114-C exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
s
Low power dissipation
s
Specified from
-
40
C to +85
C and from
-
40
C to +125
C.
3.
Quick reference data
[1]
C
PD
is used to determine the dynamic power dissipation (P
D
in
W).
P
D
= C
PD
V
CC
2
f
i
N + (C
L
V
CC
2
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in Volts;
N = number of inputs switching;
(C
L
V
CC
2
f
o
) = dissipation due to the output if the combination of the pull up voltage and resistance
results in V
CC
at the output.
74AHC1G09
2-input AND gate with open-drain output
Rev. 01 -- 26 September 2005
Product data sheet
Table 1:
Quick reference data
GND = 0 V; T
amb
= 25
C; t
r
= t
f
3.0 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t
PZL
, t
PLZ
propagation delay
A and B to Y
V
CC
= 4.5 V to 5.5 V;
C
L
= 15 pF
-
3.2
5.5
ns
C
i
input capacitance
-
1.5
10
pF
C
PD
power dissipation
capacitance
C
L
= 50 pF; f
i
= 1 MHz;
V
I
= GND to V
CC
[1]
-
5
-
pF
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
2 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
4.
Ordering information
5.
Marking
6.
Functional diagram
7.
Pinning information
7.1 Pinning
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AHC1G09GW
-
40
C to +125
C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
Table 3:
Marking
Type number
Marking code
74AHC1G09GW
A9
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
001aad598
1
B
Y
A
2
4
001aad599
1
4
&
2
001aad600
Y
GND
B
A
Fig 4.
Pin configuration SOT353-1 (TSSOP5)
09
B
V
CC
A
GND
Y
001aad601
1
2
3
5
4
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
3 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
7.2 Pin description
8.
Functional description
8.1 Function table
[1]
H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
9.
Limiting values
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP5 packages: above 87.5
C the value of P
tot
derates linearly with 4.0 mW/K.
Table 4:
Pin description
Symbol
Pin
Description
B
1
data input B
A
2
data input A
GND
3
ground (0 V)
Y
4
data output Y
V
CC
5
supply voltage
Table 5:
Function table
[1]
Input
Output
A
B
Y
L
L
L
L
H
L
H
L
L
H
H
Z
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Max
Unit
V
CC
supply voltage
-
0.5
+7.0
V
V
I
input voltage
[1]
-
0.5
+7.0
V
V
O
output voltage
active mode
[1]
-
0.5
+7.0
V
high-impedance mode
[1]
-
0.5
+7.0
V
I
IK
input clamping current
V
I
<
-
0.5 V
[1]
-
-
20
mA
I
OK
output clamping current
V
O
<
-
0.5 V
[1]
-
20
mA
I
O
output current
V
O
>
-
0.5 V
-
25
mA
I
CC
quiescent supply current
-
75
mA
I
GND
GND current
-
75
mA
T
stg
storage temperature
-
65
+150
C
P
tot
total power dissipation
T
amb
=
-
40
C to +125
C
[2]
-
250
mW
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
4 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
10. Recommended operating conditions
11. Static characteristics
Table 7:
Recommended operating operations
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
CC
supply voltage
2.0
5.0
5.5
V
V
I
input voltage
0
-
5.5
V
V
O
output voltage
active mode
0
-
V
CC
V
high-impedance mode
0
-
6.0
V
T
amb
ambient temperature
-
40
+25
+125
C
t
r
, t
f
input rise and fall times
V
CC
= 3.0 V to 3.6 V
-
-
100
ns/V
V
CC
= 4.5 V to 5.5 V
-
-
20
ns/V
Table 8:
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
T
amb
= 25
C
V
IH
HIGH-level input
voltage
V
CC
= 2.0 V
1.5
-
-
V
V
CC
= 3.0 V
2.1
-
-
V
V
CC
= 5.5 V
3.85
-
-
V
V
IL
LOW-level input
voltage
V
CC
= 2.0 V
-
-
0.5
V
V
CC
= 3.0 V
-
-
0.9
V
V
CC
= 5.5 V
-
-
1.65
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
I
O
= 50
A; V
CC
= 2.0 V
-
0
0.1
V
I
O
= 50
A; V
CC
= 3.0 V
-
0
0.1
V
I
O
= 50
A; V
CC
= 4.5 V
-
0
0.1
V
I
O
= 4.0 mA; V
CC
= 3.0 V
-
-
0.36
V
I
O
= 8.0 mA; V
CC
= 4.5 V
-
-
0.36
V
I
LI
input leakage current
V
I
= V
CC
or GND; V
CC
= 5.5 V
-
-
0.1
A
I
OZ
OFF-state output
current
V
I
= V
IH
or V
IL
; V
O
= V
CC
or GND;
V
CC
= 5.5 V
-
-
0.25
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0 A; V
CC
= 5.5 V
-
-
1.0
A
C
i
input capacitance
-
1.5
10
pF
T
amb
=
-
40
C to +85
C
V
IH
HIGH-level input
voltage
V
CC
= 2.0 V
1.5
-
-
V
V
CC
= 3.0 V
2.1
-
-
V
V
CC
= 5.5 V
3.85
-
-
V
V
IL
LOW-level input
voltage
V
CC
= 2.0 V
-
-
0.5
V
V
CC
= 3.0 V
-
-
0.9
V
V
CC
= 5.5 V
-
-
1.65
V
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
5 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
I
O
= 50
A; V
CC
= 2.0 V
-
-
0.1
V
I
O
= 50
A; V
CC
= 3.0 V
-
-
0.1
V
I
O
= 50
A; V
CC
= 4.5 V
-
-
0.1
V
I
O
= 4.0 mA; V
CC
= 3.0 V
-
-
0.44
V
I
O
= 8.0 mA; V
CC
= 4.5 V
-
-
0.44
V
I
LI
input leakage current
V
I
= V
CC
or GND; V
CC
= 5.5 V
-
-
1.0
A
I
OZ
OFF-state output
current
V
I
= V
IH
or V
IL
; V
O
= V
CC
or GND;
V
CC
= 5.5 V
-
-
2.5
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0 A; V
CC
= 5.5 V
-
-
10
A
T
amb
=
-
40
C to +125
C
V
IH
HIGH-level input
voltage
V
CC
= 2.0 V
1.5
-
-
V
V
CC
= 3.0 V
2.1
-
-
V
V
CC
= 5.5 V
3.85
-
-
V
V
IL
LOW-level input
voltage
V
CC
= 2.0 V
-
-
0.5
V
V
CC
= 3.0 V
-
-
0.9
V
V
CC
= 5.5 V
-
-
1.65
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
I
O
= 50
A; V
CC
= 2.0 V
-
-
0.1
V
I
O
= 50
A; V
CC
= 3.0 V
-
-
0.1
V
I
O
= 50
A; V
CC
= 4.5 V
-
-
0.1
V
I
O
= 4.0 mA; V
CC
= 3.0 V
-
-
0.55
V
I
O
= 8.0 mA; V
CC
= 4.5 V
-
-
0.55
V
I
LI
input leakage current
V
I
= V
CC
or GND; V
CC
= 5.5 V
-
-
2.0
A
I
OZ
OFF-state output
current
V
I
= V
IH
or V
IL
; V
O
= V
CC
or GND;
V
CC
= 5.5 V
-
-
10
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND; I
O
= 0 A; V
CC
= 5.5 V
-
-
20
A
Table 8:
Static characteristics
...continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
6 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
12. Dynamic characteristics
[1]
All typical values are measured at nominal V
CC
.
[2]
C
PD
is used to determine the dynamic power dissipation (P
D
in
W).
P
D
= C
PD
V
CC
2
f
i
N + (C
L
V
CC
2
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in Volts;
N = number of inputs switching;
(C
L
V
CC
2
f
o
) = dissipation due to the output if the combination of the pull up voltage and resistance results in V
CC
at the output.
Table 9:
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); t
r
= t
f
3.0 ns; see
Figure 6
.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
T
amb
= 25
C
t
PZL
, t
PLZ
propagation delay
A and B to Y
see
Figure 5
V
CC
= 3.0 V to 3.6 V; C
L
= 15 pF
[1]
-
4.6
7.5
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 15 pF
[1]
-
3.2
5.5
ns
V
CC
= 3.0 V to 3.6 V; C
L
= 50 pF
[1]
-
6.5
11.0
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 50 pF
[1]
-
4.6
7.5
ns
C
PD
power dissipation
capacitance
C
L
= 50 pF; f
i
= 1 MHz;
V
I
= GND to V
CC
[2]
-
5
-
pF
T
amb
=
-
40
C to +85
C
t
PZL
, t
PLZ
propagation delay
A and B to Y
see
Figure 5
V
CC
= 3.0 V to 3.6 V; C
L
= 15 pF
1.0
-
8.5
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 15 pF
1.0
-
6.5
ns
V
CC
= 3.0 V to 3.6 V; C
L
= 50 pF
1.5
-
12.0
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 50 pF
1.5
-
8.0
ns
T
amb
=
-
40
C to +125
C
t
PZL
, t
PLZ
propagation delay
A and B to Y
see
Figure 5
V
CC
= 3.0 V to 3.6 V; C
L
= 15 pF
1.0
-
9.0
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 15 pF
1.0
-
7.0
ns
V
CC
= 3.0 V to 3.6 V; C
L
= 50 pF
1.5
-
12.5
ns
V
CC
= 4.5 V to 5.5 V; C
L
= 50 pF
1.5
-
8.5
ns
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
7 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
13. Waveforms
V
M
= 0.5V
CC
; V
I
= GND to V
CC
.
V
OL
is the typical voltage output drop that occur with the output load.
Fig 5.
The data input (A, B) to output (Y) propagation delays
Test data is given in
Table 10
.
Definitions for test circuit:
C
L
= Load capacitance including jig and probe capacitance.
R
T
= Termination resistance should be equal to output impedance Z
o
of the pulse generator.
Fig 6.
Load circuitry for switching times
Table 10:
Test data
Input
Load
S
1
V
I
t
r
, t
f
R
L
C
L
t
PHZ
, t
PZH
t
PLZ
, t
PZL
t
PLH
, t
PHL
GND to V
CC
3.0 ns
1000
15 pF
GND
V
CC
open
GND to V
CC
3.0 ns
1000
50 pF
GND
V
CC
open
001aad602
t
PZL
t
PLZ
GND
V
I
V
CC
V
OL
V
M
V
M
V
X
Y output
A, B input
open
GND
V
CC
V
CC
V
I
V
O
mna232
D.U.T.
CL
R
T
RL =
1000
PULSE
GENERATOR
S
1
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
8 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
14. Package outline
Fig 7.
Package outline SOT353-1 (TSSOP5)
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
w
y
v
c
e
D
(1)
E
(1)
Z
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
e1
1.3
2.25
2.0
0.60
0.15
7
0
0.1
0.1
0.3
0.425
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.46
0.21
SOT353-1
MO-203
SC-88A
00-09-01
03-02-19
w
M
bp
D
Z
e
e1
0.15
1
3
5
4
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v
M
A
X
A
y
1.5
3 mm
0
scale
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
1.1
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
9 of 11
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
15. Abbreviations
16. Revision history
Table 11:
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
Table 12:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
74AHC1G09_1
20050926
Product data sheet
-
-
-
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
74AHC1G09_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 26 September 2005
10 of 11
17. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
20. Trademarks
Notice -- All referenced brands, product names, service names and
trademarks are the property of their respective owners.
21. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level
Data sheet status
[1]
Product status
[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 26 September 2005
Document number: 74AHC1G09_1
Published in The Netherlands
Philips Semiconductors
74AHC1G09
2-input AND gate with open-drain output
22. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
8.1
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
10
Recommended operating conditions. . . . . . . . 4
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
12
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
13
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10
18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
21
Contact information . . . . . . . . . . . . . . . . . . . . 10