ChipFind - документация

Электронный компонент: BFQ241

Скачать:  PDF   ZIP
DATA SHEET
Product specification
Supersedes data of 1995 Oct 09
File under Discrete Semiconductors, SC05
1996 Sep 04
DISCRETE SEMICONDUCTORS
BFQ241
PNP video transistor
1996 Sep 04
2
Philips Semiconductors
Product specification
PNP video transistor
BFQ241
APPLICATIONS
Primarily intended for buffer stages
in high resolution colour monitors.
DESCRIPTION
PNP silicon transistor encapsulated
in a 3-lead plastic SOT54 package.
PINNING
PIN
DESCRIPTION
1
base
2
collector
3
emitter
Fig.1 Simplified outline SOT54.
1
3
2
MSB033
QUICK REFERENCE DATA
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. T
s
is the temperature at the soldering point of the collector pin.
SYMBOL
PARAMETER
CONDITIONS
TYP
MAX
UNIT
V
CBO
collector-base voltage
open emitter
-
-
100
V
I
C
collector current (DC)
-
-
100
mA
P
tot
total power dissipation
up to T
s
= 60
C
-
1.15
W
f
T
transition frequency
I
C
=
-
25 mA; V
CE
=
-
10 V
1
-
GHz
C
re
feedback capacitance
I
C
= 0; V
CB
=
-
10 V
1.7
-
pF
T
j
junction temperature
-
150
C
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX
UNIT
V
CBO
collector-base voltage
open emitter
-
-
100
V
V
CER
collector-emitter voltage
R
BE
= 100
-
-
95
V
V
EBO
emitter-base voltage
open collector
-
-
3
V
I
C
collector current (DC)
see Fig.2
-
-
100
mA
I
C(AV)
average collector current
see Fig.2
-
-
100
mA
P
tot
total power dissipation
up to T
s
= 60
C; note 1; see Fig.3
-
1.15
W
T
stg
storage temperature
-
65
+150
C
T
j
junction temperature
-
150
C
1996 Sep 04
3
Philips Semiconductors
Product specification
PNP video transistor
BFQ241
Fig.2 DC SOAR.
T
s
= 60
C.
handbook, halfpage
MBG496
-
10
2
-
10
-
10
2
-
10
3
-
10
3
-
10
-
1
VCE (V)
IC
(mA)
Fig.3 Power derating curve.
V
CE
-
50 V.
handbook, halfpage
0
1.2
0.8
Ptot
(W)
0.4
0
50
100
150
Ts (
o
C)
MBG497
THERMAL CHARACTERISTICS
Note
1. T
s
is the temperature of the soldering point of the collector pin.
CHARACTERISTICS
T
j
= 25
C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-s
thermal resistance from junction to
soldering point
P
tot
= 1.15 W; up to T
s
= 60
C; note 1
78
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
V
(BR)CBO
collector-base breakdown voltage
I
C
=
-
0.1 mA; I
E
= 0
-
100
-
-
V
V
(BR)CER
collector-emitter breakdown voltage I
C
=
-
1 mA; R
BE
= 100
-
95
-
-
V
V
(BR)EBO
emitter-base breakdown voltage
I
C
= 0; I
E
=
-
0.1 mA
-
3
-
-
V
I
CES
collector-emitter leakage current
V
CE
=
-
50 V; V
BE
= 0
-
-
-
100
A
h
FE
DC current gain
I
C
=
-
25 mA; V
CE
=
-
10 V;
see Fig.4
20
-
-
f
T
transition frequency
I
C
=
-
25 mA; V
CE
=
-
10 V;
f = 500 MHz; see Fig.5
-
1
-
GHz
C
re
feedback capacitance
I
C
= 0; V
CB
=
-
10 V;
f = 1 MHz; see Fig.6
-
1.7
-
pF
1996 Sep 04
4
Philips Semiconductors
Product specification
PNP video transistor
BFQ241
Fig.4
DC current gain as a function of collector
current; typical values.
V
CE
=
-
10 V; t
p
= 500
s.
handbook, halfpage
0
-
20
-
100
hFE
80
40
20
0
60
MBG498
-
40
-
60
-
80
IC (mA)
Fig.5
Transition frequency as a function of
collector current; typical values.
V
CE
=
-
10 V; f = 500 MHz.
handbook, halfpage
0
0.4
0.8
1.2
-
10
2
MBG499
-
10
IC (mA)
-
20
-
50
fT
(MHz)
Fig.6
Feedback capacitance as a function of
collector-base voltage; typical values.
f = 1 MHz.
handbook, halfpage
0
-
2
-
10
Cre
(pF)
3
1
0
2
4
5
6
MBG500
-
4
-
6
-
8
VCB (V)
1996 Sep 04
5
Philips Semiconductors
Product specification
PNP video transistor
BFQ241
PACKAGE OUTLINE
Fig.7 SOT54.
Dimensions in mm.
andbook, full pagewidth
MBC014 - 1
2.54
4.8
max
4.2 max
1.7
1.4
0.66
0.56
1
2
3
5.2 max
12.7 min
2.0 max
(1)
0.48
0.40
0.40
min