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Электронный компонент: SA900

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Philips
Semiconductors
SA900
I/Q transmit modulator
Preliminary specification
1997 Sept 16
INTEGRATED CIRCUITS
IC17 Data Handbook
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
DO NOT DISTRIBUTE WITHOUT ECN DATED AFTER Sept 16, 1997
2
1997 Sept 16
853-
DESCRIPTION
The SA900 is a monolithic high performance, multi-function transmit
modulator for use in cellular radio applications, fabricated in QUBiC
BiCMOS technology. The SA900 features both analog (AMPS)
mode and complex, I/Q digital (NADC IS136) mode quadrature
modulation functions, a PLL synthesizer with VCO, crystal oscillator,
programmable prescalers and Gilbert cell multiplier phase detector
with programmable charge pump output. The DUALTX output can
be used in DUAL mode cellular phone applications with the AMPS
and NADC modulation being applied to the I/Q baseband inputs.
The DUALTX output also provides 6-bit power control with 40dB of
gain control in 0.63dB steps. In addition, buffered crystal oscillator
programmable prescaler outputs are provided to support system
clock reference needs. Programming of the SA900 functions are
realized by a high speed 3-wire serial interface. The SA900 can be
programmed into a sleep mode (low current mode providing crystal
oscillator and Master Clock functions), a standby mode (providing
crystal oscillator, Master Clock, System Clock 1 and Transmit LO
buffer functions), and the AMPS mode and the DUAL mode
configurations.
FEATURES
V
CC
= 4.0V
Tx output frequency = 900MHz
Direct modulation of RF
DUAL mode, on-chip PA control
I/Q modulator
Single sideband quadrature LO generation with no external
adjustments required
On-chip crystal oscillator with 3 buffered outputs
AMPS/TACS compatible
On-chip VCO
PIN CONFIGURATION
BE Package
45
46
47
48
1
2
3
4
5
6
7
13 14
15 16 17 18 19
25
26
27
28
29
30
42
43
44
31
32
33
34
35
36
20
21 22 23 24
8
9
10
11
12
39
40
41
37
38
GND
TXLO_2
TXLO_1
GND
Vcc
TANK_1
TANK_2
Vcc
PHSOUT
GND
XTAL_1
Vcc
GND
DUALTX
GND
Vcc
AMPSTX
GND
Vcc
GND
Vcc
Vcc
GND
Vcc
LO_2
LO_1
GND
Vcc
I
I
Q
Q
GND
Vcc
GND
XT
AL_2
Vcc
CLK1
GND
CLK2
GND
MCLK
CLKSET
DA
T
A
CLOCK
STROBE
TXEN
IPEAK
SR00636
Figure 1. Pin Configuration
Selective power-down
Low power AMPS/TACS mode
Low power dual mode NADC
48-Pin TQFP package
APPLICATIONS
North American Digital Cellular (TDMA IS-136)
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE RANGE
ORDER CODE
DWG #
48-Pin Plastic Low Profile Quad Flat Package (LQFP)
-40 to +85
C
SA900BE
SOT313-2
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
3
BLOCK DIAGRAM
3/1
4/5/1
2/1
SM1
SM2
X
Y
SM1
SM2
CONV2
XTAL
OSC
CONTROL
LOGIC
B8/1
A8/1
N
BIAS
LPF
PHS
DET
LPF
LPF
VGA
CONTROL
VGA
PA
DUALTX
AMPSTX
PA
AD
AD
AD
TXEN
STROBE
CLOCK
DATA
CLKSET
MCLK
CLK2
CLK1
TXLO_2
TXLO_1
TANK_1
TANK_2
PHSOUT
IPEAK
XTAL_1
XTAL_2
LO_2
LO_1
I
I
Q Q
VCO
IMAGE
REJECT
MIXER
TXLO
VCO
SE
N<0:1>
AD
SM1
SM2
Y
X
BG
2
6
PHASE
SHIFT
NETWORK
SR00637
Figure 2. Block Diagram
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
4
PIN DESCRIPTIONS
Pin
Description
I
Non-inverting I Mod Signal
I
Inverting I Mod Signal
TXLO_1/2
Second LO Input (differential/single-ended input)
DUALTX
RF output (850MHz) digital (DUAL) mode, complex modulated output
Q
Non-inverting Q Mod Signal
Q
Inverting Q Mod Signal
CLK1
Buffered oscillator output (XO
3/
1)
MCLK
Buffered oscillator output (XO
4/
5/
1)
CLK2
Buffered oscillator output (XO
2/
1)
AMPSTX
RF output (850MHz) AMPS mode
V
CC
+5V
DC
power supply
GND
Ground
Data
Serial data input
Clock
Serial clock input
Strobe
Data strobe input
TXEN
AMPS and Dual Mode transmit enable
CLKSET
Program control pin for MCLK prescaler
XTAL1
Crystal oscillator base input
XTAL2
Crystal oscillator emitter output
PHSOUT
Phase comparator charge pump output
TANK_1
VCO differential tank
TANK_2
VCO differential tank
LO_1/2
Buffered differential TXLO output
I
PEAK
Phase comparator current programming
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
5
1
4
11
16
18
25
28
30
33
35
37
39
45
48
5
8
14
27
29
32
36
38
44
26
GND_LO
GND
GND
GND
GND
GND_CTRL
GND
GND
GND
GND
GND
GND
GND
GND
2
3
V
CC
_LO
V
CC
_CTRL
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
6
7
V
CC
V
CC
9
V
CC
0.1/6.4 mA
0.1/6.4 mA
12
13
V
CC
V
CC
50
50
SR00638
Figure 3. Pin Diagrams
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
6
19
V
CC
17
15
20
V
CC
500
24
V
CC
500
23
22
21
31
V
CC
30
34
600
V
CC
42
43
V
CC
V
CC
40
41
680
680
47
V
CC
46
20
SR00639
Figure 4. Pin Diagrams (cont.)
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
7
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNITS
V
CC
Supply voltage
-0.3 to +6
V
V
IN
Voltage applied to any other pin
-0.3 to (V
CC
+ 0.3)
V
P
D
Power dissipation, T
A
= 25
C (still air)
600
mW
T
JMAX
Maximum operating junction temperature
150
C
P
MAX
Maximum power input/output
+10
dBm
T
STG
Storage temperature range
65 to +150
C
NOTE:
1. Maximum dissipation is determined by the operating ambient temperature and the thermal resistance,
JA
.
48-pin LQFP:
JA
= 67
C/W
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
RATING
UNITS
V
CC
Supply voltage
3.9 to 5.1
V
T
A
Operating ambient temperature range
-40 to +85
C
T
J
Operating junction temperature
-40 to +105
C
DC ELECTRICAL CHARACTERISTICS
V
CC
= +4.0V, T
A
= 25
C; unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
CC
Power supply range
3.9
5.1
V
Sleep mode
3.1
I
CC
Supply current
Standby mode
8.2
mA
I
CC
Supply current
AMPS mode
27.5
mA
DUAL mode
64
I / I
In-phase differential baseband input
DC
0.5V
CC
V
Q / Q
Quadraphase differential baseband input
DC
0.5V
CC
V
4
V
CC
CLKSET
Divide by 4/5/1
5
0.5V
CC
V
1
0
V
IL
Clock, data, strobe, TXEN
Input low
0.3
0.3V
CC
V
V
IH
Clock, data, strobe, TXEN
Input high
0.7V
CC
V
CC
+0.3
V
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
8
AC ELECTRICAL CHARACTERISTICS
V
CC
= +4.0V, T
A
= 25
C; TANK_1 = 120MHz @ 0 dBm; XO_REF = 30MHz @ 5 dBm; TxLO2 = 13 dBm, unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input power
-13
-10
1
dBm
TXLO_1/2
Transmit LO input (AC couple) (50
)
VSWR (50
)
2:1
dBm
Frequency range
900
1040
MHz
TANK_1/2
VCO tank differential inputs
Frequency range
90
1
120
140
1
MHz
PHSOUT
Phase detector charge pump output
Output level
0.5
V
CC
0.5
V
I
PHSOUT programming
R
SET
= 24k
, AD=0
200
300
400
A
I
PEAK
PHSOUT programming
R
SET
= 24k
, AD=1
0.9
1.2
1.5
mA
XTAL 1
XO transistor base
XO frequency
10
1
30
45
1
MHz
XTAL_1
XO transistor base
External drive
150
1
350
500
1
mV
P-P
CLK1
XO divide 3/1, power down SM1=0, 50%
duty cycle
Frequency range
3.33
1
30
45
1
MHz
3, X=1,
1, X=0
Output level, 5k
|| 7pF
0.7
1
1.4
V
P-P
CLK2
XO divide 2/1, power down SM2=0
Frequency range
5
1
30
45
1
MHz
CLK2
2, Y=1,
1, Y=0
Output level, 5k
|| 7pF
0.7
1
1.4
V
P-P
XO divide 4/5/1, 50% duty cycle
Frequency range
2
1
45
1
MHz
MCLK
4, CLKSET = V
CC
,
5, CLKSET = 0.5V
CC
,
1, CLKSET = 0V
Output level, 5k
|| 7pF
0.7
1
1.4
V
P-P
Serial data clock input, 33% duty cycle
Max clock rate
10
1
MHz
CLOCK
Serial interface (CMOS levels)
Logic LOW
0.3V
CC
1
V
DATA, CLOCK, STROBE, TXEN
Logic HIGH
0.7V
CC
V
AMPS output, SE=1, AD=0, TXEN=1 (AC
couple)
Frequency range
820
860
MHz
VSWR
2:1
Output level
1.5
+2
dBm
869 to 894MHz
-104
dBm
824 to 849MHz
-47
dBc
AMPSTX
Spurious output
2 to 824MHz
-41
dBc
849 to 869MHz
-41
dBc
894MHz to 8.49GHz
-41
dBc
TXLO and harmonics
-21
dBc
Adjacent channel noise power
@30kHz
-95
dBc/Hz
Alternate channel noise power
@60kHz
-101
dBc/Hz
Broadband noise power
869 to 894MHz
-136
dBm/Hz
DUAL output, SE=1, AD=1, TXEN=1 (with
external matching Figure 9)
Frequency range
820
920
2
MHz
DUALTX
VSWR
2:1
DUALTX
Output level (avg) (I and Q
quad, 0dB VGA)
0
+2
dBm
Gain flatness
1
dB
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
9
AC ELECTRICAL CHARACTERISTICS
(continued)
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DUALTX
3rd order
-35
-42
dBc
(cont.)
Linearity (0dB VGA, I and Q inphase)
5th order
-55
dBc
7th order
-65
dBc
Carrier suppression (I and Q quadrature)
VGA = 0dB
-35
-45
dBc
Carrier suppression (I and Q quadrature)
VGA = 40dB
-28
-33
dBc
Sideband suppression
I and Q quadrature
-35
-45
dBc
869 to 894MHz
104
dBm
824 to 849MHz
47
dBc
Spurious output
2 to 824MHz
41
dBc
849 to 869MHz
41
dBc
894MHz to 8.49GHz
41
dBc
TXLO and harmonics
21
dBc
Broadband noise (0dB VGA)
869 to 894MHz
136
dBm/Hz
Broadband noise (0dB VGA)
935 to 960MHz
136
dBm/Hz
Adjacent channel noise power
@30kHz
95
dBc/Hz
Alternate channel noise power
@60kHz
101
dBc/Hz
Max frequency
0.8
2
1
MHz
Q/Q
Baseband quadrature differential input
Differential modulation level
0.6
1
0.8
1.0
1
V
P-P
Differential input impedance
10
1
k
Max frequency
0.8
2
1
MHz
I/I
Baseband inphase differential input
Differential modulation level
0.6
1
0.8
1.0
1
V
P-P
Differential input impedance
10
k
Buffered TXLO differential outputs (AC
coupled)
Frequency range
900
1040
MHz
VSWR (single-ended)
2:1
LO_1/2
Output impedance
single-ended
50
_
Output impedance
differential
100
Output level
single-ended, 50
50
90
mV
P-P
Out ut level
differential, 100
100
180
mV
P-P
NOTES:
1. Guaranteed by design.
2. Needs a different matching component. Max test frequency is 850MHz with test circuit shown in Figure 11.
FUNCTIONAL DESCRIPTION
Dual Mode Operation
The SA900 transmit modulator provides direct single sideband
quadrature modulation of the difference of the TXLO and VCO
frequencies, while providing quadrature LO signals for the I/Q
modulator. The quadrature LO signals are modulated with high
linearity by the baseband inphase (I) and quadrature (Q) signals.
The summed modulator output produces the lower sideband, while
rejecting the upper sideband. The I and Q inputs also provide DC
biasing for the modulator inputs. The summed output of the
modulator goes to a variable gain amplifier (VGA) to control the
output level, it has 40.0dB of attenuation control range, with 0.63dB
steps. The power control function is programmed by means of a
6-bit word (see Table 3). The VGA output drives the power amp
output stage to provide +2dBm average minimum power level (at
0dB power control) into 50
, in conjunction with external matching
components on DUALTX. The AD (AMPS/DUAL) and the SE
(synthesizer enable) bit control the power up/down of the DUAL
mode function. The transition of the TXEN, from low to high turns
on the modulator. The falling edge of the TXEN signal disables the
synthesizer and modulator. The TXLO is a system supplied LO
signal. The SA900 buffers the TXLO signal (LO_1/2) for use with
the system synthesizer (such as the SA7025) to form the system LO
synthesizer loop. The DUAL mode can also be used for AMPS
operation. The AMPS and DUAL mode modulation is generated by
the system DSP IC to provide the required I/Q baseband modulation
for the SA900. The DUAL output provides low broadband noise
output power (so that the receiver sensitivity is not degraded) and
high linearity to meet cellular phone system needs. Table 1 provides
the VGA power control limits.
The SA900 DUALTX output is externally matched with either a shunt
inductor to V
CC
and a series capacitor or a shunt inductor to V
CC
and a series inductor. This matches the DUALTX output to 50
.
Values of the matching components are dependent on PCB layout,
typical values are shown in Figure 9.
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
10
Table 1.
VGA Power Control Limits
VGA
Min.
Typ.
Max.
Relative VGA
0
0
0
0
0
1
-1
-.63
-.2
0
2
-1
-.63
-.2
1
3
-1
-.63
-.2
2
4
-1
-.63
-.2
3
5
-1
-.63
-.2
4
6
-1
-.63
-.2
5
7
-1
-.63
-.2
6
15
-6.6
-5
-3
7
23
-6.6
-5
-3
15
31
-6.6
-5
-3
23
39
-6.6
-5
-3
31
47
-6.6
-5
-3
39
55
-6.6
-5
-3
47
63
-6.6
-5
-3
55
63
-43.2
-40.4
-37.2
0
1. Guaranteed to be monotonic.
AMPS Mode Operation
The SA900 can be configured to operate in the AMPS mode, where
FM modulation is applied to the SA900's VCO. For the AMPS
mode, the VCO is configured with the proper synthesizer bandwidth
to allow the application of the AMPS modulation to the VCO varactor
tuned tank circuit. The modulated VCO signal is input into an image
reject mixer along with the TXLO signal, where the upper sideband
is rejected. This single sideband modulated signal then drives the
AMPS output power amplifier. The PA provides +2dBm power level
into 50
, with no external matching components required. The AD
(AMPS/DUAL) and the SE (synthesizer enable) bit control the power
up/down of the AMPS mode function. The transition of the TXEN
signal from low to high turns on the modulator. The falling edge of
TXEN signal disables the synthesizer and the modulator.
Synthesizer Operation
The SA900 synthesizer is comprised of the differential VCO circuit,
with external tank components, the Gilbert cell multiplier phase
detector with programmable charge pump current, crystal oscillator
and programmable prescalers. The charge pump output drives an
external second order loop filter. The output of the loop filter is used
to provide the control voltage to the VCO tuning varactor to
complete the PLL synthesizer. The synthesized VCO output
frequency is mixed with the TXLO signal to generate the transmit LO
from the lower sideband (the difference of the VCO and TXLO
frequencies). The output of VCO is fed to a programmable /N
prescaler with user selectable divides of 6, 7, 8 and 9 (all divides
configured to provide 50% duty cycle). The output of the /N divider
drives the A8/1 prescaler. The A8/1 divide is selected by the AD
control bit (AD=1 for /1, and AD=0 for /8). The output of the divide
A8/1 is fed into one input of the phase detector. The reference input
for the phase comparator is generated from the crystal oscillator
(XO) output from the B8/1 prescaler. The B8/1 divide is selected by
the AD control bit (AD=0 for /8, and AD=1 for /1). The phase
detector compares the prescaled XO reference phase to the VCO
prescaled phase, to generate a charge pump output current
proportional to the phase error. The phase detector, a Gilbert cell
multiplier type, having a linear output from 0 to
(
/2
/2). The
charge pump peak output current is programmable from 100
A for
the AMPS mode (AD=0) to a maximum of 6.4mA for the DUAL
mode (AD=1) by way of an external current setting resistor placed
from I
PEAK
to circuit ground. The typical loop filter network is shown
in Figure 5. The charge pump current output is programmed by
AD
+
0
I
OUT
+
6
@
1.25V
R
SET
AD
+
1
I
OUT
+
24
@
1.25V
R
SET
where R
SET
is placed between I
PEAK
and GROUND.
The PLL frequency is determined by
VCO
+
XO
@
N
@
(
A8
1
)
(
B8
1
)
where N=6, 7, 8, 9 and A8/1 and B8/1 are controlled by the AD bit
(AD=1 A8/1 and B8/1 are divide by 1, AD=0 A8/1 and B8/1 are
divide 8).
Table 2.
Data Word Format
Mnemonics
Bits
Function
A0
1 (MSB)
Address bit 0 (1)
A1
2
Address bit 1 (0)
A2
3
Address bit 2 (1)
A3
4
Address bit 4 (1)
PC0
5
Power control bit 0
PC1
6
Power control bit 1
PC2
7
Power control bit 2
PC3
8
Power control bit 3
PC4
9
Power control bit 4
PC5
10
Power control bit 5
N0
11
Divide N bit 0
N1
12
Divide N bit 1
AD
13
AMPS/DUAL mode select bit
SE
14
Synthesizer enable bit
NA
15
NA
SM1
16
Sleep mode 1 control bit
SM2
17
Sleep mode 2 control bit
X
18
Divide 3/1 control bit
Y
19
Divide 2/1 control bit
NA
20
NA
NA
21
NA
NA
22
NA
NA
23
NA
NA
24 (LSB)
NA
VCO Operation
The VCO is designed to operate from 90MHz to 140MHz. The VCO
tank is configured using a parallel inductor and a dual common
cathode tuning varactor diodes. DC blocking capacitors are used to
isolate the varactor
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
11
control voltage from the VCO tank DC bias voltages. The VCO
tuning voltage is generated from the output of the PLL loop filter.
The VCO tank configuration is shown in Figure 6.
Crystal Oscillator (XO) Operation
For cellular radio applications, the SA900 will most likely utilize an
external reference TCXO in order to provide the frequency stability
necessary to operate to system requirements. The output of the
system TCXO can be AC coupled to the XTAL_1 input. However,
for applications that do not require such accuracy the XO circuit can
be configured as a Colpitts type oscillator with the addition of two
external capacitors along with the reference crystal and a trim
capacitor as shown in Figure 7.
Programmable Clock Outputs
The SA900 generates three buffered XO outputs used for external
reference signals. The XO feeds three sets of programmable
prescalers, the prescaler outputs are buffered to provide the CLK1,
CLK2 and MCLK signals. The CLK1 signal is a selectable divide 3/1
(X=1 divide 3, X=0 divide 1), 50% duty cycle, of the XO reference
signal. The CLK2 signal is a selectable divide 2/1 (Y=1 divide 2,
Y=0 divide 1), 50% duty cycle, of the XO reference signal. The
MCLK signal is a selectable divide 4/5/1 (CLKSET = V
CC
divide 4,
CLKSET = V
CC
/2 divide 5, and CLKSET = 0V divide 1), 50% duty
cycle, of the XO reference signal. MCLK is externally set by means
of the tri-level CLKSET input to provide a default master system
clock prior to programming the SA900.
Programming Operation
The SA900 is configured by means of a 3-wire input (CLOCK,
STROBE, DATA) to program the AMPS and DUAL modes, in
addition there are two power saving modes of operation, SLEEP and
STANDBY. The control logic section of the SA900 is designed using
low power CMOS logic. During SLEEP mode only the circuitry
required to provide a master clock (MCLK) to the digital portion of
the system is enabled. During the STANDBY mode of operation
MCLK, CLK1 and the TXLO and buffered LO outputs are powered
on, which may be the case when the system is in the receive only
mode. In the AMPS or DUAL operational modes all functions of the
SA900 are powered on to support receive, transmit and system
clock functions. The programming of the SA900 is identical to the
programming format of the SA7025 low-voltage 1GHz fractional-N
synthesizer, that can be used in conjunction with the SA900 to
provide the cellular radio channel selection.
The programming data is structured as a 24 bit long serial data
word; the word includes 4 address bits (dedicated 1 0 1 1) for chip
select. Data bits are shifted in on the leading edge of the clock, with
the least significant bit (LSB) first and the most significant bit (MSB)
last. Table 2 shows data word format, the 15th and last 5 bits are
not used. Figure 8 shows the chip timing diagram.
Address
A0
A1
A2
1
0
1
A3
1
Divide By N
N0
N1
Divide
0
0
6
1
0
7
0
1
8
1
1
9
AMPS/DUAL Mode
The A/D mode select enables or disables that portion of the circuitry
used for either the AMPS or DUAL mode of operation.
AD
Mode
0
AMPS
1
DUAL
Synthesizer Enable
The SE bit turns on and off the synthesizer circuitry.
SE
Operation
0
Disabled
1
Enabled
Sleep Mode 1
The SM1 bit is used to power down the TXLO buffer, the divide 3/1
prescaler and the CLK1 output buffer.
SM1
Operation
0
Power down
1
Power up (STANDBY)
Sleep Mode 2
The SM2 bit is used to power down the divide 2/1 prescaler and the
CLK2.
SM2
Operation
0
Power down
1
Power up (with
SM1=1 normal
operation)
Divide 3
X
Operation
0
Divide 1
1
Divide 3
Divide 2
Y
Operation
0
Divide 1
1
Divide 2
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
12
Table 3.
Power Control
Attenuation (dB)
PC0 (0.6dB)
PC1 (1.3dB)
PC2 (2.5dB)
PC3 (5.0dB)
PC4 (10.0dB)
PC5 (20.0dB)
0
0
0
0
0
0
0
0.6
1
0
0
0
0
0
1.3
0
1
0
0
0
0
1.9
1
1
0
0
0
0
2.5
0
0
1
0
0
0
3.2
1
0
1
0
0
0
3.8
0
1
1
0
0
0
4.4
1
1
1
0
0
0
5.0
0
0
0
1
0
0
5.7
1
0
0
1
0
0
6.3
0
1
0
1
0
0
23.3
1
0
1
0
0
1
39.7
1
1
1
1
1
1
Component
Value
R1
560
Designator
DUAL Mode
AMPS Mode
R2
1k
C1
2.2nF
C2
No Load
C3
33pF
560
5.6k
2.7
F
.27
F
6.8nF
PHSOUT
R2
R1
C1
C2
C3
VCTRL
Typical Filter Network
R
SET
15k
75k
SR00640
Figure 5. PLL Loop Filter
L1
(AMPS MODULATION)
TANK_1
VCTRL
TANK_2
VCC
C3
C2
C1
VR1
f
VCO
[
120MHz
+
1
2
p
L1C
C
+
C3
)
1
C1
)
1
C2
)
1
CVRI
*
1
C1 = C2 = 33pF
C3 = 12pF
L1 = 82nH
VR1 TOKO KV1470
SR00641
Figure 6. VCO Tank Configuration
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
13
XTAL_1
XTAL_2
C2
C1
XO
CVAR
SR00642
Figure 7. Crystal Oscillator Configuration
TXEN
DATA
CLOCK
STROBE
SYN_EN
LSB
MSB
T1
T2
T3
TRANSMIT ENABLED
SYNTHESIZER ENABLED
T4
T1
+
T2
+
T3
+
1
3CLOCK
, T
4
+
1
3CLOCK
SR00643
Figure 8. Chip Timing Diagram
VCC
SA900
L1
34
L2
1000pF
50
1nF
100pF
TYPICAL VALUES
L1 = 39nH
L2 = 22nH
OR
VCC
SA900
L3
34
C1
50
1nF
100pF
TYPICAL VALUES
L3 = 12nH
C1 = 1.5pF
SR00644
Figure 9. DUALTX Output Matching
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
14
Q1
I2
I1
J3
J4
J5
J6
C241
100PF
C305
100pF
C306
.010uF
L304
39nH
C301
100pF
L372
22nH
C242
100pF
1
2
W4
ZO=50
J9
DIGTXRF
J10
AMPSTXRF
12
W5
ZO=50
C312
100pF
C300
.010uF
JP1
JMP
JP2
JMP
JP3
JMP
R349
100k
R350
100k
C245
.010uF
Q2
1
2
W1
ZO=50
1
2
W2
ZO=50
J8
LO2PS1
J7
LO2PS2
Vcc
C246
GND
P1-4,5,6,1
1,12,13
P1-1,2,3
4.7uF
+
C247
100pF
C313
100pF
C314
100pF
J1
TXLO2
12
W3
ZO=50
C249
100pF
JP4
JMP
VCO-TUNE
P1-15
PHS-OUT
P1-14
JP5
JMP
C269
33pF
R264
1k
R333
1k
R258
1k
C254
33pF
D1
KV1470
C255
33pF
C253
5.6pF
L252
100nH
R266
560
R268
NL
C267
220pF
C265
NL
J18
VCO-REF
T1-1
KK81
J2
XO-REF
R274
0
R260
51
R284
NL
C263
.01uF
C371
100pF
R352
100
100pF
C370
R262
15k
C243
100pF
R279
NL
C299
NL
C283
NL
C282
NL
L280
NL
C281
.010uF
C287
.010uF
R293
NL
C292
NL
C289
NL
L290
NL
P2
CLK1
P3
CLK1
C288
.010uF
P4
MCLK
L296
NL
C295
NL
C294
NL
R297
NL
1
2
3
4
5
6
7
8
9
10
11
12
1
3
1
4
1
5
1
6
1
7
1
8
1
9
2
0
2
1
2
2
2
3
2
4
36
35
34
33
32
31
30
29
28
27
26
25
4
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
3
9
3
8
3
7
Vcc
GND
DUAL
TX
GND
Vcc
AMPSTX
GND
Vcc
GND
Vcc
Vcc
GND
GND
TXLO2
TXLO1
GND
Vcc
T
ANK1
T
ANK2
Vcc
PHS OUT
IPEAK
GND
XT
AL1
V
c
L
O
L
O
G
N
V
c
I
1
I
2
Q
1
Q
2
G
N
V
c
G
N
c2
1
D
c
D
D
c
X
V
C
G
C
G
M
C
D
C
S
T
T
A
L
1
c
c
L
K
1
N
D
L
K
2
N
D
C
L
K
L
K
S
E
T
A
T
A
L
O
C
K
T
R
O
B
E
X
E
N
U1
SA900BE
P1-7
DA
T
A
P1-8
CLOCK
P1-9
STROBE
P1-10
TXENABLE
NOTE:
VCO-REF circuit is optional
L372 is C307 on the PCB
C246 combines C240 and C244 on the PCB
SR00645
Figure 10. SA900 Application Circuit
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
15
Q1
I2
I1
C241
100PF
C305
100pF
C306
.010uF
L304
39nH
C301
100pF
L372
22nH
C242
100pF
1
2
ZO=50
DIGTXRF
C300
.010uF
C245
.010uF
Q2
Vcc
C246
GND
1000pF
+
C247
270pF
TXLO2
12
W3
ZO=50
C249
100pF
T
ANK1
T1-1
KK81
XO-REF
R260
51
C263
.01uF
C371
100pF
100pF
C370
C243
100pF
1
2
3
4
5
6
7
8
9
10
11
12
1
3
1
4
1
5
1
6
1
7
1
8
1
9
2
0
2
1
2
2
2
3
2
4
36
35
34
33
32
31
30
29
28
27
26
25
4
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
3
9
3
8
3
7
Vcc
GND
DUAL
TX
GND
Vcc
AMPSTX
GND
Vcc
GND
Vcc
Vcc
GND
GND
TXLO2
TXLO1
GND
Vcc
T
ANK1
T
ANK2
Vcc
PHS OUT
IPEAK
GND
XT
AL1
V
c
LL
G
N
V
c
I
1
I
2
Q
1
Q
2
G
N
V
c
G
N
cD
c
D
D
c
X
VG
G
CD
C
S
T
T
A
L
1
c
c
N
D
N
D
L
K
2
A
T
A
L
O
C
K
T
R
O
B
E
X
E
N
DA
T
A
CLOCK
STROBE
TXENABLE
O
1
O
2
SA900
R301
1K
C280
1000pF
R300
1K
PHASE OUT
R262
24K
R304
4.7K
C402
7pF
CLOCK2
C
L
K
1
R303
4.7K
C400
7pF
CLOCK1
M
C
L
K
R305
4.7K
C401
7pF
MCLK
CLKSET
C
L
K
S
E
T
C312
100pF
1
2
ZO=50
AMPSTX
C315
270pF
1
2
ZO=50
LO_1
C314
270pF
1
2
ZO=50
LO_2
SR00646
Figure 11. SA900 Test Circuit
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
16
PERFORMANCE CHARACTERISTICS
900
970
1040
16.00
FREQUENCY (MHz)
POWER (dBm)
LO Buffer vs. Frequency (27
C, TXLO = 10dBm)
16.50
17.00
17.50
18.00
18.50
19.00
900
970
1040
16.00
FREQUENCY (MHz)
POWER (dBm)
LO Buffer vs. Frequency (V
CC
= 4.0V, TXLO = 10dBm)
16.50
17.00
17.50
18.00
18.50
19.00
19.50
20.00
T = +85
C
T = +27
C
T = 45
C
VCC = 3.9V
VCC = 4.0V
VCC = 4.5V
820
836
860
3.00
FREQUENCY (MHz)
POWER (dBm)
AMPTX vs. Frequency (27
C, TXLO = 10dBm)
2.80
2.60
2.40
2.20
2.00
1.80
1.60
1.40
1.20
1.00
VCC = 3.9V
VCC = 4.0V
VCC = 4.5V
820
836
860
4.00
FREQUENCY (MHz)
POWER (dBm)
AMPTX vs. Frequency (V
CC
= 4.0V, TXLO = 10dBm)
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.50
1.00
820
836
850
2.60
2.40
2.20
FREQUENCY (MHz)
POWER (dBm)
DUALTX vs. Frequency (TEMP 27
C, TXLO = 10dBm)
820
836
850
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
FREQUENCY (MHz)
POWER (dBm)
DUALTX vs. Frequency (V
CC
= 4.0V, TXLO = 10dBm)
40
27
85
72
70
68
66
64
62
60
CURRENT
(AMPERES)
DUAL I
CC
vs. Temperature
TEMPERATURE (
C)
T = +85
C
T = +27
C
T = 45
C
SR00647
2.80
2.00
VCC = 4.5V
VCC = 3.9V
VCC = 4.0V
VCC = 4.5V
VCC = 4.0V
VCC = 3.9V
VCC = 40
C
VCC = 27
C
VCC = 85
C
Figure 12. Performance Characteristics
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
17
PERFORMANCE CHARACTERISTICS
820
836
850
43.00
44.00
44.50
45.00
45.50
46.00
46.50
SUPPRESSION (dBc)
DUALTX Carrier Suppression vs. Frequency
(V
CC
= 4.0, TXLO = 10dBm Single Sideband Mode,
With Respect to Lower Sideband)
FREQUENCY (MHz)
47.50
47.00
820
836
850
44.50
45.00
45.50
46.00
47.00
47.50
SUPPRESSION (dBc)
DUALTX Sideband Suppression vs. Frequency
(Temperature = 27
C, TXLO = 10dBm Single
Sideband Mode, With Respect to Lower Sideband)
FREQUENCY (MHz)
820
836
850
34.00
FREQUENCY (MHz)
SUPPRESSION (dBc)
DUALTX Sideband Suppression vs Frequency
(V
CC
= 4.0V, TXLO = 10dBm Single Sideband
Mode, With Respect to Lower Sideband)
40
27
40
41
42
dBc
DUALTX 3rd Order Products vs Temperature
(TXLO = 10dBm, f = 836MHz, 0dB VGA I/Q Inphase)
TEMPERATURE (
C)
85
0
30.00
A
TTENUA
TION (dB)
DUALTX Carrier Suppression vs VGA Range
(27
C, f = 836MHz, TXLO = 10dBm)
VGA 6-BIT WORD VALUE (LSBs)
35.00
40.00
45.00
50.00
55.00
2
5
7
10 13 15 18 20 23 25 26 29 33 37 40 44 48 51 55 59 63
0
30.00
A
TTENUA
TION (dB)
DUALTX Carrier Suppression vs VGA Range
(V
CC
= 4.0V, f = 836MHz, TXLO = 10dBm)
VGA 6-BIT WORD VALUE (LSBs)
35.00
40.00
45.00
50.00
55.00
2
5
7
10 13 15 18 20 23 25 26 29 33 37 40 44 48 51 55 59 63
60.00
VCC = 3.9V
VCC = 4.0V
VCC = 4.5V
36.00
38.00
40.00
42.00
44.00
46.00
48.00
T = +85
C
T = +27
C
T = 45
C
SR00648
43.50
46.50
37
38
39
34
35
36
33
32
VCC = 40
C
VCC = 85
C
VCC = 27
C
VCC = 4.5V
VCC = 4.0V
VCC = 3.9V
VCC = 85
C
VCC = 40
C
VCC = 27
C
VCC = 3.9V
VCC = 4.0V
VCC = 4.5V
Figure 13. Performance Characteristics
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
18
PERFORMANCE CHARACTERISTICS
0
2
0
A
TTENUA
TION (dB)
DUALTX VGA Attenuation Profile vs. Temperature (V
CC
= 4.0V, F = 836MHz)
VGA 6-BIT WORD VALUE (LSBs)
4
6
8
5
10
15
20
25
30
35
40
45
10
12 14
16 18
20 22 24
26
28
30
32 34
36 38
40
42 44
46
48
50 52 54
56
58
60
62
40
C
0
2
A
TTENUA
TION (dB)
DUALTX VGA Attenuation Profile vs. V
CC
(T = 27
C, F = 836MHz)
VGA 6-BIT WORD VALUE (LSBs)
4
6
8
10
12 14
16 18
20 22 24
26
28
30
32 34
36 38
40
42 44
46
48
50 52 54
56
58
60
62
SR00649
27
C
85
C
3.9V
0
5
10
15
20
25
30
35
40
45
4.0V
4.6V
Figure 14. Performance Characteristics
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
19
LQFP48:
plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
Philips Semiconductors
Preliminary specification
SA900
I/Q transmit modulator
1997 Sept 16
20
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 940883409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification
Product Status
Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
Philips
Semiconductors