Document Outline
- FEATURES
- APPLICATIONS
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING INFORMATION
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- THERMAL CHARACTERISTICS
- CHARACTERISTICS: DIGITAL PART
- CHARACTERISTICS: ANALOG PART
- TIMING DATA
- PACKAGE OUTLINE
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
File under Integrated Circuits, IC01
2001 May 07
INTEGRATED CIRCUITS
SAA6581T
RDS/RBDS demodulator
2001 May 07
2
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
FEATURES
Integrated switched capacitor filter
Demodulates European Radio Data System (RDS) or
the USA Radio Broadcast Data System (RBDS) signals
Oscillator frequencies: 4.332 or 8.664 MHz
Integrated ARI clamping
CMOS device
Single supply voltage: 5 V
Extended temperature range:
-
40 to +85
C
Low number of external components.
GENERAL DESCRIPTION
The RDS/RBDS demodulator is a CMOS device with
integrated filtering and demodulating of RDS/RBDS
signals coming from a multiplexed input data stream. Data
signal RDDA and clock signal RDCL are provided as
outputs for further processing by a suitable
microcomputer, for example CCR921 and CCR922.
The SAA6581T replaces SAA6579 in function and
pin-compatibility.
APPLICATIONS
The RDS/RBDS system offers a large range of
applications from the many functions that can be
implemented. For car radios the most important are:
Program Service (PS) name
Traffic Program (TP) identification
Traffic Announcement (TA) signal
Alternative Frequency (AF) list
Program Identification (PI)
Enhanced Other Networks (EON) information.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
DDA
analog supply voltage
4.0
5.0
5.5
V
V
DDD
digital supply voltage
4.0
5.0
5.5
V
I
DD(tot)
total supply current
-
6.0
-
mA
V
i(MPX)
RDS input sensitivity at pin MPX
1
-
-
mV
f
i(xtal)
crystal input frequency
-
4.332
-
MHz
-
8.664
-
MHz
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
SAA6581T
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
2001 May 07
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
BLOCK DIAGRAM
handbook, full pagewidth
57 kHz
8th ORDER
BANDPASS FILTER
CLOCKED
COMPARATOR
RDS/RBDS
DEMODULATOR
SIGNAL QUALITY
DETECTOR
POWER
SUPPLY
AND RESET
TEST
CONTROL
OSCILLATOR
AND CLOCK
MPX
multiplex
input
C1
C6
330 pF
560 pF
4
VDDA
VSSA
Vref
+
5 V
+
5 V
C2
100 nF
C4
47 pF
C5
56 pF
C7
100 nF
C3
2.2
F
5
6
VSSD
11
3
TCON
CIN
SCOUT
15
8
7
MODE
VDDD
9
OSCI
Q1
OSCO
QUAL
RDDA
RDCL
SYNC
13
14
12
16
10
2
1
MHB899
SAA6581T
Fig.1 Block diagram.
2001 May 07
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
PINNING
SYMBOL
PIN
DESCRIPTION
QUAL
1
signal quality indication output
RDDA
2
RDS data output
V
ref
3
reference voltage output (
1
/
2
V
DDA
)
MPX
4
multiplex signal input
V
DDA
5
analog supply voltage (5 V)
V
SSA
6
analog ground (0 V)
CIN
7
comparator input
SCOUT
8
switched capacitor filter output
MODE
9
oscillator frequency select input
SYNC
10
ARI clamping control input
V
SSD
11
digital ground (0 V)
V
DDD
12
digital supply voltage (5 V)
OSCI
13
oscillator input
OSCO
14
oscillator output
TCON
15
test control input
RDCL
16
RDS clock output
handbook, halfpage
MHB900
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
QUAL
RDDA
Vref
MPX
VDDA
VSSA
CIN
SCOUT
RDCL
TCON
OSCO
OSCI
VDDD
VSSD
SYNC
MODE
SAA6581T
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
RDS/RBDS signal demodulation
B
ANDPASS FILTER
The bandpass filter has a centre frequency of 57 kHz. It
selects the RDS/RBDS sub-band from the multiplex signal
MPX and suppresses the audio signal components. The
filter block contains an analog anti-aliasing filter at the
input followed by an 8
th
order switched capacitor bandpass
filter and a reconstruction filter at the output.
C
LOCKED COMPARATOR
The comparator digitizes the output signal from the 57 kHz
bandpass filter for further processing by the digital
RDS/RBDS demodulator. To attain high sensitivity and to
avoid phase distortion, the comparator input stage has
automatic offset compensation.
D
EMODULATOR
The demodulator provides all functions of the SAA6579
and improves performance under weak signal conditions.
Demodulator functions include:
57 kHz carrier regeneration from the two sidebands
(Costas loop)
Symbol integration over one RDS clock period
Bi-phase symbol decoding
Differential decoding
Synchronization of RDS/RBDS output data.
The RDS/RBDS demodulator recovers and regenerates
the continuously transmitted RDS/RBDS data stream in
the MPX signal and provides clock RDCL for the output
signals and data output RDDA for further processing by an
RDS/RBDS decoder, for example CCR921 or CCR922.
ARI
CLAMP
The demodulator checks the input signal for presence of
RDS only, or RDS plus ARI transmissions. After a fixed
test period, if the SYNC input is set HIGH the demodulator
locks in the `verified' condition (see Table 1). If SYNC is set
LOW, the ARI clamping is reset (disabled). After SYNC
returns to HIGH, the demodulator resumes checking the
input signal.
2001 May 07
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
Table 1
Control pin SYNC
S
IGNAL QUALITY DETECTION
Output QUAL indicates the safety of the regenerated RDS
data (HIGH = `good' data; LOW = `unsafe' data).
Oscillator and system clock generator
For good performance of the bandpass and demodulator
stages, the demodulator requires a crystal oscillator with a
frequency of 4.332 or 8.664 MHz. The demodulator can
operate with either frequency (see Table 2), so that a radio
set with a microcontroller can run, in this case, with one
crystal only. The demodulator oscillator can drive the
microcontroller, or vice versa.
Table 2
Control pins TCON and MODE
The clock generator generates the internal 4.332 MHz
system clock and timing signal derivatives.
Power supply and internal reset
The demodulator has separate power supply inputs for the
digital and analog parts of the device. For the analog
functions an additional reference voltage (
1
/
2
V
DDA
) is
internally generated and available via the output pin V
ref
.
The demodulator requires a defined reset condition. The
demodulator generates automatically a reset signal after
the power supply V
DDA
is switched on, or at a voltage-drop.
SYNC
ARI CLAMPING
LOW
internal ARI clamping disabled
HIGH
ARI clamping allowed to be logged
TCON
MODE
OSCILLATOR FREQUENCY
HIGH
LOW
4.332 MHz
HIGH
HIGH
8.664 MHz
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor).
2. Machine model (equivalent to discharging a 200 pF capacitor through a 0
series resistor and 0.75
H inductance).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DD
supply voltage
0
6.5
V
V
n
voltage at pins 1 to 4, 7 to 10, and
13 to 16 with respect to pins 6 and 11
pins 5 and 12 are
connected to V
DD
-
0.5
V
DD
+ 0.5
6.5 V
I
i
input current at pins 1 to 5, 7 to 11 and
13 to 16
pins 6 and 11 are
connected to ground
-
10
+10
mA
I
lu(prot)
latch-up protection current in pulsed
mode
T
amb
=
-
40 to +85
C with
voltage limiting
-
2 to +10 V
-
100
+100
mA
T
amb
= 25
C with voltage
limiting
-
2 to +12 V
-
200
+200
mA
T
amb
=
-
40 to +85
C
without voltage limiting
-
10
+10
mA
T
amb
ambient temperature
-
40
+85
C
T
stg
storage temperature
-
65
+150
C
V
es
electrostatic handling voltage
note 1
-
4000
+4000
V
note 2
-
500
+500
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
104
K/W
2001 May 07
6
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
CHARACTERISTICS: DIGITAL PART
V
DDA
= V
DDD
= 5 V; T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
DDD
digital supply voltage
4.0
5.0
5.5
V
I
DDD
digital supply current
-
1.5
-
mA
P
tot
total power dissipation
-
30
-
mW
Inputs
V
IL
LOW-level input voltage at
pins TCON, OSCI, SYNC and
MODE
-
-
0.3V
DDD
V
V
IH
HIGH-level input voltage at
pins TCON, OSCI, SYNC and
MODE
0.7V
DDD
-
-
V
I
i(pu)
input pull-up current at
pins TCON and MODE
V
IH
= 3.5 V
-
10
-
20
-
A
Outputs
V
OL
LOW-level output voltage at
pins QUAL, RDDA and RDCL
I
OL
= 2 mA
-
-
0.4
V
V
OH
HIGH-level output voltage at
pins QUAL, RDDA and RDCL
I
OH
=
-
0.02 mA
4.0
-
-
V
Crystal parameters
f
i(xtal)
crystal input frequency
TCON = HIGH;
MODE = LOW
-
4.332
-
MHz
TCON = HIGH;
MODE = HIGH
-
8.664
-
MHz
f
osc
adjustment tolerance of oscillator
frequency
-
-
30
10
-
6
f
osc(T)
temperature drift of oscillator
frequency
T
amb
=
-
40 to +85
C
-
-
30
10
-
6
C
L
load capacitance
-
30
-
pF
R
xtal
crystal resonance resistance
-
-
120
2001 May 07
7
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
CHARACTERISTICS: ANALOG PART
V
DDA
= V
DDD
= 5 V; T
amb
= 25
C; measurements taken in Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
DDA
analog supply voltage
4.0
5.0
5.5
V
V
DDA
-
V
DDD
difference between analog and
digital supply voltages
-
0
0.5
V
I
DD(tot)
total supply current
-
6.0
-
mA
V
ref
reference voltage
V
DDA
= 5 V
2.25
2.5
2.75
V
Z
o(Vref)
output impedance at pin V
ref
-
25
-
k
MPX input (signal before the capacitor on pin MPX)
V
i(MPX)(rms)
RDS amplitude (RMS value)
f =
1.2 kHz RDS-signal;
f =
3.2 kHz ARI-signal
1
-
-
mV
V
i(max)(p-p)
maximum input signal capability
(peak-to-peak value)
f = 57
2 kHz
200
-
-
mV
f < 50 kHz
1.4
-
-
V
f < 15 kHz
2.8
-
-
V
f > 70 kHz
3.5
-
-
V
R
i(MPX)
input resistance
f = 0 to 100 kHz
40
-
-
k
57 kHz bandpass filter
f
c
centre frequency
T
amb
=
-
40 to +85
C
56.5
57.0
57.5
kHz
B
-
3dB
-
3 dB bandwidth
2.5
3.0
3.5
kHz
G
SCOUT-MPX
signal gain
f = 57 kHz
17
20
23
dB
sb
stop band attenuation
f =
7 kHz
31
-
-
dB
f < 45 kHz
40
-
-
dB
f < 20 kHz
50
-
-
dB
f > 70 kHz
40
-
-
dB
R
o(SCOUT)
output resistance at pin SCOUT
f = 57 kHz
-
30
60
Comparator input (pin CIN)
V
i(min)(rms)
minimum input level
(RMS value)
f = 57 kHz
-
1
10
mV
R
i
input resistance
70
110
150
k
2001 May 07
8
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
TIMING DATA
handbook, full pagewidth
tCLKH
TCLK
Tbit(slipped)
td(clk)
MHB901
RDDA
RDCL
td(clk)
Fig.3 RDS timing diagram including a phase change.
Table 3
RDS timing (see Fig.3)
SYMBOL
PARAMETER
TYP.
UNIT
t
d(clk)
clock-data delay
4
s
T
CLK
clock period
842
s
t
CLKH
clock HIGH time
421
s
T
bit(slipped)
slipped data bit period
1263
s
2001 May 07
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
w
M
b
p
D
detail X
Z
e
9
1
y
0.25
075E03
MS-013
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.41
0.40
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
0
5
10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
97-05-22
99-12-27
2001 May 07
10
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2001 May 07
11
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2001 May 07
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 May 07
13
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
NOTES
2001 May 07
14
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
NOTES
2001 May 07
15
Philips Semiconductors
Product specification
RDS/RBDS demodulator
SAA6581T
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2001
72
Philips Semiconductors a worldwide company
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
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Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 7 - 9 Rue du Mont Valrien, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4728 6600, Fax. +33 1 4728 6638
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,
Tel: +36 1 382 1700, Fax: +36 1 382 1800
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands
753503/01/pp
16
Date of release:
2001 May 07
Document order number:
9397 750 08148
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