PDF: 1999 Apr 16
Philips Semiconductors
Package outline
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT263
5-lead TO-220
D
D1
q
P
L
1
5
L1
mounting
base
L2
L3
m
e
Q
b
0
5
10 mm
scale
Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220
SOT263
DIMENSIONS (mm are the original dimensions)
A
E
A1
c
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
3. Terminals in this zone are not tinned.
w
M
UNIT
A1
D1
e
P
mm
1.7
q
Q
A
b
D
c
L2
(2)
0.5
L3
(3)
max.
3.5
3.8
3.6
m
0.8
0.6
15.0
13.5
2.4
1.6
3.0
2.7
2.6
2.2
w
0.4
0.7
0.4
15.8
15.2
0.9
0.7
4.5
4.1
1.39
1.27
6.4
5.9
10.3
9.7
L1
(1)
E
L
97-06-11
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