1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

FEATURES

One chip full digital Auto Focus (AF), Auto Exposure
(AE) and Auto White Balance (AWB)

Possible to use NTSC and PAL CCD with horizontal
resolution of 510, 670, 720 or 768 pixels

No manual adjustment

One microprocessor system commonly used with
CAMera Digital Signal Processor (CAMDSP)
SAA9750H

8-bit parallel microprocessor interface

LQFP64 package (0.5 mm pitch)

Single 3 V power supply.

Auto Focus features

Video AF system

Two windows system (a small centre and large window)

The window size and place are microprocessor
controlled

Including 5

order IIR digital high-pass filter

Line peak accumulation in the large window

High-pass filter's output accumulation in one field.

Auto Exposure features

5 windows accumulation

Calculation of white-clip by centre window

Possible to control size and place of the centre windows
by the light condition with microprocessor.

Auto White Balance features

Mono colour detection

Accumulation of UV data in the corresponding UV
quadrant

Green and Magenta elimination gate

Luminance gate for detecting white

UV limiter

White-clip detection/counter.

GENERAL DESCRIPTION

The Advanced Auto Control Function (A2CF) is to be used
for a colour CCD camera system. This IC can realize AWB,
AF and AE with a microprocessor. This device consists of
an input data selector, a parallel 8-bit microprocessor
interface, a data accumulator, a window generator, a
command decoder and AWB, AF, AE for each processing
block.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

digital supply voltage (pins 6, 18 and 47)

2.7

3.0

3.3

LOW level digital input voltage

0.3V

HIGH level digital input voltage

0.7V

LOW level digital output voltage

0.5

HIGH level digital output voltage

0.5

amb

operating ambient temperature

+70

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

SAA9740H

LQFP64

plastic low profile quad flat package; 64 leads; body 10

1.4 mm

SOT314-2

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

PINNING

SYMBOL

PIN

TYPE

DESCRIPTION

input

Y input from SAA9750H (CAMDSP) (LSB)

TSTIN1

input

input pin for test

TSTIN2

input

input pin for test

TSTIN3

input

input pin for test

TST1

input

input pin for test

DD1

digital supply voltage

SS1

ground

UV_SEL

input

UV select input from SAA9750H (CAMDSP)

UV0

input

UV input from SAA9750H (CAMDSP) (LSB)

UV1

input

UV input from SAA9750H (CAMDSP)

UV2

input

UV input from SAA9750H (CAMDSP)

UV3

input

UV input from SAA9750H (CAMDSP)

UV4

input

UV input from SAA9750H (CAMDSP)

UV5

input

UV input from SAA9750H (CAMDSP)

UV6

input

UV input from SAA9750H (CAMDSP)

UV7

input

UV input from SAA9750H (CAMDSP) (MSB)

WCLIP

input

white-clip input from SAA9750H (CAMDSP)

DD2

digital supply voltage

SS2

ground

IO7

bidirectional

microprocessor interface (MSB)

IO6

bidirectional

microprocessor interface

IO5

bidirectional

microprocessor interface

IO4

bidirectional

microprocessor interface

IO3

bidirectional

microprocessor interface

IO2

bidirectional

microprocessor interface

IO1

bidirectional

microprocessor interface

IO0

bidirectional

microprocessor interface (LSB)

RSTB

input

system reset

RDB

input

read control from microprocessor

WRB

input

write control from microprocessor

ASTB

input

address set from microprocessor

WDINT

output

window interrupt

input

V-drive signal input

input

H-drive signal input

HSYNC

input

HSYNC input

WDMNT

output

window monitor for test (open-drain)

LWDB

output

large window for test (open-drain)

TSTOUT6

output

output pin for test

TSTOUT7

output

output pin for test

CLK2OUT

output

output pin of internal clock (open-drain)

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

FUNCTIONAL DESCRIPTION

The Advanced Auto Control Function (A2CF) will be used
for colour CCD camera systems.

The input signals are CDS (AF data) from 8-bit ADC,
Y (for AE, 5-bit) and UV (for AWB, 8-bit) data as the output
of SAA9750H (CAMDSP) and they are fed into the A2CF.
After being processed in the A2CF, corresponding data
are led into the microprocessor.

Together with the zoom encoder and focus sensor output
the microprocessor does the following control with the data
of A2CF:

Control focus motor

Control iris, AGC (via DAC) and high speed shutter

Send the control data to SAA9750H (CAMDSP) via
serial bus.

CLK1 is depending on the CCD type. To cope with the
different CCD clocks, some reference data have to be set
by the microprocessor.

AF system

Digital CDS signals CDS7 to CDS0 which come after
AGC, gamma processing and ADC are fed into A2CF.
This 8-bit data is shifted to the most suitable 6-bit data for
AF processing by microprocessor. For example, when the
MSB of them is `1' then the 6-bit data is shifted by the
microprocessor to CDS7 to CDS2
(not CDS6 to CDS1 or CDS5 to CDS0; see Table 4). After
AF shifting the signals go through an LPF and they are
down sampled. The down sampling is done by CLK2
(CLK1/2). In order to detect the high frequency component
for AF processing, one HPF is added. This output is the
focus value. Next peak hold block is for acquiring
maximum focus value of every line in one field.

Fig.3 AF window.

handbook, halfpage

centre

window

large window

MHA287

active video

This maximum focus value is accumulated in the AF
window (see Fig.3) by the 18-bit adder. The values in the
large window are stored in REG2 (see Table 7) and those
in the small window are stored in REG3 (see Table 7).
Which data is used is dependent on the software (see
Tables 6 and 7). Besides this accumulation, line peak
accumulation is also done. This data is the maximum value
in one field and is stored in REG0 (see Table 7).

AE system

5-bit Y signals Y7 to Y3 which come from SAA9750H are
fed into A2CF for AE processing. This signal is internally
extended to 6 bits by adding a `0' as new MSB. Next they
go through an LPF and they are down sampled in the
same way as AF processing. In order to prevent overflow
of the 18-bit adder block, 2 modes exist (see Table 4).
The first is H decimation is on or off. If H decimation is on,
then the data for AE processing is available in every other
line. The second mode is that the data for AE processing
is shifted to

or not. If the data is shifted to

, it is done

before down sampling and before the data going to the
18-bit adder becomes

. Both these modes are controlled

by the microprocessor. In AE mode there are 5 windows
as shown in Fig.4. These windows are controlled by the
microprocessor. The accumulation data in window 1 to
window 5 is respectively stored in REG1 to REG5 (see
Table 7). The white-clip count data in the centre window is
stored to the lower 5 bits of REG0 (see Table 7).
The upper 3 bits of REG0 is the overflow information in the
18-bit adder (see Table 7).

Fig.4 AE window.

handbook, halfpage

MHA288

active video

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

AWB system

8-bit UV signals UV[7] to UV[0] which come from the
SAA9750H (CAMDSP) are fed into the A2CF for AWB
processing. First the 8-bit data is limited to 6-bits because
the necessary data for AWB processing is around the
white colour signal. Then these signals go through an LPF
and they are down sampled. They are separated to U and
V signals by using UV_SEL coming from SAA9750H
(CAMDSP). As shown in Table 1, in the large window
these signals are compared with the threshold that is set
by the microprocessor. If the conditions shown in Fig.8 are
valid, the data is available for AWB processing. If the
conditions aren't valid, the data is ignored. The available
data in the first to the 4th quadrant are stored in
respectively REG1 to REG4 (see Table 7). The AWB (

)

mode (see Table 4) is for detecting whether the picture is
mono colour or not. If the AWB (B

Y) or AWB (R

Y) or

AWB (

) (see Table 4) mode is active and white-clip or

AWB limited (as mentioned above), then the counts of
them are stored in the lower 5 bits of REG0 (see Table 7).
In the AWB Y mode the lower 4 bits of REG0 are contrast
peak data in one field and the 4th bit is the overflow
information of the AF (see Table 7).

Microprocessor interface

8-bit data bus and 3 control ports are prepared (WRB,
RDB and ASTB) for microprocessor interface in A2CF for
quick data access instead of serial bus. A2CF has 11 read
commands and 13 write commands.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. Equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltage

0.5

+5.0

tot

total power dissipation

input voltage

0.5

+ 0.5

output voltage

0.5

+ 0.5

stg

storage temperature

+150

amb

operating ambient temperature

+70

electrostatic handling; note 1

2000

+2000

LTCH

latch-up protection

100

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

DC CHARACTERISTICS

amb

20 to +70

C; V

= 2.7 to 3.3 V; unless otherwise specified.

Note

1. 510H PAL; V

= 3 V; all modes active.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply current

note 1

Input pins (TSTIN1 to TSTIN3, TST1, UV_SEL, UV0 to UV7, Y3 to Y7, WCLIP, RSTB, RDB, WRB, ASTB, VD, HD,
HSYNC, CLK1, CDS0 to CDS7, SCAN_T and AMSAL)

HIGH level input voltage

0.7V

LOW level input voltage

0.3V

HIGH level input current

= V

LOW level input current

= V

Output pins (WDINT and TSTOUT1 to TSTOUT7; push pull output)

HIGH level output voltage

0.1

4 mA

0.5

LOW level output voltage

= +20

0.1

= +4 mA

0.5

Output pins (WDMNT, LWDB and CLK2OUT; open-drain)

LOW level output voltage

= +20

0.1

= +4 mA

0.5

3-state leakage current

= V

Bidirectional pins (IO0 to IO7)

HIGH level output voltage

0.1

8 mA

0.5

LOW level output voltage

= +20

0.1

= +8 mA

0.5

HIGH level input voltage

0.7V

LOW level input voltage

0.3V

HIGH level input current

= V

LOW level input current

= V

3-state leakage current

= V

or V

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

AC CHARACTERISTICS

Microprocessor interface
T

amb

20 to +70

C; V

= 2.7 to 3.3 V; V

= 0 V; V

= V

; V

ref

= 0.5V

; input t

and t

= 30 ns; see Fig.5; unless

otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

suAD

address setup time

0.4

hAD

address hold time

0.4

ASTB to RDB time

0.5

W R

RDB width

1.0

RRD

RDB to read data

= 1 k

0.8

hRRD

RDB to read data hold time

= 1 k

0.1

ASTB to WRB time

0.5

W W

WRB width

1.0

suW

WRB setup time

0.4

WRB hold time

0.4

Fig.5 Microprocessor interface timing.

handbook, full pagewidth

MHA292

tsuW

thW

50%

10%

90%

10%

90%

50%

tW W

tAR

tRRD

thRRD

thAD

tsuAD

tW R

tAW

read data

address

IO7 to IO0

ASTB

RDB

WRB

write data

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

Data input/output timing (CLK1)
T

amb

20 to +70

C; V

= 2.7 to 3.3 V; V

= 0 V; V

= V

; V

ref

= 0.5V

; t

and t

= 6 ns; output load

capacitance = 20 pF; unless otherwise specified.

Notes

1. Data inputs: UV0 to UV7, Y3 to Y7, AD0 to AD7, UV_SEL, HSYNC, HD, VD and WCLIP.

2. Data outputs: WDINT, CLK2OUT, WDMNT and LWDB (open-drain outputs with 1 k

output load resistor).

3. T

amb

= 25

C; V

= 3.0 V.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

suDI

data input setup time

note 1

hDI

data input hold time

note 1

dDO

data output delay time

notes 2 and 3

hDO

data output hold time

notes 2 and 3

W CLK1

width of CLK1

Fig.6 Data input/output timing (CLK1).

(1) 50% for open-drain outputs.

handbook, full pagewidth

MHA291

90%

CLK1

data inputs

data outputs

Vref

10%

90%

10%

90%

10%

90%

10%

90%

10%

90%

VIH

VIL

VIH

VIL

VIH

VIL

10%

tW CLK1

thDI

tdDO

tsuDI

(1)

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

MICROPROCESSOR COMMANDS

Table 1

Write commands; note 1

Notes

1. X = don't care.

2. For auto exposure processing different windows in the active video field are taken with different weighting factors.

The coordinates of the five windows are set according to Fig.7. The resolution is 1 bit

16 pixel in x-direction and

1 bit

8 lines in y-direction.

COMMAND

DATA

FUNCTION

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

81H

(2)

X1[5]

X1[4]

X1[3]

X1[2]

X1[1]

X1[0]

X1 address

82H

(2)

X2[5]

X2[4]

X2[3]

X2[2]

X2[1]

X2[0]

X2 address

83H

(2)

X3[5]

X3[4]

X3[3]

X3[2]

X3[1]

X3[0]

X3 address

84H

(2)

X4[5]

X4[4]

X4[3]

X4[2]

X4[1]

X4[0]

X4 address

85H

(2)

Y1[5]

Y1[4]

Y1[3]

Y1[2]

Y1[1]

Y1[0]

Y1 address

86H

(2)

Y2[5]

Y2[4]

Y2[3]

Y2[2]

Y2[1]

Y2[0]

Y2 address

87H

(2)

Y3[5]

Y3[4]

Y3[3]

Y3[2]

Y3[1]

Y3[0]

Y3 address

88H

(2)

Y4[5]

Y4[4]

Y4[3]

Y4[2]

Y4[1]

Y4[0]

Y4 address

8BH

TEST2

TEST1

TEST0

IIRC2

IIRC1

IIRC0

IIRC

8CH

THB[3]

THB[2]

THB[1]

THB[0]

THA[3]

THA[2]

THA[1]

THA[0]

TH1

8DH

THC[3]

THC[2]

THC[1]

THC[0]

TH2

8EH

SFTY

SFT1

SFT0

HON

MODE2

MODE1

MODE0

MODE

8FH

SIZE

MWD1

MWD0

PHS

PHD

PVD

SET

Fig.7

Window size control for AE processing
(see WRITE command 81H to 88H).

handbook, halfpage

active video

WIN1

WIN3

WIN2

X3/Y3

0/0

X1/Y1

X2/Y2

X4/Y4

MHA289

WIN4

WIN5

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

Address 8EH

By applying address 8EH and setting the MODE bits it is possible to read the values that are stored in the registers
corresponding to the selected mode. The selection which register will be read is then defined by READ address
70H to 7BH (see Tables 6 and 7).

Table 4

MODE and shift definition (see WRITE command 8EH); note 1

Note

1. X = don't care.

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

MODE

FUNCTION

SFTY SFT1

SFT0

HON

MODE MODE MODE

set mode: read AE values

set mode: read AF values

AWB (B

Y) set mode: read AWB (B

Y) values

AWB (R

Y) set mode: read AWB (R

Y) values

AWB

set mode: read AWB

values

AWB Y

set mode: read AWB Y values

H dec

decimation for 1H off

H dec

decimation for 1H on

AF shift

select CDS5 to CDS0 for AF
processing

AF shift

select CDS6 to CDS1 for AF
processing

AF shift

select CDS7 to CDS2 for AF
processing

AE shift

take AE[5] to AE[0] for internal AE
processing (see Chapter
"Functional description")

AE shift

take AE[5] to AE[1] for internal AE
processing (see Chapter
"Functional description")

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

Address 8FH

To apply several types of CCDs it is possible to set polarity VD, HD and HSYNC by PVD, PHD and PHS.

The modes set by MWD and SIZE bit are only used for system evaluation. During normal application mode they can have
any value.

Table 5

Settings (see WRITE command 8FH); note 1

Note

1. X = don't care.

READ commands

The values of the internal registers can be read as follows:

1. Set mode AF, AE or AWB by WRITE command 8EH according to Table 4.

2. Select register by READ command 70H to 7BH according to Table 6.

Table 6

Read command

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

MODE

FUNCTION

SIZE

MWD1

MWD0

PHS

PHD

PVD

PVD

VD `H' active

PVD

VD `L' active

PHD

HD `H' active

PHD

HD `L' active

PHSYNC

HSYNC `H' active

PHSYNC

HSYNC `L' active

MWD AE

monitor AE window

MWD AF

monitor AF window

MWD AWB

monitor AWB window

MWD ALL

monitor all windows

MWD SMALL

monitor small window

MWD LARGE

monitor large window

COMMAND

DATA

FUNCTION

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

70H

O[15]

O[14]

O[13]

O[12]

O[11]

O[10]

O[9]

O[8]

REG1

71H

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

72H

O[15]

O[14]

O[13]

O[12]

O[11]

O[10]

O[9]

O[8]

REG2

73H

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

74H

O[15]

O[14]

O[13]

O[12]

O[11]

O[10]

O[9]

O[8]

REG3

75H

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

76H

O[15]

O[14]

O[13]

O[12]

O[11]

O[10]

O[9]

O[8]

REG4

77H

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

78H

O[15]

O[14]

O[13]

O[12]

O[11]

O[10]

O[9]

O[8]

REG5

79H

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

7BH

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

O[1]

O[0]

REG0

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

Register assignment

For the different modes (AF, AE and AWB) the contents of the registers are assigned according to Table 7.

Table 7

MODE

REGISTER

DATA

FUNCTION

REG0 (8-bit)

O[7] to O[5]

n.a.

O[4]

overflow information of AF block

O[3] to O[0]

contrast peak within one field

REG1 (18-bit)

O[15] to O[0] n.a.

REG2 (18-bit)

O[15] to O[0] accumulated data in the large window

REG3 (18-bit)

O[15] to O[0] accumulated data in the centre window

REG4 (18-bit)

O[15] to O[0] accumulated data of the large window minus the data of the centre

window

REG5 (18-bit)

O[15] to O[0] n.a.

REG0 (8-bit)

O[7] to O[5]

18-bit adder overflow information

O[4] to O[0]

white-clip counter output

REG1 (18-bit)

O[15] to O[0] accumulated data in WIN1; REG1[18] to REG1[3]

REG2 (18-bit)

O[15] to O[0] accumulated data in WIN2; REG2[18] to REG2[3]

REG3 (18-bit)

O[15] to O[0] accumulated data in WIN3; REG3[18] to REG3[3]

REG4 (18-bit)

O[15] to O[0] accumulated data in WIN4; REG4[18] to REG4[3]

REG5 (18-bit)

O[15] to O[0] accumulated data in WIN5; REG5[18] to REG5[3]

AWB (B

Y) REG0 (8-bit)

O[7] to O[5]

n.a.

O[4] to O[0]

white-clip or AWB limiter count

REG1 (18-bit)

O[15] to O[0] accumulated B

Y data of 1st quadrant; REG1[18] to REG1[3]

REG2 (18-bit)

O[15] to O[0] accumulated B

Y data of 2nd quadrant; REG2[18] to REG2[3]

REG3 (18-bit)

O[15] to O[0] accumulated B

Y data of 3rd quadrant; REG3[18] to REG3[3]

REG4 (18-bit)

O[15] to O[0] accumulated B

Y data of 4th quadrant; REG4[18] to REG4[3]

REG5 (18-bit)

O[15] to O[0] n.a.

AWB (R

Y) REG0 (8-bit)

O[7] to O[5]

n.a.

O[4] to O[0]

white-clip or AWB limiter count

REG1 (18-bit)

O[15] to O[0] accumulated R

Y data of 1st quadrant; REG1[18] to REG1[3]

REG2 (18-bit)

O[15] to O[0] accumulated R

Y data of 2nd quadrant; REG2[18] to REG2[3]

REG3 (18-bit)

O[15] to O[0] accumulated R

Y data of 3rd quadrant; REG3[18] to REG3[3]

REG4 (18-bit)

O[15] to O[0] accumulated R

Y data of 4th quadrant; REG4[18] to REG4[3]

REG5 (18-bit)

O[15] to O[0] n.a.

AWB (

)

REG0 (8-bit)

O[7] to O[5]

n.a.

O[4] to O[0]

white-clip or AWB limiter count

REG1 (18-bit)

O[15] to O[0] accumulated

Y) data of WIN1 to WIN5; REG1[18] to REG1[3]

REG2 (18-bit)

O[15] to O[0] accumulated

Y) data of WIN1 to WIN5; REG2[18] to REG2[3]

REG3 (18-bit)

O[15] to O[0] accumulated

Y) data of WIN3; REG3[18] to REG3[3]

REG4 (18-bit)

O[15] to O[0] accumulated

Y) data of WIN3; REG4[18] to REG4[3]

REG5 (18-bit)

O[15] to O[0] n.a.

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The footprint must be at an angle of 45

to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1996 Oct 10

Philips Semiconductors

Product specification

Advanced Auto Control Function (A2CF)

SAA9740H

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA52

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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Printed in The Netherlands

537021/1200/02/pp24

Date of release: 1996 Oct 10

Document order number:

9397 750 01158

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA9740H

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SAA9740H