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Электронный компонент: SAA7201H/C2

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DATA SHEET
Objective specification
Supersedes data of 1997 Jan 29
File under Integrated Circuits, IC02
2001 Mar 28
INTEGRATED CIRCUITS
SAA7201
Integrated MPEG2 AVG decoder
2001 Mar 28
2
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
FEATURES
General
Uses single external Synchronous DRAM (SDRAM)
organized as 1M
16 interfacing at 81 MHz; compatible
with the SDRAM `lite' or `PC'
Fast external CPU interface; 16-bit data + 8-bit address
Dedicated input for audio and video data in PES or ES
format; data input rate:
9 Mbytes/s in byte mode;
20 Mbit/s in bit serial mode; audio and/or video data
can also serve as input via CPU interface
Single 27 MHz external clock for time base reference
and internal processing; all required decoding and
presentation clocks are generated internally
Internal system time base at 90 kHz can be
synchronized via CPU port
Flexible memory allocation under control of the external
CPU enables optimized partitioning of memory for
different tasks
Boundary scan (JTAG) plus external SDRAM self test
implemented
Supply voltage 3.3 V
Package 160 QFP.
CPU relation
16-bit data, 8-bit address, or 16-bit multiplexed bus;
Motorola and Intel mode supported
Support for fast DMA transfer to either internal registers
or external SDRAM
Maximum sustained rate to the external SDRAM is
9 Mbytes/s.
MPEG2 system
Parsing of MPEG2 PES and MPEG1 packet streams
Double System Time Clock (STC) counters for
discontinuity handling
Time stamps or CPU controlled audio/video
synchronization
Support for seamless time base change (edition)
Processing of errors flagged by channel decoding or
demux section
Support for retrieval of PES header and PES private
data.
MPEG2 audio
Decoding of 2 channel, layer I and II MPEG audio;
support for mono, stereo, intensity stereo and dual
channel mode
Constant and variable bit rates up to 448 kbit/s
Audio sampling frequencies: 48, 44.1, 32, 24, 22.05 and
16 kHz
CRC error detection
Selectable output channel in dual channel mode
Independent volume control for both channels and
programmable inter-channel crosstalk control through a
baseband audio processing unit
Storage ancillary data up to 54 bytes
Dynamic range control at output
Muting possibility via external controller; automatic
muting in case of errors
Generation of `beeps' with programmable tone height,
duration and amplitude
Serial two channel digital audio output with 16, 18, 20 or
22 bits per sample, compatible with either I
2
S or
Japanese formats
Serial SPDIF audio output
Clock output 256 or 384
f
s
for external D/A converter
Audio input buffer in external SDRAM with
programmable size (default is 64 kbit)
Programmable processing delay compensation
Software controlled stop, pause, restricted skip, and
restart functions.
MPEG2 video
Decoding of MPEG2 video up to main level, main profile
Nominal video input buffer size equals 2.6 Mbit for Video
Main Profile and Main Level (MP@ML)
Output picture format: CCIR-601 4 : 2 : 2 interlaced
pictures; picture format 720
576 at 50 Hz or 720
480
at 60 Hz
3 : 2 pull-down supported with 24 and 30 Hz sequences
Support of constant and variable bit rates up to 15 Mbit/s
Output interface at 8-bit wide, 27 MHz UYVY
multiplexed bus
Horizontal and vertical pan and scan allows the
extraction of a window from the coded picture
2001 Mar 28
3
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Flexible horizontal continuous scaling from 0.5 up to 4
allows easy aspect ratio conversion including support
for 2.21 : 1 aspect ratio movies
Vertical scaling with fixed factors 0.5, 1 or 2 to support
picture scaling and up-sampling
Scaling of incoming pictures to 25% of their original size
with anti-aliasing filtering to free screen space for
graphics applications like electronic program guides
Non-full screen MPEG pictures will be displayed in a box
of which position and background colour are adjustable
by the external CPU
Video output may be slaved to internally (master)
generated or externally (slave) supplied HV
synchronization signals; the position of active video is
programmable; MPEG timebase changes do not
affected the display phase
Video output direct connectable to SAA718X encoder
family
Various trick modes under control of external CPU:
Freeze I or P pictures; restart on I picture
Freeze on B pictures; restart at any moment
Scanning and decoding of I or I and P pictures
Single step mode
Repeat/Skip field for time base correction.
Graphics
Graphics is region based and presented in boxes
independent of video format
Screen arrangement of boxes is determined by display
list mechanism which allows for multiple boxes,
background loading, fast switching, scrolling and fading
of regions
Support of 2, 4, 8 bits/pixel bit-maps in fixed bit-maps or
coded in accordance to the DVB variable/run length
standard for region bases graphics
Optimized memory control in MPEG video decoding
allows for storage of graphical bit-maps up to 1.2 Mbit in
50 Hz and 2.0 Mbit in 60 Hz systems
VL/RL encoding enables full screen graphics at
8 bit/pixel in 50 Hz
Fast CPU access enables full bit-map updates within a
display field period
Display colours are obtained via colour look-up tables;
CLUT output is YUVT at 8-bit for each signal component
thus enabling 16M different colours and 6-bit for T
(transparency) which gives 64 mixing levels with video
Bit-map table mechanism to specify a sub-set of entries
if the CLUT is larger than required by the coded bit
pattern; supported bit-map tables are 16 to 256,
4 to 256 and 4 to 16
Graphics boxes may not overlap vertically; if 256 entry
CLUT has to be down loaded, a vertical separation of
1 field line is mandatory
Internal support for fast block moves in the external
SDRAM during MPEG decoding
Graphics mechanism can be used for signal generation
in the vertical blanking interval; useful for teletext, wide
screen signalling, closed caption etc.
Support for a single down-loadable cursor of 1 kpixel
with programmable shape; supported shapes are
8
128, 16
64, 32
32, 64
16 and 128
8
Cursor colours are determined via a 4-entry CLUT with
YUVT at 6, 4, 4 respectively 2 bits; mixing of cursor with
video + graphics in 4 levels
Cursor can be moved freely across the screen without
overlapping restrictions.
2001 Mar 28
4
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
GENERAL DESCRIPTION
The SAA7201 is an MPEG2 decoder which combines
audio decoding and video decoding. Additionally to these
basic MPEG functions it also provides means for
enhanced graphics and/or on-screen display.
Due to an optimized architecture for audio and video
decoding, maximum capacity in the external memory and
processing power from the external CPU is available for
the support for graphics.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
DD
functional supply voltage
3.0
3.3
3.6
V
V
CC
pad supply voltage
3.0
3.3
3.6
V
I
DD(tot)
total supply current at V
DD
= 3.3 V
-
tbf
-
mA
f
CLK
clock frequency
-
27.0
-
MHz
f
CLK
frequency deviation
-
30
10
-
6
-
+30
10
-
6
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
SAA7201H
QFP160
plastic quad flat package; 160 leads (lead length 1.95 mm);
body 28
28
3.4 mm; high stand-off height
SOT322-4
2001 Mar 28
5
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
AUDIO/VIDEO
INTERFACE
HOST
INTERFACE
SYSTEM TIME
BASE UNIT
VIDEO INPUT
BUFFER AND SYNC
MEMORY
INTERFACE
VIDEO
DECODER
GRAPHICS
UNIT
AUDIO INPUT
BUFFER AND SYNC
CLOCK
GENERATION
JTAG
MGD322
159
ASTROBE
77
75
74
78
84
83
81
80
SDRAS
VDDCO1 to
VDDCO4
SDWE
CP81M
READO
READI
SDADDR11
to
SDADDR0
SDDAT15 to
SDDAT0
SDCAS
SDUDQ
CP81MEXT
CPUTYPE
DMAREQ
DMAACK
DMARDY
DMADONE
VSTROBE
ERROR
MUX
HS
VS
106
107
CS
DS
AS
R/W
DTACK
CPADDR1 to CPADDR8
CPDAT0 to CPDAT15
IRQ0 to IRQ3
AVDAT0 to AVDAT7
2
1
8
CLK
124
TCLK
126
TRST
127
TMS
128
TDO
129
TDI
130
RESET
138
9
10
4
4
3
6
5
DISPLAY
UNIT
SD
SCLK
WS
SPDIF
143
142
145
146
AUDIO
DECODER
GRPH
YUV0
to
YUV7
119
FSCLK
139
11
12
8
148
147
8
16
14 to 17
8
16
12
4
(9)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
(1)
SAA7201
VSSCO1 to
VSSCO4
4
16
VSSA
122
TEST0 to TEST8
104, 105, 118,
120, 132 to 136
19, 51, 101, 141
VDD1(pad)
to
VDD16(pad)
VSS1(pad) to
VSS16(pad)
16
VDDA
121
2001 Mar 28
6
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
PINNING
SYMBOL
PIN
DESCRIPTION
V
I/O
MUX
1
multiplexed/non-multiplexed (active LOW) bus input
5.0
I
CPU_TYPE
2
Intel/Motorola (active LOW) selection input
5.0
I
DMA_ACK
3
DMA acknowledge input
3.3
I
DMA_REQ
4
DMA request input and output
3.3
I/O
DMA_DONE
5
DMA end input
3.3
I
DMA_RDY
6
DMA ready output
3.3
O/Z
V
SS1
7
ground for pad ring
3.3
-
CS
8
chip select input
5.0
I
DS
9
data strobe input
5.0
I
AS
10
address strobe input
5.0
I
R/W
11
read/write (active LOW) input
5.0
I
DTACK
12
data acknowledge output
5.0
O/Z
V
DD1
13
supply for pad ring
3.3
-
IRQ0
14
individually maskable interrupts
3.3
O/Z
IRQ1
15
individually maskable interrupts
3.3
O/Z
IRQ2
16
individually maskable interrupts
3.3
O/Z
IRQ3
17
individually maskable interrupts
3.3
O/Z
V
SS2
18
ground for pad ring
-
-
V
SSCO1
19
ground for core logic
-
-
V
DDCO1
20
supply for core logic
3.3
-
DATA0
21
CPU data interface
5.0
I/O
DATA1
22
CPU data interface
5.0
I/O
DATA2
23
CPU data interface
5.0
I/O
DATA3
24
CPU data interface
5.0
I/O
V
DD2
25
supply for pad ring
3.3
-
DATA4
26
CPU data interface
5.0
I/O
DATA5
27
CPU data interface
5.0
I/O
DATA6
28
CPU data interface
5.0
I/O
DATA7
29
CPU data interface
5.0
I/O
V
SS3
30
ground for pad ring
-
-
DATA8
31
CPU data interface
5.0
I/O
DATA9
32
CPU data interface
5.0
I/O
DATA10
33
CPU data interface
5.0
I/O
DATA11
34
CPU data interface
5.0
I/O
V
DD3
35
supply for pad ring
-
-
DATA12
36
CPU data interface
5.0
I/O
DATA13
37
CPU data interface
5.0
I/O
DATA14
38
CPU data interface
5.0
I/O
DATA15
39
CPU data interface
5.0
I/O
V
SS4
40
ground for pad ring
-
-
2001 Mar 28
7
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
ADDRESS1
41
CPU address interface
5.0
I
ADDRESS2
42
CPU address interface
5.0
I
ADDRESS3
43
CPU address interface
5.0
I
ADDRESS4
44
CPU address interface
5.0
I
V
DD4
45
supply for pad ring
3.3
-
ADDRESS5
46
CPU address interface
5.0
I
ADDRESS6
47
CPU address interface
5.0
I
ADDRESS7
48
CPU address interface
5.0
I
ADDRESS8
49
CPU address interface
5.0
I
V
SS5
50
ground for pad ring
-
-
V
SSCO2
51
ground for core logic
-
-
V
DDCO2
52
supply for core logic
3.3
-
SDRAM_DATA0
53
memory data interface
3.3
I/O
SDRAM_DATA15
54
memory data interface
3.3
I/O
SDRAM_DATA1
55
memory data interface
3.3
I/O
V
DD5
56
supply for pad ring
3.3
-
SDRAM_DATA14
57
memory data interface
3.3
I/O
SDRAM_DATA2
58
memory data interface
3.3
I/O
SDRAM_DATA13
59
memory data interface
3.3
I/O
V
SS6
60
ground for pad ring
-
-
SDRAM_DATA3
61
memory data interface
3.3
I/O
SDRAM_DATA12
62
memory data interface
3.3
I/O
SDRAM_DATA4
63
memory data interface
3.3
I/O
V
DD6
64
supply for pad ring
3.3
-
SDRAM_DATA11
65
memory data interface
3.3
I/O
SDRAM_DATA5
66
memory data interface
3.3
I/O
SDRAM_DATA10
67
memory data interface
3.3
I/O
V
SS7
68
ground for pad ring
-
-
SDRAM_DATA6
69
memory data interface
3.3
I/O
SDRAM_DATA9
70
memory data interface
3.3
I/O
SDRAM_DATA7
71
memory data interface
3.3
I/O
V
DD7
72
supply for pad ring
3.3
-
SDRAM_DATA8
73
memory data interface
3.3
I/O
SDRAM_WE
74
SDRAM write enable output
3.3
O
SDRAM_CAS
75
SDRAM column address strobe output
3.3
O
V
SS8
76
ground for pad ring
-
-
SDRAM_RAS
77
SDRAM row address strobe output
3.3
O
SDRAM_UDQ
78
SDRAM write mask output
3.3
O
V
DD8
79
supply for pad ring
3.3
-
READ
I
80
read command input
3.3
I
SYMBOL
PIN
DESCRIPTION
V
I/O
2001 Mar 28
8
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
READ
O
81
read command output
3.3
O
V
SS9
82
ground for pad ring
-
-
CP81MEXT
83
81 MHz clock return path input
3.3
I
CP81M
84
81 MHz memory clock output
3.3
O
V
DD9
85
supply for pad ring
3.3
-
SDRAM_ADDR8
86
memory address
3.3
O
SDRAM_ADDR9
87
memory address
3.3
O
SDRAM_ADDR11
88
memory address
3.3
O
V
SS10
89
ground for pad ring
-
-
SDRAM_ADDR7
90
memory address
3.3
O
SDRAM_ADDR10
91
memory address
3.3
O
SDRAM_ADDR6
92
memory address
3.3
O
V
DD10
93
supply for pad ring
3.3
-
SDRAM_ADDR0
94
memory address
3.3
O
SDRAM_ADDR5
95
memory address
3.3
O
SDRAM_ADDR1
96
memory address
3.3
O
V
SS11
97
ground for pad ring
-
-
SDRAM_ADDR4
98
memory address
3.3
O
SDRAM_ADDR2
99
memory address
3.3
O
SDRAM_ADDR3
100
memory address
3.3
O
V
SSCO3
101
ground for core logic
-
-
V
DDCO3
102
supply for core logic
3.3
-
V
DD11
103
supply for pad ring
3.3
-
TEST8
104
IC test interface
3.3
I/O
TEST7
105
IC test interface
3.3
I/O
HS
106
horizontal synchronization input and output
3.3
I/O
VS
107
vertical synchronization input and output
3.3
I/O
V
SS12
108
ground for pad ring
-
-
YUV0
109
YUV video output at 27 MHz
3.3
O/Z
YUV1
110
YUV video output at 27 MHz
3.3
O/Z
YUV2
111
YUV video output at 27 MHz
3.3
O/Z
YUV3
112
YUV video output at 27 MHz
3.3
O/Z
V
DD12
113
supply for pad ring
3.3
-
YUV4
114
YUV video output at 27 MHz
3.3
O/Z
YUV5
115
YUV video output at 27 MHz
3.3
O/Z
YUV6
116
YUV video output at 27 MHz
3.3
O/Z
YUV7
117
YUV video output at 27 MHz
3.3
O/Z
TEST6
118
IC test interface
3.3
I/O
GRPH
119
indicator for graphics information output
3.3
O
TEST5
120
IC test interface
3.3
I/O
SYMBOL
PIN
DESCRIPTION
V
I/O
2001 Mar 28
9
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
V
DDA
121
supply for analogue blocks
3.3
-
V
SSA
122
ground for analogue blocks
-
-
V
SS13
123
ground for pad ring
-
-
CLK
124
27 MHz clock input
3.3
I
V
SS14
125
ground for pad ring
-
-
TCLK
126
boundary scan test clock input
3.3
I
TRST
127
boundary scan test reset input
3.3
I
TMS
128
boundary scan test mode select input
3.3
I
TD
O
129
boundary scan test data output
3.3
O
TD
I
130
boundary scan test data input
3.3
I
V
DD13
131
supply for pad ring
3.3
-
TEST4
132
IC test interface
3.3
I/O
TEST3
133
IC test interface
3.3
I/O
TEST2
134
IC test interface
3.3
I/O
TEST1
135
IC test interface
3.3
I/O
TEST0
136
IC test interface
3.3
I/O
V
DD14
137
supply for pad ring
3.3
-
RESET
138
hard reset input (active LOW)
3.3
I
FSCLK
139
256 or 384 f
s
(audio sampling) output
3.3
O/Z
V
DDCO4
140
supply for core logic
3.3
-
V
SSCO4
141
ground for core logic
-
-
SCLK
142
serial audio clock output
3.3
O/Z
SD
143
serial audio data output
3.3
O/Z
V
SS15
144
ground for pad ring
-
-
WS
145
word select output
3.3
O/Z
SPDIF
146
digital audio output
3.3
O/Z
ERROR
147
flag for bitstream error input
5.0
I
V_STROBE
148
video strobe input
5.0
I
V
DD15
149
supply for pad ring
3.3
-
AV_DATA0
150
MPEG input port for PES data
5.0
I
AV_DATA1
151
MPEG input port for PES data
5.0
I
AV_DATA2
152
MPEG input port for PES data
5.0
I
AV_DATA3
153
MPEG input port for PES data
5.0
I
V
SS16
154
ground for pad ring
-
-
AV_DATA4
155
MPEG input port for PES data
5.0
I
AV_DATA5
156
MPEG input port for PES data
5.0
I
AV_DATA6
157
MPEG input port for PES data
5.0
I
AV_DATA7
158
MPEG input port for PES data
5.0
I
A_STROBE
159
audio strobe input
5.0
I
V
DD16
160
supply for pad ring
3.3
-
SYMBOL
PIN
DESCRIPTION
V
I/O
2001 Mar 28
10
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.2 Pin configuration.
handbook, full pagewidth
MGD321
SAA7201
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
MUX
CPUTYPE
DMAACK
DMAREQ
DMADONE
DMARDY
VSS1(pad)
CS
DS
AS
R/W
DTACK
VDD1(pad)
IRQ0
IRQ1
IRQ2
IRQ3
VSS2(pad)
VSSCO1
VDDCO1
CPDAT0
CPDAT1
CPDAT2
CPDAT3
VDD2(pad)
CPDAT4
CPDAT5
CPDAT6
CPDAT7
VSS3(pad)
CPDAT8
CPDAT9
CPDAT10
CPDAT11
VDD3(pad)
CPDAT12
CPDAT13
CPDAT14
CPDAT15
VSS4(pad)
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
TEST5
GRPH
TEST6
YUV7
YUV6
YUV5
YUV4
VDD12(pad)
YUV3
YUV2
YUV1
YUV0
VSS12(pad)
VS
HS
TEST7
TEST8
VDD11(pad)
VDDCO3
VSSCO3
SDADDR3
SDADDR2
SDADDR4
VSS11(pad)
SDADDR1
SDADDR5
SDADDR0
VDD10(pad)
SDADDR6
SDADDR10
SDADDR7
VSS10(pad)
SDADDR11
SDADDR9
SDADDR8
VDD9(pad)
CP81M
CP81MEXT
VSS9(pad)
READO
V
DD16(pad)
ASTROBE
AVDAT7
AVDAT6
AVDAT5
AVDAT4
V
SS16(pad)
AVDAT3
AVDAT2
AVDAT1
AVDAT0
V
DD15
(pad)
VSTROBE
ERROR
SPDIF
WS
V
SS15(pad)
SD
SCLK
V
SSCO4
V
DDCO4
FSCLK
RESET
V
DD14(pad)
TEST0
TEST1
TEST2
TEST3
TEST4
V
DD13(pad)
TDI
TDO
TMS
TRST
TCLK
V
SS14(pad)
CLK
V
SS13(pad)
V
SSA
V
DDA
CPADDR1
CPADDR2
CPADDR3
CPADDR4
V
DD4(pad)
CPADDR5
CPADDR6
CPADDR7
CPADDR8
V
SS5(pad)
V
SSCO2
V
DDCO2
SDDAT0
SDDAT15
SDDAT1
V
DD5(pad)
SDDAT14
SDDAT2
SDDAT13
V
SS6(pad)
SDDAT3
SDDAT12
SDDAT4
V
DD6(pad)
SDDAT11
SDDAT5
SDDAT10
V
SS7(pad)
SDDAT6
SDDAT9
SDDAT7
V
DD7(pad)
SDDAT8
SDWE
SDCAS
V
SS8(pad)
SDRAS
SDUDQ
V
DD8(pad)
READI
2001 Mar 28
11
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
FUNCTIONAL DESCRIPTION
General
The SAA7201 is an MPEG2 decoder which combines
audio decoding, video decoding and enhanced region
based graphics. The decoder operates with a single
16 Mbit external synchronous dynamic random access
memory (SDRAM) and runs from a single external 27 MHz
clock. Due to the optimized memory control for MPEG2
decoding, more than 1 Mbit is available for graphics in
50 Hz systems.
MPEG2 data can be accepted up to 9 Mbytes/s through a
dedicated byte wide interface. The data on this interface
can be either in PES (Packetized Elementary Stream),
MPEG1 packet or ES (Elementary Stream) format as
described in Chapter "References". Two additional strobe
signals distinguish between audio and video data.
The internal video decoder is capable of decoding all
MPEG compliant streams up to main level main profile as
specified in Chapter "References". The audio decoder
implements 2 channel audio decoding according to the
standards in Chapter "References".
All real time audio/video decoding and synchronization
tasks are performed autonomously, so the external
microcontroller only needs to perform high-level tasks like
initialization, status monitoring and trick mode control.
The main support task of the external microcontroller
concerns the control of the graphical unit. This unit should
be supplied with bit-maps, determining the contents of the
graphical regions and by a simple set of instructions
determining the appearance of the graphical data on the
screen. Most graphical information should be stored in the
external memory which implies multiple data transfers
between CPU and the external memory. By performing
these data transfers on a direct memory access (DMA)
basis, full bit-maps can be transferred within one video
frame period.
The video output, containing a mix of MPEG video and
graphical data, is at a YUV multiplexed format which can
be directly connected to an external composite video
encoder. The audio output, containing a mix of MPEG
audio and programmable `beeps', is in a serial, I
2
S or
Japanese format which can be directly supplied to most
commercially available up-sampling audio DA converters.
A functional block diagram of the decoder is given in Fig.1.
Its application environment is depicted in Fig.24. In the
following sections, a brief description of the individual
internal blocks of the MPEG2 decoder will be given.
Audio/video interface
In a basic set-top box application the SAA7201 receives
audio and video PES data in a byte wide format at rates up
to 9 Mbytes/s. A timing diagram is shown in Fig.3. Next to
the 8-bit wide data bus an audio and video strobe is
expected at the input. Erroneous data may be flagged via
the error indicator.
handbook, full pagewidth
VSTROBE
ASTROBE
ERROR
AVDAT0
to
AVDAT7
25 ns
25 ns
75 ns
video byte (n)
video byte (n + 1)
audio byte (m)
MGD323
Fig.3 Timing diagram of parallel input mode.
2001 Mar 28
12
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.4 Timing diagram of serial input mode.
handbook, full pagewidth
VSTROBE
ASTROBE
AVDAT0
to
AVDAT7
25 ns
25 ns
75 ns
video bit (n + 6)
video bit (n + 7)
audio bit (m + 0)
first bit of a byte
ERROR
MGD324
Alternatively data can be received in a 1-bit serial format at
rates up to 20 Mbit/s. In this mode, data is input at the LSB
input of the AV_DATA bus. Audio and video data must be
input in multiples of 8 bits. The first bit after switching from
audio to video (or the other way around) must be the first
bit of a byte since this transition will be used for the internal
bit-to-byte conversion.
Audio/video data can also be received via the CPU
interface in 8 or 16-bit mode. The peak rate is 27 Mbytes/s
in bursts of
128 bytes with a sustained rate up to
9 Mbytes/s. However, the MPEG bit rate is still limited to
15 Mbit/s for video and 448 kbit/s for audio.
Independent of the input mode all audio and video input
data are stored sequentially in the audio or video input
buffer area of the external memory. The audio and video
data can be either in MPEG2 PES, MPEG1 packet or ES
format.
Memory interface unit
The memory interface takes care of addressing and
control of the 16-Mbit external SDRAM. The SDRAM
should be either JEDEC compliant either the `lite/PC'
version.
Due to memory communication requirements this interface
runs at 81 MHz. The SDRAM types used with the
SAA7201 should be organized as 1M
16, split internally
in two banks, each having 2048 pages of 256 words of
16 bits.
The target SDRAM type is NEC
PD 4516161G5-A12-7FJ
(83 MHz JEDEC version) or NEC
PD 4516421G5-A83-7FJ-PC (83 Mhz PC version).
Clock generation
The clock generation unit generates all the internal
processing clocks, the clock for the system time base
counter and the audio oversampling clock for the audio
DAC. For this purpose a non-integer divider plus a PLL is
implemented. In order to get reliable audio and video
decoding the 27 MHz input clock should be locked
externally to the MPEG time base.
Host interface system
The host interface system handles the communication
between on one side the SAA7201 plus SDRAM and on
the other side the external CPU. The interface consists of
a 16-bit wide data bus plus 8 address lines. It is compatible
with both Motorola's 68xxx and Intel's x86 family.
An optimized interface with the SAA7208 is also
supported. Via this interface a fast direct access to a large
number of internal status and data registers can be
achieved. Moreover, the external SDRAM can be
accessed via a specific register in combination with an
internally implemented auto increment counter.
The access to the external SDRAM is guaranteed up to a
sustained data rate of 9 Mbyte per second. However, in
practice the achievable data rate can be much higher.
Next to the data and address lines, 4 interrupt lines are
part of the host interface bus. Each interrupt line can
monitor up to 32 internal events which all can be masked
individually. Examples of internal events are audio/video
bit stream information, decoder status, internal error
conditions and input buffer occupation. The latter may be
very useful in interactive applications to serve as input data
request line.
2001 Mar 28
13
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
System time base unit
The system time base unit serves as a timing master for all
internal processes. It consists of two 24-bit wide System
Time Clock (STC) counters, running at 90 kHz. The STCs
will be used as internal synchronization reference for audio
and video.The contents of the STC can be loaded by the
external CPU which should insure that the phase of the
SAA7201 internal STC is identical to the main system time
clock in the system demultiplexer. The CPU should correct
for possible latency problems.
Because two counters are implemented, the previous time
base reference which might still be required as reference
for some time in case of time base discontinuity, can be
maintained. Thus all information for audio/video
synchronization is available in the decoder chip and only
minor support of the external controller is required.
The synchronization of graphics for e.g. subtitling, should
be controlled by the external CPU.
Video input buffer and synchronization control
The size and position of the video input buffer in the
external SDRAM is programmable. By default 2.6 Mbit/s
are reserved for the video input buffer but in principle any
other value can be programmed. The current fullness of
the video input buffer can be monitored by the CPU and an
internal interrupt will be generated is case of either near
over- or near underflow.
Data retrieval from the input buffer can be controlled by
DTS time stamps parsed from the PES or MPEG1 packet
stream. For those frames where no DTS time stamp is
present in the video bitstream a DTS is emulated by the
SAA7201.
Obviously this emulation mode can also be used when the
input stream is a video elementary stream (ES). The latter
case should be handled by start and stop decode
commands from the CPU.
The external CPU can select to retrieve the video PES
header and/or video PES private data for further software
processing.
Audio input buffer and synchronization control
The audio input buffer and synchronization control
basically behaves identical to its video counter part.
The default buffer size is 64 kbit in this case.
Synchronization will be controlled by PTS time stamps in
the audio Packetized Elementary Stream. Also in this case
an PTS emulation or a free running start/stop controlled
mode are supported.
Audio decoder
A functional block diagram for the audio decoding part is
depicted in Fig.5.
Fig.5 Audio decoding unit.
handbook, full pagewidth
BUFFER AND
SYNC UNIT
AUDIO
CLOCK
GENERATOR
AUDIO
BEEP
DRAM-bus
81 MHz
MPEG
AUDIO
DECODER
OUTPUT
INTERFACE
Sony or
I
2
S-bus
SPDIF
MGD325
Audio decoding unit
+
2001 Mar 28
14
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Audio decoding will be performed at a clock locked to the
video decoding clock and only the output interface is
running on the audio oversampling clock.
The audio decoder unit performs the decoding of the
selected MPEG audio stream in a range from 8 up to
448 kbit/s in a fixed or variable bit rate format. Decoding is
restricted to 2 channel, layer I, II MPEG audio at sampling
frequency of 48.0, 44.1, 32.0, 24.0, 22.05 or 16.0 kHz.
The audio decoder support the stop, mute, and skip
function to support insertion
Apart from basic MPEG processing the audio decoder
core contain also:
Support for: stop, mute and skip function.
Fully parameterized dynamic range compression unit to
decrease the dynamic range of the output signal on
audio frame basis. Depending on the power level a
programmable amplification and offset may be applied.
Fully programmable base band audio processing unit to
control the gain in both output channels independently
and/or to mix both channels.
MPEG de-emphasis filtering on the output data, thus
avoiding the need of external analog de-emphasis filter
circuitry.
Storage buffer for the last 54 bytes of each audio frame.
The CPU can retrieve eventual ancillary data from this
buffer.
The output of the audio decoder unit can be mixed with
square waveform audio signals which are generated by a
beep generator. Programmable parameters for the beep
generator are amplitude, frequency and duration.
The audio output interface module produces stereo base
band output samples on two different outputs at the same
time:
Serial digital audio in I
2
S-bus or in Japanese format in
16, 18, 20 or 22-bit
SPDIF (Sony/Philips Digital Interface).
Any of the two outputs may be enabled or set to high
impedance mode. The I
2
S-bus format with 18-bit sample
precision is shown in Fig.6.
The difference between I
2
S-bus and the Japanese format
is that I
2
S-bus is MSB aligned whereas the Japanese
format is LSB aligned.
The 1-bit serial interface SPDIF contains 64-bit per audio
sample period. Complete frames must be transmitted at
the audio sample rate. Not only left/right information but
also validity flags, channel status, user data and parity
information is contained in an SPDIF frame (see Chapter
"References").
Fig.6 I
2
S-bus format with 18-bit sample precision.
handbook, full pagewidth
b17
MSB aligned
MGD326
left sample n
left sample n + 1
right sample n
0
31
32
63
SCLK
WS
SD
b0
b17
b0
b17
b0
2001 Mar 28
15
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Video decoder
The video decoding unit provides all actions required for
compliant decoding of MPEG2 main level, main profile
coded video bit streams. The decoding process consists of
fixed and variable length decoding, run length decoding,
inverse quantization, inverse discrete cosine
transformation, motion compensation and interpolation.
In general the arithmetic decoding result is stored as
reference picture in the external memory.
Decoded B-frames are only stored for the conversion from
the frame coded macro block (MB) to the scanning line
format. In many cases a field storage is sufficient for this
conversion but in some cases the user might decide to use
a full frame storage to enable chroma frame up-conversion
or full performance 3 : 2 pull-down in 60 Hz systems.
Obviously when using less memory for the video decoding
process more memory is available for non-video decoding
tasks.
The Frame Buffer Management unit (FBM) manages the
allocation of frame buffers in external SDRAM for both
video decoding and display unit and can be programmed
to use less memory in not fully MP@ML bitstreams:
smaller pictures (e.g. 544
576), simple profile, etc.
Apart from decoding compliant MPEG video streams the
decoder deals with some trick modes. Supported are field
or frame freeze at I or P pictures or freeze field on
B-pictures. In the latter case decoding will continue as a
background process and the output can be restarted at
any moment. When receiving non-compliant MPEG
streams the decoder can be switched to a scanning mode
in which only I or I + P frames are decoded while skipping
all other pictures. In the single step mode, the decoder
decodes just one frame and awaits a next step command.
The functional diagram of the video decoding unit is shown
in Fig.7.
Fig.7 Video decoding unit.
handbook, full pagewidth
VLD
FLD
IZZ
IQ
IDCT
MC
INTERP
FBM
to display
unit
to external
memory
from reference
memory
from
input
buffer
MGD327
2001 Mar 28
16
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Graphics unit
The SAA7201 incorporates the display support for pixel
based graphics. Possible applications are the user
interface, logos and subtitling. Graphical data should be
grouped logically in regions and will be displayed in boxes
at the screen.
The definition of each region in the decoder consists of
four parts being a region descriptor, a top-field descriptor,
a bottom-field descriptor and a table-data descriptor:
The region descriptor contains information relevant for
the full region like format, size, position and pointers to
the other descriptors.
The top-field and bottom-field descriptor contain a pixel
based bit-map for the contents of that region for both
fields independently. The bit-maps can be stored in
either straight forward or in a compressed bit-map
format.
The table-data descriptor defines the tables to be used
for the transformation of bit-maps to display colours.
All descriptors should be loaded under control of the
external CPU in the external memory.
The appearance of graphical data at the display is
determined by the assembly of region descriptors in a so
called display list. An example of such a display list for the
4 regions example is shown in Fig.9.
Fig.8 Graphics unit.
handbook, full pagewidth
REGION-1 (VBI-SIGNALS)
REGION-2
active
video
REGION-3 (256 ENTRY CLUT)
REGION-4
MGD328
active
video
H-size (2)
H-start (2)
V-start (2)
V-size (2)
Fig.9 Display list.
handbook, full pagewidth
DESCRIPTOR 1
MAP
CLUT
bottom-field
top-field
table
data
PIXEL
DATA
PIXEL
DATA
128 bit
gfx
anchor
address
eodl
position, size, format
pointers to locations in SDRAM
DESCRIPTOR 2
DESCRIPTOR 3
DESCRIPTOR 4
MGD329
2001 Mar 28
17
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Basically there is no restriction on the number of different
regions but because regions may not vertically overlap the
practical limit will be the number of lines within a field.
However, one should realize that each region requires its
own 128-bit region descriptor.
The display list will be scanned twice per frame, once for
each display field. The region descriptors should be
ordered properly in the external SDRAM, starting from the
graphics anchor address. The last descriptor in the list
must have the end of display list indicator set.
Multiple pixel bit-maps, CLUTs and map tables may be
stored in the external memory but per region only two
bit-maps (one for each fields) and two tables
(CLUT + map table) may be used. Obviously bit-maps and
tables may be shared by multiple regions.
Pixel data bit-maps can be described in 2, 4 or 8 bit/pixel
in either a direct bit-map or coded in a one-dimensional (H)
variable and run length encoded format according the
pixel-data-sub-block syntax as specified in Chapter
"References" and illustrated in Chapter "Appendix".
The actual coding format is specified in the region
descriptor for each region thus allowing different coding
schemes within a picture.
During display the 2, 4 and 8 bit/pixel bit-maps will be
transformed, eventually with run length decoding, via a
table look-up mechanism into a 4, 16 or 256 different YUV
colours with 8-bit resolution for each component plus a
factor T for mixing of graphics and MPEG video.
In order to obtain maximum flexibility two cascaded tables
are active in this bit-map to pixel conversion as indicated
in Fig.10.
The tables are retrieved from the external memory just
before the region is going to be displayed. One table per
region can be updated and for small tables this occurs
during the horizontal blanking interval. However, updating
a 256 entry CLUT may take about one line period which
means that a spatial separation of one line with the
previous region is mandatory in this case. If the required
tables for a certain region are already stored in the local
memory, the table down load action can be skipped.
Additionally some special bits can be set in the region
descriptor.
Transparency shift: this parameter overrules the pixel
based transparency in order to support fading of the
entire graphical region.
Zoom: this parameter initiates horizontal pixel repetition.
It should be noted that a copy of pixels in vertical
direction can be achieved by pointing to a single bit-map
for both fields.
Regions can also be defined in the vertical blanking
interval. In combination with 8 bit/pixel coding, arbitrary
test signals on 13.5 MHz grid can be programmed.
Possible application areas are teletext, closed caption,
wide screen signalling bits, Video Programming Signals
(VPS) and Vertical Interval Test Signals (VITS).
As indicated above multiple regions can be specified in a
display list which will be scanned sequentially every frame.
In case of stationary graphics no updates of the display list
are required, but the external CPU can update it
dynamically to achieve scrolling and/or fading of one or
more graphical boxes. The display list mechanism also
allows for non real time transfer of large bit-maps by
keeping that region out of the display list during loading.
Fig.10 Bit-map to pixel conversion.
handbook, full pagewidth
8
4 LSBs
2 LSBs
2 LSBs
4 LSBs
8 LSBs
8
CLUT
8
8
MGD330
MAP
TABLE 4 to 8
MAP
TABLE 2 to 8
8
Y
U
V
T
8
8
8
2001 Mar 28
18
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
C
URSOR PROCESSING
Additionally to the above defined graphics boxes one
cursor can be activated on the screen. Since the cursor
data is fully stored locally, no overlapping restriction apply
to this box so the cursor can moved over the entire screen.
The cursor can be as large as 1 kpixel with a 2 bits/pixel
colour depth. Obviously data transfer can be done on DMA
basis and need only be performed when a cursor is
required or when its contents must be modified.
The cursor XY dimensions (where the Y dimension refers
to frame lines) can be selected between 8
128, 16
64,
32
32, 64
16 and 128
8. On top of these shapes, a
zoom with a factor 2 can be applied in both directions
independently.
The cursor pixels will be translated via a 4-entry CLUT to
YUV colours and a transparency factor T. The resolution
of the YUV parameters is 6, 4, 4 bits respectively.
The T parameter is coded in 2 bits to enable the mixing
with video and graphics in 4 steps being 100% (cursor
only), 50%, 25% and 0% (fully transparent cursor).
Display unit
Before feeding the MPEG decoded and graphical data to
the output, a display unit re-formats the MPEG specific
4 : 2 : 0 format to CCIR-601 4 : 2 : 2 format and performs
a mixing between video and graphics where required.
The output picture can be up to 720
576 pixels at 50 Hz
or 720
480 pixels at 60 Hz.
A schematic representation of this unit is shown in Fig.11.
In a first step a selected window can be retrieved from
the decoded MPEG data. This might be useful for e.g.
pan and scan operations for aspect ratio conversion.
In case the resulting number of pixels per line does not
match the 720 pixels/line output format a horizontal
scaler can be activated. This scaling unit can transform
any number of bits below 720 to the required output
format. Internally a poly-phase filter is used which
performs a 64 phases interpolation. Not only
up-conversion but also down-conversion is supported
up to a scaling by a factor 2. Thus horizontal scaling can
be performed in a range from 0.5 up to 64. In practice
the maximum up-conversion factor will be less or equal
to 4.
In vertical direction the picture can be expanded or
scaled down, in both cases by a factor 2. Expansion with
a factor 2 might be relevant for the up-conversion of SIF
resolution pictures to full screen. The factor 2 scaling, if
combined with the appropriate horizontal scaling, results
is
1
/
4
picture thus freeing-up a large screen area for
graphics. This might be very useful for electronic
program guide applications. It should be noted that in
case of picture compression an anti-aliasing filter can be
activated.
Shifting: when the resulting MPEG picture is smaller
than the 720
576 (480) display format, this picture can
be located anywhere on the display screen.
Moreover, the non-covered area can be given any
background colour.
Clipping: the amplitude of the MPEG decoded and
re-scaled video signal is kept within the range 16 to 235
for luminance and 16 to 240 for both chrominance
components.
Fig.11 Display unit.
handbook, full pagewidth
WINDOW
EXTRACTION
SCALING
64 STEP
MIXER
4 STEP
MIXER
GRAPHICS
CURSOR
OUTPUT
FORMAT
to digital
CVBS
encoder
SHIFTING
CLIPPING
CHROMA
UP-CONVERSION
MPEG
decoded
picture
MGD331
2001 Mar 28
19
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
The chroma up-conversion unit converts the MPEG
4 : 2 : 0 format into the at the output required
4 : 2 : 2 format. This vertical up-conversion is performed
by a simple 8-phase interpolation between two adjacent
lines.
The mixer units combine MPEG video with graphics and
cursor information in two steps. In a first step the MPEG
decoded information is mixed with graphical information.
Mixing can be done at pixel basis in 64 steps and is
controlled by the internally implemented colour look up
table. In a second step, the video plus graphics can be
mixed in 4 steps with the internally generated cursor.
The output formatting unit performs two main tasks, i.e.
synchronization and formatting. Synchronization is
characterized by three signals being horizontal (H),
vertical (V) and field parity (FP), all having
programmable length and polarity.
Since the decoder can operate in master or slave mode,
the synchronization signals can be generated by the
decoder or should be delivered by an external device.
In both cases the length and polarity should be
programmed internally.
The video output samples are supplied in a multiplexed
YUV format to the output. Next to this byte wide YUV
stream, which can directly be supplied to most
commercially available composite video encoder ICs,
three additional signals are delivered at the output.
HREF indicates all active samples; CREF can flag any
combination of pixels: U, V, Y
odd
and/or Y
even
; GRPH
flags all the pixels inside a graphical box.
Additionally the full YUV bus can be set to a HIGH
impedance state under control of the signal YUV_ENA.
This might be useful for multiplexing the MPEG decoder
output with any other signal source on static basis.
Fig.12 Timing diagram of graphics information output.
handbook, full pagewidth
,,
,,
,,,
,,,
,,
,,
,,
,,
,,,
,,,
CLK
YUV
HREF
CREF
(example)
GRPH
'128'
'16'
U0
Y0
V0
Y2
MGD332
2001 Mar 28
20
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
JTAG
The SAA7201 supports the standard Boundary Scan test
instructions: bypass, extest, sample, intest, runbist,
idcode.
Memory requirements
As indicated before the MPEG source decoder operates
with 16 Mbit of external memory. Several processes
require access to the external memory, mostly being the
video decoding process. In normal main level, main profile
video applications about 1.2 Mbit of memory space is free
for non-video processes. In practice most of this capacity
will be used for graphics. In combination with the internal
variable length decoding, full screen graphics at 8-bit per
pixel is feasible. Moreover, by having introduced a flexible
memory allocation procedure the available memory
capacity for graphics may be enlarged when decoding
lower resolution MPEG pictures or when the input bit rate
is less than 15 Mbit/s.
Obviously for graphics-only applications all 16 Mbit can be
used for the storage of bit-maps and look-up tables.
In Table 1 an overview is given of the required memory
capacity for some user defined modes.
In 50 Hz systems memory capacity can be saved by
restricting the chroma vertical interpolation to field
interpolation. This mode would only bring some extra
chroma resolution in case the input stream contains
progressive coded pictures.
In 60 Hz systems the reduction of storage capacity for
B-frames to field capacity has not only consequences for
the chroma vertical interpolation but also for the
3 : 2 pull-down operation mode. The operation
repeat-first-field is not possible in all cases and a modified
3 : 2 pull-down is performed under the control of the
SAA7201. The user may decide to use this modified
3 : 2 pull-down mode in order to have more memory
available for OSD or graphics.
Table 1
Required memory capacity for some user defined modes
System
50 Hz
60 Hz
Bit rate (R)
15 Mbit/s
15 Mbit/s
9 Mbit/s
Chroma interpolation
frame
field
field
frame
field
field
3 : 2 pull-down
n.a.
n.a.
n.a.
full MPEG
modified
modified
Picture format
720
576
720
576
544
576
720
480
720
480
720
480
Audio input buffer
64 kbit
64 kbit
64 kbit
64 kbit
64 kbit
64 kbit
Video input buffer
1835 kbit
1835 kbit
1835 kbit
1835 kbit
1835 kbit
1835 kbit
Video implementation buffer (R/P)
600 kbit
600 kbit
400 kbit
500 kbit
500 kbit
300 kbit
Slave synchronization buffer (R/2P)
300 kbit
300 kbit
200 kbit
250 kbit
250 kbit
150 kbit
Reference and decoded picture
13456 kbit
12719 kbit
9609 kbit
12441 kbit
10634 kbit
8042 kbit
Total for video + audio
16255 kbit
15518 kbit
12108 kbit
15090 kbit
13292 kbit
10391 kbit
Remains for OSDG (2
24
= 16777 kbit)
522 kbit
1259 kbit
4669 kbit
1687 kbit
3485 kbit
6386 kbit
2001 Mar 28
21
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DD
supply voltage (on all supply pins)
3.0
3.6
V
V
max
maximum voltage on all pins
0
5.5
V
P
tot
total power dissipation
T
amb
= 25
C
-
tbf
W
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
0
+70
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
30
K/W
2001 Mar 28
22
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
Supply
V
DD
supply voltage
3.0
3.3
3.6
V
I
DD
supply current
-
tbf
-
mA
Inputs
V
IH
HIGH level input voltage
2.0
-
V
DD
+ 2.0
V
V
IL
LOW level input voltage
-
0.5
-
0.8
V
I
LI
leakage current
-
-
20
mA
C
i
input capacitance
0
-
10
pF
Outputs
V
OH
HIGH level output voltage
2.4
-
-
V
V
OL
LOW level output voltage
-
-
0.4
V
CLK timing
T
C
cycle time
37.036
37.037
37.038
ns
duty factor
40
-
60
%
t
r
rise time
2
-
4
ns
t
f
fall time
2
-
4
ns
Input timing with respect to CLK rising edge
t
su
set-up time
8
-
-
ns
t
h
hold time
0
-
-
ns
Timing (see Figs. 13, 14, 15, 16, 17, 18, 19, 20, 21, 21 and 21)
t
su(A-CS)
address/CS set-up time
20
-
-
ns
t
h(A-CS)
address/CS hold time
75
-
-
ns
t
su(D-W)
data write set-up time
20
-
-
ns
t
su(D-R)
data read set-up time
20
-
-
ns
t
rel(D)
data release time
0
-
10
ns
t
h(CT)
control signal hold time
0
-
-
ns
t
W(ACK)
acknowledge pulse width
25
-
-
ns
t
rel(ACK)
acknowledge release time
0
-
10
ns
t
d(ACK-R)
delay time for acknowledge read
96
-
125
ns
t
d(ACK-W)
delay time for acknowledge write
48
-
75
ns
t
W(RW)
write/read pulse width
25
-
-
ns
Output timing with respect to CLK rising edge
t
h
hold time
3
-
t
d
ns
t
d
delay time
t
h
-
20
ns
C
L
load capacitance
10
-
30
pF
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
handbook, full pagewidth
,,
,,
,,
,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
ADDRESS
DATA
MGD333
CPADDR1
to
CPADDR8
CS
R/W
tsu(A-CS)
th(A-CS)
tsu(D-DS)
th(D-DS)
trel(R/W)
trel(ACK)
td(ACK-W)
tW(RW)
DTACK
(Intel RDY)
DS
(Intel RDN)
CPDAT0
to
CPDAT15
Fig.13 Motorola write timing (non-multiplexed).
handbook, full pagewidth
,,,
,,,
,,,,,,,,,,
,,,,,,,,,,
ADDRESS
DATA
,,,
,,,
,,,,,,,,,,
,,,,,,,,,,
MGD334
CPADDR1
to
CPADDR8
CS
DS
DTACK
CPDAT0
to
CPDAT15
R/W
tsu(A-CS)
th(A-CS)
tA(D-R)
trel(DS)
trel(RW)
trel(ACK)
td(ACK-R)
tW(RW)
Fig.14 Motorola read timing (non-multiplexed).
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.15 Intel write timing (non-multiplexed).
handbook, full pagewidth
,,
,,
,,,,,,,,,,,
,,,,,,,,,,,
ADDRESS
DATA
MGD335
CPADDR1
to
CPADDR8
CS
tsu(A-CS)
th(A-CS)
tsu(D-DS)
th(D-DS)
trel(RW)
trel(ACK)
td(ACK-W)
tW(RW)
DTACK
(Intel RDY)
R/W
(Intel NRN)
CPDAT0
to
CPDAT15
Fig.16 Intel read timing (non-multiplexed).
handbook, full pagewidth
,,
,,
,,,,,,,,,,,
,,,,,,,,,,,
ADDRESS
DATA
MGD336
CPADDR1
to
CPADDR8
CS
DTACK
(Intel RDY)
R/W
(Intel NRN)
tsu(A-CS)
th(A-CS)
trel(DS)
tA(D-R)
trel(RW)
trel(ACK)
td(ACK-R)
tW(RW)
CPDAT0
to
CPDAT15
2001 Mar 28
25
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.17 DMA read access.
handbook, full pagewidth
DATA
,,,
,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,
,,,
,,,,,,,,,,,
,,,,,,,,,,,
MGD337
CS
DMAACK
DMARDY
CPDAT0
to
CPDAT15
DMAREQ
tsu(A-CS)
th(A-CS)
tsu(D-DS)
th(D-DS)
trel(RW)
trel(ACK)
td(ACK-W)
tW(RW)
Fig.18 DMA write access.
handbook, full pagewidth
DATA
,,,
,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,
,,,
,,,,,,,,,,,
,,,,,,,,,,,
MGD338
CS
DMAACK
DMARDY
CPDAT0
to
CPDAT15
DMAREQ
tsu(A-CS)
th(A-CS)
tA(D-R)
trel(RW)
trel(ACK)
trel(DS)
td(ACK-R)
tW(RW)
2001 Mar 28
26
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.19 DMA_DONE timing.
handbook, full pagewidth
MGD339
DMAACK
DMADONE
DMAREQ
tsu(A-CS)
th(A-CS)
Fig.20 SAA7208 mode; read timing.
handbook, full pagewidth
MGD919
ADDRESS
ADDRESS
(8 to 0)
DATA
DATA
(15 to 0)
RDY
ALE
th(CS)
th(CS-ALE)
tW(ALE)
tW(SDR)
trel(D)
tsu(SDR-D)
tsu(ALE-SDR)
tsu(A-CS)
th(A-CS)
,,
,,
,,,,
,,,,
CS
,,
,,
,,,,
,,,,
SYSRD
2001 Mar 28
27
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.21 SAA7208 mode; write timing.
handbook, full pagewidth
MGD918
DATA
(15 to 0)
ADDRESS
(8 to 0)
,,
,,
,,,,
,,,,
,,
,,
,,,,
,,,,
CS
SYSRD
RDY
DATA
ADDRESS
ALE
th(CS)
th(A-CS)
tsu(A-CS)
th(CS-ALE)
tW(SDR)
tW(ALE)
tW(D-SDR)
th(D-SDR)
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.22 SAA7208 mode; burst write timing.
handbook, full pagewidth
MGD920
DATA
(15 to 0)
ADDRESS
(8 to 0)
,,
,,
,,,
,,,
,,
,,
,,,
,,,
CS
SYSRD
RDY
DATA
DATA
ALE
tW(ALE)
tsu(D-SDR)
th(D-SDR)
tsu(D-SDR)
th(D-SDR)
tW(SDR)
tW(SDR)
trel(SDR)
ADDRESS
ADDRESS
th(CS)
th(CS-ALE)
tsu(A-SDR)
th(A-SDR)
tsu(A-SDR)
th(A-SDR)
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Fig.23 Intel read/write timing multiplexed.
handbook, full pagewidth
,,
,,
,,,,,,,,
,,,,,,,,
ADDRESS
ADDRESS
DATA
DATA
MGD341
AD (read)
AD (write)
CS
DS
(Intel RD)
DTACK
(Intel RDY)
AS
(Intel ALE)
td(ACK-R/W)
trel(DS)
trel(ACK)
tW(AS)
tsu(D-R)
tA(D-R)
th(A-CS)
th(D-DS)
tsu(A-CS)
tsu(D-DS)
trel(RW)
tW(RW)
WR
REFERENCES
1.
MPEG ISO/IEC 11172-1 International standard; MPEG-1 systems.
2.
MPEG ISO/IEC 13818-1 International standard; MPEG-2 systems.
3.
MPEG ISO/IEC 11172-2 International standard; MPEG-1 Video.
4.
MPEG ISO/IEC 13818-2 International standard; MPEG-2 Video.
5.
MPEG ISO/IEC 11172-3 International standard; MPEG-1 Audio.
6.
MPEG ISO/IEC 13818-3 International standard; MPEG-2 Audio.
7.
DVB subtitling system; working draft 2.0; TM 1398 rev 2.
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
APPLICATION INFORMATION
Fig.24 Application diagram.
handbook, full pagewidth
SAA7208
(DEMUX/MIPS)
4 Mbits
EPROM
4 Mbits
DRAM
SAA7201
SAA7183
(EURO-DENC)
16 Mbits
SDRAM
AUDIO
D/A
8
+
3
4
2
12
address data
control
8
16
16
IRQ
H,V valid
YUV
CVBS
MGD342
RGB
Y/C
strobe
27
MHz
27 MHz
I
2
C-bus
I
2
C-bus
H, V, FP
TTX/TTXRQ
high
speed
data
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
APPENDIX
Syntax of pixel-data-sub-block
data type
pixel-code-string of N-coded words
end of string
2 bit/pixel
01
1 pixel in colour 1
10
1 pixel in colour 2
0001 0000
11
1 pixel in colour 3
00 00 00
00 01
1 pixel in colour 0
00 00 01
2 pixels in colour 0
00 1L LL CC
L pixels (3 to 10) in colour C
00 00 10 LL LL CC
L pixels (12 to 27) in colour C
00 00 11 LL LL LL LL CC
L pixels (29 to 284) in colour C
4 bit/pixel
0001
1 pixel in colour 1
0001 0001
1111
1 pixel in colour 15
0000 0000
0000 1100
1 pixel in colour 0
0000 1101
2 pixels in colour 0
0000 0LLL (L>0)
L pixels (3 to 9) in colour 0
0000 10LL CCCC
L pixels (4 to 7) in colour C
0000 1110 LLLL CCCC
L pixels (9 to 24) in colour C
0000 1111 LLLL LL11 CCCC
L pixels (25 to 280) in colour C
8 bit/pixel
00000001
1 pixel in colour 1
00000000-- --00000000
0001 0010
11111111
1 pixel in colour 255
00000000 0LLLLLLL
L pixels (1 to 127) in colour 0
00000000 1LLLLLLL CCCCCCCC
L pixels (3 to 127) in colour C
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
(1)
(1)
e
H
E
L
L
p
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.40
0.25
3.70
3.15
0.25
0.40
0.25
0.23
0.13
28.1
27.9
0.65
0.3
1.95
32.2
31.6
1.5
1.1
8
0
o
o
0.15
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.1
0.7
SOT322-1
MO-112
97-08-04
99-12-27
D
(1)
28.1
27.9
H
D
32.2
31.6
E
Z
1.5
1.1
D
pin 1 index
b
p
e
E
A
1
A
L
p
detail X
L
(A )
3
B
40
c
D
H
b
p
E
H
A
2
v
M
B
D
Z D
A
Z E
e
v
M
A
X
1
160
121
120
81
80
41
y
w
M
w
M
0
5
10 mm
scale
SOT322-1
160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height
QFP160: plastic quad flat package;
A
max.
3.95
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2001 Mar 28
34
Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2001 Mar 28
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Philips Semiconductors
Objective specification
Integrated MPEG2 AVG decoder
SAA7201
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
ICs with MPEG-2 functionality
Use of this product in
any manner that complies with the MPEG-2 Standard is
expressly prohibited without a license under applicable
patents in the MPEG-2 patent portfolio, which license is
available from MPEG LA, L.L.C., 250 Steele Street, Suite
300, Denver, Colorado 80206.
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2001
72
Philips Semiconductors a worldwide company
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Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands
753504/03/pp
36
Date of release:
2001 Mar 28
Document order number:
9397 750 08176