1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

FEATURES

Acquisition and display of the 625-line PAL CCST
Chinese standard for teletext, with Chinese and Latin
character sets

Supports multiple DRAM sizes: 256K

4 bits,

4 bits, 4M

4 bits and 2

4 bits with an

additional decoder/demultiplexer IC

Acquires and stores in background up to (typically)
400 pages with 1M

4 bits external DRAM

CCST Fastext, with capability of displaying Chinese
characters on Fastext prompt row

Meshing for reduced contrast video background in
subtitles and boxes

Full line and screen colour to all edges of screen

Supports 625-line 50/100 Hz display modes

Scan-locked and stand-alone sync modes; supports
video-locked sync modes with external PLL

Easy control via high level I

C-bus SAFARI commands

Sync mode switching and picture centring via I

C-bus

SAFARI commands

Supports external decryption unit for encrypted data.

GENERAL DESCRIPTION

The SAA5700 is a Chinese teletext decoder suitable for TV
and multimedia applications. It incorporates all the data
slicing, acquisition and display circuitry on-chip, as well as
the logic for memory management. An external DRAM is
used to store the currently displayed page and also the
precaptured teletext pages.

An external ROM is used to store the ideographic Chinese
character set. There is a high level software interface with
easy commands for the control of the decoder. Control is
achieved via the I

C-bus.

The device is available in a QFP64 package.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

SAA5700GP

QFP64

plastic quad flat package; 64 leads (lead length 1.95 mm);
body 14

2.8 mm

SOT319-2

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

PINNING

SYMBOL

PIN

I/O

DESCRIPTION

OSCOUT

oscillator output to crystal

SS3

ground

ground for I/O pad buffers connect to V

; internally connected to V

SS1

and V

SS2

n.c.

not connected

BLACK

I/O

black level sample and hold capacitor; 100 nF to V

SSA

CVBS

video signal input; 100 nF series capacitor, 250

source impedance maximum,

reference to V

SSA

STN

I/O

ADC current reference decoupling; 100 nF to V

SSA

REF

current reference input; 10 k

to V

SSA

ground

0 V power supply; analog

DDA

supply

+5 V power supply; analog

REF+

ADC voltage reference decoupling; 100 nF to V

SSA

i.c.

internally connected; do not use

i.c.

internally connected; do not use

i.c.

internally connected; do not use

ground

connect to V

for normal use

n.c.

not connected

ground

connect to V

for normal use

LFB

scan line flyback input (HSYNC)

FFB/STTV

I/O

scan field flyback input (VSYNC)/sync to TV output

DDX

supply

+5 V power supply; connect to V

for normal use

SSO

ground

output stage current return and 0 V

analog Red output

analog Green output

analog Blue output

BLAN

fast blanking (VDS)

ODD/EVEN

frame rate signal for hardware de-interlace (FRAME)

ground

connect to V

for normal use

ROMCS

chip select (address decode) for ROM

RA0

bit 0 of address to DRAM, ROM and IC

RA1

bit 1 of address to DRAM, ROM and IC

RA2

bit 2 of address to DRAM, ROM and IC

RA3

bit 3 of address to DRAM, ROM and IC

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

RA4

bit 4 of address to DRAM, ROM and IC

SS1

ground

0 V power supply digital; connected internally to V

SS2

and V

SS3

n.c.

not connected

DDD1

supply

+5 V power supply digital; connected internally to V

DD2

RA5

bit 5 of address to DRAM, ROM and IC

RA6

bit 6 of address to DRAM, ROM and IC

RA7

bit 7 of address to DRAM, ROM and IC

n.c.

not connected

RA8

bit 8 of address to DRAM, ROM and IC

RA9

bit 9 of address to DRAM, ROM and IC

RAS

row address strobe to DRAM; active LOW

n.c.

not connected

write enable to DRAM and IC; active LOW

i.c.

internally connected; do not use

RD0

I/O

bit 0 of data bus to/from DRAM, ROM and IC

RD1

I/O

bit 1 of data bus to/from DRAM, ROM and IC

DDD2

supply

+5 V power supply digital; connected internally to V

DD1

SS2

ground

0 V power supply digital; connected internally to V

SS1

and V

SS3

n.c.

not connected

RD2

I/O

bit 2 of data bus to/from DRAM, ROM and IC

RD3

I/O

bit 3 of data bus to/from DRAM, ROM and IC

CAS

column address strobe to DRAM; active LOW

RA10

bit 10 of address to DRAM, ROM and IC

RD7

I/O

bit 7 of data bus to/from DRAM, ROM and IC

RD6

I/O

bit 6 of data bus to/from DRAM, ROM and IC

RD5

I/O

bit 5 of data bus to/from DRAM, ROM and IC

RD4

I/O

bit 4 of data bus to/from DRAM, ROM and IC

RESET

chip/processor reset input (active HIGH)

DDA

I/O

bidirectional serial data to/from optional Decryptor

SCL

primary I

C-bus serial clock input

SDA

I/O

primary I

C-bus serial data

DCL

serial clock to optional Decryptor

OSCIN

oscillator input from crystal/external clock input

SYMBOL

PIN

I/O

DESCRIPTION

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

HIGH LEVEL I

C-BUS COMMAND INTERFACE

This device communicates via the I

C-bus using the SAFARI protocol. The following section indicates the protocol which

is supported by this decoder.

User commands

Table 1 lists the CCST user command codes in TV mode; Table 2 lists the CCST user command codes in Text mode.

Table 1

TV mode user command codes

FUNCTION ID

(HEX)

FUNCTION

PICTURE

STATUS

TIME

TV PROGRAMME 0

TV PROGRAMME 1

TV PROGRAMME 2

TV PROGRAMME 3

TV PROGRAMME 4

TV PROGRAMME 5

TV PROGRAMME 6

TV PROGRAMME 7

TV PROGRAMME 8

TV PROGRAMME 9

TV PROGRAMME 10

TV PROGRAMME 11

TV PROGRAMME 12

TV PROGRAMME 13

TV PROGRAMME 14

TV PROGRAMME 15

Table 2

Text mode user command codes

FUNCTION ID

(HEX)

FUNCTION

RED

GREEN

YELLOW

SUBTITLE

STATUS

HOLD TOGGLE

REVEAL

CANCEL TOGGLE

INDEX

BROWSE

REVEAL SET TOGGLE

DISPLAY CHINESE PROMPT

SUBCODE TOGGLE

SIZE

DOWN

CYAN

MIX

TEXT

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

CHARACTERISTICS

amb

20 to +70

C and V

DDn

= 4.5 to 5.5 V; unless otherwise indicated.

SYMBOL

PARAMETER

MIN.

MAX.

UNITS

DDD1

digital supply voltage 1

0.3

+6.5

DDD2

digital supply voltage 2

0.3

+6.5

DDA

analog supply voltage

0.3

+6.5

DDX

supply voltage X

0.3

+6.5

I(max)

maximum input voltage (any input)

0.3

+ 0.5

O(max)

maximum output voltage (any output)

0.3

+ 0.5

DDX-DDn

supply voltage difference

between V

DDX

, V

DDD1

, V

DDD2

and V

DDA

0.25

I(d)

diode input current (DC)

O(d)

diode output current (DC)

O(max)

maximum output current (any output)

stg

storage temperature

+125

amb

operating ambient temperature

+70

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Power supplies

DDD1

digital supply voltage 1

4.5

5.0

5.5

DDD1

digital supply current 1

140

DDD2

digital supply voltage 2

4.5

5.0

5.5

DDD2

digital supply current 2

2.4

6.5

DDA

analog supply voltage

4.5

5.0

5.5

DDA

analog supply current

DDX

supply voltage X

4.5

5.0

5.5

DDX

supply current X

DD(tot)

total supply current

170

240

Inputs

CVBS

sync

sync amplitude

0.1

0.3

0.6

bur(p-p)

colour burst amplitude
(peak-to-peak value)

0.3

I(video)(p-p)

video input amplitude (peak-to-peak
value)

0.7

1.0

1.4

I(data)

teletext data amplitude

0.29

0.46

0.71

source

source impedance

250

SW(I)

input switching level of sync
separator

1.6

1.9

2.2

input capacitance

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

IREF

resistor to V

SSA

IREF

voltage on I

REF

= 5 V

2.3

ESET

LOW-level input voltage

0.3

+0.8

HIGH-level input voltage

2.0

+ 0.5

input leakage current

= 0 to V

+10

LFB (HSYNC)

LOW-level input voltage

0.3

+0.6

HIGH-level input voltage

2.4

+ 0.5

hys

input hysteresis voltage

0.7

input leakage current

= 0 to V

+10

I(max)

maximum input current

note 1

W(LFB)

LFB input pulse width

200

i(r)

input rise time

100

i(f)

input fall time

100

FFB (VSYNC)

LOW-level input voltage

0.3

0.3V

HIGH-level input voltage

0.7V

+ 0.5

input leakage current

= 0 to V

+10

I(max)

maximum input current

W(FFB)

FFB input pulse width

display
lines

i(r)

input rise time

500

i(f)

input fall time

500

Input/outputs

REF+

decoupling capacitor to V

SSA

100

REF+

DC voltage on REF+

2.3

2.5

2.7

OSCIN

AND

OSCOUT

osc(p-p)

oscillation amplitude
(peak-to-peak value)

input capacitance

osc

oscillator frequency

6.0

MHz

osc

oscillator frequency tolerance

500

ppm

BLACK

storage capacitor to V

SSA

100

BLACK

black level for nominal sync
amplitude

1.75

2.0

2.25

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

input leakage current

= 0 to V

+10

STN

decoupling capacitor to V

SSA

100

STN

DC voltage on STN

0.95

1.1

1.25

SCL (

OPEN

DRAIN

)

SCL

SCL clock frequency

400

kHz

LOW-level input voltage

0.5

+1.5

HIGH-level input voltage

3.0

+ 0.5

LOW-level output voltage

= 3 mA

0.4

= 6 mA

0.6

input leakage current

= 0 to V

+10

input capacitance

load capacitance

400

i(r)

input rise time

SCL

= 100 kHz;

note 2

1000

SCL

= 400 kHz;

note 2

300

i(f)

input fall time

SCL

= 100 kHz;

note 3

300

SCL

= 400 kHz;

note 3

300

o(f)

output fall time

3 to 1.5 V;
I

= 3 mA

250

SDA (

OPEN

DRAIN

)

LOW-level input voltage

0.5

+1.5

HIGH-level input voltage

3.0

+ 0.5

LOW-level output voltage

= 3 mA

0.4

= 6 mA

0.6

input leakage current

= 0 to V

+10

input capacitance

load capacitance

400

i(r)

input rise time

SCL

= 100 kHz;

note 2

1000

SCL

= 400 kHz;

note 2

300

i(f)

input fall time

SCL

= 100 kHz;

note 3

300

SCL

= 400 kHz;

note 3

300

o(f)

output fall time

3 to 1.5 V;
I

= 3 mA

250

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DCL

AND

DDA (

INTERNAL PULL

DOWN RESISTOR

)

LOW-level input voltage

0.3

+0.8

HIGH-level input voltage

2.0

+ 0.5

LOW-level output voltage

= 1.6 mA

0.4

input leakage current

= 0 to V

+10

input capacitance

load capacitance

o(f)

output fall time

2.2 to 0.6 V;
I

= 1.6 mA

RD7

RD0

LOW-level input voltage

0.3

+0.8

HIGH-level input voltage

2.0

+ 0.5

LOW-level output voltage

= 1.6 mA

0.4

HIGH-level output voltage

0.2 mA

2.4

input leakage current

= 0 to V

+10

input capacitance

load capacitance

o(r)

output rise time into C

0.6 to 2.2 V

o(f)

output fall time into C

2.2 to 0.6 V

Outputs

CAS

LOW-level output voltage

= 1.6 mA

0.4

HIGH-level output voltage

0.2 mA

2.4

load capacitance

o(r)

output rise time into C

0.6 to 2.2 V

o(f)

output fall time into C

2.2 to 0.6 V

RAS, WE, ROMCS, RA10

RA0

LOW-level output voltage

= 1.6 mA

0.4

HIGH-level output voltage

0.2 mA

2.4

load capacitance

o(r)

output rise time into C

0.6 to 2.2 V

o(f)

output fall time into C

2.2 to 0.6 V

ODD/EVEN (FRAME)

LOW-level output voltage

= 1.6 mA

0.4

HIGH-level output voltage

0.2 mA

2.4

load capacitance

200

o(r)

output rise time into C

0.6 to 2.2 V

200

o(f)

output fall time into C

2.2 to 0.6 V

200

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Notes

1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs.

An external series resistor must be used to limit the input currents to 1 mA.

2. Measured from V

IL(max)

to V

IH(min)

3. Measured from V

IH(min)

to V

IL(max)

STTV

VCS, TCS amplitude

0.2

0.3

0.4

STTV(DC)

nominal DC voltage

1.85

2.0

2.15

O(drive)

output drive

R, G

AND

LOW-level output current (black
level)

+10

HIGH-level output current
(full intensity)

DDX

= 5 V

5.1

6.0

6.9

load resistance to V

SSO

for nominal

1 V

(p-p)

output

160

load capacitance

o(r)

output rise time

10% to 90%

o(f)

output fall time

90% to 10%

BLAN (VDS)

HIGH-level output voltage

2 mA

0.25

LOW-level output voltage

= 2 mA

0.2

load capacitance

o(r)

output rise time

10% to 90%

o(f)

output fall time

90% to 10%

skew delay between outputs R,G,B
and BLAN

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Table 4

C-bus Timing (see note 1 and Fig.3)

Note

1. The I

C-bus interface pins SDA and SCL may pull the data and clock lines below 3 V while the power supply V

in the range 0.4 to 0.8 V. Outside this range, the SDA and SCL pins behave correctly.

SYMBOL

PARAMETER

100 kHz

400 kHz

UNIT

MIN.

MAX.

MIN.

MAX.

SCL

SCL clock frequency

100

400

kHz

LOW

LOW period of the SCL clock

4.7

1.3

HIGH

HIGH period of the SCL clock

4.0

0.6

SU;DAT

data set-up time

250

100

HD;DAT

date hold time

SU;STO

set-up time clock HIGH to STOP

4.7

0.6

BUF

set-up time STOP to START

4.7

1.3

HD;STA

START hold time

4.0

0.6

SU;STA

set-up time clock rising edge to START

4.7

0.6

rise time of both SDA and SCL signals

1000

300

fall time of both SDA and SCL signals

300

Fig.3 Primary I

C-bus timing.

handbook, full pagewidth

MGG541

tHIGH

tLOW

tSU;STA

tHD;STA

tSU;DAT

tHD;DAT

tSU;STO

tBUF

SCL

SDA

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DRAM Interface timing (see note 1 and Fig.4)

Note

1. Based on a display clock frequency of 24 MHz, maximum 24 MHz + 500 ppm.

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

cy(RAS)

RAS cycle time

375

pch(RAS)

RAS precharge time

h(CAS)

CAS hold time

d(RAS-CAS)

RAS to CAS delay time

WL(CAS)

CAS pulse width LOW

cy(CAS)

CAS page mode cycle time

pch(CAS)

CAS precharge time

h(CAS-RAS)

RAS hold time after CAS

pch(CAS-RAS)

CAS to RAS precharge time

su(RA)

row address set-up time

h(RA)

row address hold time

su(CA)

column address set-up time

h(CA)

column address hold time

su(R)

read command set-up time

h(R)(CAS)

read command hold time from (CAS)

h(R)(RAS)

read command hold time from (RAS)

su(W)

write command set-up time

h(W)

write command hold time

su(i)(D)

data input set-up time

h(i)(D)

data input hold time

ACC(R)(CAS)

read access time from (CAS)

ACC(R)(RAS)

read access time from (RAS)

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

"Quality

Reference Handbook" (order code 9397 750 00192).

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The footprint must be at an angle of 45

to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1997 May 16

Philips Semiconductors

Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA54

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Tel. +41 1 488 2686, Fax. +41 1 481 7730

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381

Middle East: see Italy

Printed in The Netherlands

547047/50/01/pp24

Date of release: 1997 May 16

Document order number:

9397 750 01008

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA5700GP/M4C

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA5700GP/M4C