CBT3253A Dual 1-of-4 FET multiplexer/demultiplexer

General description

The CBT3253A is a dual 1-of-4 high-speed TTL-compatible FET
multiplexer/demultiplexer. The low on-resistance of the switch allows inputs to be
connected to outputs without adding propagation delay or generating additional ground
bounce noise.

1OE, 2OE, S0, and S1 select the appropriate B output for the A-input data.

The CBT3253A is characterized for operation from

C to +85

Features

switch connection between two ports

TTL-compatible input levels

Minimal propagation delay through the switch

ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

Ordering information

[1]

Also known as QSOP16.

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Rev. 01 -- 24 October 2005

Product data sheet

Table 1:

Ordering information

amb

C to +85

Type number

Topside
mark

Package

Name

Description

Version

CBT3253AD

SO16

plastic small outline package; 16 leads;
body width 3.9 mm

SOT109-1

CBT3253ADB

C3253A

SSOP16

plastic shrink small outline package;
16 leads; body width 5.3 mm

SOT338-1

CBT3253ADS

CT3253A

SSOP16

[1]

plastic shrink small outline package;
16 leads; body width 3.9 mm;
lead pitch 0.635 mm

SOT519-1

CBT3253APW CT3253A

TSSOP16

plastic thin shrink small outline package;
16 leads; body width 4.4 mm

SOT403-1

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

3 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Pinning information

5.1 Pinning

5.2 Pin description

[1]

B outputs are inputs if A inputs are outputs.

Fig 2.

Pin configuration for SO16

Fig 3.

Pin configuration for SSOP16

Fig 4.

Pin configuration for SSOP16
(QSOP16)

Fig 5.

Pin configuration for TSSOP16

CBT3253AD

2OE

1B4

1B3

2B4

1B2

2B3

1B1

2B2

2B1

GND

002aab824

1OE

2OE

1B4

1B3

2B4

1B2

2B3

1B1

2B2

2B1

1OE

CBT3253ADB

GND

002aab825

2OE

1B4

1B3

2B4

1B2

2B3

1B1

2B2

2B1

1OE

CBT3253ADS

GND

002aab826

2OE

1B4

1B3

2B4

1B2

2B3

1B1

2B2

2B1

1OE

GND

CBT3253APW

002aab827

Table 2:

Pin description

Symbol

Pin

Description

1OE

output enable (active LOW)

select-control input

1B4, 1B3, 1B2, 1B1

3, 4, 5, 6

B outputs

[1]

A input

GND

ground (0 V)

A input

2B1, 2B2, 2B3, 2B4

10, 11, 12, 13

B outputs

select-control input

2OE

output enable (active LOW)

positive supply voltage

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Product data sheet

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Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Functional description

Refer to

Figure 1 "Logic diagram of CBT3253A (positive logic)"

6.1 Function selection

Limiting values

[1]

The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings
are observed.

Recommended operating conditions

Table 3:

Function selection

H = HIGH state; L = LOW state; X = Don't Care

Inputs

Function

1OE

2OE

disconnect 1A and 2A

1A to 1B1 and 2A to 2B1

1A to 1B2 and 2A to 2B2

1A to 1B3 and 2A to 2B3

1A to 1B4 and 2A to 2B4

Table 4:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

0.5

+7.0

input voltage

0.5

[1]

+7.0

CCC

continuous current through
each V

or GND pin

128

input clamping current

< 0 V

stg

storage temperature

+150

Table 5:

Operating conditions

All unused control inputs of the device must be held at V

or GND to ensure proper device

operation.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

supply voltage

4.5

5.5

HIGH-state input voltage

LOW-state input voltage

0.8

amb

ambient temperature

operating in free air

+85

9397 750 12919

Product data sheet

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Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Static characteristics

[1]

All typical values are at V

= 5 V, T

amb

= 25

[2]

This is the increase in supply current for each input that is at the specified TTL voltage level rather than V

or GND.

[3]

Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is
determined by the lowest voltage of the two (A or B) terminals.

10. Dynamic characteristics

[1]

The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).

[2]

Output enable time to HIGH and LOW level.

[3]

Output disable time from HIGH and LOW level.

Table 6:

Static characteristics

amb

C to +85

Symbol

Parameter

Conditions

Min

Typ

[1]

Max

Unit

input clamping voltage

= 4.5 V; I

18 mA

1.2

pass

pass voltage

= V

= 5.5 V; I

100

3.4

3.6

3.9

input leakage current

= 5 V; V

= 5.5 V or GND

quiescent supply current

= 5.5 V; I

= 0 mA;

= V

or GND

additional quiescent supply
current (control inputs)

= 5.5 V; one input at 3.4 V;

other inputs at V

or GND

[2]

2.5

input capacitance
(control pins)

= 3 V or 0 V

4.5

io(off)

off-state input/output
capacitance

A port; V

= 3 V or 0 V; OE = V

23.5

B port; V

= 3 V or 0 V; OE = V

6.5

ON-state resistance

[3]

= 4.5 V; V

= 0 V; I

= 64 mA

= 4.5 V; V

= 0 V; I

= 30 mA

= 4.5 V; V

= 2.4 V; I

15 mA

Table 7:

Dynamic characteristics

= +5.0 V

0.5 V; T

amb

C to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

propagation delay

from input (nA or nBn) to output (nBn or nA)

[1]

0.25

from input (Sn) to output (nA or nBn)

1.2

6.2

enable time

[2]

from input (Sn) to output (nA or nBn)

1.3

6.3

from input (nOE) to output (nA or nBn)

1.4

6.4

dis

disable time

[3]

from input (Sn) to output (nA or nBn)

1.1

7.2

from input (nOE) to output (nA or nBn)

1.0

9397 750 12919

Product data sheet

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Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

10.1 AC waveforms

= GND to 3.0 V.

PLZ

and t

PHZ

are the same as t

dis

PZL

and t

PZH

are the same as t

PLH

and t

PHL

are the same as t

Fig 6.

Input to output propagation delay

(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when

disabled by the output control.

(2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when

disabled by the output control.

Fig 7.

3-state output enable and disable times

002aab665

3.0 V

0 V

PLH

PHL

1.5 V

input

output

1.5 V

002aab666

3 V

3.5 V

PLZ

1.5 V

output control

(LOW-level enabling)

output

waveform 1
S1 at 7 V

(1)

1.5 V

PZL

0 V

+ 0.3 V

0 V

1.5 V

0.3 V

output

waveform 2

S1 open

(2)

PZH

PHZ

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

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Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

11. Test information

Test data are given in

Table 8

All input pulses are supplied by generators having the following characteristics:
PRR

10 MHz; Z

= 50

; t

2.5 ns; t

2.5 ns.

The outputs are measured one at a time with one transition per measurement.

= load capacitance includes jig and probe capacitance.

= load resistance.

Fig 8.

Test circuit

Table 8:

Test data

Test

Load

Switch

50 pF

500

open

PLZ

, t

PZL

50 pF

500

7 V

PHZ

, t

PZH

50 pF

500

open

50 pF

002aab667

RL
500

from output under test

7 V
open
GND

500

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

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Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

12. Package outline

Fig 9.

Package outline SOT109-1 (SO16)

detail X

(A )

pin 1 index

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

10.0

9.8

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0
0.4

SOT109-1

99-12-27
03-02-19

076E07

MS-012

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.39
0.38

0.16
0.15

0.05

1.05

0.041

0.244
0.228

0.028
0.020

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

9 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Fig 10. Package outline SOT338-1 (SSOP16)

UNIT

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.21
0.05

1.80
1.65

0.25

0.38
0.25

0.20
0.09

6.4
6.0

5.4
5.2

0.65

1.25

7.9
7.6

1.03
0.63

0.9
0.7

1.00
0.55

8
0

0.13

0.2

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT338-1

99-12-27
03-02-19

(1)

detail X

(A )

MO-150

pin 1 index

2.5

5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

max.

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

10 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Fig 11. Package outline SOT519-1 (SSOP16)

UNIT

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.25
0.10

1.55
1.40

0.25

0.31
0.20

0.25
0.18

5.0
4.8

4.0
3.8

0.635

6.2
5.8

0.89
0.41

0.18
0.05

8
0

0.18

0.2

0.09

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

SOT519-1

99-05-04
03-02-18

(1)

detail X

(A )

2.5

5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm

SOT519-1

max.

1.73

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

11 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

Fig 12. Package outline SOT403-1 (TSSOP16)

UNIT

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15
0.05

0.95
0.80

0.30
0.19

0.2
0.1

5.1
4.9

4.5
4.3

0.65

6.6
6.2

0.4
0.3

0.40
0.06

8
0

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75
0.50

SOT403-1

MO-153

99-12-27
03-02-18

0.25

detail X

(A )

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

max.

1.1

pin 1 index

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

12 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

13. Soldering

13.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

13.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

13.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

13 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

13.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 9:

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

14 of 16

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

14. Abbreviations

15. Revision history

Table 10:

Abbreviations

Acronym

Description

CDM

Charged Device Model

ESD

ElectroStatic Discharge

FET

Field-Effect Transistor

HBM

Human Body Model

Machine Model

PRR

Pulse Rate Repetition

TTL

Transistor-Transistor Logic

Table 11:

Revision history

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

CBT3253A_1

20051024

Product data sheet

9397 750 12919

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

9397 750 12919

Product data sheet

Rev. 01 -- 24 October 2005

15 of 16

16. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

18. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

19. Trademarks

Notice -- All referenced brands, product names, service names and
trademarks are the property of their respective owners.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 24 October 2005

Document number: 9397 750 12919

Published in The Netherlands

Philips Semiconductors

CBT3253A

Dual 1-of-4 FET multiplexer/demultiplexer

21. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 1

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

5.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

6.1

Function selection. . . . . . . . . . . . . . . . . . . . . . . 4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 4

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

10.1

AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12

13.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12

13.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13

13.5

Package related soldering information . . . . . . 13

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Contact information . . . . . . . . . . . . . . . . . . . . 15

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: CBT3253APW

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: CBT3253APW