PDF: 2003 Apr 07
Philips Semiconductors
Package outline
UNIT
A1
A2
A3
bp
c
D
(1)
E
(2)
Z
(1)
Dh
e
L
Lp
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
Eh
HE
3.1
2.9
4.5
4.3
0.65
6.6
6.2
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT527-1
03-02-18
03-04-07
w
M
bp
D
Dh
Eh
Z
exposed die pad side
e
0.25
1
10
20
11
A
A
1
A
2
L
p
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads;
body width 4.4 mm; exposed die pad
SOT527-1
A
max.
1.1
pin 1 index
PDF 
ZIP