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Электронный компонент: SAA1300

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DATA SHEET
Product specification
File under Integrated Circuits, IC12
June 1987
INTEGRATED CIRCUITS
SAA1300
Tuner switching circuit
June 1987
2
Philips Semiconductors
Product specification
Tuner switching circuit
SAA1300
The SAA1300 is for switching on and off the supply lines
of various circuit parts via an I
2
C bus signal. Furthermore,
it can be used to supply current for switching diodes in
radio and television tuners. It contains 5 output stages,
which are capable of supplying up to 85 mA in the ON state
or sinking up to
-
100
A in the OFF state.
Current limiting and short-circuit protection are included.
The output stages are driven by a shift register/latch
combination which is loaded via data from the I
2
C bus. A
power-on reset of the latches ensures the OFF state of the
output stages (OUT 2 to OUT 5) without data reception
from the I
2
C bus. A subaddressing system allows the
connection of up to three circuits on the same I
2
C bus
lines; one of the outputs (OUT 1, pin 7) can also be used
as an input to select the device via a simple internal A/D
converter.
PACKAGE OUTLINE
9-lead SIL; plastic (SOT142); SOT142-1; 1996 September 05.
Fig.1 Block diagram.
June 1987
3
Philips Semiconductors
Product specification
Tuner switching circuit
SAA1300
PINNING
I
2
C BUS INFORMATION
Address, first byte
Data, second byte
OUT 5, OUT 4, OUT 3, OUT 2, OUT 1, X, X, X
The I/O output stage (OUT 1) is switched as an input stage after a power-on reset. It depends on the contents of the first
data transmission whether the output stage is switched as an output or remains as an input.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PIN NO.
SYMBOL
FUNCTION
1
GND
ground
2
V
P
positive supply
3
OUT 5
outputs
4
OUT 4
5
OUT 3
6
OUT 2
7
OUT 1
output and subaddressing input
8
SDA
serial data line
I
2
C bus
9
SCL
serial clock line
0 1 0 0 0 A B 0 where,
A
B
FUNCTION
CONDITION
0
0
general address
OUT 1 = output
0
1
OUT 1 = input
address accepted if V
OUT 1
= V
OUT L
(LOW)
1
0
OUT 1 = input
address accepted if V
OUT 1
= V
OUT H
(HIGH)
1
1
OUT 1 = input
address accepted if V
OUT 1
= V
OUT M
(MEDIUM)
Supply voltage
V
P
max.
13,2
V
Input voltage range at SDA, SCL
V
I
-
0,5 to
+
6,0
V
Input voltage range at OUT 1
V
I
-
0,5 to + 12,5
V
Output voltage range at OUT 1 to OUT 5
V
O
-
0,5 to + 12,5
V
Input current at SDA, SCL
I
I
max.
20
mA
Input current at OUT 1
I
I
max.
20
mA
Total power dissipation
P
tot
max.
825
mW
Storage temperature range
T
stg
-
40 to + 125
C
Operating ambient temperature ranges
T
amb
-
20 to + 80
C
June 1987
4
Philips Semiconductors
Product specification
Tuner switching circuit
SAA1300
CHARACTERISTICS
V
P
= 8 V; T
amb
= 24
C; unless otherwise specified
Note
1. Outputs must not be driven simultaneously at maximum source current.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply (pin 2)
Supply voltage range
V
P
4
8
12
V
Supply current
5 outputs LOW
I
PL
5
10
15
mA
5 outputs HIGH
I
PH
30
50
70
mA
Power on reset level output stage in "OFF" condition
V
PR
-
3,5
3,8
V
Maximum power dissipation
(1)
P
max
-
650
-
mW
Inputs SDA, SCL (pins 8 and 9)
Input voltage HIGH
V
IH
3,0
-
5,5
V
Input voltage LOW
V
IL
0
-
1,5
V
Input current HIGH
-
I
IH
-
-
10
A
Input current LOW
I
IH
-
-
0,4
A
Acknowledge sink current
I
ACK
2,5
-
-
mA
Maximum input frequency
f
i max
100
-
-
kHz
Outputs OUT 1 to OUT 5 (pins 3 to 7)
Maximum output current; source: "ON"
I
Oso
+85
-
+150
mA
Maximum output current; source: "ON"
T
amb
= 80
C
I
Oso
60
-
-
mA
Output voltage HIGH
at I
Oso
= 85 mA
V
OH
V
p
-
2
-
-
V
Output current; sink "OFF"
I
Osi
-
100
-
300
-
A
Output voltage LOW
at I
Osi
=
-
100
A
V
OL
-
-
100
mV
Output voltage MEDIUM
at I
O
= 10 mA
V
OM
V
P
-
0,5
-
-
V
OUT 1 used as subaddressing input
Input voltage HIGH (code 1 0)
V
OUT 1H
0,72 V
P
-
V
P
V
Input voltage MEDIUM (code 1 1)
V
OUT 1M
0,39 V
P
-
0,61 V
P
V
Input voltage LOW (code 0 1)
V
OUT 1L
0
-
0,28 V
P
V
June 1987
5
Philips Semiconductors
Product specification
Tuner switching circuit
SAA1300
PACKAGE OUTLINE
UNIT
A
A
3
b
1
D
1
b
2
b
c
D
(1)
E
(1)
e
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
12
11
1.8
1.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
D
2
18.6
18.2
6.48
6.20
2.54
3.9
3.4
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT142-1
95-02-09
97-12-16
0
5
10 mm
scale
Z
(1)
1.0
0.25
w
max.
D
E
A
A
c
A
2
3
L
Q
w
M
b
b
1
b
2
D
1
D
2
Z
e
1
9
seating plane
pin 1 index
SIL9MP: plastic single in-line medium power package; 9 leads
SOT142-1
A
max.
2
3.7
June 1987
6
Philips Semiconductors
Product specification
Tuner switching circuit
SAA1300
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent to use the
components in the I
2
C system provided the system conforms to the I
2
C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.