PDF: 1999 Apr 16
Philips Semiconductors
Package outline
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
Z
(1)
e
H
E
L
L
p
Q
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
2.25
12.3
11.8
1.15
1.05
0.6
0.3
7
0
o
o
0.1
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1
92-11-17
95-01-24
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004
0.096
0.089
0.017
0.012
0.0087
0.0055
0.61
0.60
0.30
0.29
0.03
0.089
0.48
0.46
0.045
0.041
0.024
0.012
0.004
0.2
0.008
0.004
0.067
0.059
0.010
0
5
10 mm
scale
VSO40: plastic very small outline package; 40 leads
SOT158-1
A
max.
2.70
0.11
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