ChipFind - документация

Электронный компонент: PZUxB

Скачать:  PDF   ZIP

Document Outline

1.
Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
I
Total power dissipation:
310 mW
I
Tolerance series: B: approximately
5 %; B1, B2, B3: sequential, approximately
2 %
I
Small plastic package suitable for surface mounted design
I
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
I
General regulation functions
1.4 Quick reference data
[1]
Pulse test: t
p
300
s;
0.02.
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
PZUxB series
Single Zener diodes in a SOD323F package
Rev. 01 -- 7 March 2006
Product data sheet
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
F
forward voltage
I
F
= 100 mA
[1]
-
-
1.1
V
P
tot
total power dissipation
T
amb
25
C
[2]
-
-
310
mW
[3]
-
-
550
mW
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
2 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
2.
Pinning information
[1]
The marking bar indicates the cathode.
3.
Ordering information
[1]
The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.
4.
Marking
Table 2.
Pinning
Pin
Description
Simplified outline
Symbol
1
cathode
[1]
2
anode
2
1
sym068
2
1
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PZU2.4B to
PZU36B
[1]
SC-90
plastic surface mounted package; 2 leads
SOD323F
Table 4.
Marking codes
Type number
Marking code
Type number
Marking code
B
B1
B2
B3
B
B1
B2
B3
PZU2.4
G3
-
-
-
PZU10
GJ
FH
HF
KB
PZU2.7
G4
F3
H1
-
PZU11
GK
FJ
HG
KC
PZU3.0
G5
F4
H2
-
PZU12
GL
FK
HH
KD
PZU3.3
G6
F5
H3
-
PZU13
GM
FL
HJ
KE
PZU3.6
G7
F6
H4
-
PZU14
-
-
HK
-
PZU3.9
G8
F7
H5
-
PZU15
GN
FM
HL
KF
PZU4.3
G9
F8
H6
HS
PZU16
GP
FN
HM
KG
PZU4.7
GA
F9
H7
HT
PZU18
GQ
FP
HN
KH
PZU5.1
GB
FA
H8
HU
PZU20
GR
FQ
HP
KJ
PZU5.6
GC
FB
H9
HV
PZU22
GS
FR
HQ
KK
PZU6.2
GD
FC
HA
HW
PZU24
GT
FS
HR
KL
PZU6.8
GE
FD
HB
HX
PZU27
GU
-
-
-
PZU7.5
GF
FE
HC
HY
PZU30
GV
-
-
-
PZU8.2
GG
FF
HD
HZ
PZU33
GW
-
-
-
PZU9.1
GH
FG
HE
KA
PZU36
GX
-
-
-
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
3 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
5.
Limiting values
[1]
t
p
= 100
s; square wave; T
j
= 25
C prior to surge
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[3]
Soldering point of cathode tab.
7.
Characteristics
[1]
Pulse test: t
p
300
s;
0.02.
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
I
F
forward current
-
200
mA
I
ZSM
non-repetitive peak reverse
current
-
see
Table 8
and
9
P
ZSM
non-repetitive peak reverse
power dissipation
[1]
-
40
W
P
tot
total power dissipation
T
amb
25
C
[2]
-
310
mW
[3]
-
550
mW
T
j
junction temperature
-
150
C
T
amb
ambient temperature
-
65
+150
C
T
stg
storage temperature
-
65
+150
C
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
-
-
400
K/W
[2]
-
-
230
K/W
R
th(j-sp)
thermal resistance from
junction to solder point
[3]
-
-
55
K/W
Table 7.
Characteristics
T
j
= 25
C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
F
forward voltage
I
F
= 10 mA
[1]
-
-
0.9
V
I
F
= 100 mA
[1]
-
-
1.1
V
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
4 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
[1]
f = 1 MHz; V
R
= 0 V
[2]
t
p
= 100
s; square wave; T
j
= 25
C prior to surge
Table 8.
Characteristics per type; PZU2.4B to PZU5.6B3
T
j
= 25
C unless otherwise specified.
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
Maximum differential
resistance
r
dif
(
)
Reverse
current
I
R
(
A)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min
Max
I
Z
= 0.5 mA I
Z
= 5 mA
Max
V
R
(V) Typ
Max
Max
2.4
B
2.3
2.6
1000
100
50
1
-
1.6
450
8
2.7
B
2.5
2.9
1000
100
20
1
-
2.0
440
8
B1
2.5
2.75
B2
2.65
2.9
3.0
B
2.80
3.20
1000
95
10
1
-
2.1
425
8
B1
2.80
3.05
B2
2.95
3.20
3.3
B
3.10
3.50
1000
95
5
1
-
2.4
410
8
B1
3.10
3.35
B2
3.25
3.50
3.6
B
3.40
3.80
1000
90
5
1
-
2.4
390
8
B1
3.40
3.65
B2
3.55
3.80
3.9
B
3.70
4.10
1000
90
3
1
-
2.5
370
8
B1
3.70
3.97
B2
3.87
4.10
4.3
B
4.01
4.48
1000
90
3
1
-
2.5
350
8
B1
4.01
4.21
B2
4.15
4.34
B3
4.28
4.48
4.7
B
4.42
4.90
800
80
2
1
-
1.4
325
8
B1
4.42
4.61
B2
4.55
4.75
B3
4.69
4.90
5.1
B
4.84
5.37
250
60
2
1.5
0.3
300
5.5
B1
4.84
5.04
B2
4.98
5.20
B3
5.14
5.37
5.6
B
5.31
5.92
100
40
1
2.5
1.9
275
5.5
B1
5.31
5.55
B2
5.49
5.73
B3
5.67
5.92
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
5 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
Table 9.
Characteristics per type; PZU6.2B to PZU36B
T
j
= 25
C unless otherwise specified.
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
Maximum differential
resistance
r
dif
(
)
Reverse
current
I
R
(nA)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min
Max
I
Z
= 0.5 mA I
Z
= 5 mA
Max
V
R
(V) Typ
Max
Max
6.2
B
5.86
6.53
80
30
500
3
2.7
250
5.5
B1
5.86
6.12
B2
6.06
6.33
B3
6.26
6.53
6.8
B
6.47
7.14
60
20
500
3.5
3.4
215
5.5
B1
6.47
6.73
B2
6.65
6.93
B3
6.86
7.14
7.5
B
7.06
7.84
60
10
500
4
4.0
170
3.5
B1
7.06
7.36
B2
7.28
7.60
B3
7.52
7.84
8.2
B
7.76
8.64
60
10
500
5
4.6
150
3.5
B1
7.76
8.10
B2
8.02
8.36
B3
8.28
8.64
9.1
B
8.56
9.55
60
10
500
6
5.5
120
3.5
B1
8.56
8.93
B2
8.85
9.23
B3
9.15
9.55
10
B
9.45
10.55
60
10
100
7
6.4
110
3.5
B1
9.45
9.87
B2
9.77
10.21
B3
10.11
10.55
11
B
10.44
11.56
60
10
100
8
7.4
108
3
B1
10.44
10.88
B2
10.76
11.22
B3
11.10
11.56
12
B
11.42
12.60
80
10
100
9
8.4
105
3
B1
11.42
11.90
B2
11.74
12.24
B3
12.08
12.60
13
B
12.47
13.96
80
10
100
10
9.4
103
2.5
B1
12.47
13.03
B2
12.91
13.49
B3
13.37
13.96
14
B2
13.70
14.30
80
10
100
11
10.4
101
2
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
6 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
[1]
f = 1 MHz; V
R
= 0 V
[2]
t
p
= 100
s; square wave; T
j
= 25
C prior to surge
15
B
13.84
15.52
80
15
50
11
11.4
99
2
B1
13.84
14.46
B2
14.34
14.98
B3
14.85
15.52
16
B
15.37
17.09
80
20
50
12
12.4
97
1.5
B1
15.37
16.01
B2
15.85
16.51
B3
16.35
17.09
18
B
16.94
19.03
80
20
50
13
14.4
93
1.5
B1
16.94
17.70
B2
17.56
18.35
B3
18.21
19.03
20
B
18.86
21.08
100
20
50
15
16.4
88
1.5
B1
18.86
19.70
B2
19.52
20.39
B3
20.21
21.08
22
B
20.88
23.17
100
25
50
17
18.4
84
1.3
B1
20.88
21.77
B2
21.54
22.47
B3
22.23
23.17
24
B
22.93
25.57
120
30
50
19
20.4
80
1.3
B1
22.93
23.96
B2
23.72
24.78
B3
24.54
25.57
27
B
25.1
28.9
150
40
50
21
23.4
73
1
30
B
28
32
200
40
50
23
26.6
66
1
33
B
31
35
250
40
50
25
29.7
60
0.9
36
B
34
38
300
60
50
27
33.0
59
0.8
Table 9.
Characteristics per type; PZU6.2B to PZU36B
...continued
T
j
= 25
C unless otherwise specified.
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
Maximum differential
resistance
r
dif
(
)
Reverse
current
I
R
(nA)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min
Max
I
Z
= 0.5 mA I
Z
= 5 mA
Max
V
R
(V) Typ
Max
Max
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
7 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
T
j
= 25
C
PZU2.4B to PZU4.3B
T
j
= 25
C to 150
C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
Temperature coefficient as a function of
working current; typical values
PZU4.7B to PZU12B
T
j
= 25
C to 150
C
FR4 PCB, standard footprint
Fig 3.
Temperature coefficient as a function of
working current; typical values
Fig 4.
Power derating curve
V
F
(V)
0.6
1
0.8
mbg781
100
200
300
I
F
(mA)
0
0
60
0
-
2
-
3
-
1
mgl273
20
40
I
Z
(mA)
S
Z
(mV/K)
4.3
3.9
3.6
3.3
3.0
2.4
2.7
0
20
16
10
0
-
5
5
mgl274
4
8
12
I
Z
(mA)
S
Z
(mV/K)
4.7
12
11
10
9.1
8.2
7.5
6.8
6.2
5.6
5.1
T
amb
(
C)
0
200
150
50
100
006aaa687
200
100
300
400
P
tot
(mW)
0
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
8 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
8.
Package outline
9.
Packing information
[1]
For further information and the availability of packing methods, see
Section 14
.
10. Soldering
Fig 5.
Package outline SOD323F (SC-90)
04-09-13
Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 10.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing quantity
3000
10000
PZU2.4B to
PZU36B
SOD323F
4 mm pitch, 8 mm tape and reel
-115
-135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6.
Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2
)
2.10
1.60
2.80
0.60
3.05
0.50
0.95
solder lands
solder resist
occupied area
solder paste
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
9 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
11. Mounting
PCB thickness = 1.6 mm
PCB thickness = 1.6 mm
Fig 7.
FR4 PCB, standard footprint
Fig 8.
FR4 PCB, mounting pad for cathode
1 cm
2
006aaa487
40
Dimensions in mm
0.6
0.6
0.5
0.6
43.4
0.6
006aaa488
40
0.6
0.6
10
0.5
10
43.4
Dimensions in mm
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
10 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
12. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PZUXB_SER_1
20060307
Product data sheet
-
-
PZUXB_SER_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 7 March 2006
11 of 12
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
13. Legal information
13.1
Data sheet status
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term `short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.semiconductors.philips.com.
13.2
Definitions
Draft -- The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet -- A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
13.3
Disclaimers
General -- Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes -- Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use -- Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer's own risk.
Applications -- Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values -- Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale -- Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.semiconductors.philips.com/profile/terms
, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license -- Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Philips Semiconductors
PZUxB series
Single Zener diodes in a SOD323F package
Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 7 March 2006
Document identifier: PZUXB_SER_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section `Legal information'.
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14
Contact information. . . . . . . . . . . . . . . . . . . . . 11
15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12