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Электронный компонент: PUMB14

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1.
Product profile
1.1 General description
PNP/PNP resistor-equipped transistors.
1.2 Features
s
Built-in bias resistors
s
Simplifies circuit design
s
Reduces component count
s
Reduces pick and place cost
1.3 Applications
s
Low current peripheral driver
s
Control of IC inputs
s
Replacement of general-purpose transistors in digital applications
1.4 Quick reference data
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors;
R1 = 47 k
, R2 = open
Rev. 01 -- 17 February 2005
Product data sheet
Table 1:
Product overview
Type number
Package
NPN/PNP
complement
NPN/NPN
complement
Philips
JEITA
PEMB14
SOT666
-
PEMD14
PEMH14
PUMB14
SOT363
SC-88
PUMD14
PUMH14
Table 2:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
CEO
collector-emitter voltage
open base
-
-
-
50
V
I
O
output current (DC)
-
-
-
100
mA
R1
bias resistor 1 (input)
33
47
61
k
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
2 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
2.
Pinning information
3.
Ordering information
4.
Marking
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 3:
Pinning
Pin
Description
Simplified outline
Symbol
1
GND (emitter) TR1
2
input (base) TR1
3
output (collector) TR2
4
GND (emitter) TR2
5
input (base) TR2
6
output (collector) TR1
001aab555
6
4
5
1
3
2
6
5
4
1
2
3
TR1
TR2
R1
R1
006aaa268
Table 4:
Ordering information
Type number
Package
Name
Description
Version
PEMB14
-
plastic surface mounted package; 6 leads
SOT666
PUMB14
SC-88
plastic surface mounted package; 6 leads
SOT363
Table 5:
Marking codes
Type number
Marking code
[1]
PEMB14
5A
PUMB14
T1*
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
3 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
5.
Limiting values
[1]
Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
6.
Thermal characteristics
[1]
Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
V
CBO
collector-base voltage
open emitter
-
-
50
V
V
CEO
collector-emitter voltage
open base
-
-
50
V
V
EBO
emitter-base voltage
open collector
-
-
5
V
I
O
output current (DC)
-
-
100
mA
I
CM
peak collector current
-
-
100
mA
P
tot
total power dissipation
T
amb
25
C
SOT363
[1]
-
200
mW
SOT666
[1] [2]
-
200
mW
T
stg
storage temperature
-
65
+150
C
T
j
junction temperature
-
150
C
T
amb
ambient temperature
-
65
+150
C
Per device
P
tot
total power dissipation
T
amb
25
C
SOT363
[1]
-
300
mW
SOT666
[1] [2]
-
300
mW
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
T
amb
25
C
SOT363
[1]
-
-
625
K/W
SOT666
[1] [2]
-
-
625
K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
T
amb
25
C
SOT363
[1]
-
-
416
K/W
SOT666
[1] [2]
-
-
416
K/W
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
4 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
7.
Characteristics
Table 8:
Characteristics
T
amb
= 25
C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
I
CBO
collector-base cut-off
current
V
CB
=
-
50 V; I
E
= 0 A
-
-
-
100
nA
I
CEO
collector-emitter
cut-off current
V
CE
=
-
30 V; I
B
= 0 A
-
-
-
1
A
V
CE
=
-
30 V; I
B
= 0 A;
T
j
= 150
C
-
-
-
50
A
I
EBO
emitter-base cut-off
current
V
EB
=
-
5 V; I
C
= 0 A
-
-
-
100
nA
h
FE
DC current gain
V
CE
=
-
5 V; I
C
=
-
1 mA
100
-
-
V
CEsat
collector-emitter
saturation voltage
I
C
=
-
10 mA; I
B
=
-
0.5 mA
-
-
-
150
mV
R1
bias resistor 1 (input)
33
47
61
k
C
c
collector capacitance
V
CB
=
-
10 V; I
E
= i
e
= 0 A;
f = 1 MHz
-
-
2.5
pF
V
CE
=
-
5 V
(1) T
amb
= 100
C
(2) T
amb
= 25
C
(3) T
amb
=
-
40
C
I
C
/I
B
= 20
(1) T
amb
= 100
C
(2) T
amb
= 25
C
(3) T
amb
=
-
40
C
Fig 1.
DC current gain as a function of collector
current; typical values
Fig 2.
Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa206
100
1000
h
FE
10
I
C
(mA)
-
10
-
1
-
10
2
-
10
-
1
(1)
(2)
(3)
006aaa207
I
C
(mA)
-
10
-
1
-
10
2
-
10
-
1
-
10
-
1
-
1
V
CEsat
(V)
-
10
-
2
(1)
(2)
(3)
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
5 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
8.
Package outline
Fig 3.
Package outline SOT363 (SC-88)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT363
SC-88
w
B
M
bp
D
e1
e
pin 1
index
A
A1
Lp
Q
detail X
HE
E
v
M
A
A
B
y
0
1
2 mm
scale
c
X
1
3
2
4
5
6
Plastic surface mounted package; 6 leads
SOT363
UNIT
A1
max
bp
c
D
E
e
1
HE
Lp
Q
y
w
v
mm
0.1
0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15
0.65
e
1.3
2.2
2.0
0.2
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
97-02-28
04-11-08
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
6 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
Fig 4.
Package outline SOT666
UNIT
b
p
c
D
E
e
1
H
E
L
p
w
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
01-08-27
04-11-08
IEC
JEDEC
JEITA
mm
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
0.5
e
1.0
1.7
1.5
0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT666
bp
pin 1 index
D
e1
e
A
Lp
detail X
HE
E
A
S
0
1
2 mm
scale
A
0.6
0.5
c
X
1
2
3
4
5
6
Plastic surface mounted package; 6 leads
SOT666
Y S
w
M
A
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
7 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
9.
Packing information
[1]
For further information and the availability of packing methods, see
Section 14
.
[2]
T1: normal taping
[3]
T2: reverse taping
Table 9:
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing quantity
3000
4000
10000
PEMB14
SOT666
4 mm pitch, 8 mm tape and reel;
-
-115
-
PUMB14
SOT363
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-135
PUMB14
SOT363
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-165
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
8 of 10
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
10. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PEMB14_PUMB14_1
20050217
Product data sheet
-
9397 750 14405
-
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
9397 750 14405
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
9 of 10
11. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level
Data sheet status
[1]
Product status
[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 17 February 2005
Document number: 9397 750 14405
Published in The Netherlands
Philips Semiconductors
PEMB14; PUMB14
PNP/PNP resistor-equipped transistors; R1 = 47 k
, R2 = open
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Packing information. . . . . . . . . . . . . . . . . . . . . . 7
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 9
12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14
Contact information . . . . . . . . . . . . . . . . . . . . . 9