General description

The PCA9546A is a quad bi-directional translating switch controlled via the I

C-bus. The

SCL/SDA upstream pair fans out to four downstream pairs, or channels. Any individual
SCx/SDx channel or combination of channels can be selected, determined by the
contents of the programmable control register.

An active LOW reset input allows the PCA9546A to recover from a situation where one of
the downstream I

C-buses is stuck in a LOW state. Pulling the RESET pin LOW resets the

C-bus state machine and causes all the channels to be deselected as does the internal

Power-On Reset (POR) function.

The pass gates of the switches are constructed such that the V

pin can be used to limit

the maximum high voltage which will be passed by the PCA9546A. This allows the use of
different bus voltages on each pair, so that 1.8 V or 2.5 V or 3.3 V parts can communicate
with 5 V parts without any additional protection. External pull-up resistors pull the bus up
to the desired voltage level for each channel. All I/O pins are 5 V tolerant.

Features

1-of-4 bi-directional translating switches

C-bus interface logic; compatible with SMBus standards

Active LOW reset input

3 address pins allowing up to 8 devices on the I

C-bus

Channel selection via I

C-bus, in any combination

Power-up with all switch channels deselected

Low R

switches

Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses

No glitch on power-up

Supports hot insertion

Low stand-by current

Operating power supply voltage range of 2.3 V to 5.5 V

5 V tolerant Inputs

0 kHz to 400 kHz clock frequency

ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

Three packages offered: SO16, TSSOP16, and HVQFN16

PCA9546A

4-channel I

C switch with reset

Rev. 03 -- 6 April 2005

Product data sheet

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

2 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

Ordering information

Standard packing quantities and other packaging data are available at
www.standardics.philips.com/packaging.

Marking

Table 1:

Ordering information

amb

C to +85

Type number

Package

Name

Description

Version

PCA9546ABS

HVQFN16

plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 4

0.85 mm

SOT629-1

PCA9546AD

SO16

plastic small outline package; 16 leads;
body width 3.9 mm

SOT109-1

PCA9546APW

TSSOP16

plastic thin shrink small outline package; 16 leads;
body width 4.4 mm

SOT403-1

Table 2:

Marking codes

Type number

Topside mark

PCA9546ABS

546A

PCA9546AD

PCA9546APW

PA9546A

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

4 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

Pinning information

6.1 Pinning

Fig 2.

Pin configuration for SO16

Fig 3.

Pin configuration for TSSOP16

Fig 4.

Pin configuration for HVQFN16 (transparent top view)

PCA9546AD

SDA

RESET

SCL

SD0

SC0

SC3

SD1

SD3

SC1

SC2

SD2

002aab185

PCA9546APW

SDA

RESET

SCL

SD0

SC0

SC3

SD1

SD3

SC1

SC2

SD2

002aab186

002aab187

Transparent top view

SD1

SD3

SC0

SC3

SD0

RESET

SCL

SC1

SD2

SC2

SDA

terminal 1

index area

PCA9546ABS

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

5 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

6.2 Pin description

[1]

HVQFN package die supply ground is connected to both the V

pin and the exposed center pad. The V

pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and
board-level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be
incorporated in the PCB in the thermal pad region.

Functional description

Refer to

Figure 1 "Block diagram of PCA9546A" on page 3

7.1 Device address

Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9546A is shown in

Figure 5

. To conserve power, no

internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.

The last bit of the slave address defines the operation to be performed. When set to
logic 1 a read is selected, while a logic 0 selects a write operation.

Table 3:

Pin description

Symbol

Pin

Description

SO, TSSOP

HVQFN

address input 0

address input 1

RESET

active LOW reset input

SD0

serial data 0

SC0

serial clock 0

SD1

serial data 1

SC1

serial clock 1

[1]

supply ground

SD2

serial data 2

SC2

serial clock 2

SD3

serial data 3

SC3

serial clock 3

address input 2

SCL

serial clock line

SDA

serial data line

supply voltage

Fig 5.

Slave address

002aab189

A0 R/W

fixed

hardware

selectable

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

6 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

7.2 Control register

Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9546A, which will be stored in the control register. If multiple bytes are
received by the PCA9546A, it will save the last byte received. This register can be written
and read via the I

C-bus.

7.2.1 Control register definition

One or several SCx/SDx downstream pair, or channel, is selected by the contents of the
control register. This register is written after the PCA9546A has been addressed. The
4 LSBs of the control byte are used to determine which channel is to be selected. When a
channel is selected, the channel will become active after a STOP condition has been
placed on the I

C-bus. This ensures that all SCx/SDx lines will be in a HIGH state when

the channel is made active, so that no false conditions are generated at the time of
connection.

Remark: Several channels can be enabled at the same time. Example: B3 = 0, B2 = 1,
B1 = 1, B0 = 0, means that channel 0 and channel 3 are disabled and channel 1 and
channel 2 are enabled. Care should be taken not to exceed the maximum bus
capacitance.

Fig 6.

Control register

002aab190

channel selection bits

(read/write)

channel 0
channel 1
channel 2
channel 3

Table 4:

Control register: Write--channel selection; Read--channel status

Command

channel 0 disabled

channel 0 enabled

channel 1 disabled

channel 1 enabled

channel 2 disabled

channel 2 enabled

channel 3 disabled

channel 3 enabled

no channel selected;
power-up/reset default state

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

7 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

7.3 RESET input

The RESET input is an active LOW signal which may be used to recover from a bus fault
condition. By asserting this signal LOW for a minimum of t

, the PCA9546A will reset its

registers and I

C-bus state machine and will deselect all channels. The RESET input must

be connected to V

through a pull-up resistor.

7.4 Power-on reset

When power is applied to V

, an internal Power-On Reset (POR) holds the PCA9546A in

a reset condition until V

has reached V

POR

. At this point, the reset condition is released

and the PCA9546A registers and I

C-bus state machine are initialized to their default

states--all zeroes--causing all the channels to be deselected. Thereafter, V

must be

lowered below 0.2 V to reset the device.

7.5 Voltage translation

The pass gate transistors of the PCA9546A are constructed such that the V

voltage can

be used to limit the maximum voltage that will be passed from one I

C-bus to another.

Figure 7

shows the voltage characteristics of the pass gate transistors (note that the graph

was generated using the data specified in

Section 11 "Static characteristics"

of this data

sheet). In order for the PCA9546A to act as a voltage translator, the V

o(sw)

voltage should

be equal to, or lower than the lowest bus voltage. For example, if the main bus was
running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then V

o(sw)

should be

equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at

Figure 7

, we see that V

o(sw)(max)

will be at 2.7 V when the PCA9546A supply voltage is

3.5 V or lower, so the PCA9546A supply voltage could be set to 3.3 V. Pull-up resistors
can then be used to bring the bus voltages to their appropriate levels (see

Figure 14

(1) maximum

(2) typical

(3) minimum

Fig 7.

Pass gate voltage versus supply voltage

(V)

2.0

5.5

4.5

3.0

4.0

002aaa964

3.0

2.0

4.0

5.0

o(sw)

(V)

1.0

3.5

5.0

2.5

(1)

(2)

(3)

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

8 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

More Information can be found in Application Note

AN262: PCA954X family of I2C/SMBus

multiplexers and switches.

Characteristics of the I

C-bus

The I

C-bus is for 2-way, 2-line communication between different ICs or modules. The two

lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.

8.1 Bit transfer

One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see

Figure 8

8.2 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see

Figure 9

8.3 System configuration

A device generating a message is a `transmitter', a device receiving is the `receiver'. The
device that controls the message is the `master' and the devices which are controlled by
the master are the `slaves' (see

Figure 10

Fig 8.

Bit transfer

mba607

data line

stable;

data valid

change

of data

allowed

SDA

SCL

Fig 9.

Definition of START and STOP conditions

mba608

SDA

SCL

STOP condition

SDA

SCL

START condition

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

9 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

8.4 Acknowledge

The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.

A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also, a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; setup and hold
times must be taken into account.

A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.

Fig 10. System configuration

002aaa966

MASTER

TRANSMITTER/

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER/

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER/

RECEIVER

SDA

SCL

MULTIPLEXER

SLAVE

Fig 11. Acknowledgement on the I

C-bus

002aaa987

START

condition

clock pulse for

acknowledgement

not acknowledge

acknowledge

data output

by transmitter

data output

by receiver

SCL from master

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

10 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

8.5 Bus transactions

Data is transmitted to the PCA9546A control register using the Write mode as shown in

Figure 12

Data is read from PCA9546A using the Read mode as shown in

Figure 13

Fig 12. Write control register

Fig 13. Read control register

002aab196

slave address

START condition

R/W

acknowledge
from slave

acknowledge

from slave

control register

SDA

STOP condition

002aab197

slave address

START condition

R/W

acknowledge
from slave

no acknowledge

from master

control register

SDA

STOP condition

last byte

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

12 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

10. Limiting values

[1]

The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 150

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to V

(ground = 0 V).

[1]

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

0.5

+7.0

input voltage

0.5

+7.0

input current

output current

supply current

100

ground supply current

100

tot

total power dissipation

400

stg

storage temperature

+150

amb

operating ambient temperature

+85

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

13 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

11. Static characteristics

[1]

For operation between published voltage ranges, refer to the worst-case parameter in both ranges.

[2]

must be lowered to 0.2 V in order to reset part.

Table 6:

DC characteristics

= 2.3 V to 3.6 V; V

= 0 V; T

amb

C to +85

C; unless otherwise specified.

See

Table 7 on page 14

for V

= 4.5 V to 5.5 V.

[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply

supply voltage

2.3

3.6

supply current

Operating mode; V

= 3.6 V; no load;

= V

or V

; f

SCL

= 100 kHz

stb

standby current

Standby mode; V

= 3.6 V; no load;

= V

or V

0.1

POR

power-on reset voltage

no load; V

= V

or V

[2]

1.6

2.1

Input SCL; input/output SDA

LOW-level input voltage

0.5

0.3V

HIGH-level input voltage

0.7V

LOW-level output current

= 0.4 V

= 0.6 V

leakage current

= V

or V

input capacitance

= V

Select inputs A0 to A2, RESET

LOW-level input voltage

0.5

0.3V

HIGH-level input voltage

0.7V

+ 0.5

input leakage current

pin at V

or V

input capacitance

= V

1.6

Pass gate

on-state resistance

= 3.67 V; V

= 0.4 V; I

= 15 mA

= 2.3 V to 2.7 V; V

= 0.4 V;

= 10 mA

o(sw)

switch output voltage

i(sw)

= V

= 3.3 V; I

o(sw)

100

1.9

i(sw)

= V

= 3.0 V to 3.6 V;

o(sw)

100

1.6

2.8

i(sw)

= V

= 2.5 V; I

o(sw)

100

1.5

i(sw)

= V

= 2.3 V to 2.7 V;

o(sw)

100

1.1

2.0

leakage current

= V

or V

input/output capacitance

= V

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

14 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

[1]

For operation between published voltage ranges, refer to the worst-case parameter in both ranges.

[2]

must be lowered to 0.2 V in order to reset part.

Table 7:

DC characteristics

= 4.5 V to 5.5 V; V

= 0 V; T

amb

C to +85

C; unless otherwise specified.

See

Table 6 on page 13

for V

= 2.3 V to 3.6 V.

[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply

supply voltage

4.5

5.5

supply current

Operating mode; V

= 5.5 V;

no load; V

= V

or V

;

SCL

= 100 kHz

100

stb

standby current

Standby mode; V

= 5.5 V;

no load; V

= V

or V

0.3

POR

power-on reset voltage

no load; V

= V

or V

[2]

1.7

2.1

Input SCL; input/output SDA

LOW-level input voltage

0.5

0.3V

HIGH-level input voltage

0.7V

LOW-level output current

= 0.4 V

= 0.6 V

LOW-level input current

= V

HIGH-level input current

= V

input capacitance

= V

Select inputs A0 to A2, RESET

LOW-level input voltage

0.5

0.3V

HIGH-level input voltage

0.7V

+ 0.5

input leakage current

pin at V

or V

input capacitance

= V

Pass gate

on-state resistance

= 4.5 V to 5.5 V; V

= 0.4 V;

= 15 mA

o(sw)

switch output voltage

i(sw)

= V

= 5.0 V;

o(sw)

100

3.6

i(sw)

= V

= 4.5 V to 5.5 V;

o(sw)

100

2.6

4.5

leakage current

= V

or V

input/output capacitance

= V

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

15 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

12. Dynamic characteristics

[1]

Pass gate propagation delay is calculated from the 20

typical R

and the 15 pF load capacitance.

[2]

A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the V

IH(min)

of the SCL signal) in order to

bridge the undefined region of the falling edge of SCL.

[3]

= total capacitance of one bus line in pF.

[4]

Measurements taken with 1 k

pull-up resistor and 50 pF load.

Table 8:

Dynamic characteristics

Symbol

Parameter

Conditions

Standard-mode

C-bus

Fast-mode I

C-bus

Unit

Min

Max

Min

Max

propagation delay from SDA to SDn, or
SCL to SCn

0.3

[1]

0.3

[1]

SCL

SCL clock frequency

100

400

kHz

BUF

bus free time between a STOP and
START condition

4.7

1.3

HD;STA

hold time (repeated) START condition.
After this period, the first clock pulse is
generated.

4.0

0.6

LOW

LOW period of the SCL clock

4.7

1.3

HIGH

HIGH period of the SCL clock

4.0

0.6

SU;STA

setup time for a repeated START
condition

4.7

0.6

SU;STO

setup time for STOP condition

4.0

0.6

HD;DAT

data hold time

[2]

3.45

[2]

0.9

SU;DAT

data setup time

250

100

rise time of both SDA and SCL signals

1000

20 + 0.1C

[3]

300

fall time of both SDA and SCL signals

300

20 + 0.1C

[3]

300

capacitive load for each bus line

400

pulse width of spikes which must be
suppressed by the input filter

VD;DAT

data valid time

HIGH-to-LOW

[4]

LOW-to-HIGH

[4]

0.6

VD;ACK

data valid Acknowledge

RESET

w(rst)L

LOW-level reset time

rst

reset time (SDA clear)

500

REC;STA

recovery time to START condition

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

16 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

Fig 15. Definition of timing on the I

C-bus

BUF

HD;STA

LOW

HD;DAT

HIGH

SU;DAT

SU;STA

HD;STA

SU;STO

SDA

SCL

002aaa986

Fig 16. Definition of RESET timing

SDA

SCL

002aab174

rst

50 %

30 %

50 %

REC;STA

w(rst)L

RESET

LEDx

LED off

START

rst

ACK or read cycle

Rise and fall times refer to V

and V

Fig 17. I

C-bus timing diagram

SCL

SDA

HD;STA

SU;DAT

HD;DAT

BUF

SU;STA

LOW

HIGH

VD;ACK

002aab175

SU;STO

protocol

START

condition

(S)

bit 7

MSB

(A7)

bit 6
(A6)

bit 0

(R/W)

acknowledge

(A)

STOP

condition

(P)

SCL

VD;DAT

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

17 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

13. Package outline

Fig 18. Package outline SOT109-1 (SO16)

detail X

(A )

pin 1 index

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

10.0

9.8

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0
0.4

SOT109-1

99-12-27
03-02-19

076E07

MS-012

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.39
0.38

0.16
0.15

0.05

1.05

0.041

0.244
0.228

0.028
0.020

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

18 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

Fig 19. Package outline SOT403-1 (TSSOP16)

UNIT

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15
0.05

0.95
0.80

0.30
0.19

0.2
0.1

5.1
4.9

4.5
4.3

0.65

6.6
6.2

0.4
0.3

0.40
0.06

8
0

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75
0.50

SOT403-1

MO-153

99-12-27
03-02-18

0.25

detail X

(A )

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

max.

1.1

pin 1 index

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

19 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

Fig 20. Package outline SOT629-1 (HVQFN16)

terminal 1
index area

0.65

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

4.1
3.9

2.25
1.95

4.1
3.9

2.25
1.95

1.95

0.38
0.23

0.05
0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT629-1

MO-220

- - -

0.75
0.50

0.1

0.05

2.5

5 mm

scale

SOT629-1

HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 4 x 4 x 0.85 mm

(1)

max.

detail X

y1 C

01-08-08
02-10-22

terminal 1
index area

1/2

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

(1)

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

20 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

21 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

14.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 9:

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

22 of 25

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

16. Revision history

Table 10:

Abbreviations

Acronym

Description

CDM

Charged Device Model

ESD

Electro Static Discharge

HBM

Human Body Model

Integrated Circuit

LSB

Least Significant Bit

Machine Model

MSB

Most Significant Bit

PCB

Printed-Circuit Board

Table 11:

Revision history

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

PCA9546A_3

20050406

Product data sheet

9397 750 14318

PCA9546A_2

Modifications:

The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.

Section 2 "Features" on page 1

7th bullet: changed `RDS

' to `R

16th bullet: changed `JESDEC' to `JEDEC'

Figure 4 "Pin configuration for HVQFN16 (transparent top view)" on page 4

added pin 1 indicator notch and center pad

changed pin 1 from `A2' to `RESET'

Section 6.2 "Pin description" on page 5

: added

Table note 1

and its reference at HVQFN pin 6.

Section 7.2.1 "Control register definition" on page 6

, third sentence: changed `The 2 LSBs of the

control byte ...' to `The 4 LSBs of the control byte ...'

Section 7.5 "Voltage translation" on page 7

Figure 7

modified and title changed from `V

pass

voltage versus V

' to `Pass gate voltage versus

supply voltage'

2nd paragraph: changed symbol `V

pass

' and `V

pass(max)

' to `V

o(sw)

' and `V

o(sw)(max)

', respectively.

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

23 of 25

Modifications
(continued):

Added

Section 8.5 "Bus transactions" on page 10

; moved

Figure 12 "Write control register"

and

Figure 13 "Read control register"

to this section.

Table 5 "Limiting values" on page 12

In the description line below table title, changed `referenced to GND' to `referenced to V

Removed (old) table note [1], as this statement is now covered in

Section 19 "Disclaimers"

Table 6 "DC characteristics" on page 13

added (new)

Table note 1

changed symbol `R

' to `R

' and its parameter from `switch resistance' to `on-state resistance'

changed symbol `V

pass

' to `V

o(sw)

under Conditions column: changed `V

swin

' to `V

i(sw)

'; changed `I

swout

' to I

o(sw)

Table 7 "DC characteristics" on page 14

added (new)

Table note 1

sub-section `Select inputs A0 to A2, RESET': changed I

LI(max)

from `+50

A' to `+1

A'.

sub-section `Pass gate': changed I

L(min)

from `

A' to `

A';

changed I

L(max)

from `+100

A' to `+1

changed symbol `R

' to `R

' and its parameter from `switch resistance' to `on-state resistance'

changed symbol `V

pass

' to `V

o(sw)

under Conditions column: changed `V

swin

' to `V

i(sw)

'; changed `I

swout

' to I

o(sw)

Table 8 "Dynamic characteristics" on page 15

symbol `t

' changed to `t

'; symbol `t

' changed to `t

changed symbols `t

VD;DATL

' and `t

VD;DATH

' to `t

VD;DAT

' and added Conditions indicating

HIGH-to-LOW and LOW-to-HIGH transitions

changed symbol `t

WL(rst)

' to `t

w(rst)L

changed parameter for symbol t

REC;STA

from `recovery to START' to `recovery time to START

condition'

Table note 1

: changed `R

' to `R

Added

Figure 16

and

Figure 17

Added

Section 15 "Abbreviations"

PCA9546A_2

20040929

Objective data sheet

9397 750 13991

PCA9546A_1

20040728

Objective data sheet

9397 750 13308

Table 11:

Revision history

...continued

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

9397 750 14318

Product data sheet

Rev. 03 -- 6 April 2005

24 of 25

17. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

18. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

19. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 6 April 2005

Document number: 9397 750 14318

Published in The Netherlands

Philips Semiconductors

PCA9546A

4-channel I

C switch with reset

21. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

Functional description . . . . . . . . . . . . . . . . . . . 5

7.1

Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2

Control register . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.2.1

Control register definition . . . . . . . . . . . . . . . . . 6

7.3

RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.4

Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.5

Voltage translation . . . . . . . . . . . . . . . . . . . . . . 7

Characteristics of the I

C-bus. . . . . . . . . . . . . . 8

8.1

Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.2

START and STOP conditions . . . . . . . . . . . . . . 8

8.3

System configuration . . . . . . . . . . . . . . . . . . . . 8

8.4

Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.5

Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10

Application design-in information . . . . . . . . . 11

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

Static characteristics. . . . . . . . . . . . . . . . . . . . 13

Dynamic characteristics . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

14.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21

14.5

Package related soldering information . . . . . . 21

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 24

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Contact information . . . . . . . . . . . . . . . . . . . . 24

Document Outline

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Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: PCA9546A