1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

FEATURES

SAA5261, SAA5262 and SAA5263

Complete 625-line teletext decoder in a single
integrated circuit thereby reducing printed-circuit board
area and cost

Automatic detection of transmitted pages so that only
existing pages will be selected by page-up and
page-down once inventory validated

Automatic detection of transmitted Fastext links or
service information (packet 8/30)

On-screen display for user interface (menus, etc.) using
teletext and dedicated menu icons

Video Programming System (VPS) decoding

Wide Screen Signalling (WSS) decoding

8-page Fastext decoder

6-page TOP decoder in addition to capture of Basic TOP
Table (BTT) and 3 Additional Information Table (AIT)
pages

4-page user defined list mode

Yugoslavian, Cyrillic, Greek/Turkish, Thai,
Arabic/Hebrew, Pan-European and
Arabic/English/French language coverage

High level command interface via I

C-bus giving easy

control from a low software overhead

High level command interface is backward compatible to
SAFARI interface

625 and 525 line display

RGB interface to standard colour decoder ICs, push-pull
output drive

Versatile 8-bit open-drain I/O expander

Single 12 MHz crystal oscillator for reduced cost

+5 V power supply.

SAA5262 and SAA5263

Automatic Channel Installation (ACI)

Enhanced SAFARI interface providing additional
commands.

SAA5263

Electronic Programme Guide (EPG) feature.

GENERAL DESCRIPTION

The SAA526xPS ICs are single-chip 10-page 625-line
World System Teletext (WST) decoders with a high level
command interface, SAFARI compatible.

It has been designed so that the overall system cost is kept
to a minimum. This has been achieved through the
capability of the device to be driven from a single +5 V
power supply, low cost 12 MHz crystal oscillator and the
high level command interface, which offers the benefit of
low software overhead in the TV microcontroller.

The SAA526xPS offers automatic detection of Fastext or
TOP transmissions. The device also incorporates a facility
to detect the pages in the transmission, which allows only
transmitted pages to be selected by page-up and
page-down.

SAA5262 and SAA5263 provide Automatic Channel
Installation (ACI) information.

SAA5263 provides access to Electronic Programme Guide
(EPG) information.

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

SYSTEM

CONTROLLER

MEMORY

INTERFACE

PACKET 26

PROCESSING

ENGINE

TELETEXT

ACQUISITION

AND

DECODING

24 TO 18

HAMMING

DECODER

POWER-ON

RESET

DISPLAY

VDS

COR

VDDA

VDDD(T) VDDD(M)

PON

RGBREF

res

E/W
PDI
SA

SAA526xPS

DISLCBD

DIS8/30

HSMODE

DISDSR
VSMODE

PUINL
V0-V7

ME8/30T

SDA1

SCL1

SDA2

SCL2

BLACK

HSYNC

VSYNC

XTALI

MGL418

XTALO

CVBS2

CVBS1

Iref

FRAME

RESET

VSSD2

VSSD1

VSSA

OSCGND

1-8

30 29

31 32 33 34

DRAM

REFRESH

AND TIMING

10 k

DRAM

C-BUS

INTERFACE

WSS

ACQUISITION

AND

DECODING

INPUT CLAMP

AND SYNC

SEPARATOR

DISPLAY

CLOCK

GENERATOR

12 MHz
CLOCK

GENERATOR

VPS

ACQUISITION

AND

DECODING

TELETEXT

VPS

CONTROL

ANALOG-

TO-DIGITAL

CONVERTER

ANALOG-

REFERENCE
GENERATOR

SERIAL-TO-

PARALLEL

CONVERTER

DATA SLICER

AND CLOCK

REGENERATOR

9 to 12

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

PINNING

SYMBOL

PIN

DESCRIPTION

versatile open-drain input/output bit 0 (should be tied HIGH)

versatile open-drain input/output bit 1 (should be tied HIGH)

versatile open-drain input/output bit 2 (should be tied HIGH)

versatile open-drain input/output bit 3 (should be tied HIGH)

versatile open-drain input/output bit 4 (should be tied HIGH)

versatile open-drain input/output bit 5 (should be tied HIGH)

versatile open-drain input/output bit 6 (should be tied HIGH)

versatile open-drain input/output bit 7 (should be tied HIGH)

res

reserved

res

reserved

res

reserved

res

reserved

SSD1

digital ground 1

SCLK1

serial clock input 1 (NVRAM)

SDAT1

serial data input/output 1 (NVRAM)

slave address input: LOW selects 58H; HIGH selects 60H

field polarity input: LOW selects first half line; HIGH selects second half line at the start of an
even field

HSMODE

horizontal sync mode control input: LOW selects HSYNC on rising edge

VSMODE

vertical sync mode control input. LOW selects VSYNC on rising edge

PDI

power-down imminent input: this input should be pulled LOW to indicate that the system is
about to lose power

phase-lock output: HIGH indicates that the system is phase-locked to the CVBS input

SSA

analog ground

CVBS1

CVBS input: this signal is applied via a 100 nF capacitor (nominal input 1 V (p-p)

CVBS2

this pin should be connected to ground if unused

BLACK

black level input: a 100 nF capacitor should be connected to V

SSA

ref

reference current input for analog circuits: for correct operation a 27 k

resistor should be

connected to V

SSA

FRAME

Frame output for use in non-interlaced displays: during teletext off, teletext mixed with TV
picture and subtitles this pin is inactive. In full teletext mode this pin provides a 25 Hz square
wave. FRAME = 1 = odd, FRAME = 0 = even.

SSD2

digital ground 2

COR

contrast reduction: active LOW output which allows selective contrast reduction of the
television picture to enhance a mixed mode display

PON

picture on output: HIGH indicates that a TV picture is present and that the SAA526xPS is in
TV mode, mix mode, subtitle mode or news flash mode

RGBREF

RGB reference input: drive level reference for RGB outputs

blue dot rate character output of the blue colour information: the high voltage level is defined
by the RGBREF pin (can source 4 mA)

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

green dot rate character output of the green colour information: the high voltage level is
defined by the RGBREF pin (can source 4 mA)

red dot rate character output of the red colour information: the high voltage level is defined by
the RGBREF pin (can source 4 mA)

VDS

push-pull output for blanking the TV picture

HSYNC

horizontal sync input: the polarity of this pulse is set by input HSMODE

VSYNC

vertical sync input: the polarity of this pulse is set by input VSMODE

DDA

analog supply voltage (+5 V)

DDD(T)

digital supply voltage for teletext circuits (+5 V)

OSCGND

ground for crystal oscillator

XTALI

12 MHz crystal oscillator input

XTALO

12 MHz crystal oscillator output

RESET

reset input

DDD(M)

digital supply voltage for microcontroller (+5 V)

PUINL

power-up in list mode control input: LOW selects auto TOP/Fastext on power-up; HIGH
selects LIST mode on power-up

DISDSR

disable default status row input: LOW enables display of status row

DIS8/30

disable packet 8/30 display input: LOW enables display of packet 8/30

DISLCBD

disable Link Control Byte (LCB) decode input: LOW enables decoding of the LCB in Fastext

SCLK2

serial clock input (I

C-bus)

SDAT2

serial data input/output (I

C-bus)

ME8/30T

mesh 8/30 and time displays input: HIGH will select a meshed display for the packet 8/30 and
time

E/W

East/West language select input: LOW selects West language

SYMBOL

PIN

DESCRIPTION

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

HIGH LEVEL COMMAND INTERFACE

The I

C-bus interface is used to pass control commands and data between the SAA526xPS and the television

microcontroller. The interface uses high level commands, which are backward compatible with the SAFARI interface.

The formats for the I

C-bus transmission are as follows:

Table 1

User command

Table 2

System command

Table 3

System read

Table 4

C-bus address

START

C-bus

ADDRESS

WRITE

ACK

COMMAND

ACK

STOP

START

C-bus

ADDRESS

WRITE

ACK

COMMAND

ACK

PARAMETER

ACK

STOP

START

C-bus

ADDRESS

READ

ACK

DATA

NACK

STOP

PIN 16 = LOW

PIN 16 = HIGH

ADDRESS

DESCRIPTION

ADDRESS

DESCRIPTION

01 01 100

read = 1; write = 0

0110 000

read = 1; write = 0

Table 5

Control commands

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

picture

TV status

time

program 0

program 1

program 2

program 3

program 4

program 5

program 6

program 7

program 8

program 9

program 10

program 11

program 12

program 13

program 14

program 15

red

green

yellow

subtitle

text status

hold

reveal

cancel

index

list toggle

reveal toggle

store

subcode

digit 1

digit 2

digit 3

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

digit 4

digit 5

digit 6

digit 7

digit 8

digit 9

digit 0

size

down

cyan

mix

text

read PAL + line

00 to 41

select list

00 to 03 or

00 to 80

force mode

read broadcast status

00 or 01

read network
identification

read PCS byte

OSD data

OSD mode on

OSD mode off

OSD display on

OSD display off

OSD cursor on

OSD cursor off

0, row, column

OSD position

0 followed by

20 bytes

OSD data write

00 to FF

bitwise parameter or
V7 to V0

00 to FF

bitwise parameter
and V7 to V0

00 to FF

returns V7 to V0 on
I

C-bus read

PWM

No.

PWM

data

PWM control

reg

data

or text register

reg

data

and text register

reg

data

read text register

quick list

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

SAA5262 and SAA5263 only

get time

0 = disable

set ACI mode

1 = enable

get ACI status

select next ACI channel

information type get ACI information

get device version

page type and

page number

set page number

page type

get page number

page type and

language

set language

page type

get language

row 24 control

enable/disable row 24

start column

and

length string

set row 24 contents

string type,

index length

and string

set string contents

option type and

values

set option

movement type move cursor

SAA5263 only

EPG mode

set EPG mode

get EPG status

number and list

of features

set EPG feature list

get number of EPG
CNIs found

CNI index

get found EPG CNIs

number and list

of CNIs

set EPG CNI list

table type, item

type and string

index

get EPG item
information

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134).

Note

1. This maximum value has an absolute maximum of 6.5 V independent of V

DDD

QUALITY AND RELIABILITY

This device will meet Philips Semiconductors general quality specification for business group

"Consumer Integrated

Circuits SNW-FQ-611-Part E". The principal requirements are shown in Tables 6 to 9.

Group A

Table 6

Acceptance tests per lot; note 1

Note

1. ppm = fraction of defective devices, in parts per million.

Group B

Table 7

Processability tests (by package family); note 1

Note

1. LTPD = Lot Tolerance Percent Defective.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

DDD

digital supply voltages

0.3

+6.5

DDA

analog supply voltage

0.3

+6.5

input voltage (any input)

note 1

0.3

DDD(M)

+ 0.5 V

output voltage (any output)

note 1

0.3

DDD(M)

+ 0.5 V

output current (each output)

I/OK

DC input or output diode current

amb

operating ambient temperature

+70

stg

storage temperature

+125

TEST

REQUIREMENTS

Mechanical

cumulative target: <80 ppm

Electrical

cumulative target: <80 ppm

TEST

REQUIREMENTS

Solderability

<7% LTPD

Mechanical

<15% LTPD

Solder heat resistance

<15% LTPD

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

Group C

Table 8

Reliability tests (by package family); note 1

Note

1. FPM = fraction of devices failing at test conditions, in Failures Per Million.

Table 9

Reliability tests (by device type)

CHARACTERISTICS

DDD(M)

= 5 V

10%; V

= 0 V; T

amb

20 to +70

C; unless otherwise specified.

TEST

CONDITIONS

REQUIREMENTS

Operational life

168 hours at T

= 150

<1000 FPM at T

= 70

Humidity life

temperature, humidity, bias 1000 hours,
T

amb

= 85

C, 85% RH (or equivalent

test)

<2000 FPM

Temperature cycling
performance

stg(min)

to T

stg(max)

<2000 FPM

TEST

CONDITIONS

REQUIREMENTS

ESD and latch-up

ESD human body model 100 pF, 1.5 k

<2000 V

ESD machine model 200 pF, 0

<200 V

latch-up

100 mA, 1.5V

DDD

(absolute maximum)

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

DDD(M)

microcontroller supply
voltage

referenced to V

SSD

4.5

5.0

5.5

DDA

analog supply voltage referenced to V

SSD

4.5

5.0

5.5

DDD(T)

teletext supply
voltage

referenced to V

SSD

4.5

5.0

5.5

DDD(M)

microcontroller supply
current

DDA

analog supply current

DDD(T)

teletext supply
current

Digital inputs

RESET

LOW-level input
voltage

0.3

0.2V

DDD(M)

0.1

HIGH-level input
voltage

0.7V

DDD(M)

+ 0.3

input leakage current

= 0 to V

DDD(M)

+10

input capacitance

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

INS

HSYNC

AND

VSYNC

th(f)

switching threshold
falling

0.2V

DDD(M)

th(r)

switching threshold
rising

0.8V

DDD(M)

hys

hysteresis voltage

0.33V

DDD(M)

input capacitance

Digital outputs

INS

R, G

AND

B: note 1

LOW-level output
voltage

= 2 mA

0.2

HIGH-level output
voltage

2 mA

RGBREF

0.3

RGBREF

+ 0.4

output impedance

150

load capacitance

DC output current

o(r)

output rise time

between 10 and
90%; C

= 50 pF

o(f)

output fall time

between 90 and
10%; C

= 50 pF

VDS

LOW-level output
voltage

= 1.6 mA

0.2

HIGH-level output
voltage

1.6 mA

DDD(M)

0.3

DDD(M)

+ 0.4

load capacitance

o(r)

output rise time

between 10 and
90%; C

= 50 pF

o(f)

output fall time

between 90 and
10%; C

= 50 pF

INS

R, G, B

AND

VDS

d(skew)

skew delay between
any two pins

COR (

OPEN

DRAIN OUTPUT

)

HIGH-level pull-up
output voltage

DDD(M)

LOW-level output
voltage

= 2 mA

0.5

LOW-level output
current

load capacitance

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

FRAME

HIGH-level output
voltage

= 8 mA

0.5

LOW-level output
voltage

8 mA

DDD(M)

0.5

DDD(M)

LOW-level output
current

load capacitance

100

Digital inputs/outputs

INS

LOW-level input
voltage

0.3

0.2V

DDD(M)

0.1

HIGH-level input
voltage

3.0

DDD(M)

+ 0.3

input capacitance

LOW-level output
voltage

= 10 mA

0.45

load capacitance

INS

SCL

AND

SDA (

PINS

14, 15, 49

AND

50)

LOW-level input
voltage

0.3

+1.5

HIGH-level input
voltage

3.0

DDD(M)

+ 0.3

input capacitance

LOW-level output
voltage

= 3 mA

0.5

load capacitance

400

o(f)

output fall time

between 3 and 1 V

200

Digital inputs

INS

VSMODE, HSMODE, PDI, SA, FP, PUINL, DISDSR, DIS8/30, DISLCBD, ME8/30T

AND

E/W

LOW-level input
voltage

0.3

0.2V

DDD(M)

0.1

HIGH-level input
voltage

0.2V

DDD(M)

+ 0.9

DDD(M)

+ 0.3

input capacitance

load capacitance

Digital outputs

INS

AND

PON

LOW-level output
voltage

= 10 mA

0.45

load capacitance

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

Analog inputs

INS

CVBS0

AND

CVBS1

sync

sync voltage
amplitude

0.1

0.3

0.6

vid(p-p)

video input voltage
amplitude
(peak-to-peak value)

0.7

1.0

1.4

source

source impedance

250

HIGH-level input
voltage

3.0

DDD(M)

+ 0.3

input impedance

2.5

5.0

input capacitance

ref

VSS

resistor to ground

RGBREF: note 1

input voltage

0.3

DDD(M)

DC input current

Analog input/output

BLACK

storage capacitor to
ground

100

BLACK

black level voltage
for nominal sync
amplitude

1.8

2.15

2.5

input leakage current

+10

Crystal oscillator

XTALI

LOW-level input
voltage

0.3

0.2V

DDD(M)

0.1

HIGH-level input
voltage

0.7V

DDD(M)

+ 0.3

input capacitance

XTALO

output capacitance

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

Notes

1. All RGB current is sourced from the RGBREF pin. The maximum effective series resistance between RGBREF and

the R, G and B pins is 150

2. Crystal order number 4322 143 05561.

TIMING CHARACTERISTICS

Notes

1. This parameter is determined by the user software. It must comply with the I

C-bus specification.

2. This value gives the auto-clock pulse length which meets the I

C-bus specification for the special crystal frequency.

Alternative, the SCL pulse must be timed by software.

3. The rise time is determined by the external bus line capacitance and pull-up resistor. It must be less than 1

4. The maximum capacitance on bus lines SDA and SCL is 400 pF.

RYSTAL SPECIFICATION

: note 2

xtal

nominal frequency

MHz

load capacitance

series capacitance

amb

= 25

18.5

parallel capacitance

amb

= 25

4.9

res

resonance resistance

amb

= 25

xtal

temperature range

+25

+70

adjustment tolerance

amb

= 25

drift

SYMBOL

PARAMETER

INPUT

OUTPUT

C-BUS SPECIFICATION

SCL timing

HD;STA

START condition hold time

4.0

note 1

4.0

LOW

SCL LOW time

4.7

note 1

4.7

HIGH

SCL HIGH time

4.0

s; note 2

4.0

r(SCL)

SCL rise time

1.0

note 3

1.0

f(SCL)

SCL fall time

0.3

s; note 4

0.3

SDA timing

SU;DAT1

data set-up time

250 ns

note 1

250 ns

HD;DAT

data hold time

0 ns

note 1

0 ns

SU;STA

repeated START set-up time

4.7

note 1

4.7

SU;STO

STOP condition set-up time

4.0

note 1

4.0

BUF

bus free time

4.7

note 1

4.7

r(SDA)

SDA rise time

1.0

note 3

1.0

f(SDA)

SDA fall time

0.3

s; note 4

0.3

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

EMC GUIDELINES

Optimization of circuit return paths and minimisation of
common mode noise will be assisted by using a
double-sided PCB with a low inductance ground plane.

On a single-sided PCB a local ground plane under the
whole IC should be present, as shown in Fig.16. This
should be connected by the widest possible connection
back to the PCB ground connection and bulk electrolytic
decoupling capacitor. It should preferably not connect to
other grounds on the way and no wire links should be
present in this connection. The use of wire links increases
ground bounce by introducing inductance into the ground.

The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency. Using a device
socket will unfortunately add to the area and inductance of
the external bypass loop.

A ferrite bead or inductor with resistive characteristics at
high frequency may be utilized in the supply line close to
the decoupling capacitor to provide a high impedance.
To prevent pollution by conduction onto signal lines (which
may then radiate) signals connected to the +5 V supply via
a pull up resistor should not be connected to the IC side of
the ferrite component.

OSCGND should be connected only to the crystal load
capacitors and not the local or circuit ground.

Keep physical connection distances to associated active
devices short.

Route output traces with close proximity mutually coupled
ground return paths.

Fig.16 Power supply and ground connections for SOT247-1.

handbook, full pagewidth

electrolytic decoupling capacitor (2.2

ferrite components

SM decoupling capacitors (22 to 100 nF)

under-IC GND plane

IC(SAA5290)

MGL414

VSSD

VSSA

VDDD(M)

VDDD(T)

VDDA

GND

5 V

other
GND
connections

under-IC GND plane
GND connection
note: no wire links

1998

Apr

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

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APPLICA

TION INFORMA

TION

handbook, full pagewidth

4.7

VSS

VDD

PTC

PCF8582P

SCL

SDA

SAA526xPS

VDDD(M)

VSSD1

VSSD2

VSSA

VSSD2

VSSA

100 nF

CVBS1

FRAME

MGL419

COR

PON

VDS

HSYNC

VSYNC

CVBS2

100 nF

27 k

1 k

4.7 k

1 k

220

2.2

12 MHz

22 pF

56 k

3.3 nF

VDDA

VDDD(T)

VDDD(M)

VSSD

VSSD1

VSSD

VDDD(M)

VSSD2

SDA2

SCL2

Fig.17 Application diagram.

1998 Apr 22

Philips Semiconductors

Product specification

10-page intelligent teletext decoders

SAA5261; SAA5262; SAA5263

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA59

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381

Printed in The Netherlands

545104/00/01/pp28

Date of release: 1998 Apr 22

Document order number:

9397 750 03442

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