Philips
Semiconductors
NE1619
HECETA4
Temperature and voltage monitor
Product data sheet
Supersedes data of 2004 May 10
2004 Oct 05
INTEGRATED CIRCUITS
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2
2004 Oct 05
GENERAL DESCRIPTION
The NE1619 is designed for monitoring the temperatures and supply
voltages of microprocessor-based systems by measuring those
parameters and comparing the readings with programmable limits.
The device provides five possible analog inputs, a remote
temperature sensor input and on-board local temperature sensor.
The device also monitors its own power supply and provides digital
inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus
(System Management bus) by which it can be programmed for
operation and data collection. Readings come from conversions of
the on-board A-to-D converter which cycles through all
measurements in sequence in approximately one second when the
conversion is started. The device includes a number of registers to
store data of the device configuration, status, readings and limits.
Except for the temperature-related data which are in 8-bit digital
2's complement format, all the data are in 8-bit digital straight format.
FEATURES
Monitor local and remote temperatures
Temperature accuracy of
2
C for local, and
3
C for remote
channel
Temperature resolution of 1
C
2.8 V to 5.5 V supply range
Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
CCP,
V
DD
V
IN
accuracy of
2% of full scale
Differential non-linearity of
1LSB
No calibration required
Programmable temperature and voltage limits for alarms
Programmable Reset low state pulse output
SMBus 2-wire serial interface
Small 16-lead SSOP (QSOP) package
Compatible with Intel "Heceta 4" specification and reference
designs utilizing it
ESD protection exceeds 2000 V HBM per JESD22-A114,
250 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101
Latch-up testing is done to JESDEC Standard JESD78 which
exceeds 100 mA
APPLICATIONS
System thermal and hardware monitor
Desktop computers
Notebook computers
Industrial controllers
Telecom equipment
ORDERING INFORMATION
T
amb
= 0
C to +125
C
Type number
Topside mark
Package
Name
Description
Version
NE1619DS
NE1619
SSOP16
(QSOP)
plastic shrink small outline package; 16 leads; body width 3.9 mm;
lead pitch 0.635 mm
SOT519-1
Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging.
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
3
PINNING
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SDA
SCL
GND
V
DD
/3.3VSB
VID0
VID1
VID2
VID3
A0/RESET/NTEST_OUT
V
CCPVIN
2.5V
IN
3.3V
IN
5V
IN
12V
IN
/VID4
D+
D/NTEST_IN
SL01228
Figure 1. Pin configuration
Pin Description
PIN #
SYMBOL
FUNCTION DESCRIPTION
1
SDA
Digital I/O. SMBus serial bi-directional data. Open-drain output.
2
SCL
Digital Input. SMBus serial clock input.
3
GND
Ground. To be connected to system ground.
4
V
DD
/3.3VSB
Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is
required. This pin also serves as the analog input to monitor the V
DD
voltage level.
5
VID0
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status
register (LSB bit).
6
VID1
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
7
VID2
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
8
VID3
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
9
D/NTEST_IN
Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for
analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode.
10
D+
Analog Input. This pin is connected to the positive terminal of the remote temperature sensor.
11
12V
IN
/VID4
Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is
programmable to be a digital input for voltage ID readouts from the processor. Its state is read into
the VID4 status register.
12
5V
IN
Analog Input. For monitoring the +5 V supply.
13
3.3V
IN
Analog Input. For monitoring the +3.3 V supply.
14
2.5V
IN
Analog Input. For monitoring the +2.5 V supply.
15
V
CCPVIN
Analog Input. For monitoring the processor voltage supply (0 to 3.0 V)
16
A0/RESET/NTEST_OUT
Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address.
This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions
as the output in the NANDTREE test mode.
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
4
FUNCTIONAL BLOCK DIAGRAM
SL01229
Local Temp
Sensor
Temp
Mux
A-to-D
Converter
Voltage
Mux
V
IN
Attenuators
Switch
Vid4
Register
Control
Logic
Local Temp
RDG Register
Remote Temp
RDG Register
VDD Reading
Register
VCCP Reading
Register
2.5 V Reading
Register
3.3 V Reading
Register
5 V Reading
Register
12 V Reading
Register
Configuration
Register
Local Temp
HL Register
Remote Temp
HL Register
VDD HL
Register
VCCP HL
Register
2.5 V HL
Register
3.3 V HL
Register
5 V HL
Register
12 V HL
Register
Local Temp
LL Register
Remote Temp
LL Register
VDD LL
Register
VCCP LL
Register
2.5 V LL
Register
3.3 V LL
Register
5 V LL
Register
12 V LL
Register
Command
Pointer Register
D+
D-/
NTEST_IN
GND
VDD
V
CCVIN
2.5 V
IN
3.3 V
IN
5 V
IN
12 V
IN
/
VID4
SMBus Interface
SCL
SDA
VID3
VID2
VID1
VID0
Address Decoder
and Register
Status
Register 1
Status
Register 2
Company #
Register
Step Version
Register
Test
Register
Reset Pulse
Circuit
VID 0-3
Register
NTEST
Circuit
A0/
RESET/
NTEST_OUT
NE1619
Figure 2. Functional block diagram
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
5
TYPICAL APPLICATION CIRCUIT
Remote Sensor
P On-Board PNP Transistor
or Discrete NPN Transistor
Ground
0.1
F
10 k
10 k
100 k
V
DD
SMBus
Selectable
A0/RESET/NTEST_OUT
Processor Voltage
ID Code
DATA
CLOCK
VID0
VID1
VID2
VID3
VID4
System Power
Supplies
2.5 V
3.3 V
5.0 V
12.0 V
Ground
V
CCP
See
Note 1
SL01230
4
2
1
16
5
6
3
11
12
13
14
15
9
10
8
7
NE1619
NOTE:
1. Should be placed close to D+ and D pins.
May be required in noisy environment, about 1 nF.
D+
D
V
CCPVIN
2.5V
IN
3.3V
IN
5V
IN
12V
IN
/VID4
GND
VID0
VID1
VID2
VID3
A0/RESET/
NTEST_OUT
SDA
SCL
V
DD
/3.3VSB
Figure 3. Typical application circuit
ABSOLUTE MAXIMUM RATINGS
PARAMETER
MIN.
MAX.
UNIT
V
DD
to GND
0.3
6
V
12V
IN
to GND
0.3
18
V
5V
IN
, 3.3V
IN
, 2.5V
IN
, V
CCP
to GND
0.3
6
V
Other pins to GND
0.3
V
DD
+0.3
V
Input current at any pin
5
5
mA
Package input current
20
20
mA
Operating temperature range
0
+125
C
Maximum junction temperature
+150
C
Storage temperature range
65
+150
C
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
6
30
25
20
15
10
5
0
5
10
15
20
1
10
100
Leakage Resistance (Mohm)
Remote
T
emp Error(deg. C)
SL01245
from D+ pin to GND
from D+ pin to V
DD
Figure 4. Temp Error versus PC Board Leakage Resistance
10
9
8
7
6
5
4
3
2
1
0
1
2.2
3.3
4.7
6.8
10
22
33
47
D+ to D Capacitance (nF)
T
emperature Error (deg. C)
SL01244
Figure 5. Temp Error versus D+D Capacitance
0
20
40
60
80
100
0
1
2
3
4
5
6
Supply Voltage (V)
Stdby Supply Current (uA)
SL01243
Figure 6. Standby Current versus Supply Voltage
0
10
20
30
40
50
50
25
0
25
50
75
100
125
Temperatures (deg. C)
Stdby Supply Current (uA)
SL01242
V
DD
= 5.0 V
V
DD
= 3.8 V
V
DD
= 3.3 V
V
DD
= 2.8 V
Figure 7. Standby Current versus Temperature
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
7
0
50
100
150
200
250
1 k
10 k
100 k
1000 k
SCLK Frequency (Hz)
Stdby Supply Current (uA)
SL01246
V
DD
= 5 V
V
DD
= 3.3 V
Figure 8. Standby Current versus SCLK Frequency
10
5
0
5
10
15
20
25
30
1 k
10 k
100 k
1000 k
10000 k
100000 k
Noise Frequency (Hz)
T
emperature Error (deg. C)
NOISE IS AC COUPLED TO D PINS
NOISE=100MVPP
NOISE=50MVPP
SL01241
Figure 9. Temp Error versus Common Mode Noise
1
0
1
2
3
4
5
6
7
8
9
10
1 k
10 k
100 k
1000 k
10000 k
100000 k
Noise Frequency (Hz)
T
emperature Error (deg. C)
NOISE=10MVPP SQ.WAVE
APPLIED BETWEEN D+ & D PINS
SL01240
Figure 10. Temp error versus Different Mode Noise Frequency
0
25
50
75
100
125
0
25
50
75
100
125
Temperature (deg. C)
T
emp Reading (Decimal)
SL01247
Figure 11. Relationship between Temperature and
Temp reading
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
8
DC ELECTRICAL CHARACTERISTICS
V
DD
= 3.3 V (see Note 4); T
amb
= 0
C to +125
C unless otherwise specified.
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
V
DD
Supply voltage
2.8
3.3
5.5
V
I
DD
Supply current
Standby mode
100
A
I
DD
Supply current
Operating mode
250
500
A
t
C
Total monitoring cycle time
1
All conversions
0.25
0.50
sec
T
R
Temperature resolution
Local and Remote
1.0
C
T
Internal temperature accuracy
T
amb
= 25
C
2.0
C
T
AI
Internal temperature accuracy
T
amb
= 0
C to +120
C
3.0
C
T
External temperature accuracy
T
amb
= 25
C
3.0
C
T
AE
External temperature accuracy
T
amb
= 0
C to +120
C
5.0
C
I
S
Remote source current
High level
100
A
I
S
Remote source current
Low level
10
A
Voltage-to-Digital converter (12V
IN
, 5V
IN
, 3.3V
IN
, 2.5V
IN
, V
CCP
, V
DD
)
VUE
Unadjusted error
2.0
%FS
VDNL
Differential non-linearity error
1.0
LSB
VRIN
V
IN
input resistance
100
200
k
VPSS
V
IN
power supply sensitivity
1.0
%/V
Digital output (SDA, A0
2
)
V
OH
Output High voltage
I
OUT
= 3.0 mA, V
DD
= 2.8 V
2.4
V
V
OL
Output Low voltage
I
OUT
= 3.0 mA, V
DD
= 3.8 V
0.4
V
I
OH
Output High leakage current
V
OUT
= V
DD
0.1
10.0
A
SMB digital input voltages (SDA, SCL)
V
IH
Input High voltage
0.6V
DD
V
V
IL
Input Low voltage
0.3V
DD
V
Digital input voltages (A0, VID04, NT_IN
3
)
V
IH
Input High voltage
2.0
V
V
IL
Input Low voltage
0.4
V
Digital input current (all digital inputs)
I
IH
Input High current
V
IN
= V
DD
1.0
A
I
IL
Input Low current
V
IN
= GND
1.0
A
C
IN
Input capacitance
20.0
pF
NOTES:
1. Total monitoring cycle time includes all temperature conversions and all voltage conversions.
2. When A0 is selected as output in NAND-TREE test mode.
3. When D is selected as input in NAND-TREE test mode.
4. Operating the device at 2.8 V to 5.5 V is allowed, but parameter values in characteristics table are not guaranteed.
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
9
SMBus INTERFACE AC CHARACTERISTICS
V
DD
= 3.3 V, T
amb
= 0
C to +125
C unless otherwise specified.
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
t
SCL
SCL clock frequency
400
kHz
t
BUF
SMBus free time
4.7
s
t
LOW
SCL Low time
4.7
s
t
HIGH
SCL High time
4.0
s
t
SU:STA
Start set-up time
100
ns
t
HD:STA
Start hold time
100
ns
t
SU:STO
Stop set-up time
4.0
s
t
SU:DAT
Data set-up time
250
ns
t
HD:DAT
Data hold time
0
ns
t
F
Fall time
1.0
s
NOTE:
1. These specifications are guaranteed by design and not tested in production.
TIMING DIAGRAM
SL01231
SCL
SDA
t
LOW
t
HIGH
t
HD:STA
t
HD:DAT
t
SU:DAT
t
SU:STA
t
SU:STO
t
BUF
t
F
P
S
P
S
S: Start Condition
P: Stop Condition
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
10
Table 1.
List of registers
NAME
COMMAND OR ADDRESS
R/W
POR STATE
DESCRIPTION
CR
40h
R/W
0000
1000
Configuration register
SR1
41h
Read only
0000
0000
Status register #1
SR2
42h
Read only
0000
0000
Status register #2
VID
47h
Read only
0000
xxxx
VID register, xxxx = VID3VID0
VID4
49h
Read only
1000
000x
VID4 register, x = VID4
CID
3Eh
Read only
1010 0001
Company number
SID
3Fh
Read only
0010 0001
Stepping version number
TEST
15h
R/W
N/A
Manufacturer test register
2.5VR
20h
Read only
N/A
2.5V
IN
reading register
VCCPR
21h
Read only
N/A
V
CCPVIN
reading register
3.3VR
22h
Read only
N/A
3.3V
IN
reading register
5VR
23h
Read only
N/A
5V
IN
reading register
12VR
24h
Read only
N/A
12V
IN
reading register
VDDR
25h
Read only
N/A
V
DD
reading register
ETR
26h
Read only
N/A
External or remote temperature reading register
ITR
27h
Read only
N/A
Internal or local temperature reading register
2.5VHL
2Bh
R/W
0000
0000
2.5V
IN
high limit register
2.5VLL
2Ch
R/W
0000
0000
2.5V
IN
low limit register
VCCPHL
2Dh
R/W
0000
0000
V
CCPVIN
high limit register
VCCPLL
2Eh
R/W
0000
0000
V
CCPVIN
low limit register
3.3VHL
2Fh
R/W
0000
0000
3.3V
IN
high limit register
3.3VLL
30h
R/W
0000
0000
3.3V
IN
low limit register
5VHL
31h
R/W
0000
0000
5V
IN
high limit register
5VLL
32h
R/W
0000
0000
5V
IN
low limit register
12VHL
33h
R/W
0000
0000
12V
IN
high limit register
12VLL
34h
R/W
0000
0000
12V
IN
low limit register
VDDHL
35h
R/W
0000
0000
V
DDVIN
high limit register
VDDLL
36h
R/W
0000
0000
V
DDVIN
low limit register
ETHL
37h
R/W
0000
0000
External or remote temperature high limit register
ETLL
38h
R/W
0000
0000
External or remote temperature low limit register
ITHL
39h
R/W
0000
0000
Internal or local temperature high limit register
ITLL
3Ah
R/W
0000
0000
Internal or local temperature low limit register
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
11
Table 2.
Configuration Register (CR, 40h, default = 0000 1000)
BIT
NAME
R/W
DESCRIPTION
0
START
R/W
Logic 1 enables startup of monitor device, logic 0 places the device in standby mode.
Powerup default = 0.
At startup, limit checking functions and scanning begins. Note, all High and Low limits
should be set into the ASIC prior turning on this bit.
1
Reserved
Read
Power-up default = 0.
2
Reserved
Read
Power-up default = 0.
3
Reserved
Read
Power-up default = 1.
4
RESET
R/W
Setting this bit generates a minimum 20ms low pulse on the Reset pin, if the reset
function is enabled. Power-up default = 0.
5
12V
IN
/VID4
SELECT
R/W
Selects whether pin 11 acts as a 12 volt analog input monitoring pin, or as a VID[4] input.
This pin defaults to the 12 volt analog input. Powerup default = 0.
6
Reserved
Read
Powerup default = 0.
7
Initialization
R/W
Logic 1 restores powerup default values to the configuration register and the status
registers. This bit automatically clears itself. Powerup default = 0.
Table 3.
Status Register 1 (SR1, 41h, default = 0000 0000)
BIT
NAME
R/W
DESCRIPTION
0
+2.5V_ERROR
Read
A one indicates 2.5V
IN
High or Low limit has been exceeded.
1
VCCP_ERROR
Read
A one indicates V
CCPVIN
High or Low limit has been exceeded.
2
+3.3V_ERROR
Read
A one indicates 3.3V
IN
High or Low limit has been exceeded.
3
+5V_ERROR
Read
A one indicates 5V
IN
High or Low limit has been exceeded.
4
Internal Temp Error
Read
A one indicates internal or local temp High or Low limit has been exceeded.
5
External Temp Error
Read
A one indicates external or remote temp High or Low limit has been exceeded.
6
Reserved
Read
7
Reserved
Read
Table 4.
Status Register 2 (SR2, 42h, default = 0000 0000)
BIT
NAME
R/W
DESCRIPTION
0
+12V_ERROR
Read
A one indicates 12V
IN
High or Low limit has been exceeded.
1
VDD_ERROR
Read
A one indicates V
DD
High or Low limit has been exceeded.
2
Reserved
Read
Undefined.
3
Reserved
Read
Undefined.
4
Reserved
Read
Undefined.
5
Reserved
Read
Undefined.
6
Remote Diode Fault
Read
A one indicates either a short or open circuited fault on the remote thermal diode inputs.
7
Reserved
Read
Undefined.
Table 5.
VID (VID, 47h, default = 0000 VID[3:0] )
BIT
NAME
R/W
DESCRIPTION
03
VID[0:3]
Read
The VID[0:3] inputs from Pentium/PRO power supplies ID to indicate the operating
voltage (e.g. 1.5V to 2.9V). Power-up default = VID[0:3].
46
Reserved
Read
Undefined.
7
RESET ENABLE
Read
When set to 1, enables the RESET pin output function.
This bit defaults to 0 at Powerup and enables addressing function.
Table 6.
VID4 (VID4, 49h, default = 1000 000VID[4] )
BIT
NAME
R/W
DESCRIPTION
0
VID4
Read
VID4 input, if selected, from Pentium/PRO power supplied ID.
Power-up default = 0 and pin 11 is not selected for VID4.
17
Reserved
Read
Power-up default = 1000 000
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
12
FUNCTIONAL DESCRIPTION
SMBus serial interface
The NE1619 can be connected to a compatible 2-wire serial
interface SMBus as a slave device under the control of a master
device or controller, using two device terminals SCL and SDA. The
controller will provide a clock signal to the device SCL pin and
write/read data to/from the device through the SDA pin.
Data of 8-bit digital byte or word are used for communication
between the controller and the device.
Notice that external pull-up resistors, about 10 k
, are needed for
the two terminals SCL and SDA.
Slave address
The NE1619 slave address on the SMBus is defined by the
hardware connection applied to the device pin 16. At power-up this
pin is automatically reset to its address sensing function A0. This
logic input will set up the value of the LSB bit of the 7-bit address.
Because A0 is a two-level digital input and the other 6 bits of the
address are predefined to 010110, only two slave addresses can be
used as listed below for the device:
Table 7.
A0 connection (Pin 16)
Slave address
GND
0101100
V
DD
0101101
Because the logic is sampled and latched into the device storage
only at power-up, the device pin 16 can be programmed for different
functions while power is on without effecting the address definition.
Registers
The NE1619 contains a number of registers, as listed in Table 1, in
order to store data of the device setup and operation results. The
table indicates the command value and read/write capability of each
register for SMBus communication and also the power-up default
values for some registers. It includes:
Configuration register to provide control and configuration as well
as initialization the NE1619,
Status registers to provide the flags resulting from limit
comparisons,
Reading registers to store results of measurements,
Limit registers to store programmable limit data,
ID and test registers.
Data are stored in registers by 8-bit digital byte, either in 2's
complement format for temperature-related data or in straight format
for others. Writing and reading registers will be done on the SMBus
by a controller using the SMBus protocols that will be described
more in the last section of this functional description. Notice that
attempting to write to a "Read only" register will produce an invalid
result.
Power-on reset
When the power is applied to the NE1619, also called hardware
reset, the registers are reset to their default value, if defined, as
shown in Table 1. The content of registers which have indeterminate
default value such as reading registers will be unknown. The
on-board A-to-D converter is disabled and the monitoring function is
not started. The device enters standby mode and draws a supply
current less than 100
A.
Because all limit registers are reset to zero, writing limits into the
limits registers should usually be the first action to be performed
after power-on reset.
Initialization
Initialization or software reset of the NE1619 can be initiated by
setting bit 7 of the configuration register. This bit automatically clears
itself after being set. The initialization performs a similar reset function
to power-on reset, except that the reading and limit registers are
not reset.
Starting conversion
The NE1619 monitoring function is started by setting (to 1) the
START bit (bit 0) of the configuration register. The device then
performs a loop of monitoring about every second. In monitoring
function, the device cycles sequentially through all measurements of
temperatures and voltages and also performs the comparisons
between readings and limits accordingly. The inputs are sampled in
this order: Remote diode temperature, Local temperature, V
DD
V
IN
,
12V
IN
, 5V
IN
. 3.3V
IN,
2.5V
IN
and V
CCPVIN
.
Measured values are stored in reading registers and results of limit
comparison are reflected by the state of the flag bits in the status
registers. Reading and status data can be read at any time. Limit
values should be written into limit registers before starting
conversion to avoid false conditions of the status.
Resetting (to 0) the START bit (bit 0) of the configuration register will
stop the monitoring function and put the device into its standby
mode thereby reducing power consumption.
Temperature measurement
The NE1619 contains an on-chip temperature sensor to measure
the local or internal temperature and provides input pins (D and
D+) to measure the remote or external temperature with the use of a
remote diode-type sensor. The remote sensor should be connected
to the D and D+ pins properly.
The method of temperature measurement is based on the change of
the diode VBE at two different operating current levels given by:
VBE = (KT/q)*LN(N)
where:
K: Boltzmann's constant
T: absolute temperature in
K
q: charge on the electron
N: ratio of the two currents
LN: natural logarithm
The NE1619 provides two current sources of about 10
A and
100
A during the measurement of the remote diode VBE and the
sensed voltage between two pins D and D+ is limited within 0.25 V
and 0.95 V.
The external diode should be selected to meet this current and
voltage requirements. The diode-connected PNP transistor provided
on the Pentium series microprocessor is typically used, or the
discrete diode-connected transistor 2N3904 is recommended.
For temperature measurement, local or remote, the
VBE is
converted into digital data by the on-chip sigma-delta A-to-D
converter. The result is stored in the temperature reading register
and is also compared with the limits stored in the temperature limit
registers in order to set the temperature flag bits in the status
register as described in Table 3.
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
13
Temperature data is represented by a digital 8-bit byte or word in
two's complement format with a resolution of 1
C. Theoretically, the
temperature value can be from 128
C to +127
C but, practically,
the operation range is limited to (0
C, 120
C). Here are some of
temperature values and data:
Table 8.
TEMPERATURE VALUE (
C)
TEMPERATURE DATA
+127
0111 1111
+126
0111 1110
+100
0110 0100
+25
0001 1001
+1
0000 0001
0
0000 0000
1
1111 1111
25
1110 0111
50
1100 1110
Voltage measurement
The NE1619 provides 5 analog inputs for directly monitoring the
power supplies typically found in a PC or multiservice equipment,
having nominal values of +2.5 V, +3.3 V, +5.0 V, +12.0 V and V
CCP
(2.25 V). The device also monitors its own V
DD
whose nominal
value is 3.3 V. Note: at power-up, the device Pin 11 is defaulted to its
12V
IN
function. These inputs are internally attenuated by on-chip
resistor networks to the reference levels that are then multiplexed to
a 8-bit Delta-Sigma A-to-D converter for converting into digital data.
Each V
IN
input is overall scaled in such a way that the decimal value
of the data for its nominal voltage value is equal to 192. It means
that the overall step size of the conversion for each V
IN
is equal to
1
/
192
of its nominal value. Reading data are stored in the V
IN
reading
registers and are also compared with the limits stored in the V
IN
limit
registers in order to set the voltage flag bits in the status registers as
described in Tables 3 and 4.
The V
IN
data, different from the temperature data, is represented by
a digital 8-bit byte or word in straight format with a resolution LSB
equal to
1
/
192
of the nominal value, and has any value from 0 to 255.
This is how to calculate the V
IN
error from the V
IN
reading at any
input including V
DD
:
Resolution in volts:
LSB = (V
IN
nominal in volt)/192
Full scale in volts:
FS= 255 * LSB
Reading value in volts: V
IN
value =
(decimal value of V
IN
reading) * LSB
Reading error in volts: V
IN
error = (V
IN
value) (V
IN
applied)
VIN error in % of FS:
V
IN
error % = 100*(V
IN
error)/FS
Applied value < 0 results in a reading of about 0
Applied value > FS results in a reading of about 255
Input safety
Since the power supply voltages will appear directly at V
IN
pins, a
small external resistor, about 500
, should be connected in series
with each pin in order to prevent damaging the power supplies due
to accidental short. These resistors are recommended but not
necessary. No external resistor-divider should be used for the V
IN
pins because of the effect of the internal input resistors, about
140 k
at each pin, on the divider accuracy.
Processor Voltage ID (VID)
The NE1619 provides 5 digital pins (VID0VID4) to read the
processor voltage ID code and store it into the VID registers so that
the code can be read over the SMBus:
VID register:
bit 0bit3
reflect VID0VID3 respectively
VID4 register:
bit 0
reflects VID4
Because the VID4 function of 12V
IN
/VID4 pin (Pin 11) is not selected
at power-up (default function of this pin is 12V
IN
), the process of
selecting this pin must be performed, if VID4 is needed, by setting
(to 1) bit 5 (12V
IN
/VID4 SELECT) of the configuration register.
The default value of bit 0 of the VID4 register is 0.
The VID inputs should not be left floating because they are not
internally biased. If they are not used then they should be connected
to either GND or V
DD
with resistors.
Limit data
High and Low limits for temperatures and voltages should be
programmed into the limit registers using the format as described
above. During monitoring cycle, the measured data is automatically
compared with the limits and flag bits in the status registers are set
accordingly to the results. The assignment of the status bits are
listed in Tables 3 and 4.
Status registers
Results of limits comparisons are reflected by status or flag bits
stored in the status register 1 and 2. If the reading is within the limits
then the corresponding flag bit will be cleared to 0. Otherwise, it will
be set to 1. Status data can be read over the SMBus. Notice that
because the flag bits are automatically updated at every monitoring
cycle, their states only reflect the last measurements.
Diode fault status
The hardware connection at the diode pins (D+ and D) are also
checked at the measurement of external temperature and the fault
condition is indicated by the flag bit 6 of the status register 2. This bit
is set to 1 if either short or open circuit fault is detected.
RESET output function
The NE1619 Pin 16 can be selected as a reset pulse output. When
this function is selected and the reset pulse is initiated, this pin will
output a single (minimum 20 ms) low state pulse.
The reset output function is selected by setting (to 1) the RESET
ENABLE bit (bit 7) of the VID register. Thereafter, the reset pulse is
generated whenever the RESET bit (bit 4) of the configuration
register is programmed to change from 0 to 1.
Because Pin 16 becomes an open-drain output when it is selected
as an output, an external pull-up resistor, about 100 k
is needed
for the output operation. This will restrict the address function on
Pin 16 to being high at power-up. Therefore, if multiple NE1619's
are connected on the same bus, only one can have this function
enabled at one time.
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
14
NAND-tree test
A NAND tree is provided in the NE1619 for Automated Test
Equipment (ATE) board level connectivity testing. The device is
placed into NAND tree test mode by powering up with Pin 9
(D/NTEST_IN) held high. In this test mode Pin 16
(A0/RESET/NTEST_OUT) becomes the NAND-tree output and all
input pins become NAND-tree inputs as illustrated in Figure 12.
To perform a NAND tree test all pins should be initially driven low.
Then one-by-one toggle them high (and keep them high), starting
with the input closest to the output, cycling toward the farthest, the
NAND tree output will toggle with each input change.
SL01232
SDA
SCL
VID4
VID0
VID1
VID2
VID3
NTEST_OUT
Figure 12. NAND-tree circuitry
Table 9.
NAND-tree test vectors
VECTOR #
SDA
SCL
VID0
VID1
VID2
VID3
VID4
NTEST_OUT
1
L
L
L
L
L
L
L
H
2
L
L
L
L
L
L
H
L
3
L
L
L
L
L
H
H
H
4
L
L
L
L
H
H
H
L
5
L
L
L
H
H
H
H
H
6
L
L
H
H
H
H
H
L
7
L
H
H
H
H
H
H
H
8
H
H
H
H
H
H
H
L
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
15
SMBus interface protocol
The NE1619 can communicate over a compatible 2-wire serial
interface SMBus using the two device pins SCL and SDA. The
device employs three standard SMBus protocols: Write Byte, Read
Byte and Receive byte.
Data formats of those protocols are shown below with following notices:
The SMBus controller initiates data transfer by establishing a start
condition (S) and terminates data transfer by generating a stop
condition (P).
Data is sent over the serial bus in sequence of 9 clock pulses for
each 8-bit data byte followed by 1-bit status of the device
acknowledgement (A).
The 7-bit slave address is replaced by the selected address of the
device.
The command byte is replaced by the selected command of the
device register.
The receive byte format is used for quickly transfer data from a
reading register which was previously selected by a read.
During the transition between start and stop conditions, data must
be stable and valid when the SCL is high.
SL01233
SCL
SDA
SCL (continued)
SDA (continued)
SCL
SDA
SCL (continued)
SDA (continued)
SCL
SDA
RESTART
DEVICE ADDRESS
DEVICE REGISTER COMMAND
DATA TO BE WRITTEN TO REGISTER
DATA FROM DEVICE REGISTER
(end)
DEVICE ADDRESS
DEVICE ADDRESS
DEVICE ADDRESS
DATA FROM DEVICE REGISTER
DATA REGISTER COMMAND
STOP
STOP
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
(TO NEXT)
(TO NEXT)
(TO NEXT)
(TO NEXT)
1
2
3
4
5
6
7
8
9
0
1
0
1
1
0
a0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
0
1
0
1
1
0
a0
0
1
0
1
1
0
a0
S
W
A
A
A
P
S
W
A
A
P
S
R
A
NA
P
S
R
A
NA
P
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
0
1
0
1
1
0
a0
D7
D6
D5
D4
D3
D2
D1
D0
Receive Byte Format:
Read Byte Format:
Write Byte Format:
Figure 13. NE1619 SMBus interface protocols
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
16
Printed Circuit Board layout considerations
Care must be taken in PCB layout to minimize noise induced at the
remote temperature sensor inputs, especially in extremely noisy
environments, such as a computer motherboard. Noise induced in
the traces running between the device sensor inputs and the remote
diode can cause temperature conversion errors. Typical sensor
signal levels to the NE1619 is a few microvolts. The following
guidelines are recommended:
1. Place the NE1619 as close as possible to the remote sensor. It
can be from 4 to 8 inches, as long as the worst noise sources
such as clock generator, data and address buses, CRTs are
avoided.
2. Route the D+ and D lines parallel and close together with
ground guards enclosing them (see Figure 14).
3. Leakage currents due to PC board contamination must be
considered. Error can be introduced by these leakage currents.
4. Use wide traces to reduce inductance and noise pickup. Narrow
traces more readily pickup noise. The minimum width of 10 mil
and space of 10 mil are recommended.
GND
D+
D
GND
SL01218
Figure 14. PCB layout for D+ and D
5. Place a bypass capacitor of 100 nF close to the V
DD
pin and an
input filter capacitor of 2200 pF close to the D+ and D pins.
6. If the remote sensor is operating in a noisy environment and
located several feet away from the NE1619, a shielded twisted
pair cable is recommended. Make sure the shield of the cable is
connected to the NE1619 ground pin, and leave the shield at the
remote end unconnected. Shield connecting to ground of both
ends could create a ground loop (refer to Figure 15) and defeat
the purpose of the shielded cable. Also, cold soldered joints and
damaged cable could introduce series resistance and reslult in
measurement error. For instance, a 1
resistance can introduce
a change of temperature of about 0.5
C.
SL02156
D+
D
NE1619
GND
REMOTE
SENSOR
SHIELDED TWISTED PAIR
Figure 15. Using shielded twisted pair
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
17
SSOP16:
plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
18
REVISION HISTORY
Rev
Date
Description
_4
20041005
Product data sheet (9397 750 14175). Supersedes data of 2004 May 10 (9397 750 13254).
Modifications:
"Features" section on page 2: add ESD and Latch-up bullets to bottom of list.
"Ordering information" table: change temperature range from "T
amb
= 0
C to +120
C" to "T
amb
= 0
C to +125
C"
Add figure titles to Pin configuration, Functional block diagram, Typical application circuit.
Section "Typical operating circuit" re-named to "Typical application circuit"; figure modified.
"Absolute maximum ratings" table: change Operating temperature range maximum from +120
C to +125
C
Figure 4 re-titled
"DC electrical characteristics" table: add Note 4 and its reference at table description line.
"SMBus interface AC characteristics" table: change temperature range from "T
amb
= 0
C to +120
C"
to "T
amb
= 0
C to +125
C"
Section "Printed Circuit Board layout condiserations":
paragraph 5: change from "Place a bypass capacitor of 10 nF close to ..." to "Place a bypass capacitor of
100 nF close to ..."
paragraph 6 re-written
add Figure 15
_3
20040510
Product data (9397 750 13254). Supersedes data of 2001 Aug 29.
_2
20010829
Product data (9397 750 08874). Supersedes data of 2000 Jul 13.
_1
20000713
Product specification (9397 750 07323).
Philips Semiconductors
Product data sheet
NE1619
HECETA4 Temperature and voltage monitor
2004 Oct 05
19
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent
to use the components in the I
2
C system provided the system conforms to the
I
2
C specifications defined by Philips. This specification can be ordered using the
code 9398 393 40011.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to make changes in the products--including circuits, standard cells, and/or software--described
or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Printed in U.S.A.
Date of release: 10-04
Document order number:
9397 750 14175
Philips
Semiconductors
Data sheet status
[1]
Objective data sheet
Preliminary data sheet
Product data sheet
Product
status
[2] [3]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
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