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Электронный компонент: 8547TS

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DATA SHEET
Product specification
Supersedes data of 1997 Oct 14
File under Integrated Circuits, IC01
1998 Apr 01
INTEGRATED CIRCUITS
TDA8547TS
2
0.7 W BTL audio amplifier with
output channel switching
1998 Apr 01
2
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
FEATURES
Selection between output channels
Flexibility in use
Few external components
Low saturation voltage of output stage
Gain can be fixed with external resistors
Standby mode controlled by CMOS compatible levels
Low standby current
No switch-on/switch-off plops
High supply voltage ripple rejection
Protected against electrostatic discharge
Outputs short-circuit safe to ground, V
CC
and across the
load
Thermally protected.
APPLICATIONS
Telecommunication equipment
Portable consumer products
Personal computers
Motor-driver (servo).
GENERAL DESCRIPTION
The TDA8547TS is a two channel audio power amplifier
for an output power of 2
0.7 W with a 16
load at a 5 V
supply. At a low supply voltage of 3.3 V an output power of
0.6 W with an 8
load can be obtained. The circuit
contains two BTL amplifiers with a complementary
PNP-NPN output stage and standby/mute logic.
The operating condition of all channels of the device
(standby, mute or on) is externally controlled by the
MODE pin. With the SELECT pin one of the output
channels can be switched in the standby condition. This
feature can be used for loudspeaker selection and also
reduces the quiescent current consumption.
When only one channel is used the maximum output
power is 1.2 W.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
2.2
5
18
V
I
q
quiescent current
V
CC
= 5 V; 2 channels
-
15
22
mA
V
CC
= 5 V; 1 channel
-
8
12
mA
I
stb
standby current
-
-
10
A
P
o
output power
two channels
THD = 10%; R
L
= 8
; V
CC
= 3.3 V
0.5
0.6
-
W
THD = 10%; R
L
= 16
; V
CC
= 5 V
0.6
0.7
-
W
one channel
THD = 10%; R
L
= 8
; V
CC
= 5 V
1
1.2
-
W
THD = 10%; R
L
= 4
; V
CC
= 3.3 V
1
1.2
-
W
THD
total harmonic distortion
P
o
= 0.4 W
-
0.15
-
%
SVRR
supply voltage ripple rejection
50
-
-
dB
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8547TS
SSOP20
plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
1998 Apr 01
3
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGK984
STANDBY/MUTE LOGIC
R
R
20 k
20 k
IN1
-
IN1
+
VCC1
OUT1
-
OUT1
+
-
-
+
-
-
+
STANDBY/MUTE LOGIC
R
R
20 k
20 k
IN2
-
IN2
+
VCC2
SVRR
MODE
OUT2
-
OUT2
+
-
-
+
-
-
+
SELECT
GND1 GND2
VCC1 VCC2
20
11
18
3
13
8
1
10
17
16
14
15
5
5
4
6
n.c.
2, 7, 9, 12, 19
TDA8547TS
1998 Apr 01
4
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
PINNING
SYMBOL PIN
DESCRIPTION
GND1
1
ground, channel 1
n.c.
2
not connected
OUT1+
3
positive loudspeaker terminal,
channel 1
MODE
4
operating mode select (standby, mute,
operating)
SVRR
5
half supply voltage, decoupling ripple
rejection
SELECT
6
input for selection of operating channel
n.c.
7
not connected
OUT2+
8
positive loudspeaker terminal,
channel 2
n.c.
9
not connected
GND2
10
ground, channel 2
V
CC2
11
supply voltage, channel 2
n.c.
12
not connected
OUT2
-
13
negative loudspeaker terminal,
channel 2
IN2
-
14
negative input, channel 2
IN2+
15
positive input, channel 2
IN1+
16
positive input, channel 1
IN1
-
17
negative input, channel 1
OUT1
-
18
negative loudspeaker terminal,
channel 1
n.c.
19
not connected
V
CC1
20
supply voltage, channel 1
Fig.2 Pin configuration.
handbook, halfpage
GND1
n.c.
OUT1
+
MODE
SVRR
SELECT
n.c.
OUT2
+
n.c.
GND2
VCC1
n.c.
OUT1
-
IN1
-
IN2
+
IN2
-
IN1
+
OUT2
-
n.c.
VCC2
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA8547TS
MGK998
FUNCTIONAL DESCRIPTION
The TDA8547TS is a 2
0.7 W BTL audio power amplifier
capable of delivering 2
0.7 W output power to a 16
load at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.
Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of a NPN power
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and a 16
loudspeaker an output power of
0.7 W can be delivered, when two channels are operating.
If only one channel is operating then an output power of
1.2 W can be delivered (5 V, 8
)
.
MODE pin
The whole device (both channels) is in the standby mode
(with a very low current consumption) if the voltage at the
MODE pin is >(V
CC
-
0.5 V), or if this pin is floating. At a
MODE voltage level of less than 0.5 V the amplifier is fully
operational. In the range between 1.5 V and V
CC
-
1.5 V
the amplifier is in mute condition. The mute condition is
useful to suppress plop noise at the output caused by
charging of the input capacitor.
1998 Apr 01
5
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
SELECT pin
If the voltage at the SELECT pin is in the range between
1.5 V and V
CC
-
1.5 V, or if it is kept floating, then both
channels can be operational. If the SELECT pin is set to a
LOW voltage or grounded, then only channel 2 can
operate and the power amplifier of channel 1 will be in the
standby mode. In this case only the loudspeaker at
channel 2 can operate and the loudspeaker at channel 1
will be switched off. If the SELECT pin is set to a
HIGH level or connected to V
CC
, then only channel 1 can
operate and the power amplifier of channel 2 will be in the
standby mode. In this case only the loudspeaker at
channel 1 can operate and the loudspeaker at channel 2
will be switched off. Setting the SELECT pin to a LOW or
a HIGH voltage results in a reduction of quiescent current
consumption by a factor of approximately 2.
Switching with the SELECT pin during operating is not
plop-free, because the input capacitor of the channel
which is coming out of standby needs to be charged first.
For plop-free channel selecting the device has first to be
set in mute condition with the MODE pin (between 1.5 V
and V
CC
-
1.5 V), then set the SELECT pin to the new
level, after a delay set the MODE pin to a LOW level.
The delay needed depends on the values of the input
capacitor and the feedback resistors. Time needed is
approx. 10
C1
(R1 + R2), so approximately 0.6 s. for
the values in Fig.4.
Table 1
Control pins MODE and SELECT versus status of output channels
Voltage levels at control pins at V
P
= 5 V; for other supply voltages see Figs. 14 and 15.
Notes
1. HIGH = V
pin
> V
CC
-
0.5 V.
2. NC = not connected or floating.
3. X = don't care.
4. HVP = 1.5 V < V
pin
< V
CC
-
1.5 V.
5. LOW = V
pin
< 0.5 V.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
CONTROL PIN
STATUS OF OUTPUT
CHANNEL
TYP. I
q
(mA)
MODE
SELECT
CHANNEL 1 CHANNEL 2
HIGH
(1)
/NC
(2)
X
(3)
standby
standby
0
HVP
(4)
HVP
(4)
/NC
(2)
mute
mute
15
LOW
(5)
HVP
(4)
/NC
(2)
on
on
15
HVP
(4)
/LOW
(5)
HIGH
(1)
mute/on
standby
8
HVP
(4)
/LOW
(5)
HVP
(4)
/NC
(2)
mute/on
mute/on
15
HVP
(4)
/LOW
(5)
LOW
(5)
standby
mute/on
8
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
operating
-
0.3
+18
V
V
I
input voltage
-
0.3
V
CC
+ 0.3
V
I
ORM
repetitive peak output current
-
1
A
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
-
40
+85
C
V
Psc
AC and DC short-circuit safe voltage
-
10
V
P
tot
power dissipation
-
1.1
W
1998 Apr 01
6
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
QUALITY SPECIFICATION
In accordance with
"SNW-FQ-611-E".
THERMAL CHARACTERISTICS
Table 2
Maximum ambient temperature at different conditions
Note
1. At THD = 10%.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
110
K/W
V
CC
(V)
R
L
(
)
APPLICATION
P
o
(W)
(1)
CONTINUOUS SINE WAVE DRIVEN
P
max
(W)
T
amb(max)
(
C)
3.3
4
1 channel
1.2
0.58
86
3.3
4
2 channels
2
1.2
1.12
27
3.3
8
1 channels
0.6
0.3
117
3.3
8
2 channels
2
0.6
0.60
84
5
8
1 channel
1.2
0.67
76
5
8
2 channels
2
1.2
1.33
-
5
16
1 channel
0.7
0.35
112
5
16
2 channels
2
0.7
0.70
73
Fig.3 Power derating curve.
handbook, halfpage
0
40
80
160
0
2.0
120
1.6
1.2
0.8
0.4
MGK987
Tamb (
C)
P
(W)
1998 Apr 01
7
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
DC CHARACTERISTICS
V
CC
= 5 V; T
amb
= 25
C; R
L
= 8
; V
MODE
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
otherwise specified.
Notes
1. Measured with R
L
=
. With a load connected at the outputs the quiescent current will increase, the maximum of this
increase being equal to the DC output offset voltage divided by R
L
.
2. The DC output voltage with respect to ground is approximately 0.5V
CC
.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
operating
2.2
5
18
V
I
q
quiescent current
BTL 2 channels;
note 1
-
15
22
mA
BTL 1 channel;
note 1
-
8
12
mA
I
stb
standby current
V
MODE
= V
CC
-
-
10
A
V
O
DC output voltage
note 2
-
2.2
-
V
V
OUT+
-
V
OUT
-
differential output voltage
offset
-
-
50
mV
I
IN+
, I
IN
-
input bias current
-
-
500
nA
V
MODE
input voltage MODE pin
operating
0
-
0.5
V
mute
1.5
-
V
CC
-
1.5 V
standby
V
CC
-
0.5
-
V
CC
V
I
MODE
input current MODE pin
0 V < V
MODE
< V
CC
-
-
20
A
V
SELECT
input voltage SELECT pin
channel 1 = standby;
channel 2 = on
0
-
1
V
channel 1 = on;
channel 2 = standby
V
CC
-
1
-
V
CC
V
I
SELECT
input current SELECT pin
V
SELECT
= 0 V
-
-
100
A
1998 Apr 01
8
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
AC CHARACTERISTICS
V
CC
= 5 V; T
amb
= 25
C; R
L
= 8
; f = 1 kHz; V
MODE
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
unless otherwise specified.
Notes
1. Gain of the amplifier is
in BTL application circuit Fig.4.
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of R
S
= 0
at the input.
3. Supply voltage ripple rejection is measured at the output, with a source impedance of R
S
= 0
at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of R
S
= 0
at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz,
so including noise.
6. Channel separation is measured at the output with a source impedance of R
S
= 0
at the input and a frequency of
1 kHz. The output power in the operating channel is set to 0.5 W.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
P
o
output power, one channel
THD = 10%
1
1.2
-
W
THD = 0.5%
0.6
0.9
-
W
THD
total harmonic distortion
P
o
= 0.4 W
-
0.15
0.3
%
G
v
closed loop voltage gain
note 1
6
-
30
dB
Z
i
differential input impedance
-
100
-
k
V
no
noise output voltage
note 2
-
-
100
V
SVRR
supply voltage ripple rejection
note 3
50
-
-
dB
note 4
40
-
-
dB
V
o
output voltage
note 5
-
-
200
V
cs
channel separation
V
SELECT
= 0.5V
CC
; note 6 40
-
-
dB
2
R2
R1
--------
1998 Apr 01
9
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
TEST AND APPLICATION INFORMATION
Test conditions
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each
application are shown separately.
The thermal resistance = 110 K/W for the SSOP20; the
maximum sine wave power dissipation for T
amb
= 25
C
is:
For T
amb
= 60
C the maximum total power dissipation is:
Thermal Design Considerations
The `measured' thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different Semiconductor manufacturers because the
application boards and test methods are not (yet)
standardized. Also, the thermal performance of packages
for a specific application may be different than presented
here, because the configuration of the application boards
(copper area!) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper
traces with solder coating.
The SSOP package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.24) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to about 80 K/W.
For T
amb
= 60
C the maximum total power dissipation at
this PCB layout is:
Please note that this two channel IC is mentioned for
application with only one channel active. For that reason
the curves for worst case power dissipation are given for
the condition of only one of the both channels driven with
a 1 kHz sine wave signal.
BTL application
T
amb
= 25
C if not specially mentioned, V
CC
= 5 V,
f = 1 kHz, R
L
= 8
, G
v
= 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application circuit is illustrated in Fig.4.
150
25
110
----------------------
1.14 W
=
150
60
110
----------------------
0.82 W
=
150
60
80
----------------------
1.12 W
=
The quiescent current has been measured without any
load impedance and both channels driven. When one
channel is active the quiescent current will be halved.
The total harmonic distortion as a function of frequency
was measured using a low-pass filter of 80 kHz.
The value of capacitor C3 influences the behaviour of the
SVRR at low frequencies: increasing the value of C3
increases the performance of the SVRR.
The figure of the MODE voltage (V
MODE
) as a function of
the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depend on the supply
voltage level. The figure of the SELECT voltage (V
SELECT
)
as a function of the supply voltage shows the voltage
levels for switching the channels in the active, mute or
standby mode.
SE application
T
amb
= 25
C if not specially mentioned, V
CC
= 7.5 V,
f = 1 kHz, R
L
= 4
, G
v
= 20 dB, audio band-pass
22 Hz to 22 kHz.
The SE application circuit is illustrated in Fig.16.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive
output is not designed for high output current (2
I
o
) at
low load impedance (
16
), the SE application with
output capacitors connected to ground is advised.
The capacitor value of C6/C7 in combination with the load
impedance determines the low frequency behaviour.
The THD as a function of frequency was measured using
a low-pass filter of 80 kHz. The value of capacitor C3
influences the behaviour of the SVRR at low frequencies:
increasing the value of C3 increases the performance of
the SVRR.
General remark
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback
resistor. To improve the immunity to HF radiation in radio
circuit applications, a small capacitor can be connected in
parallel with the feedback resistor (56 k
); this creates a
low-pass filter.
1998 Apr 01
10
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
BTL APPLICATION
Fig.4 BTL application.
handbook, full pagewidth
MGK985
17
VCC
Vi1
OUT1
-
IN1
-
IN1
+
OUT1
+
18
C4
100 nF
C5
100
F
20
11
1
10
TDA8547TS
16
OUT2
-
GND
RL1
IN2
-
14
IN2
+
SVRR
15
5
4
6
MODE
SELECT
3
OUT2
-
OUT2
+
13
RL2
8
C3
47
F
C2
1
F
C1
1
F
R1
R2
R4
10 k
10 k
50 k
50 k
R3
Vi2
Gain channel 1
2
R2
R1
--------
=
Gain channel 2
2
R4
R3
--------
=
Fig.5 I
q
as a function of V
CC
.
R
L
=
.
handbook, halfpage
0
Iq
(mA)
VCC (V)
20
30
10
0
4
20
8
12
16
MGD890
Fig.6 THD as a function of P
o
.
f = 1 kHz; G
v
= 20 dB.
(1) V
CC
= 5 V; R
L
= 8
.
handbook, halfpage
10
1
THD
(%)
10
-
2
10
-
1
MGK988
10
-
2
10
-
1
1
Po (W)
10
(1)
1998 Apr 01
11
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Fig.7 THD as a function of frequency.
P
o
= 0.5 W; G
v
= 20 dB.
(1) V
CC
= 5 V; R
L
= 8
.
handbook, halfpage
10
1
10
-
1
10
-
2
MGK989
10
10
2
10
3
10
4
THD
(%)
f (Hz)
10
5
(1)
Fig.8
Channel separation as a function of
frequency.
V
CC
= 5 V; V
o
= 2 V; R
L
= 8
.
(1) G
v
= 30 dB.
(2) G
v
= 20 dB.
(3) G
v
= 6 dB.
andbook, halfpage
-
100
-
90
-
80
-
70
-
60
MGK699
10
10
2
10
3
10
4
10
5
f (Hz)
cs
(dB)
(1)
(2)
(3)
Fig.9 SVRR as a function of frequency.
V
CC
= 5 V; R
S
= 0
; V
r
= 100 mV.
(1) G
v
= 30 dB.
(2) G
v
= 20 dB.
(3) G
v
= 6 dB.
handbook, halfpage
-
80
-
60
-
40
-
20
MGD894
10
2
10
10
3
SVRR
(dB)
f (Hz)
10
4
10
5
(1)
(2)
(3)
Fig.10 P
o
as a function of V
CC
.
THD = 10%.
(1) R
L
= 8
.
(2) R
L
= 16
.
handbook, halfpage
0
4
8
Po
(W)
VCC (V)
12
0
2
1.5
1
(1)
(2)
0.5
MGK990
1998 Apr 01
12
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Fig.11 Worst case power dissipation as a function
of V
CC
(one channel active).
(1) R
L
= 8
.
(2) R
L
= 16
.
handbook, halfpage
0
1.5
(1)
(2)
1.0
VCC (V)
0.5
0
4
8
12
MGK991
P
(W)
Fig.12 Power dissipation as a function of P
o
(one channel active).
Sine wave of 1 kHz.
(1) V
CC
= 5 V; R
L
= 8
.
handbook, halfpage
0
1
(1)
0.5
1.5
0
0.5
1
1.5
Po (W)
MGK992
P
(W)
Fig.13 V
o
as a function of V
MODE
.
Band-pass = 22 Hz to 22 kHz.
(1) V
CC
= 3 V.
(2) V
CC
= 5 V.
(3) V
CC
= 12 V.
handbook, halfpage
1
10
10
-
2
10
-
1
10
-
3
10
-
4
10
-
6
10
-
5
MGL211
10
-
1
1
Vo
(V)
VMODE (V)
10
10
2
(1)
(2)
(3)
Fig.14 V
MODE
as a function of V
P
.
handbook, halfpage
0
4
8
VMODE
(V)
16
16
12
4
0
8
12
VP (V)
MGL210
operating
mute
standby
1998 Apr 01
13
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Fig.15 V
SELECT
as a function of V
P
.
handbook, full pagewidth
20
20
0
4
8
0
2
4
6
8
12
14
16
18
12
16
10
MGK700
channel 2
standby
channel 1
standby
channel 2
on
channel 1
on
channel 1
+
2
on
VP (V)
VSELECT
(V)
VP
SE APPLICATION
Fig.16 SE application.
handbook, full pagewidth
MGK986
17
VCC
Vi1
OUT1
-
IN1
-
IN1
+
OUT1
+
18
C4
100 nF
470
F
C6
C7
470
F
C5
100
F
20
11
1
10
TDA8547TS
16
OUT2
-
GND
RL1
RL2
IN2
-
14
IN2
+
SVRR
15
5
4
6
MODE
SELECT
3
OUT2
-
OUT2
+
13
8
C3
47
F
C2
1
F
C1
1
F
R1
R2
R4
10 k
10 k
100 k
100 k
R3
Vi2
Gain channel 1
R2
R1
--------
=
Gain channel 2
R4
R3
--------
=
1998 Apr 01
14
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Fig.17 THD as a function of P
o
.
f = 1 kHz; G
v
= 20 dB.
(1) V
CC
= 7.5 V; R
L
= 4
.
(2) V
CC
= 9 V; R
L
= 8
.
(3) V
CC
= 12 V; R
L
= 16
.
handbook, halfpage
10
1
Po (W)
THD
(%)
10
-
1
10
-
2
MGD899
10
-
2
10
-
1
1
(1)
(2)
10
(3)
Fig.18 THD as a function of frequency.
P
o
= 0.5 W; G
v
= 20 dB.
(1) V
CC
= 7.5 V; R
L
= 4
.
(2) V
CC
= 9 V; R
L
= 8
.
(3) V
CC
= 12 V; R
L
= 16
.
handbook, halfpage
10
1
THD
(%)
f (Hz)
10
-
1
10
-
2
MGD900
10
10
2
10
3
10
4
10
5
(1)
(2)
(3)
Fig.19 Channel separation as a function of
frequency.
V
o
= 1 V; G
v
= 20 dB.
(1) V
CC
= 7.5 V; R
L
= 4
.
(2) V
CC
= 9 V; R
L
= 8
.
(3) V
CC
= 12 V; R
L
= 16
.
(4) V
CC
= 5 V; R
L
= 32
.
handbook, halfpage
-
100
-
80
-
60
-
40
MGK993
10
(1)
10
2
10
3
10
4
f (Hz)
10
5
(3)
(4)
(2)
cs
(dB)
Fig.20 SVRR as a function of frequency.
V
CC
= 7.5 V; R
L
= 4
; R
S
= 0
; V
r
= 100 mV.
(1) G
v
= 24 dB.
(2) G
v
= 20 dB.
(3) G
v
= 0 dB.
handbook, halfpage
-
80
-
60
-
40
-
20
MGD902
10
10
2
10
3
SVRR
(dB)
f (Hz)
10
4
10
5
(1)
(2)
(3)
1998 Apr 01
15
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Fig.21 P
o
as a function of V
CC
.
THD = 10%.
(1) R
L
= 4
.
(2) R
L
= 8
.
(3) R
L
= 16
.
handbook, halfpage
0
(1)
(2)
(3)
4
8
Po
(W)
VCC (V)
16
2
0
1.6
12
1.2
0.8
0.4
MGK994
Fig.22 Worst case power dissipation as a function
of V
CC
(one channel active).
(1) R
L
= 4
.
(2) R
L
= 8
.
(3) R
L
= 16
.
handbook, halfpage
0
1.5
1.0
VCC (V)
0.5
0
4
8
(1)
(2)
(3)
16
12
MGK995
P
(W)
Fig.23 Power dissipation as a function of P
o
(one channel active).
Sine wave of 1 kHz.
(1) V
CC
= 12 V; R
L
= 16
.
(2) V
CC
= 7.5 V; R
L
= 4
.
(3) V
CC
= 9 V; R
L
= 8
.
handbook, halfpage
0
(2)
(1)
(3)
1.2
0.8
0.4
0
0.4
0.8
1.6
1.2
P
(W)
Po (W)
MGK996
1998 Apr 01
16
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
handbook, full pagewidth
-
OUT1
+
OUT1
-
OUT2
+
OUT2
+
VCC
IN1
IN2
CIC
Nijmegen
MODE
1
20
11
10
GND
TDA
8542TS
8547TS
SELECT
11 k
10 k
10 k
11 k
56 k
56 k
1
F
1
F
47
F
100
F
100 nF
TDA
8542/47TS
MGK997
Fig.24 Printed-circuit board layout (BTL).
b. Top view components layout.
a. Top view copper layout.
1998 Apr 01
17
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65
1.0
0.2
6.6
6.2
0.65
0.45
0.48
0.18
10
0
o
o
0.13
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1
90-04-05
95-02-25
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
X
(A )
3
A
y
0.25
1
10
20
11
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
A
max.
1.5
1998 Apr 01
18
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1998 Apr 01
19
Philips Semiconductors
Product specification
2
0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands
545102/00/02/pp20
Date of release: 1998 Apr 01
Document order number:
9397 750 03347