1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

FEATURES

Operating supply voltage 2.5 to 6.0 V

Low data retention voltage; minimum 1.0 V

Low standby current; maximum 15

Power-saving mode; typical 50 nA

Serial input/output bus (I

C-bus)

Address by 3 hardware address pins

Automatic word address incrementing

Available in DIP8 and SO8 packages.

APPLICATIONS

Telephony:

RAM expansion for stored numbers in repertory

dialling (e.g. PCD33xxA applications)

General purpose RAM for applications requiring
extremely low current and low-voltage RAM retention,
such as battery or capacitor-backed.

Radio, television and video cassette recorder:

channel presets

General purpose:

RAM expansion for the microcontroller families

PCD33xxA, PCF84CxxxA, P80CLxxx and most other
microcontrollers.

GENERAL DESCRIPTION

The PCF8570 is a low power static CMOS RAM,
organized as 256 words by 8-bits.

Addresses and data are transferred serially via a two-line
bidirectional bus (I

C-bus). The built-in word address

register is incremented automatically after each written or
read data byte. Three address pins, A0, A1 and A2 are
used to define the hardware address, allowing the use of
up to 8 devices connected to the bus without additional
hardware.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

2.5

6.0

supply current (standby)

SCL

= 0 Hz

DDR

supply current (power-saving mode)

amb

= 25

400

amb

operating ambient temperature

+85

stg

storage temperature

+150

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

PCF8570P

DIP8

plastic dual in-line package; 8 leads (300 mil)

SOT97-1

PCF8570T

SO8

plastic small outline package; 8 leads; body width 7.5 mm

SOT176-1

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

CHARACTERISTICS OF THE I

C-BUS

The I

C-bus is for bidirectional, two-line communication

between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor. Data transfer may be initiated only when the bus
is not busy.

8.1

Bit transfer

One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as a control signal.

Fig.3 Bit transfer.

MBA607

data line

stable;

data valid

change

of data

allowed

SDA

SCL

8.2

Start and stop conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is
defined as the stop condition (P).

Fig.4 Definition of start and stop conditions.

MBA608

SDA

SCL

STOP condition

SDA

SCL

START condition

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

8.3

System configuration

A device generating a message is a `transmitter', a device receiving a message is the `receiver'. The device that controls
the message is the `master' and the devices which are controlled by the master are the `slaves'.

Fig.5 System configuration.

MBA605

MASTER

TRANSMITTER /

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER /

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER /

RECEIVER

SDA

SCL

8.4

Acknowledge

The number of data bytes transferred between the start
and stop conditions from transmitter to receiver is
unlimited. Each byte of eight bits is followed by an
acknowledge bit. The acknowledge bit is a HIGH level
signal put on the bus by the transmitter during which time
the master generates an extra acknowledge related clock
pulse. A slave receiver which is addressed must generate
an acknowledge after the reception of each byte. Also a
master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the
slave transmitter.

The device that acknowledges must pull down the SDA
line during the acknowledge clock pulse, so that the SDA
line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times
must be taken into consideration). A master receiver must
signal an end of data to the transmitter by not generating
an acknowledge on the last byte that has been clocked out
of the slave. In this event the transmitter must leave the
data line HIGH to enable the master to generate a stop
condition.

Fig.6 Acknowledgement on the I

C-bus.

handbook, full pagewidth

MBA606 - 1

START

condition

SCL FROM

MASTER

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

clock pulse for

acknowledgement

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

8.5

C-bus protocol

Before any data is transmitted on the I

C-bus, the device which should respond is addressed first. The addressing is

always carried out with the first byte transmitted after the start procedure. The I

C-bus configuration for the different

PCF8570 WRITE and READ cycles is shown in Figs 7, 8 and 9.

Fig.7 Master transmits to slave receiver (WRITE) mode.

handbook, full pagewidth

0 A

SLAVE ADDRESS

WORD ADDRESS

DATA

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/W

auto increment

memory word address

MBD822

n bytes

Fig.8 Master reads after setting word address (WRITE word address; READ data).

handbook, full pagewidth

0 A

SLAVE ADDRESS

WORD ADDRESS

SLAVE ADDRESS

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/W

acknowledgement

from master

DATA

auto increment

memory word address

MLB930

no acknowledgement

from master

DATA

auto increment

memory word address

last byte

R/W

n bytes

at this moment master -
transmitter becomes
master - receiver and
PCF8570 slave -
receiver becomes
slave - transmitter

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

10 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
"Handling MOS Devices".

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltage (pin 8)

0.8

+8.0

input voltage (any input)

0.8

+ 0.8

DC input current

DC output current

positive supply current

negative supply current

tot

total power dissipation per package

300

power dissipation per output

amb

operating ambient temperature

+85

stg

storage temperature

+150

Fig.9 Master reads slave immediately after first byte (READ mode).

andbook, full pagewidth

1 A

SLAVE ADDRESS

DATA

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/W

auto increment

word address

MBD824

auto increment

word address

n bytes

last bytes

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

11 DC CHARACTERISTICS

= 2.5 to 6.0 V; V

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

Notes

1. The Power-on reset circuit resets the I

C-bus logic when V

< V

POR

. The status of the device after a Power-on reset

condition can be tested by sending the slave address and testing the acknowledge bit.

2. If the input voltages are a diode voltage above or below the supply voltage V

or V

an input current will flow; this

current must not exceed

0.5 mA.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

2.5

6.0

supply current

standby mode

= V

or V

;

SCL

= 0 Hz;

amb

25 to +70

operating mode

= V

or V

;

SCL

= 100 Hz

200

POR

Power-on reset voltage

note 1

1.5

1.9

2.3

Inputs, input/output SDA

LOW level input voltage

note 2

0.8

0.3V

HIGH level input voltage

note 2

0.7V

+ 0.8 V

LOW level output current

= 0.4 V

input leakage current

= V

or V

Inputs A0, A1, A2 and TEST

input leakage current

= V

or V

250

+250

Inputs SCL and SDA

input capacitance

= V

Low V

data retention

DDR

supply voltage for data retention

DDR

supply current

DDR

= 1 V

DDR

= 1 V;

amb

25 to +70

Power-saving mode (see Figs 13 and 14)

DDR

supply current

TEST = V

; T

amb

= 25

400

HD2

recovery time

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

12 AC CHARACTERISTICS

All timing values are valid within the operating supply voltage and ambient temperature range and reference to V

and

with an input voltage swing of V

to V

Note

1. A detailed description of the I

C-bus specification, with applications, is given in brochure

"The I

C-bus and how to

use it". This brochure may be ordered using the code 9398 393 40011.

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

C-bus timing (see Fig.10; note 1)

SCL

SCL clock frequency

100

kHz

tolerable spike width on bus

100

BUF

bus free time

4.7

SU;STA

START condition set-up time

4.7

HD;STA

START condition hold time

4.0

LOW

SCL LOW time

4.7

HIGH

SCL HIGH time

4.0

SCL and SDA rise time

1.0

SCL and SDA fall time

0.3

SU;DAT

data set-up time

250

HD;DAT

data hold time

VD;DAT

SCL LOW-to-data out valid

3.4

SU;STO

STOP condition set-up time

4.0

Fig.10 I

C-bus timing diagram; rise and fall times refer to V

and V

handbook, full pagewidth

PROTOCOL

SCL

SDA

MBD820

BIT 0

LSB

(R/W)

t HD;STA

SU;DAT

HD;DAT

VD;DAT

t SU;STO

BUF

SU;STA

LOW

t HIGH

1 / f SCL

START

CONDITION

(S)

BIT 7

MSB

(A7)

BIT 6

(A6)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

15 SOLDERING

15.1

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

15.2

Through-hole mount packages

15.2.1

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

15.2.2

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

15.3

Surface mount packages

15.3.1

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

15.3.2

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

15.3.3

ANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

15.4

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

suitable

Surface mount

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

1999 Jan 06

Philips Semiconductors

Product specification

256

8-bit static low-voltage RAM with

C-bus interface

PCF8570

16 DEFINITIONS

17 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

18 PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA61

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Printed in The Netherlands

415106/00/04/pp20

Date of release: 1999 Jan 06

Document order number:

9397 750 04971

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: PCF8570

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: PCF8570