General description

The SA56202 is a one-chip motor driver IC that is capable to drive all motors of CD or
DVD systems: spindle, sled and loading motors and actuators on the optical pick-up unit.
The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses
True-Silent PWM. This proprietary technology ensures that all 3-phase motor currents are
sinusoidal resulting in an optimally silent driver. Internal regeneration of the back-EMF of
the spindle motor enables the driver to operate in current-steering mode without using
external power-dissipating sense resistors. The driver intended for the 2-phase sled
stepper motor operates in current-steering PWM mode. In addition the IC contains four
full-bridge linear channels that can be used to drive a loading motor and 3D actuators
(focus, tracking and tilt).

The SA56202 is available in an exposed die pad HTSSOP56 package.

Features

True-Silent PWM spindle motor driver

Low heat generation due to power-efficient direct full-bridge switching of spindle motor
driver

Controlled spindle motor current during acceleration and brake

Reverse torque brake function (full bridge)

Adjustable spindle motor current limiter

Internal regeneration for EMF of spindle motor

Current-steering PWM controlled stepper motor driver for sled

Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and
tilt)

Low on-resistance D-MOSFET output power stages

Built-in thermal shutdown, thermal warning and temperature diode

Interfaces to 3 V and 5 V logic

Package with low thermal resistance to heatsink (reflowable die pad).

Applications

DVD+RW, DVD-RW, DVD-ROM and DVD-RAM

Combi

CD-ROM and CD-RW

Other compact disk media.

SA56202

One-chip motor driver

Rev. 01 -- 19 July 2004

Preliminary data sheet

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

3 of 24

Philips Semiconductors

SA56202

One-chip motor driver

Block diagram

Fig 1.

Block diagram.

001aaa429

REVERSE

DETECTION

LEVEL

SHIFT

LEVEL

SHIFT

LEVEL

SHIFT

LEVEL

SHIFT

SLED

LOGIC

CURRENT

REFERENCE

OSCILLATOR

THERMAL

SHUTDOWN

HALL BIAS

ADC

CHARGE

PUMP

MUTE/

STANDBY

FUNCTIONS

SPINDLE

LOGIC

HALL

AMP

DIODE

47 k

VINREF

SA56202

SS(DIO)

VINLD

COSC

HBIAS

RREF

REMF

RLIM

SS1(SPN)

DD1(SPN)

SS2(SPN)

DD2(SPN)

SSD

VINSPN

VINREF

DDA

CP1

CP2

CP3

CTL1

CTL2

TEMP

VINFCS
VINTRK
VINTLT
V

DD(LD)

LDO

SS(LIN)

DD(ACT)

TLTO

TRKO

FCSO

TLTO

RSLD1

RSLD2

SLDO2

SLDO1

DD(SLD)

SSA

VINSLD1

VINSLD2

47 k

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

4 of 24

Philips Semiconductors

SA56202

One-chip motor driver

Pinning information

6.1 Pinning

6.2 Pin description

Fig 2.

Pin configuration.

SA56202TW

001aaa458

DIODE

SS(DIO)

VINLD

COSC

HBIAS

RREF

REMF

RLIM

SS1(SPN)

DD1(SPN)

SS2(SPN)

DD2(SPN)

SSD

VINSPN

VINREF

DDA

CP1

CP2

CP3

CTL1

CTL2

TEMP

VINFCS

VINTRK

VINTLT

DD(LD)

LDO

SS(LIN)

DD(ACT)

TLTO

TRKO

FCSO

TLTO

RSLD1

RSLD2

SLDO2

SLDO1

DD(SLD)

SSA

VINSLD1

VINSLD2

Table 2:

Pin description

Symbol

Pin

Description

HU+

Hall input U positive

Hall input U negative

HV+

Hall input V positive

Hall input V negative

HW+

Hall input W positive

Hall input W negative

HBIAS

Hall element bias

RREF

external resistor for current reference

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

5 of 24

Philips Semiconductors

SA56202

One-chip motor driver

REMF

external resistor for EMF regeneration

RLIM

external resistor for current limit

SS1(SPN)

spindle driver ground 1

spindle driver output U

DD1(SPN)

spindle driver supply voltage 1

spindle driver output V

SS2(SPN)

spindle driver ground 2

spindle driver output W

DD2(SPN)

spindle driver supply voltage 2

frequency generator output

SSD

digital ground

VINSPN

spindle driver input voltage for spindle motor current

VINREF

reference input voltage for all motor drivers

DDA

analog supply voltage

CP1

charge pump capacitor connection 1

CP2

charge pump capacitor connection 2

CP3

charge pump capacitor connection 3

CTL1

driver logic control input 1

CTL2

driver logic control input 2

TEMP

thermal warning

VINSLD1

sled driver 1 input voltage for sled motor current

VINSLD2

sled driver 2 input voltage for sled motor current

SSA

analog ground

DD(SLD)

sled driver supply voltage

SLD2O

sled driver output 2 negative

SLDO2+

sled driver output 2 positive

RSLD2

external sense resistor for sled driver 2 current sense

SLDO1

sled driver output 1 negative

SLDO1+

sled driver output 1 positive

RSLD1

external sense resistor for sled driver 1 current sense

TLTO

tilting driver output negative

TLTO+

tilting driver output positive

TRKO

tracking driver output negative

TRKO+

tracking driver output positive

DD(ACT)

actuator drivers supply voltage

SS(LIN)

linear drivers ground

FCSO

focus driver output negative

FCSO+

focus driver output positive

LDO

loading driver output negative

LDO+

loading driver output positive

DD(LD)

loading driver supply voltage

Table 2:

Pin description

...continued

Symbol

Pin

Description

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

6 of 24

Philips Semiconductors

SA56202

One-chip motor driver

Functional description

7.1 Spindle motor control

The control input voltage on pin VINSPN is converted into a digital value by the ADC
where the voltage on pin VINREF is the midpoint reference. The transconductance gain
from input voltage V

VINSPN

to output motor current I

MOT

is:

where I

LIM

can be programmed by means of external resistor R

LIM

; see

Section 7.4

. The

motor current is described by

Figure 3

For VINSPN voltages larger than V

VINREF

the motor will accelerate with forward torque

control. For VINSPN voltages smaller than V

VINREF

the motor will brake with reverse

torque control. Because the U, V and W half-bridges of the spindle motor driver use a
direct PWM full-bridge switching scheme, the motor current can also be controlled and
limited during brake. Note that because of this active brake mechanism energy of the
motor can be recuperated back to the supply. Especially at large speeds, this can result in
currents delivered back to the supply. If the supply and/or other circuits than the motor

VINTLT

tilting driver input for tilt actuator voltage

VINTRK

tracking driver input for tracking actuator voltage

VINFCS

focus driver input for focus actuator voltage

VINLD

loading driver input for loading motor voltage

SS(DIO)

temperature diode ground

DIODE

diode for temperature readout

COSC

external capacitor for internal oscillator

Table 2:

Pin description

...continued

Symbol

Pin

Description

Fig 3.

Spindle motor current as a function of control input voltage on pin VINSPN.

m(SP N

)

MOT

VINSPN

VINREF

-------------------------------------------------

LIM

VINREF

---------------------

001aaa431

LIM

MOT

VINSPN

LIM

reverse

torque

brake

VINREF

forward

torque

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

7 of 24

Philips Semiconductors

SA56202

One-chip motor driver

driver do not use this recuperated current, than the supply voltage can possibly rise to
unacceptable values. In that case it is recommended to lower the spindle current during
brake by means of the VINSPN setting.

Upon detection of reverse detection all U, V and W driver outputs are connected to
V

DD(SPN)

. This short brake prevents the motor of spinning backwards.

7.2 Internal regeneration of back-EMF spindle motor

The spindle motor driver uses the information from the Hall sensors to internally
regenerate the back-EMF of the motor. See

Figure 4

Rotational speed

is derived from the Hall event frequency. Multiplying

with the k-factor

of the motor gives the back-EMF voltage V

EMF

. This V

EMF

is added to the current-limit

scaled spindle input voltage V

VINSPN

. This sum V

MOT

steers the PWM outputs U, V and W.

The result is that the input voltage V

VINSPN

sets the current through the motor. This

explains how the SA56202 spindle motor driver exhibits a current control transfer function
without using external sense resistors.

The simplified motor schematic in

Figure 5

shows the series resistance and back-EMF

voltage of the motor.

Fig 4.

Regeneration of back-EMF voltage spindle motor.

Fig 5.

Simplified spindle motor schematic.

001aaa438

PWM

SPEED

U
V
W

Hall U

spindle
motor

MOT

= V

+ V

EMF

= R

EMF

Hall V
Hall W

DIGITAL DOMAIN

VINSPN

torque

control

signal

LIM

maximum

motor

current

EMF

motor

k-factor

ANALOG DOMAIN

001aaa450

EMF

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

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Philips Semiconductors

SA56202

One-chip motor driver

Figure 6

depicts the motor voltages V

and V

during accelerating and braking. The

back-EMF voltage is part of these motor voltages.

7.3 Sine generation using True-Silent signals

For the phase relation between the Hall inputs and the spindle outputs in forward rotation,
see

Figure 7

. These are the signal shapes in sine mode using our True-Silent PWM

technology. The particular shape of the 120

symmetrical U, V and W steering voltages

are because of improved drive strength and improved power efficiency. The drive strength
is improved because with this signal shape a 15 % larger sine can be fit within the supply
rails compared to direct-written sine signals. Also the power efficiency is improved
because this signal shape has 33 % less switching losses compared to a direct-written
sine.

The result is that the motor currents (and motor torques) are pure sine waves generated in
such a way that the motor is driven optimally silent, optimally power efficient and with
maximum driving strength.

Fig 6.

Motor voltages when accelerating and braking with constant motor current.

001aaa432

accelerating

braking

EMF

DD(SPN)

max

9397 750 12772

Preliminary data sheet

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Philips Semiconductors

SA56202

One-chip motor driver

7.4 Programming R

LIM

If the supply is connected between the terminals of a non-running spindle motor, then
usually a current will flow that is too large. The motor current can be limited to a value I

LIM

This I

LIM

can be programmed by means of R

LIM

. In order to calculate the required R

LIM

first a typical maximum motor current I

MAX

needs to be determined:

Fig 7.

Phase relation between Hall input signals and spindle motor driver output
voltages U(V), V(V), W(V) and motor currents U(I), V(I), W(I) in forward rotation
mode.

001aaa433

HALL U

U(V)

U(I)

V(V)

V(I)

W(V)

W(I)

HALL W

HALL V

MAX

DD SPN

(

)

motor

switches

--------------------------------------------

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

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Philips Semiconductors

SA56202

One-chip motor driver

LIM

can be chosen to be a fraction of this maximum current I

MAX

. By making the ratio

between R

LIM

(connected to pin 10) and R

REF

(connected to pin 8) this same fraction, I

LIM

is programmed as expressed in the following formula:

So by choosing I

LIM

, R

LIM

needs to be:

Figure 8

shows the limit current as a function of R

LIM

with R

REF

= 47 k

During accelerating and braking the motor current will not exceed I

LIM

. I

LIM

also sets the

transconductance gain I

LIM

VINREF

of the spindle driver.

7.5 Programming R

EMF

The back-EMF voltage is internally regenerated. The ratio between R

EMF

and R

REF

used to scale the internal EMF regeneration. The value of external resistor R

EMF

depends

on the type of motor (k-factor and number of pole pairs N

) and the motor supply voltage

DD(SPN)

. The following formula should be used to determine the R

EMF

resistor:

with k in units Nm/A.

7.6 FG generator

The raw zero-crossings of the Hall sensors are first filtered and debounced before being
passed to the FG generator. The FG generator toggles its output at every filtered Hall
zero-crossing. For three Hall sensors this means that the motor frequency is linked to the

FG frequency by:

Fig 8.

Limit current I

LIM

as a function of external resistor R

LIM

LIM

REF

-------------

MAX

LIM

MAX

------------

REF

LIM

)

001aaa434

100

LIM

(% of I

MAX

)

EMF

2.6

REF

DD SPN

(

)

--------------------------------------------------

motor

-------------------

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

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Philips Semiconductors

SA56202

One-chip motor driver

where N

indicates the number of pole pairs of the motor. FG has an open-drain output

for easy interfacing to 3 V and 5 V logic.

7.7 Sled motor driver

Two current-steering PWM channels are available to drive a stepper motor. Per channel
an external sense resistor R

sense

is used that is connected to ground. A peak-current

control loop is implemented that modulates the duty cycle of the PWM signal. See

Figure 9

The clock generator has a nominal frequency of f

osc

/256 = 70 kHz. See

Figure 10

for the

transfer function from input voltage V

VINSLD

to output current at a typical R

sense

of 0.5

Input-to-output transconductance gain can be scaled down by connecting an external
resistor R

ext

in series with the input VINSLD.

Both limit current and transconductance gain are related to R

sense

in the following way:

Transconductance gain,

Limit current,

Fig 9.

Peak-current control architecture of stepper motor driver.

Fig 10. Transfer function of stepper motor driver.

001aaa435

CLOCK

70 kHz

LOGIC
DRIVE

DRIVER

VINSLD

Rsense

Rext

47 k

VINREF

input amplifier

VINREF

001aaa436

VINSLD

VINREF

(V)

1 A

1 A/V

1 A

OUT

(A)

dead zone

30 mV

--------

sense

------------------------

LIM

sense

------------------------

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

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Philips Semiconductors

SA56202

One-chip motor driver

7.8 Loading motor driver

One of the linear channels is available to drive a DC loading motor. Pin V

DD(LD)

is used to

set the supply voltage for the loading motor driver.

Figure 11

depicts the voltage-steering

bridge topology of the SA56202.

7.9 Actuator motor drivers

Three linear channels are available to drive 3D actuators: focus, tracking and tilt. A pin
V

DD(ACT)

is used to set the supply voltage for these actuator drivers. The voltage-steering

bridge topology is the same as depicted in

Figure 11

. The mismatch of the voltage gain of

these 3 linear channels is guaranteed to be less than 5 %.

7.10 Charge pump

The on-board charge pump generates a regulated voltage of typically 18.2 V by using the
V

DD(SPN)

supply voltage. This boosted voltage is used to turn on the upper n-type DMOS

transistors of the output stages of the spindle driver, sled driver, loading driver and
actuator drivers. Recommended values for the pump-and-hold capacitor are 10 nF and
22 nF respectively (see also application diagram

Figure 13

). The charge pump should not

be loaded with other components or circuitry than these capacitors.

7.11 Thermal protection

If the junction temperature of the SA56202 exceeds 150

C, then a thermal warning signal

is given at pin TEMP. TEMP has an active-LOW open-drain output for easy interfacing to
3 V and 5 V logic. The temperature hysteresis for the thermal warning is 10

C. If the

junction temperature of the IC rises to 160

C, then a thermal shutdown is activated that

sets all power outputs in 3-state. The temperature hysteresis for the thermal shutdown is
30

C. As soon as the thermal shutdown deactivates at 130

C, all motor drivers continue

normal operation.

Fig 11. Voltage-steering bridge topology of linear driver.

001aaa437

47 k

188 k

LDO

DD(LD)

VINREF

VINLD

188 k

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

13 of 24

Philips Semiconductors

SA56202

One-chip motor driver

7.12 Oscillator

The RC oscillator uses two external components (R

REF

and C

OSC

) to fix its frequency at

18 MHz. R

REF

is used to generate a reference current. This reference current is used to

charge and discharge C

OSC

. The nominal oscillation frequency f

osc

is 18 MHz with

REF

= 47 k

(2 % tolerance) and C

OSC

= 70 pF (5 % tolerance). These values are fixed.

The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference
current derived from R

REF

is also used for R

LIM

and R

EMF

. R

REF

should always be

connected.

7.13 Muting functions

Pins CTL1 and CTL2 are used to mute certain parts of the IC. See

Table 3

. In this table off

means 3-state.

Limiting values

Table 3:

Muting functions

CTL1

CTL2

Loading
motor

Sled motor Others

Spindle mode

off

FG and Hall bias on

off

block commutation

off

True-Silent commutation

Table 4:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Voltages

DD(SPN)

spindle driver supply voltage

0.5

+16

DD(SLD)

sled driver supply voltage

0.5

+16

DD(LD)

loading driver supply voltage

0.5

+16

DD(ACT)

actuator drivers supply
voltage

0.5

+16

DDA

system supply voltage

0.5

+6.5

Currents

DD(SPN)

current on pins 12, 14 and 16

2.1

DD(SLD)

current on pins 33, 34, 35, 36,
37 and 38

1.2

DD(ACT)

current on pins 39, 40, 41, 42,
45, 46, 47 and 48

2.0

HALL

current on pins 1, 2, 3, 4, 5
and 6

HBIAS

current on pin 7

+100

RPROG

current on pins 8, 9 and 10

current on pins 18 and 28

+10

DIG

current on pins 26 and 27

CPUMP

current on pins 23, 24 and 25

+20

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

14 of 24

Philips Semiconductors

SA56202

One-chip motor driver

[1]

Class 1, equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor.

[2]

Class 1, equivalent to discharging a 200 pF capacitor through a 0.75

H coil and a 10

resistor.

Thermal characteristics

STEER

current on pins 20, 21, 29, 30,
50, 51, 52 and 28

DIODE

current on pins 54 and 55

OSC

current on pin 56

+20

General

stg

storage temperature

+150

amb

ambient temperature

+85

junction temperature

+160

Electrostatic discharge voltage

esd(HBM)

human body model

pins 1 to 6 and 8 to 56

[1]

1500

pin 7

1000

esd(MM)

machine model

[2]

150

Table 4:

Limiting values

...continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 5:

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

th(j-a)

thermal resistance from junction to
ambient

multilayer PCB,
no airflow

K/W

Fig 12. Maximum dissipation as a function of ambient temperature.

001aaa428

amb

(

150

100

(W)

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

15 of 24

Philips Semiconductors

SA56202

One-chip motor driver

10. Characteristics

Table 6:

Characteristics

amb

= 25

C; V

DDA

= 5 V; V

DD(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Spindle motor driver

DDA

system supply voltage

4.5

5.0

5.5

DD(SPN)

motor supply voltage

4.5

input offset voltage Hall amplifier

3.5

+3.5

input voltage range Hall amplifier

DDA

i(dif)(p-p)

Hall amplifier differential input
voltage (peak-to-peak value)

HBIAS

voltage on pin HBIAS

HBIAS

= 32 mA

0.6

0.9

osc

oscillator frequency

REF

= 47 k

;

OSC

= 70 pF

MHz

PWM

PWM frequency

REF

= 47 k

;

OSC

= 70 pF

kHz

ds(on)

D-MOSFET on-resistance (high or
low)

0.35

0.50

VINREF

reference voltage on pin VINREF

1.2

1.65

2.5

VINSPN

torque control voltage on pin
VINSPN

DDA

Stepper motor driver

DDA

supply voltage

4.5

5.0

5.5

DD(SLD)

motor supply voltage

4.5

DD(SLD)

motor current limit

sense

= 0.5

0.85

1.0

1.15

PWM

PWM frequency

REF

= 47 k

;

OSC

= 70 pF

kHz

i(trip)

input dead-zone trip level

transconductance gain

sense

= 0.5

0.85

1.0

1.15

A/V

ds(on)

D-MOSFET on-resistance (high or
low)

1.0

1.4

Loading motor driver

DD(LD)

motor supply voltage

4.5

DD(LD)

current limit (high or low)

0.9

1.2

2.0

output offset voltage

100

+100

voltage gain

16.8

17.6

18.4

ds(on)

D-MOSFET on-resistance (high or
low)

0.6

0.9

Actuator driver (focus, tracking and tilt)

DD(ACT)

supply voltage

4.5

DD(ACT)

current limit (high or low)

0.9

1.2

2.0

output offset voltage

+55

voltage gain

16.8

17.6

18.4

v(m)

gain mismatch between 3 channels

9397 750 12772

Preliminary data sheet

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Philips Semiconductors

SA56202

One-chip motor driver

ds(on)

D-MOSFET on-resistance (high or
low)

0.6

0.9

General

CP3

charge pump output voltage

18.2

HIGH-level input voltage digital on
pins 26 and 27

2.0

LOW-level input voltage digital on
pins 26 and 27

0.8

LOW-level output voltage digital on
pins 18 and 28

= 2 mA

0.5

DDA(q)

DDA

quiescent current

CTL1 = H; CTL2 = H

DD(SPN)(q)

DD(SPN)

quiescent current

CTL1 = H; CTL2 = H

DD(SLD)(q)

DD(SLD)

quiescent current

CTL1 = H; CTL2 = H

DD(ACT)(q)

DD(ACT)

quiescent current

CTL1 = H; CTL2 = H

STB(tot)

total standby current

CTL1 = L; CTL2 = L

4.5

TEMP

thermal warning temperature

150

hys(TEMP)

thermal warning hysteresis

thermal shutdown temperature

160

hys(SD)

thermal shutdown hysteresis

Table 6:

Characteristics

...continued

amb

= 25

C; V

DDA

= 5 V; V

DD(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

17 of 24

Philips Semiconductors

SA56202

One-chip motor driver

11. Application information

For R

EMF

and R

LIM

see

Section 7

Fig 13. Application diagram.

001aaa430

REVERSE

DETECTION

LEVEL

SHIFT

LEVEL

SHIFT

LEVEL

SHIFT

LEVEL

SHIFT

SLED

LOGIC

CURRENT

REFERENCE

OSCILLATOR

THERMAL

SHUTDOWN

0 V

12 V

0 V

HALL BIAS

ADC

HALL V

HALL U

HALL W

CHARGE

PUMP

MUTE/

STANDBY

FUNCTIONS

MUTE/

SELECT

SPINDLE

LOGIC

HALL

AMP

3.3 V

47 k

EMF

REF

LIM

47 k

3.3 V

22 nF

10 nF

5 V

1.65 V

spindle input

sled motor

spindle

motor

0 V

47 k

VINREF

150

0 V

tray motor in
focus in
tracking in
tilt in

tray
motor

focus
actuator

12 V

70 pF

12 V

0 V

sled in2

sled in1

47 k

tracking
actuator

tilt
actuator

0 V

5 V

0 V

0.5

SA56202

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

18 of 24

Philips Semiconductors

SA56202

One-chip motor driver

12. Package outline

Fig 14. Package outline.

UNIT

max.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

1.2

0.15
0.05

1.05
0.80

0.25

0.27
0.17

0.20
0.09

4.3
4.1

0.5

8.3
7.9

0.4
0.1

8
0

0.08

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.8
0.4

SOT793-1

143E36T

MO-153

03-03-04

(1)

14.1
13.9

(2)

6.2
6.0

(1)

4.3
4.1

detail X

(A3)

exposed die pad

pin 1 index

HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads;
body width 6.1 mm; exposed die pad

SOT793-1

2.5

5 mm

scale

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

19 of 24

Philips Semiconductors

SA56202

One-chip motor driver

13. Soldering

13.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

13.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

13.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

20 of 24

Philips Semiconductors

SA56202

One-chip motor driver

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

13.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 7:

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

21 of 24

Philips Semiconductors

SA56202

One-chip motor driver

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

Philips Semiconductors

SA56202

One-chip motor driver

9397 750 12772

Preliminary data sheet

Rev. 01 -- 19 July 2004

23 of 24

15. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

16. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

17. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

18. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 19 July 2004

Document order number: 9397 750 12772

Published in The Netherlands

Philips Semiconductors

SA56202

One-chip motor driver

19. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 6

7.1

Spindle motor control . . . . . . . . . . . . . . . . . . . . 6

7.2

Internal regeneration of back-EMF spindle
motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.3

Sine generation using 3-phase PWM signals . . 8

7.4

Programming R

LIM

. . . . . . . . . . . . . . . . . . . . . . 9

7.5

Programming R

EMF

. . . . . . . . . . . . . . . . . . . . . 10

7.6

FG generator . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.7

Sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11

7.8

Loading motor driver. . . . . . . . . . . . . . . . . . . . 12

7.9

Actuator motor drivers . . . . . . . . . . . . . . . . . . 12

7.10

Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12

7.11

Thermal protection . . . . . . . . . . . . . . . . . . . . . 12

7.12

Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.13

Muting functions . . . . . . . . . . . . . . . . . . . . . . . 13

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13

Thermal characteristics. . . . . . . . . . . . . . . . . . 14

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15

Application information. . . . . . . . . . . . . . . . . . 17

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19

13.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19

13.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20

13.5

Package related soldering information . . . . . . 20

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Contact information . . . . . . . . . . . . . . . . . . . . 23

Document Outline

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Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SA56202TW