PDF: 2002 Oct 23
Philips Semiconductors
Package outline
0.5
1
A1
Eh
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
Dh
5.35
5.05
y1
5.35
5.05
e1
6.5
e2
6.5
0.30
0.18
0.05
0.00
8.1
7.9
8.1
7.9
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT684-2
MO-220
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT684-2
HVQFN56: plastic thermal enhanced very thin quad flat package; no leads;
56 terminals; body 8 x 8 x 0.85 mm
A
(1)
max.
A
A1
c
detail X
y
y1 C
e
L
Eh
Dh
e
e1
b
15
28
56
43
42
29
14
1
X
D
E
C
B
A
e2
02-04-24
02-10-22
terminal 1
index area
terminal 1
index area
1/2
e
1/2
e
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
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