2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

FEATURES

Requires very few external components

Flexibility in use: mono Bridge-Tied Load (BTL) and
stereo Single-Ended (SE); it should be noted that in
stereo applications the outputs of both amplifiers are in
opposite phase

High output power

Low offset voltage at output (important for BTL)

Fixed gain

Good ripple rejection

Mode select switch (operating, mute and standby)

AC and DC short-circuit safe to ground and V

Electrostatic discharge protection

Thermal protection

Reverse polarity safe

Capable of handling high energy on outputs (V

= 0 V)

No switch-on/switch-off plop

Low thermal resistance.

GENERAL DESCRIPTION

The TDA1517ATW is an integrated class-AB output
amplifier contained in a plastic heatsink thin shrink small
outline package (HTSSOP20). The device is primarily
developed for multimedia applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

ORM

repetitive peak output current

2.5

q(tot)

total quiescent current

stb

standby current

0.1

100

SE application

output power

THD = 10%; R

= 4

SVRR

supply voltage ripple rejection

= 0

channel separation

= 10 k

n(o)

noise output voltage

= 0

input impedance

BTL application

output power

THD = 10%; R

= 8

SVRR

supply voltage ripple rejection

= 0

output offset voltage

150

n(o)(offset)

noise output offset voltage

= 0

input impedance

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA1517ATW

HTSSOP20

plastic, heatsink thin shrink small outline package; 20 leads; body
width 4.4 mm

SOT527-1

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

PINNING

SYMBOL

PIN

DESCRIPTION

n.c.

not connected

n.c.

not connected

IN1+

non-inverting input 1

SGND

signal ground

SVRR

supply voltage ripple rejection

n.c.

not connected

n.c.

not connected

OUT1a

output 1a

OUT1b

output 1b

PGND1

power ground 1

PGND2

power ground 2

OUT2a

output 2a

OUT2b

output 2b

n.c.

not connected

supply voltage 1

supply voltage 2

MODE

mode select switch

IN2

inverting input 2

n.c.

not connected

n.c.

not connected

handbook, halfpage

TDA1517ATW

MGU302

n.c.

IN1

SGND

SVRR

n.c.

OUT1a

OUT1b

PGND1

n.c.

IN2

MODE

VP2

VP1

n.c.

OUT2b

OUT2a

PGND2

Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION

The TDA1517ATW contains two identical amplifiers with differential input stages. This device can be used for
Bridge-Tied Load (BTL) or Single-Ended (SE) applications. The gain of each amplifier is fixed at 20 dB. A special feature
of this device is the mode select switch. Since this pin has a very low input current (<40

A), a low cost supply switch

can be used. With this switch the TDA1517ATW can be switched into three modes:

Standby: low supply current

Mute: input signal suppressed

Operating: normal on condition.

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL CHARACTERISTICS

DC CHARACTERISTICS
V

= 12 V; T

amb

= 25

C; measured in Fig.3; unless otherwise specified.

Note

1. The circuit is DC adjusted at V

= 6 to 18 V and AC operating at V

= 8.5 to 18 V.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT.

supply voltage

PSC

AC and DC short-circuit-safe voltage

reverse polarity voltage

ERG

energy handling capability at outputs

= 0 V

200

OSM

non-repetitive peak output current

ORM

repetitive peak output current

2.5

tot

total power dissipation

virtual junction temperature

150

stg

storage temperature

+150

amb

ambient temperature

+85

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

tbf

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

note 1

6.0

quiescent current

Operating condition

MODE(oper)

mode switch voltage level

8.5

MODE(oper)

mode switch current

MODE

= 12 V

DC output voltage

5.7

DC output offset voltage

150

Mute condition

MODE(mute)

mode switch voltage level

3.3

6.4

DC output voltage

5.7

DC output offset voltage

150

Standby condition

MODE(stb)

mode switch voltage level

stb

standby current

0.1

100

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

AC CHARACTERISTICS
V

= 12 V; f = 1 kHz; T

amb

= 25

C; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

SE application; note 1

output power

note 2

THD = 1%

2.5

3.3

THD = 10%

THD

total harmonic distortion

= 1 W

0.1

ro(L)

low frequency roll-off

1 dB; note 3

ro(H)

high frequency roll off

1 dB

kHz

voltage gain

channel balance

SVRR

supply voltage ripple rejection

note 4

mute

standby

input impedance

n(o)(rms)

noise output voltage (RMS value)

note 5

on; R

= 0

on; R

= 10 k

100

mute; note 6

channel separation

= 10 k

o(mote)

output voltage in mute

note 7

BTL application; note 8

output power

note 2

THD = 1%

6.6

THD = 10%

6.5

8.0

THD

total harmonic distortion

= 1 W

0.03

ro(L)

low frequency roll-off

1 dB; note 3

ro(H)

high frequency roll off

1 dB

kHz

voltage gain

SVRR

supply voltage ripple rejection

note 4

mute

standby

input impedance

n(o)(rms)

noise output voltage (RMS value)

note 5

on; R

= 0

on; R

= 10 k

100

200

mute; note 6

o(mute)

output voltage in mute

note 7

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

handbook, full pagewidth

MGU305

OUT

PGND

SGND

100

1000

RL
4

VCC

TDA1517ATW

15 k

10 k

8.2
k

15 k

100

1000

RL
4

1000

IN1

MODE

220 nF

60 k

IN2

220 nF

VCC

STANDBY/

MUTE LOGIC

MICRO-

CONTROLLER

0
0
1

On
Mute
Standby

0
1
0

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

input

reference

voltage

60 k

Fig.4 SE application block diagram.

Test conditions

amb

= 25

C; unless otherwise specified: V

= 12 V, BTL

application, f = 1 kHz, R

= 8

, fixed gain = 26 dB, audio

band-pass: 22 Hz to 22 kHz. In the figures as a function of
frequency a band-pass of 10 Hz to 80 kHz was applied.

The BTL application block diagram is shown in Fig.3. The
PCB layout [which accommodates both the mono (BTL)
and stereo (single-ended) application] is shown in Fig.6.

Printed-Circuit Board (PCB) layout and grounding

For high system performance levels certain grounding
techniques are imperative. The input reference grounds
have to be tied to their respective source grounds and
must have separate traces from the power ground traces;
this will separate the large (output) signal currents from
interfering with the small AC input signals. The small
signal ground traces should be located physically as far as
possible from the power ground traces. Supply and output
traces should be as wide as possible for delivering
maximum output power.

Proper supply bypassing is critical for low noise
performance and high power supply rejection. The
respective capacitor locations should be as close as
possible to the device and grounded to the power ground.
Decoupling the power supply also prevents unwanted
oscillations. For suppressing higher frequency transients
(spikes) on the supply line a capacitor with low ESR
(typical 0.1

F) has to be placed as close as possible to the

device. For suppressing lower frequency noise and ripple
signals, a large electrolytic capacitor (e.g. 1000

F or

greater) must be placed close to the IC.

In single-ended (stereo) application a bypass capacitor
connected to pin SVR reduces the noise and ripple on the
midrail voltage. For good THD and noise performance a
low ESR capacitor is recommended.

Input configuration

It should be noted that the DC level of the input pins is
approximately 2.1 V; a coupling capacitor is therefore
necessary.

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

The formula for the cut-off frequency at the input is as

follows:

thus

As can be seen it is not necessary to use high capacitor
values for the input; so the delay during switch-on, which
is necessary for charging the input capacitors, can be
minimized. This results in a good low frequency response
and good switch-on behaviour.

In stereo applications (single-ended) coupling capacitors
on both input and output are necessary. It should be noted
that the outputs of both amplifiers are in opposite phase.

Built-in protection circuits

The IC contains two types of protection circuits:

Short-circuits the outputs to ground, the supply to
ground and across the load: short-circuit is detected and
controlled by a SOAR protection circuit

Thermal shut-down protection: the junction temperature
is measured by a temperature sensor. Thermal foldback
is activated at a junction temperature of >150

Output power

The output power as a function of supply voltage has been
measured on the output pins and at THD = 10%. The
maximum output power is limited by the maximum
allowable power dissipation and the maximum available
output current, 2.5 A repetitive peak current.

Supply voltage ripple rejection

The SVRR has been measured without an electrolytic
capacitor on pin 5 and at a bandwidth of 10 Hz to 80 kHz.
The curves for operating and mute condition (respectively)
were measured with R

source

= 0

. Only in single-ended

applications is an electrolytic capacitor (e.g. 100

F) on

pin 5 necessary to improve the SVRR behaviour.

Headroom

A typical music CD requires at least 12 dB (is factor 15.85)
dynamic headroom (compared with the average power
output) for passing the loudest portions without distortion.
The following calculation can be made for this application
at V

= 12 V and R

= 8

: P

at THD = 0.1% is

approximately 5 W (see Fig.7).

Average listening level without any distortion yields:

The power dissipation can be derived from Fig.11 for 0 dB
and 12 dB headroom.

Table 1

Power rating

Thus for the average listening level (music power) a power
dissipation of 2.0 W can be used for the thermal PCB
calculation; see Section "Thermal behaviour (PCB design
considerations)".

Mode pin

For the 3 functional modes: standby, mute and operate,
the MODE pin can be driven by a 3-state logic output
stage, e.g. a microcontroller with some extra components
for DC-level shifting; see Fig.10 for the respective
DC levels.

Standby mode is activated by a low DC level between
0 and 2 V. The power consumption of the IC will be
reduced to <0.12 mW.

Mute mode is activated by a DC level between
3.3 and 6.4 V. The outputs of the amplifier will be muted
(no audio output); however the amplifier is DC biased
and the DC level of the output pins stays at half the
supply voltage. The input coupling capacitors are
charged when in mute mode to avoid pop-noise.

The IC will be in the operating condition when the
voltage at pin MODE is between 8.5 V and V

Switch-on/switch-off

To avoid audible plops during switch-on and switch-off of
the supply voltage, the MODE pin has to be set in standby
condition (V

level) before the voltage is applied

(switch-on) or removed (switch-off). The input and SVRR
capacitors are smoothly charged during mute mode.

The turn-on and turn-off time can be influenced by an
RC-circuit connected to the MODE pin. Switching the
device or the MODE pin rapidly on and off may cause `click
and pop' noise. This can be prevented by proper timing on
the MODE pin. Further improvement in the BTL application
can be obtained by connecting an electrolytic capacitor
(e.g. 100

F) between the SVRR pin and signal ground.

------------------------------

470

------------------------------------------------------------------------------

11 Hz

RATING

HEADROOM

POWER

DISSIPATION

= 5 W

(THD = 0.1%)

0 dB

3.5 W

12 dB

2.0 W

ALL

tot

factor

-----------------

15.85

---------------

315 mW

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

Thermal behaviour (PCB design considerations)

The typical thermal resistance [R

th(j-a)

] of the IC in the

HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35

m copper with

a minimum area of approximately 30 cm

. The actual

usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.

The bottom `heat-spreader' of the IC has to be soldered
efficiently on the `thermal land' of the copper area of the
printed-circuit board using the re-flow solder technique.

A number of thermal vias in the `thermal land' provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.

The thermal vias (0.3 mm

) in the `thermal land' should

not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.

For a maximum ambient temperature of 60

C the

following calculation can be made: for the application at
V

= 12 V and R

= 8

the (ALL-) music power

dissipation approximately 2.0 W;
T

j(max)

= T

amb

+ P

th(j-a)

= 60

C + 2.0

37 = 134

Note: the above calculation holds for application at
`average listening level' music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.

handbook, full pagewidth

K/W

number of 35

m copper layers

CU-LAYER 2-4

MGU306

ON-BOARD-COOLING

COPPER DESIGN

CU-LAYER 1

Rth(j-a)

Rth(j-p)

Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.

th(j-p)

curve is given for practical calculation purpose.

L = 30 mm plus vias

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 220

C for

thick/large packages, and below 235

C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, HBGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

2001 Apr 17

Philips Semiconductors

Product specification

8 W BTL or 2

4 W SE power amplifier

TDA1517ATW

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2001

Philips Semiconductors a worldwide company

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Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands

753503/02/pp

Date of release:

2001 Apr 17

Document order number:

9397 750 08264

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA1517A

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA1517A