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Электронный компонент: NE1617DS

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Philips
Semiconductors
NE1617
Temperature monitor for
microprocessor systems
Product specification
1999 Mar 19
INTEGRATED CIRCUITS
Philips Semiconductors
Product specification
NE1617
Temperature monitor for microprocessor systems
2
1999 Mar 19
8532144 21065
FEATURES
Replacement for Maxim MAX1617 and Analog Devices ADM1021
Monitors local and remote temperature
Accuracy
2
C local (on-chip) sensor
3
C remote sensor
No calibration required
Programmable over/under temperature alarm
SMBus 2-wire serial interface
3V to 5.5V supply range
70
a supply current in operating mode
3
a (typical) supply current in standby mode
Small 16lead QSOP package
APPLICATIONS
Desktop computers
Notebook computers
Smart battery packs
Industrial controllers
Telecom equipment
DESCRIPTION
The NE1617 is an accurate two-channel temperature monitor. It
measures the temperature of itself and the temperature of a remote
sensor. The remote sensor is a diode connected transistor. This can
be in the form of either a discrete NPN/PNP, such as the
2N3904/2N3906, or a diode connected PNP built into another die,
such as is done on some INTEL microprocessors.
The temperature of both the remote and local sensors is stored in a
register that can be read via a 2-wire SMBus. The temperatures are
updated at a rate that is programmable via the SMBus (the average
supply current is dependent upon the update rate--the faster the
rate, the higher the current).
In addition to the normal operation, which is to update the
temperature at the programmed rate, there is a one shot mode that
will force a temperature update.
There is also an alarm that senses either an over or under
temperature condition. The trip points for this alarm are also
programmable.
The device can have 1 of 9 addresses (determined by 2 address
pins), so there can be up to 9 of the NE1617 on the SMBus.
It can also be put in a standby mode (in order to save power). This
can be done either with software (over the SMBus) or with hardware
(using the STANDBY pin).
PIN CONFIGURATION
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
TEST
V
DD
D+
D
TEST
ADD1
GND
GND
TEST
STBY
SCLK
TEST
SDATA
ALERT
ADD0
TEST
SL01202
Figure 1. Pin configuration
PIN FUNCTION DESCRIPTION
PIN #
FUNCTION
DESCRIPTION/COMMENTS
1
TEST
Factory use only
1
2
V
DD
Positive supply
2
3
D+
Positive side of remote sensor
4
D
Negative side of remote sensor
5
TEST
Factory use only
1
6
ADD1
Device address pin (3-State)
7
GND
Ground
8
GND
Ground
9
TEST
Factory use only
1
10
ADD0
Device address pin (3-State)
11
ALERT
Open drain output used as
interrupt or SMBus alert
12
SDATA
SMBus serial data input/output
open drain
13
TEST
Factory use only
1
14
SCLK
SMBus clock input
15
STBY
Hardware standby input pin
HIGH = normal operating mode
LOW = standby mode
16
TEST
Factory use only
1
NOTES:
1. These pins should either float or be tied to ground.
2. V
DD
pin should be decoupled by a 0.1
F capacitor.
ORDERING INFORMATION
PART NUMBER
PACKAGE
DRAWING NUMBER
NE1617DS
16-lead QSOP package
SOT5191
Philips Semiconductors
Product specification
NE1617
Temperature monitor for microprocessor systems
1999 Mar 19
3
FUNCTIONAL BLOCK DIAGRAM
COMMAND POINTER
REGISTER
LOCAL TEMP HIGH
LIMIT REGISTER
LOCAL TEMP LOW
LIMIT REGISTER
REMOTE TEMP HIGH
LIMIT REGISTER
REMOTE TEMP LOW
LIMIT REGISTER
CONFIGURATION
REGISTER
LOCAL TEMP HIGH
THRESHOLD
LOCAL LOW TEMP
THRESHOLD
REMOTE HIGH TEMP
THRESHOLD
REMOTE LOW TEMP
THRESHOLD
STATUS REGISTER
SMBUS INTERFACE
ONE-SHOT
REGISTER
CONVERSION RATE
REGISTER
LOCAL TEMP
DATA REGISTER
REMOTE TEMP
DATA REGISTER
ADDRESS
DECODER
INTERRUPT
MASKING
A-TO-D
CONVERTER
CONTROL
LOGIC
LOCAL TEMP
SENSOR
ANALOG
MUX
ALERT
ADD0
ADD1
D
D+
STDBY
SCLK
SDATA
TEST16
TEST13
TEST9
TEST5
TEST1
GND
GND
V
DD
SL01210
Philips Semiconductors
Product specification
NE1617
Temperature monitor for microprocessor systems
1999 Mar 19
4
TYPICAL OPERATING CIRCUIT
2
15
14
12
11
10
6
7
8
SHIELDED
TWISTED PAIR
(NOTE 1)
REMOTE SENSOR
3
4
C
1
(NOTE 2)
0.1
F
V
DD
CLOCK
DATA
MICROCONTROLLER
INTERRUPT
10K
10K
10K
SL01203
NE1617
NOTES:
1. May be required if remote diode is in a noisy environment and/or several feet from the NE1617.
2. May be required in noisy environment. Up to 2200pF may be used.
Figure 2. Typical operating circuit
ABSOLUTE MAXIMUM RATINGS
PARAMETER
MIN.
MAX.
UNIT
V
DD
to GND
0.3
+6
V
D+, ADD0, ADD1
0.3
V
DD
+0.3
V
D to GND
0.3
+0.8
V
SCLK, SDATA, ALERT, STBY
0.3
+6
V
Input current SDATA
1
+50
mA
D current
1
mA
Operating temperature range
0
+120
C
Maximum junction temperature
+150
C
Storage temperature range
65
+150
C
Philips Semiconductors
Product specification
NE1617
Temperature monitor for microprocessor systems
1999 Mar 19
5
ELECTRICAL CHARACTERISTICS
V
DD
= 3.3V; T
amb
= 0
C to +125
C unless otherwise noted.
PARAMETER
CONDITIONS
LIMITS
UNIT
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Temperature resolution
1
C
Local temperature error
T
amb
= +60
C to +100
C
<
1
2
C
Local temperature error
T
amb
= 0
C to +125
C
<
2
3
C
Remote temperature error
T
remote
= +60
C to +100
C
3
C
Remote temperature error
T
remote
= 0
C to +125
C
5
C
Under voltage lockout
V
DD
supply (Note 1)
2.0
2.95
V
Power-on reset threshold
V
DD
supply (falling edge) (Note 2)
1.0
2.5
V
Power supply current (average)
Conversion rate = 0.25/sec
70
A
Power supply current (average)
Conversion rate = 2/sec
180
A
Power supply current (standby)
SMBus inactive
3
10
A
Conversion time
From stop bit to conversion complete,
both channels
170
ms
Conversion rate error
Percentage error in programmed rate
30
+30
%
Remote sensor source current
HIGH level
100
A
Remote sensor source current
LOW level
10
A
Address pin bias current
Momentary as the address is being read
(Notes 3 and 4)
160
A
NOTES:
1. V
DD
(rising edge) voltage below which the ADC is disabled.
2. V
DD
(falling edge) voltage below which the logic is reset.
3. Address is read a power up and at start of conversion for all conversions except the fastest rate.
4. Due to the bias current, any pull-up/down resistors should be
2k
.