Document Outline
- FEATURES
- DESCRIPTION
- QUICK REFERENCE DATA
- FUNCTION TABLE
- ORDERING AND PACKAGE INFORMATION
- PINNING
- RECOMMENDED OPERATING CONDITIONS
- LIMITING VALUES
- DC CHARACTERISTICS
- AC CHARACTERISTICS
- TRANSFER CHARACTERISTIC WAVEFORMS
- APPLICATION INFORMATION
- PACKAGE OUTLINES
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 2001 Mar 02
2002 May 15
INTEGRATED CIRCUITS
74HC1G14; 74HCT1G14
Inverting Schmitt-triggers
2002 May 15
2
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
FEATURES
Wide operating voltage range from 2.0 to 6.0 V
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
Very small 5 pins package
Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
Output capability: standard.
DESCRIPTION
The 74HC1G/HCT1G14 is a high-speed Si-gate CMOS
device.
The 74HC1G/HCT1G14 provides the inverting buffer
function with Schmitt-trigger action. These devices are
capable of transforming slowly changing input signals into
sharply defined, jitter-free output signals.
The standard output currents are
1
/
2
compared to the
74HC/HCT14.
QUICK REFERENCE DATA
GND = 0 V; T
amb
= 25
C; t
r
= t
f
= 6.0 ns.
Notes
1. C
PD
is used to determine the dynamic power dissipation (P
D
in
W).
P
D
= C
PD
V
CC
2
f
i
+
(C
L
V
CC
2
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in Volts;
(C
L
V
CC
2
f
o
) = sum of outputs.
2. For HC1G the condition is V
I
= GND to V
CC
.
For HCT1G the condition is V
I
= GND to V
CC
-
1.5 V.
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
HC1G
HCT1G
t
PHL
/t
PLH
propagation delay A to Y
C
L
= 15 pF V
CC
= 5 V
10
15
ns
C
I
input capacitance
1.5
1.5
pF
C
PD
power dissipation capacitance
notes 1 and 2
20
22
pF
INPUT
OUTPUT
A
Y
L
H
H
L
2002 May 15
3
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
ORDERING AND PACKAGE INFORMATION
PINNING
OUTSIDE NORTH
AMERICA
PACKAGES
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
MARKING
74HC1G14GW
-
40 to +125
C
5
SC-88A
plastic
SOT353
HF
74HCT1G14GW
-
40 to +125
C
5
SC-88A
plastic
SOT353
TF
74HC1G14GV
-
40 to +125
C
5
SC-74A
plastic
SOT753
H14
74HCT1G14GV
-
40 to +125
C
5
SC-74A
plastic
SOT753
T14
PIN
SYMBOL
DESCRIPTION
1
n.c.
not connected
2
A
data input A
3
GND
ground (0 V)
4
Y
data output Y
5
V
CC
supply voltage
Fig.1 Pin configuration.
handbook, halfpage
1
2
3
5
4
MNA022
14
VCC
A
Y
GND
n.c
Fig.2 Logic symbol.
handbook, halfpage
MNA023
A
Y
2
4
Fig.3 IEC logic symbol.
handbook, halfpage
2
4
MNA024
Fig.4 Logic diagram.
handbook, halfpage
MNA025
A
Y
2002 May 15
4
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 55
C the value of P
D
derates linearly with 2.5 mW/K.
SYMBOL
PARAMETER
CONDITIONS
74HC1G
74HCT1G
UNIT
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
V
CC
supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
V
I
input voltage
0
-
V
CC
0
-
V
CC
V
V
O
output voltage
0
-
V
CC
0
-
V
CC
V
T
amb
operating ambient
temperature
see DC and AC
characteristics per device
-
40
+25
+125
-
40
+25
+125
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
-
0.5
+7.0
V
I
IK
input diode current
V
I
< -
0.5 V or V
I
>
V
CC
+ 0.5 V; note 1
-
20
mA
I
OK
output diode current
V
O
< -
0.5 V or V
O
>
V
CC
+ 0.5 V; note 1
-
20
mA
I
O
output source or sink current
-
0.5 V
<
V
O
<
V
CC
+ 0.5 V; note 1
-
12.5
mA
I
CC
V
CC
or GND current
note 1
-
25
mA
T
stg
storage temperature
-
65
+150
C
P
D
power dissipation per package
for temperature range from
-
40 to +125
C;
note 2
-
200
mW
2002 May 15
5
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
DC CHARACTERISTICS
Family 74HC1G
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Note
1. All typical values are measured at T
amb
= 25
C.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
OTHER
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
V
OH
HIGH-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
=
-
20
A
2.0
1.9
2.0
-
1.9
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
20
A
4.5
4.4
4.5
-
4.4
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
20
A
6.0
5.9
6.0
-
5.9
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
2.0 mA
4.5
4.13
4.32
-
3.7
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
2.6 mA
6.0
5.63
5.81
-
5.2
-
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
= 20
A
2.0
-
0
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 20
A
4.5
-
0
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 20
A
6.0
-
0
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 2.0 mA
4.5
-
0.15
0.33
-
0.4
V
V
I
= V
IH
or V
IL
;
I
O
= 2.6 mA
6.0
-
0.16
0.33
-
0.4
V
I
LI
input leakage current
V
I
= V
CC
or GND
6.0
-
-
1.0
-
1.0
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND;
I
O
= 0
6.0
-
-
10
-
20
A
2002 May 15
6
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
Family 74HC1G14
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Note
1. All typical values are measured at T
amb
= 25
C.
Family 74HCT1G
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Note
1. All typical values are measured at T
amb
= 25
C.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
V
T+
positive-going threshold
see Figs 5 and 6 2.0
0.7
1.09
1.5
0.7
1.5
V
4.5
1.7
2.36
3.15
1.7
3.15
V
6.0
2.1
3.12
4.2
2.1
4.2
V
V
T
-
negative-going threshold
see Figs 5 and 6 2.0
0.3
0.60
0.9
0.3
0.9
V
4.5
0.9
1.53
2.0
0.9
2.0
V
6.0
1.2
2.08
2.6
1.2
2.6
V
V
H
hysteresis (V
T+
-
V
T
-
)
see Figs 5 and 6 2.0
0.2
0.48
1.0
0.2
1.0
V
4.5
0.4
0.83
1.4
0.4
1.4
V
6.0
0.6
1.04
1.6
0.6
1.6
V
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
OTHER
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
V
OH
HIGH-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
=
-
20
A
4.5
4.4
4.5
-
4.4
-
V
V
I
= V
IH
or V
IL
;
I
O
=
-
2.0 mA
4.5
4.13
4.32
-
3.7
-
V
V
OL
LOW-level output
voltage
V
I
= V
IH
or V
IL
;
I
O
= 20
A
4.5
-
0
0.1
-
0.1
V
V
I
= V
IH
or V
IL
;
I
O
= 2.0 mA
4.5
-
0.15
0.33
-
0.4
V
I
LI
input leakage current V
I
= V
CC
or GND
5.5
-
-
1.0
-
1.0
A
I
CC
quiescent supply
current
V
I
= V
CC
or GND;
I
O
= 0
5.5
-
-
10.0
-
20.0
A
I
CC
additional supply
current per input
V
I
= V
CC
-
2.1 V;
I
O
= 0
4.5 to 5.5
-
-
500
-
850
A
2002 May 15
7
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
Family 74HCT1G14
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Note
1. All typical values are measured at T
amb
= 25
C.
AC CHARACTERISTICS
Type 74HC1G14
GND = 0 V; t
r
= t
f
= 6.0 ns; C
L
= 50 pF.
Note
1. All typical values are measured at T
amb
= 25
C.
Type 74HCT1G14
GND = 0 V; t
r
= t
f
= 6.0 ns; C
L
= 50 pF.
Note
1. All typical values are measured at T
amb
= 25
C.
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
V
T+
positive-going threshold
see Figs 5 and 6
4.5
1.2
1.55
1.9
1.2
1.9
V
5.5
1.4
1.80
2.1
1.4
2.1
V
V
T
-
negative-going threshold
see Figs 5 and 6
4.5
0.5
0.76
1.2
0.5
1.2
V
5.5
0.6
0.90
1.4
0.6
1.4
V
V
H
hysteresis (V
T+
-
V
T
-
)
see Figs 5 and 6
4.5
0.4
0.80
-
0.4
-
V
5.5
0.4
0.90
-
0.4
-
V
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
t
PHL
/t
PLH
propagation delay
A to Y
see Figs 12 and 13
2.0
-
25
155
-
190
ns
4.5
-
12
31
-
38
ns
6.0
-
11
26
-
32
ns
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
(
C)
UNIT
WAVEFORMS
V
CC
(V)
-
40 to +85
-
40 to +125
MIN.
TYP.
(1)
MAX.
MIN.
MAX.
t
PHL
/t
PLH
propagation delay
A to Y
see Figs 12 and 13
4.5
-
17
43
-
51
ns
2002 May 15
8
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
TRANSFER CHARACTERISTIC WAVEFORMS
Fig.5 Transfer characteristic.
handbook, halfpage
MNA026
VO
VH
VI
VT
-
VT
+
Fig.6
The definitions of V
T+
, V
T
-
and V
H
; where
V
T+
and V
T
-
are between limits of 20%
and 70%.
handbook, halfpage
MNA027
VO
VI
VH
VT
+
VT
-
Fig.7
Typical HC1G14 transfer characteristics;
V
CC
= 2.0 V.
handbook, halfpage
0
2.0
100
0
50
ICC
(
A)
1.0
VI (V)
MNA028
Fig.8
Typical HC1G14 transfer characteristics;
V
CC
= 4.5 V.
handbook, halfpage
0
5.0
1.0
0.8
0.6
0.4
0.2
0
ICC
(mA)
2.5
VI (V)
MNA029
2002 May 15
9
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
Fig.9
Typical HC1G14 transfer characteristics;
V
CC
= 6.0 V.
handbook, halfpage
0
3.0
6.0
1.6
0
0.8
MNA030
ICC
(mA)
VI (V)
Fig.10 Typical HCT1G14 transfer characteristics;
V
CC
= 4.5 V.
handbook, halfpage
0
5.0
2.0
0
1.0
ICC
(mA)
2.5
VI (V)
MNA031
Fig.11 Typical HCT1G14 transfer characteristics;
V
CC
= 5.5 V.
handbook, halfpage
0
3.0
2.0
1.0
0
3.0
6.0
MNA032
ICC
(mA)
VI (V)
Fig.12 The input (A) to output (Y) propagation
delays.
handbook, halfpage
MNA033
A input
Y output
tPHL
tPLH
VM
VM
For HC1G: V
M
= 50%; V
I
= GND to V
CC
.
For HCT1G: V
M
= 1.3 V; V
I
= GND to 3.0 V.
2002 May 15
10
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
Fig.13 Load circuitry for switching times.
Definitions for test circuit:
C
L
= load capacitance including jig and probe capacitance (See "AC characteristics" for values).
R
T
= termination resistance should be equal to the output impedance Z
o
of the pulse generator.
handbook, halfpage
VCC
VI
VO
MNA034
D.U.T.
CL
50 pF
RT
PULSE
GENERATOR
2002 May 15
11
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
APPLICATION INFORMATION
The slow input rise and fall times cause additional power
dissipation, this can be calculated using the following
formula:
P
ad
= f
i
(t
r
I
CCa
+ t
f
I
CCa
)
V
CC
Where:
P
ad
= additional power dissipation (
W)
f
i
= input frequency (MHz)
t
r
= input rise time (ns); 10% to 90%
t
f
= input fall time (ns); 90% to 10%
I
CCa
= average additional supply current (
A).
Average I
CCa
differs with positive or negative input
transitions, as shown in Fig.14 and Fig.15.
HC1G/HCT1G14 used in relaxation oscillator circuit,
see Fig.14 and Fig.16.
Note to the application information:
1. All values given are typical unless otherwise specified.
Fig.14 Average I
CC
for HC1G Schmitt-trigger
devices; linear change of V
I
between
0.1V
CC
to 0.9V
CC
.
handbook, halfpage
0
2.0
4.0
6.0
VCC (V)
200
150
50
0
100
MNA036
ICC(AV)
(
A)
positive-going
edge
negative-going
edge
Fig.15 Average I
CC
for HCT1G Schmitt-trigger
devices; linear change of V
I
between
0.1V
CC
to 0.9V
CC
.
handbook, halfpage
0
4
6
2
VCC (V)
200
100
50
150
0
MNA058
ICC(AV)
(
A)
positive-going
edge
negative-going
edge
Fig.16 Relaxation oscillator using the
HC1G/HCT1G14.
For HC1G:
For HCT1G:
f
1
T
---
1
0.8
RC
-----------------------
=
f
1
T
---
1
0.67
RC
---------------------------
=
handbook, halfpage
MNA035
R
C
2002 May 15
12
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT353
w
B
M
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
v
M
A
A
B
y
0
1
2 mm
scale
c
X
1
3
2
4
5
Plastic surface mounted package; 5 leads
SOT353
UNIT
A1
max
bp
c
D
E
(2)
e
1
HE
Lp
Q
y
w
v
mm
0.1
0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15
0.65
e
1.3
2.2
2.0
0.2
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
97-02-28
SC-88A
2002 May 15
13
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT753
SC-74A
w
B
M
bp
D
e
A
A1
Lp
Q
detail X
HE
E
v
M
A
A
B
y
0
1
2 mm
scale
c
X
1
3
2
4
5
Plastic surface mounted package; 5 leads
SOT753
UNIT
A1
bp
c
D
E
HE
Lp
Q
y
w
v
mm
0.100
0.013
0.40
0.25
3.1
2.7
0.26
0.10
1.7
1.3
e
0.95
3.0
2.5
0.2
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.6
0.2
0.33
0.23
A
1.1
0.9
02-04-16
2002 May 15
14
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2002 May 15
15
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
"(LF)BGA Application Note" (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable
(3)
suitable
PLCC
(4)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended
(6)
suitable
2002 May 15
16
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2002 May 15
17
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
NOTES
2002 May 15
18
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
NOTES
2002 May 15
19
Philips Semiconductors
Product specification
Inverting Schmitt-triggers
74HC1G14; 74HCT1G14
NOTES
Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
613508/03/pp
20
Date of release:
2002 May 15
Document order number:
9397 750 09721
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