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Электронный компонент: SMABZG01

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Product specification
1999 Dec 23
DISCRETE SEMICONDUCTORS
SMA BZG01 series
Voltage regulator diodes
1999 Dec 23
2
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
FEATURES
Glass passivated
High maximum operating
temperature
Ideal for surface mount automotive
applications
Low leakage current
Excellent stability
UL 94V-O classified plastic
package
Zener working voltage range:
10 to 270 V for 35 types
Supplied in 12 mm embossed tape
and reel, 1500 and 7500 pieces
Marking: cathode, date code,
type name
Easy pick and place.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic. The small rectangular
package has two J bent leads.
Fig.1 Simplified outline (DO-214AC) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
P
tot
total power dissipation
T
tp
= 100
C; see Fig.2
-
2.50
W
P
tot
total power dissipation
T
amb
= 25
C; see Fig.2; device
mounted on an Al
2
O
3
PCB (see Fig.5)
-
1.50
W
P
ZSM
non-repetitive peak reverse power
dissipation
t
p
= 100
s; square pulse;
T
j
= 25
C prior to surge; see Fig.3
-
150
W
T
stg
storage temperature
-
65
+175
C
T
j
junction temperature
-
65
+175
C
1999 Dec 23
3
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
ELECTRICAL CHARACTERISTICS
Total series
T
j
= 25
C unless otherwise specified.
Per type
T
j
= 25
C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
V
F
forward voltage
I
F
= 0.1 A; see Fig.4
1.2
V
TYPE
No.
SUFFIX
(1)
WORKING VOLTAGE
DIFFERENTIAL
RESISTANCE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
REVERSE CURRENT
at REVERSE VOLTAGE
V
Z
(V) at I
Z
r
dif
(
) at I
Z
S
Z
(%/K) at I
Z
I
Z
(mA)
I
R
(
A)
V
R
(V)
MIN.
NOM.
MAX.
TYP.
MAX.
MIN.
MAX.
MAX.
C10
9.4
10
10.6
2
7
0.05
0.09
25
10
7.5
C11
10.4
11
11.6
3
8
0.05
0.10
20
4
8.2
C12
11.4
12
12.7
3
9
0.05
0.10
20
3
9.1
C13
12.4
13
14.1
3
10
0.05
0.10
20
2
10
C15
13.8
15
15.6
5
15
0.05
0.10
15
1
11
C16
15.3
16
17.1
5
15
0.06
0.11
15
1
12
C18
16.8
18
19.1
7
20
0.06
0.11
15
1
13
C20
18.8
20
21.2
8
24
0.06
0.11
10
1
15
C22
20.8
22
23.3
8
25
0.06
0.11
10
1
16
C24
22.8
24
25.6
8
25
0.06
0.11
10
1
18
C27
25.1
27
28.9
10
30
0.06
0.11
8
1
20
C30
28
30
32
10
30
0.06
0.11
8
1
22
C33
31
33
35
12
35
0.06
0.11
8
1
24
C36
34
36
38
13
40
0.06
0.11
8
1
27
C39
37
39
41
17
50
0.06
0.11
6
1
30
C43
40
43
46
17
50
0.07
0.12
6
1
33
C47
44
47
50
30
90
0.07
0.12
4
1
36
C51
48
51
54
40
115
0.07
0.12
4
1
39
C56
52
56
60
40
120
0.07
0.12
4
1
43
C62
58
62
66
40
125
0.08
0.13
4
1
47
C68
64
68
72
40
130
0.08
0.13
4
1
51
C75
70
75
79
40
135
0.08
0.13
4
1
56
C82
77
82
87
70
200
0.08
0.13
2.7
1
62
C91
85
91
96
80
250
0.09
0.13
2.7
1
68
C100
94
100
106
120
350
0.09
0.13
2.7
1
75
C110
104
110
116
150
450
0.09
0.13
2.7
1
82
1999 Dec 23
4
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
Note
1. To complete the type number the suffix is added to the basic type number, e.g. BZG01-C130.
THERMAL CHARACTERISTICS
Notes
1. Device mounted on an Al
2
O
3
printed-circuit board, 0.7 mm thick; thickness of Cu-layer
35
m, see Fig.5.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
40
m, see Fig.5.
For more information please refer to the `General Part of associated Handbook'.
C120
114
120
127
200
550
0.09
0.13
2
1
91
C130
124
130
141
250
700
0.09
0.13
2
1
100
C150
138
150
156
300
1000
0.09
0.13
2
1
110
C160
153
160
171
350
1100
0.09
0.13
1.5
1
120
C180
168
180
191
400
1200
0.09
0.13
1.5
1
130
C200
188
200
212
500
1500
0.09
0.13
1.5
1
150
C220
208
220
233
700
2250
0.09
0.13
1
1
160
C240
228
240
256
800
2550
0.09
0.13
1
1
180
C270
251
270
289
1000
3000
0.09
0.13
1
1
200
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-tp
thermal resistance from junction to tie-point
30
K/W
R
th j-a
thermal resistance from junction to ambient
note 1
100
K/W
note 2
150
K/W
TYPE
No.
SUFFIX
(1)
WORKING VOLTAGE
DIFFERENTIAL
RESISTANCE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
REVERSE CURRENT
at REVERSE VOLTAGE
V
Z
(V) at I
Z
r
dif
(
) at I
Z
S
Z
(%/K) at I
Z
I
Z
(mA)
I
R
(
A)
V
R
(V)
MIN.
NOM.
MAX.
TYP.
MAX.
MIN.
MAX.
MAX.
1999 Dec 23
5
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
GRAPHICAL DATA
Solid line: tie-point temperature.
Dotted line: ambient temperature; device mounted on an Al
2
O
3
PCB
as shown in Fig.5.
Fig.2
Maximum total power dissipation as a
function of temperature.
T
j
= 25
C prior to surge.
Fig.3
Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
T
j
= 25
C.
Fig.4
Forward current as a function of forward
voltage; typical values.
Dimensions in mm.
Fig.5 Printed-circuit board for surface mounting.
1999 Dec 23
6
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
PACKAGE OUTLINE
1999 Dec 23
7
Philips Semiconductors
Product specification
Voltage regulator diodes
SMA BZG01 series
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.