2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

CONTENTS

FEATURES

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

6.1

Type SAA5360

6.2

Type SAA5361

COMMANDS AND CHARACTER SETS

7.1

High-level command interface

7.2

Character sets

LIMITING VALUES

THERMAL CHARACTERISTICS

QUALITY AND RELIABILITY

CHARACTERISTICS

APPLICATION INFORMATION

12.1

EMC guidelines

12.2

Application diagram

12.3

Application notes

12.3.1

External data memory access

12.3.2

Symbol explanations

PACKAGE OUTLINE

SOLDERING

14.1

Introduction to soldering surface mount
packages

14.2

Reflow soldering

14.3

Wave soldering

14.4

Manual soldering

14.5

Suitability of surface mount IC packages for
wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I

C COMPONENTS

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

FEATURES

Support for 50 or 60 and 100 or 120 Hz and progressive
scan display modes

Complete 625 line teletext decoder in one chip reduces
printed-circuit board area and cost

Automatic detection of transmitted fastext links or
service information (packet 8/30)

On-Screen Display (OSD) for user interface menus
using teletext and dedicated menu icons

Video Programming System (VPS) decoding

Wide Screen Signalling (WSS) decoding

SAA5360 supports Pan-European, Arabic and Iranian
character sets

SAA5361 supports Pan-European, Cyrillic, Greek and
Arabic character sets

High-level command interface via I

C-bus gives easy

control with a low software overhead

High-level command interface is backward compatible
to Stand-Alone Fastext And Remote Interface (SAFARI)

625 and 525 line display

RGB interface to standard colour decoder ICs; current
source

Versatile 8-bit open-drain Input/Output (I/O) expander;
5 V tolerant

Single 12 MHz crystal oscillator

Single power supply: from 3.0 V to 3.6 V

Operating temperature:

20 to +70

Automatic detection of transmitted pages to be selected
by page up and page down

8 page fastext decoder

Table Of Pages (TOP) decoder with Basic Top Table
(BTT) and Additional Information Tables (AITs)

4 page user-defined list mode.

GENERAL DESCRIPTION

The SAA5360; SAA5361 is a single-chip multi page 625
line world system teletext decoder with a high-level
command interface, and is SAFARI compatible.

The device is designed to minimize the overall system
cost, due to the high-level command interface offering the
benefit of a low software overhead in the TV
microcontroller.

The SAA5360 incorporates the following functions:

10 page teletext decoder with OSD, fastext, TOP,
default and list acquisition modes

Automatic channel installation support.

The functionality of the SAA5361 is similar to the
SAA5360, but offers the capability to store up to
250 additional pages of teletext in an external SRAM.

QUICK REFERENCE DATA

Note

1. Periphery supply current is dependent on external components and I/O voltage levels.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

all supply voltages

referenced to V

3.0

3.3

3.6

DDP

periphery supply current

note 1

DDC

core supply current

normal mode

idle mode

4.6

DDA

analog supply current

normal mode

idle mode

0.87

xtal(nom)

nominal crystal frequency

fundamental mode

MHz

amb

ambient temperature

+70

stg

storage temperature

+125

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

PINNING

6.1

Type SAA5360

SYMBOL

PIN

TYPE

DESCRIPTION

P2_7/PWM6

I/O

programmable bidirectional port 2: bit 7 or output bit 6 of the 7-bit PWM

P3_0/ADC0

I/O

programmable bidirectional port 3: bit 0 or input 0 for the software ADC facility

n.c.

not connected

P3_1/ADC1

I/O

programmable bidirectional port 3: bit 1 or input 1 for the software ADC facility

P3_2/ADC2

I/O

programmable bidirectional port 3: bit 2 or input 2 for the software ADC facility

P3_3/ADC3

I/O

programmable bidirectional port 3: bit 3 or input 3 for the software ADC facility

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

SSC

core ground

SSP

periphery ground

P0_5

I/O

8 mA current sinking output for direct drive of LED

n.c.

not connected

n.c.

not connected

SCL_NVRAM

C-bus serial clock input to non-volatile RAM

SDA_NVRAM

I/O

C-bus serial data input and output of non-volatile RAM

P0_2

I/O

programmable bidirectional port 0: bit 2

n.c.

not connected

n.c.

not connected

VPE

OTP programming voltage input; connect to ground

P0_3

I/O

programmable bidirectional port 0: bit 3

n.c.

not connected

P0_4

I/O

programmable bidirectional port 0: bit 4

n.c.

not connected

n.c.

not connected

n.c.

not connected

P0_6

I/O

8 mA current sinking output for direct drive of LED

P0_7

I/O

programmable bidirectional port 0: bit 7

SSA

analog ground

CVBS0

composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor

CVBS1

composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor

n.c.

not connected

SYNC_FILTER

I/O

CVBS sync filter input; this pin should be connected to V

SSA

via a 100 nF

capacitor

IREF

reference current input for analog circuits and connected to V

SSA

via a 24 k

resistor

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

FRAME

de-interlace output synchronized with the VSYNC pulse to produce a
non-interlaced display by adjustment of the vertical deflection circuits

VPE

OTP programming voltage input; connect to ground

COR

output which allows selective contrast reduction of the TV picture to enhance a
mixed mode display; open-drain; active LOW

n.c.

not connected

DDA

3.3 V analog supply voltage

pixel rate output of the blue colour information

pixel rate output of the green colour information

pixel rate output of the red colour information

n.c.

not connected

n.c.

not connected

n.c.

not connected

VDS

video or data switch push-pull output for dot rate fast blanking

HSYNC

Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the
polarity of this pulse is programmable by register bit TXT1.H POLARITY

n.c.

not connected

VSYNC

Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the
polarity of this pulse is programmable by register bit TXT1.V POLARITY

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

SSP

periphery ground

n.c.

not connected

SSC

core ground

DDC

3.3 V core supply voltage

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

OSCGND

crystal oscillator ground

XTALIN

12 MHz crystal oscillator input

XTALOUT

12 MHz crystal oscillator output

RESET

reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; internal pull-up

SYMBOL

PIN

TYPE

DESCRIPTION

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

RESET

reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; this pin should be connected to V

DDC

via a capacitor if

an active HIGH reset is required; internal pull-down

n.c.

not connected

DDP

3.3 V periphery supply voltage

P1_0

I/O

programmable bidirectional port 1: bit 0

n.c.

not connected

P1_1

I/O

programmable bidirectional port 1: bit 1

P1_2

I/O

programmable bidirectional port 1: bit 2

P1_3

I/O

programmable bidirectional port 1: bit 3

SCL

C-bus serial clock input from application

SDA

I/O

C-bus serial data input from or output to application

P1_4

I/O

programmable bidirectional port 1: bit 4

P1_5

I/O

programmable bidirectional port 1: bit 5

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

P2_1/PWM0

I/O

programmable bidirectional port 2: bit 1 or output bit 0 of the 7-bit PWM

P2_2/PWM1

I/O

programmable bidirectional port 2: bit 2 or output bit 1 of the 7-bit PWM

P2_3/PWM2

I/O

programmable bidirectional port 2: bit 3 or output bit 2 of the 7-bit PWM

P2_4/PWM3

I/O

programmable bidirectional port 2: bit 4 or output bit 3 of the 7-bit PWM

P2_5/PWM4

I/O

programmable bidirectional port 2: bit 5 or output bit 4 of the 7-bit PWM

P2_6/PWM5

I/O

programmable bidirectional port 2: bit 6 or output bit 5 of the 7-bit PWM

SSC

core ground

P2_0/TPWM

100

I/O

programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM

SYMBOL

PIN

TYPE

DESCRIPTION

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

SAA5360HL

mhc508

n.c.

P0_4

n.c.

P0_3

VPE

n.c.

P0_2

SDA_NVRAM

SCL_NVRAM

n.c.

P0_5

SSP

SSC

n.c.

P3_3/ADC3

P3_2/ADC2

P3_1/ADC1

n.c.

P3_0/ADC0

P2_7/PWM6

n.c.

SSA

CVBS0

CVBS1

n.c.

SYNC_FILTER

IREF

n.c.

FRAME

VPE

COR

n.c.

DDA

n.c.

VDS

HSYNC

n.c.

VSYNC

n.c.

SSP

n.c.

SSC

DDC

n.c.

OSCGND

XTALIN

XTALOUT

RESET

n.c.

DDP

/
TPWM

SSC

/
PWM5

/
PWM4

/
PWM3

/
PWM2

/
PWM1

/
PWM0

n.c.

SDA

SCL

n.c.

Fig.2 Pin configuration of SAA5360HL.

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

6.2

Type SAA5361

SYMBOL

PIN

TYPE

DESCRIPTION

P2_7/PWM6

I/O

programmable bidirectional port 2: bit 7 or output bit 6 of the 6-bit PWM

P3_0/ADC0

I/O

programmable bidirectional port 3 with alternative functions: bit 0 or input 0 for the
software ADC facility

n.c.

not connected

P3_1/ADC1

I/O

programmable bidirectional port 3 with alternative functions: bit 1 or input 1 for the
software ADC facility

P3_2/ADC2

I/O

programmable bidirectional port 3 with alternative functions: bit 2 or input 2 for the
software ADC facility

P3_3/ADC3

I/O

programmable bidirectional port 3 with alternative functions: bit 3 or input 3 for the
software ADC facility

n.c.

not connected

A14

address line 14

read control output to external data memory; active LOW

write control output to external data memory; active LOW

SSC

core ground

SSP

periphery ground

P0_5

I/O

8 mA current sinking output for direct drive of LED

n.c.

not connected

address line 7

SCL_NVRAM

C-bus serial clock input to non-volatile RAM

SDA_NVRAM

I/O

C-bus serial data input and output of non-volatile RAM

P0_2

I/O

programmable bidirectional port 0 with alternative functions: bit 2 input and output
for general use

n.c.

not connected

n.c.

not connected

VPE

OTP programming voltage input; connect to ground

P0_3

I/O

programmable bidirectional port 0 with alternative functions: bit 3 input and output
for general use

address line 6

P0_4

I/O

programmable bidirectional port 0 with alternative functions: bit 4 input and output
for general use

n.c.

I/O

not connected

address line 5

address line 4

P0_6

I/O

8 mA current sinking output for direct drive of LED

P0_7

I/O

programmable bidirectional port 0 with alternative functions: bit 7 input and output
for general use

SSA

analog ground

CVBS0

composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor

CVBS1

composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

A15_BK

address line 15

SYNC_FILTER

I/O

CVBS sync filter input; this pin should be connected to V

SSA

via a 100 nF capacitor

IREF

reference current input for analog circuits and connected to V

SSA

via a 24 k

resistor

A13

address line 13

A12

address line 12

address line 3

address line 2

address line 1

FRAME

de-interlace output synchronized with the VSYNC pulse to produce a
non-interlaced display by adjustment of the vertical deflection circuits

VPE

OTP programming voltage input; connect to ground

COR

output which allows selective contrast reduction of the TV picture to enhance a
mixed mode display; open-drain; active LOW

n.c.

I/O

not connected

DDA

3.3 V analog supply voltage

pixel rate output of the blue colour information

pixel rate output of the green colour information

pixel rate output of the red colour information

address line 0

RAMBK1

RAMBK SFR selection bits input 1 for external program SRAM data storage

RAMBK0

RAMBK SFR selection bits input 0 for external program SRAM data storage

VDS

video or data switch push-pull output for dot rate fast blanking

HSYNC

Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the
polarity of this pulse is programmable by register bit TXT1.H POLARITY

n.c.

I/O

not connected

VSYNC

Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the polarity
of this pulse is programmable by register bit TXT1.V POLARITY

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

I/O

not connected

SSP

periphery ground

n.c.

not connected (internal pull-up)

SSC

core ground

DDC

3.3 V core supply voltage

A11

address line 11

A10

address line 10

address line 9

address line 8

n.c.

not connected

OSCGND

crystal oscillator ground

SYMBOL

PIN

TYPE

DESCRIPTION

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

XTALIN

12 MHz crystal oscillator input

XTALOUT

12 MHz crystal oscillator output

RESET

reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; internal pull-up

RESET

reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; this pin should be connected to V

DDC

via a capacitor if

an active HIGH reset is required; internal pull-down

n.c.

not connected

DDP

3.3 V periphery supply voltage

P1_0

programmable bidirectional port 1 with alternative functions: bit 0 input and output
for general use

n.c.

not connected

P1_1

I/O

programmable bidirectional port 1 with alternative functions: bit 1 input and output
for general use

P1_2

I/O

programmable bidirectional port 1 with alternative functions: bit 2 input and output
for general use

P1_3

I/O

programmable bidirectional port 1 with alternative functions: bit 3 input and output
for general use

SCL

C-bus serial clock input from application

SDA

I/O

C-bus serial data input from or output to application

P1_4

I/O

programmable bidirectional port 1 with alternative functions: bit 4 input and output
for general use

P1_5

I/O

programmable bidirectional port 1 with alternative functions: bit 5 input and output
for general use

AD0

I/O

address line 0 with multiplexed data line 0

AD1

I/O

address line 1 with multiplexed data line 1

AD2

I/O

address line 2 with multiplexed data line 2

AD3

I/O

address line 3 with multiplexed data line 3

AD4

I/O

address line 4 with multiplexed data line 4

AD5

I/O

address line 5 with multiplexed data line 5

AD6

I/O

address line 6 with multiplexed data line 6

AD7

I/O

address line 7 with multiplexed data line 7

P2_1/PWM0

I/O

programmable bidirectional port 2: bit 1 or output bit 0 of the 6-bit PWM

P2_2/PWM1

I/O

programmable bidirectional port 2: bit 2 or output bit 1 of the 6-bit PWM

P2_3/PWM2

I/O

programmable bidirectional port 2: bit 3 or output bit 2 of the 6-bit PWM

P2_4/PWM3

I/O

programmable bidirectional port 2: bit 4 or output bit 3 of the 6-bit PWM

P2_5/PWM4

I/O

programmable bidirectional port 2: bit 5 or output bit 4 of the 6-bit PWM

P2_6/PWM5

I/O

programmable bidirectional port 2: bit 6 or output bit 5 of the 6-bit PWM

SSC

core ground

P2_0/TPWM

100

I/O

programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM

SYMBOL

PIN

TYPE

DESCRIPTION

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

SAA5361HL

001aaa526

n.c.

P0_4

P0_3

VPE

n.c.

P0_2

SDA_NVRAM

SCL_NVRAM

n.c.

P0_5

SSP

SSC

A14

n.c.

P3_3/ADC3

P3_2/ADC2

P3_1/ADC1

n.c.

P3_0/ADC0

P2_7/PWM6

SSA

CVBS0

CVBS1

A15_BK

SYNC_FILTER

IREF

A13

A12

FRAME

VPE

COR

n.c.

DDA

RAMBK1

RAMBK0

VDS

HSYNC

n.c.

VSYNC

n.c.

SSP

n.c.

SSC

DDC

A11

A10

n.c.

OSCGND

XTALIN

XTALOUT

RESET

n.c.

DDP

/
TPWM

SSC

/
PWM5

/
PWM4

/
PWM3

/
PWM2

/
PWM1

/
PWM0

AD7

AD6

AD5

AD4

AD3

AD2

AD1

AD0

SDA

SCL

n.c.

Fig.3 Pin configuration of SAA5361HL.

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

COMMANDS AND CHARACTER SETS

7.1

High-level command interface

The I

C-bus interface is used to pass control commands and data between the SAA5360; SAA5361 and the television

microcontroller. The interface uses high-level commands, which are backwards compatible with the SAFARI.

The I

C-bus transmission formats are given in Tables 1 to 3.

Table 1

User command

Table 2

System command

Table 3

User read

7.2

Character sets

The SAA5360HL/M1/0004 contains the character set for Pan-Euro, Arabic and Iranian and has slave address 58H.

The SAA5361HL/M1/1651 contains the character set for Pan-Euro, Cyrillic, Greek and Arabic and has slave address
60H.

USER COMMAND

START

C-bus address

write

ACK

command

ACK

STOP

SYSTEM COMMAND

START

C-bus address

write

ACK

command

ACK

parameter

ACK

STOP

USER READ

START

C-bus address

read

ACK

data

ACK

STOP

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 60134).

Note

1. This maximum value refers to 5 V tolerant I/Os and may be 6 V maximum but only when V

is present.

THERMAL CHARACTERISTICS

10 QUALITY AND RELIABILITY

In accordance with

"General Quality Specification for Integrated circuits SNW-FQ-611".

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

all supply voltages

0.5

+4.0

input voltage (any input)

< 3.6 V; note 1

0.5

+ 0.5

3.6 V; note 1

0.5

4.1

output voltage (any output)

note 1

0.5

+ 0.5

output current (each output)

IO(d)

diode DC input or output current

amb

ambient temperature

+70

junction temperature

+125

stg

storage temperature

+125

esd

electrostatic discharge voltage

Human body model;
C = 100 pF; R = 1.5 k

2000

Machine model;
C = 200 pF; R = 0

200

latch-up current

1.5

100

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

K/W

th(j-c)

thermal resistance from junction to case

K/W

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

11 CHARACTERISTICS
V

= 3.3 V

10 %; V

= 0 V; T

amb

C to +70

C; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

any supply voltage

referenced to V

3.0

3.3

3.6

DDP

periphery supply current

note 1

DDC

core supply current

operating mode

idle mode

4.6

power-down mode

0.76

DDA

analog supply current

operating mode

idle mode

0.87

power-down mode

0.45

0.7

Digital inputs

RESET

LOW-level input voltage

1.00

HIGH-level input voltage

1.85

5.5

hys

hysteresis voltage of Schmitt-trigger input

0.44

0.58

input leakage current

= 0

0.17

equivalent pull-down resistance

= V

55.73 70.71

92.45

RESET

LOW-level input voltage

0.98

HIGH-level input voltage

1.73

5.5

hys

hysteresis voltage of Schmitt-trigger input

0.41

0.5

input leakage current

= V

0.00

equivalent pull-up resistance

= 0

46.07 55.94

70.01

INS

HSYNC

AND

VSYNC

LOW-level input voltage

0.96

HIGH-level input voltage

1.80

5.5

hys

hysteresis of Schmitt-trigger input

0.40

0.56

input leakage current

= 0 to V

0.00

Digital outputs

INS

FRAME

AND

VDS

LOW-level output voltage

= 3 mA

0.13

HIGH-level output voltage

= 3 mA

2.84

o(r)

output rise time

10 % to 90 % of V

;

= 70 pF

7.50

8.85

10.90

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

6.70

7.97

10.00

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

COR (

OPEN

DRAIN

)

LOW-level output voltage

= 3 mA

0.14

HIGH-level pull-up output voltage

3 mA; push-pull

2.84

input leakage current

= 0 to V

0.12

o(r)

output rise time

10 % to 90 % of V

;

= 70 pF

7.20

8.64

11.10

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

4.90

7.34

9.40

Digital input/outputs

INS

SCL_NVRAM, SDA_NVRAM, P0_4

P0_7, P1_0, P1_1, P2_1

P2_7

AND

P3_0

P3_4

LOW-level input voltage

0.98

HIGH-level input voltage

1.78

5.50

hys

hysteresis of Schmitt-trigger input

0.41

0.55

input leakage current

= 0 to V

0.01

LOW-level output voltage

= 4 mA

0.18

HIGH-level output voltage

4 mA; push-pull

2.81

o(r)

output rise time

10 % to 90 % of V

;

= 70 pF; push-pull

6.50

8.47

10.70

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

5.70

7.56

10.00

INS

P1_2, P1_3

AND

P2_0

LOW-level input voltage

0.99

HIGH-level input voltage

1.80

5.50

hys

hysteresis voltage of Schmitt-trigger input

0.42

0.56

input leakage current

= 0 to V

0.02

LOW-level output voltage

= 4 mA

0.17

HIGH-level output voltage

4 mA; push-pull

2.81

o(r)

output rise time

10 % to 90 % of V

;

= 70 pF; push-pull

7.00

8.47

10.50

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

5.40

7.36

9.30

INS

P0_5

AND

P0_6

LOW-level input voltage

0.98

HIGH-level input voltage

1.82

5.50

input leakage current

= 0 to V

0.11

hys

hysteresis voltage of Schmitt-trigger input

0.42

0.58

LOW-level output voltage

= 8 mA

0.20

HIGH-level output voltage

8 mA; push-pull

2.76

o(r)

output rise time

10 % to 90 % of V

;

= 70 pF; push-pull

7.40

8.22

8.80

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

4.20

4.57

5.20

INS

P1_4

AND

P1_5 (

OPEN DRAIN

)

LOW-level input voltage

1.08

HIGH-level input voltage

1.99

5.50

hys

hysteresis voltage of Schmitt-trigger input

0.49

0.60

input leakage current

= 0 to V

0.13

LOW-level output voltage

= 8 mA

0.35

o(f)

output fall time

10 % to 90 % of V

;

= 70 pF

69.70 83.67

103.30

o(f)(I2C)

output fall time in relation to the I

C-bus

specifications

= 3 V to 1.5 V at

= 3 mA; C

= 400 nF

57.80

Analog inputs

INS

CVBS0

AND

CVBS1

sync

sync voltage amplitude

0.1

0.3

0.6

v(p-p)

video input voltage amplitude
(peak-to-peak value)

0.7

1.0

1.4

source

source impedance

250

HIGH-level input voltage

3.0

DDA

+ 0.3

input capacitance

IREF

gnd

resistance to ground

resistor tolerance 2 %

INS

ADC0

ADC3

HIGH-level input voltage

range = V

DDP

;

note 2

DDA

input capacitance

Analog outputs

INS

R, G

AND

o(b)

output current (black level)

DDA

= 3.3 V

+10

o(max)

output current (maximum Intensity)

DDA

= 3.3 V; intensity

level code = 31 decimal

6.0

6.67

7.3

o(70)

output current (70 % of full intensity)

DDA

= 3.3 V; intensity

level code = 0 decimal

4.2

4.7

5.1

load resistor

referenced to V

SSA;

resistor tolerance 5 %

150

load capacitance

o(r)

output rise time

10 % to 90 % full
intensity

16.1

o(f)

output fall time

90 % to 10 % full
intensity

14.5

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

Analog input/output

SYNC_FILTER

sync

storage capacitor to ground

100

sync

sync filter level voltage for nominal sync
amplitude

0.35

0.55

0.75

Crystal oscillator

NPUT

XTALIN

LOW-level input voltage

SSA

HIGH-level input voltage

DDA

input capacitance

UTPUT

XTALOUT

output capacitance

Crystal specification; notes 3 and 4

xtal

nominal frequency

fundamental mode

MHz

load capacitance

mot

motional capacitance

amb

= 25

res

resonance resistance

amb

= 25

osc

capacitors at pins XTALIN and XTALOUT T

amb

= 25

note 4

crystal holder capacitance

amb

= 25

note 4

xtal

crystal temperature range

+25

+85

adjustment tolerance

amb

= 25

drift

100

C-bus characteristics for fast mode

SCL

SCL clock frequency

400

kHz

BUF

bus free time between a STOP and
START condition

1.3

HD;STA

hold time START condition; after this
period; the first clock pulse is generated

0.6

LOW

SCL LOW time

1.3

HIGH

SCL HIGH time

0.6

SU;STA

set-up time repeated START

0.6

HD;DAT

data hold time

notes 5 and 6

0.9

SU;DAT

data set-up time

note 7

100

rise time SDA and SCL

note 7

300

fall time SDA and SCL

note 7

300

SU;STO

set-up time STOP condition

0.6

capacitive load of each bus line

note 8

400

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

Notes

1. Periphery current is dependent on external components and voltage levels on I/Os.

2. V

is the drop across a protection transistor which clamps the input to V

. The maximum value is V

= 0.75 V

3. Crystal order number 4322 143 05561.

4. If the 4322 143 05561 crystal is not used, the formula in the crystal specification should be used. The mean of the

capacitances due to the chip at XTALIN and at XTALOUT is C

, where C

= 7 pF. C

ext

is a value for the mean of

the stray capacitances due to the external circuits at XTALIN and XTALOUT.

a) C

osc(typ)

= 2C

ext

. Capacitor C

osc

may need to be reduced from the initial selected value.

b) C

O(max)

= 35

0.5 (C

osc

+ C

ext

) pF. The maximum value for the crystal holder capacitance is to ensure

start-up.

5. A device must internally provide a hold time of at least 300 ns for the SDA signal, referenced to the V

IH(min)

of the

SCL signal, in order to bridge the undefined region of the falling edge of SCL.

6. The maximum t

HD;DAT

has only to be met if the device does not stretch the LOW period of the SCL signal (t

LOW(SCL)

7. A fast mode I

C-bus device can be used in a standard-mode I

C-bus system, but the requirement t

SU;DAT

250 ns

must be met. This requirement is met for a device that does not stretch t

LOW(SCL)

. If a device does stretch t

LOW(SCL)

the next data bit to the SDA line must be output t

r(max)

+ t

SU;DAT

= 1000 + 250 = 1250 ns before the SCL line is

released (according to the standard-mode I

C-bus specification).

8. C

= total capacitance of one bus line in pF.

12 APPLICATION INFORMATION

12.1

EMC guidelines

Optimization of circuit return paths and minimization of
common mode emission is achieved by a double sided
Printed-Circuit Board (PCB) with low inductance ground
plane.

On a single-sided PCB a local ground plane under the
whole IC should be present. Preferably, the PCB local
ground plane connection should not be connected to other
grounds on route to the PCB ground. Do not use wire links.
Wire links cause ground inductance which increases
ground bounce.

The supply pins can be decoupled at the ground pin plane
below the IC. This is easily achieved by using surface
mount capacitors, which, at high frequency, are more
effective than components with leads.

Using a device socket would increase the area and
therefore increase the inductance of the external bypass
loop.

To provide a high-impedance to any high frequency
signals on the V

supplies to the IC, a ferrite bead or

inductor can be connected in series with the supply line
close to the decoupling capacitor. To prevent signal
radiation, pull-up resistors of signal outputs should not be
connected to the V

supply on the IC side of the ferrite

bead or inductor.

OSCGND should only be connected to the crystal load
capacitors and not to any other ground connection.

Distances to physical connections of associated active
devices should be as short as possible.

PCB output tracks should have close proximity, mutually
coupled and ground return paths.

2005

Mar

Philips Semiconductors

Product specification

Multi page intelligent telete

xt decoder

SAA5360; SAA5361

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12.2

Application dia

gram

mhc509

AFC

AV status

program

plus(

)

minus(

)

tune

SSC

DDP

DDC

SSP

SSA

VPE

P2_1/PWM0

P2_2/PWM1

P2_3/PWM2

P2_4/PWM3

P2_5/PWM4

P2_6/PWM5

P2_7/PWM6

P3_0/ADC0

P3_1/ADC1

P3_2/ADC2

SCL_NVRAM

P3_3/ADC3

11, 62, 99

SDA_NVRAM

P0_2

P0_3

P0_4

P0_5

P0_6

P0_7

DDA

HSYNC

VDS

VSYNC

XTALOUT

XTALIN

OSCGND

P1_0

RESET

IREF

100 nF

FRAME

SYNC_FILTER

CVBS1

CVBS0

CVBS (IF)

CVBS (SCART)

21, 42

100

12, 60

P2_0/TPWM

P1_4

SDA

SCL

P1_3

P1_2

P1_1

P1_5

brightness

contrast

saturation

hue

volume (L)

volume (R)

1 k

150

24 k

40 V

PH2369

100 nF

COR

56 pF

SAA5360HL
SAA5361HL

RECEIVER

12 MHz

to TV

display
circuits

control

signals

field flyback

line flyback

RESET

Fig.4 Application diagram.

Bidirectional ports have been configured as open-drain.

Output ports have been configured as push-pull.

Connections of the SAA5361HL to the external SDRAM are shown in Fig.5.

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

coa003

SRAM

SAA5361HL

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

RAMBK1

A12

A13

A15_BK

100

3 4 5

6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

75 74 73 72 71 70 69 68 67 66

A11

RAMBK0

A10

65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

A17

A16

A15

A14

A13

A12

A11

A10

RD/

A14

Fig.5 Application diagram of SAA5361 with external SRAM connections.

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

12.3

Application notes

Ports AD0 to AD7 of the microcontroller can be connected
to pins D0 to D7 of the SRAM in any order.

For the addressing, the lower group of address lines
(A0 to A8) and the upper group of address lines
(A9 to A14, A15_BK, RAMBK0 and RAMBK1) may be
connected in any order within the groups, provided that the
full 256 kbytes of external SRAM is used.

Fig.5 shows the application diagram of the SAA5361 with
external SRAM connections.

When using an external SRAM smaller than 256 kbytes,
the relevant number of bits from the microcontroller
address bus should be disconnected, always removing the
most significant bits first.

For power saving modes, it might be advisable to control
the CE pin of the SRAM module(s) using one of the
microcontroller ports to de-select the SRAM.

12.3.1

XTERNAL DATA MEMORY ACCESS

Table 4

External data memory access (see Fig.6 and
Fig.7)

Note

1. The timings are only valid for the nominal 12 MHz

clock provided to the microcontroller.

12.3.2

YMBOL EXPLANATIONS

Each timing symbol has five characters. The first character
is always `t' (time). Depending on their positions, the other
characters indicate the name of a signal or the logical
status of that signal.

The designations are:

A = Address

C = Clock

D = Input data

H = Logic level HIGH

I = Instruction (program memory contents)

L = Logic level LOW, or ALE

P = PSEN

Q = Output data

R = RD signal

t = Time

V = Valid

W = WR signal

X = No longer a valid logic level

Z = Float

Examples:
t

AVLL

= time for address valid to ALE LOW.

LLPL

= time for ALE to PSEN LOW.

SYMBOL

PARAMETER

TYPICAL

(1)

UNIT

RLRH

RD pulse width

250

WLWH

WR pulse width

250

RLDV

RD LOW to valid data in 198

RHDX

Data hold after RD

RHDZ

Data float after RD

tbd

LLWL

ALE LOW to RD or
WR LOW

132

AVWL

Address valid to WR
LOW or RD LOW

172

QVWX

Data valid to WR LOW

WHQX

Data hold after WR

RLAZ

RD LOW to address
float

tbd

WHLH

RD or WR HIGH to
ALE HIGH

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

13 PACKAGE OUTLINE

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

1.6

0.15
0.05

1.45
1.35

0.25

0.27
0.17

0.20
0.09

14.1
13.9

0.5

16.25
15.75

1.15
0.85

7
0

0.08

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75
0.45

SOT407-1

136E20

MS-026

00-02-01
03-02-20

(1)

14.1
13.9

16.25
15.75

1.15
0.85

detail X

(A )

Z E

100

pin 1 index

10 mm

scale

LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm

SOT407-1

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

14 SOLDERING

14.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

14.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.

Typical reflow peak temperatures range from
215

C to 270

C depending on solder paste material. The

top-surface temperature of the packages should
preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free

process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a

volume

350 mm

so called thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

14.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250

C or 265

C, depending

on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270

C and 320

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

14.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217

C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar soldering or manual soldering is suitable for PMFP packages.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, HTSSON..T

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(3)

, TFBGA,

VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable

(4)

suitable

PLCC

(5)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(5)(6)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(7)

suitable

CWQCCN..L

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable

2005 Mar 09

Philips Semiconductors

Product specification

Multi page intelligent teletext decoder

SAA5360; SAA5361

15 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

16 DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

17 DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

R24/06/pp

Date of release:

2005 Mar 09

Document order number:

9397 750 14857

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA5360HL

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA5360HL