Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINES
- PINNING
- FUNCTIONAL DESCRIPTION
- RATINGS
- THERMAL RESISTANCE
- HEATSINK DESIGN EXAMPLE
- CHARACTERISTICS
- APPLICATION INFORMATION
- PACKAGE OUTLINES
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
July 1994
2
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
GENERAL DESCRIPTION
The TDA1521/TDA1521Q is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package.
The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio).
Features
Requires very few external components
Input muted during power-on and off
(no switch-on or switch-off clicks)
Low offset voltage between output and ground
Excellent gain balance between channels
Hi-fi according to IEC 268 and DIN 45500
Short-circuit-proof
Thermally protected
QUICK REFERENCE DATA
PACKAGE OUTLINES
TDA1521: 9 leads in-line; plastic power (SOT131); SOT131-1; 1996 August 20.
TDA1521Q: 9 leads SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 August 20.
Stereo applications
Supply voltage range
V
P
7,5 to
21,0
V
Output power at THD = 0,5%,
V
P
=
16 V
P
O
typ.
12
W
Voltage gain
G
v
typ.
30
dB
Gain balance between channels
G
v
typ.
0,2
dB
Ripple rejection
SVRR
typ.
60
dB
Channel separation
typ.
70
dB
Noise output voltage
V
no(rms)
typ.
70
V
July 1994
3
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.1 Block diagram.
PINNING
1
-
INV1
non-inverting input 1
2
INV1
inverting input 1
3
GND
ground (symmetrical)
1
/
2
V
P
(asymmetrical)
4
OUT1
output 1
5
-
V
P
negative supply (symmetrical)
ground (asymmetrical)
6
OUT2
output 2
7
+V
P
positive supply
8
INV2
inverting input 2
9
-
INV2
non-inverting input 2
July 1994
4
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
FUNCTIONAL DESCRIPTION
This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and
asymmetrical power supply systems. An output power of 2
12 watts (THD = 0,5%) can be delivered into an 8
load
with a symmetrical power supply of
16 V.
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the
amplifiers (0,2 dB).
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.
Referring to Fig.13, the 100
F capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed
reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the
non-inverting inputs on pins 1 and 9.
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the
instantaneous temperature of the power transistors. Both protection circuits activate at 150
C allowing safe operation to
a maximum junction temperature of 150
C without added distortion.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Note
For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to V
P
= 28 V.
If the total internal resistance of the supply (R
i
) > 4
, the maximum unloaded supply voltage is increased to 32 V.
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
pin 7
V
P
= V
7-3
-
+21
V
pin 5
-
V
P
= V
5-3
-
-
21
V
Non-repetitive peak
output current
pins 4 and 6
I
OSM
-
4
A
Total power dissipation
see Fig.2
P
tot
Storage temperature range
T
stg
-
55
+150
C
Junction temperature
T
j
-
150
C
Short-circuit time:
see note
outputs short-circuited
to ground
symmetrical
(full signal drive)
power supply
t
sc
-
1
hour
asymmetrical
power supply;
V
P
< 32 V
(unloaded);
R
i
4
t
sc
-
1
hour
July 1994
5
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.2 Power derating curve.
THERMAL RESISTANCE
HEATSINK DESIGN EXAMPLE
With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows:
given R
L
= 8
and V
P
=
16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature
of 65
C, the required thermal resistance of the heatsink is
Note: The internal metal block (heatsink) has the same potential as pin 5 (
-
V
P
).
From junction to case
R
th j-c
= 2,5 K/W
R
th h
a
150
65
14 6
,
----------------------
2 5
3 3 K W
/
,
=
,
=
July 1994
6
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
CHARACTERISTICS
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
operating mode
V
P
7,5
16,0
21,0
V
input mute mode
V
P
2,0
-
5,8
V
Repetitive peak
output current
I
ORM
2,2
-
-
A
Operating mode: symmetrical power supply; test circuit as per Fig.12;
V
P
=
16 V; R
L
= 8
; T
amb
= 25
C; f = 1 kHz
Total quiescent current
without R
L
I
tot
18
40
70
mA
Output power
THD = 0,5%
P
O
10
12
-
W
THD = 10%
P
O
12
15
-
W
Total harmonic
distortion
P
O
= 6 W
THD
-
0,15
0,2
%
Power bandwidth
THD = 0,5%
note 1
B
20 to
20k
Hz
Voltage gain
G
V
29
30
31
dB
Gain balance
G
V
-
0,2
1,0
dB
Noise output voltage
(r.m.s, value);
unweighted (20 Hz to 20 kHz)
R
S
= 2 k
V
no(rms)
-
70
140
V
Input impedance
|Z
i
14
20
26
k
Ripple rejection
note 2
SVRR
40
60
-
dB
Channel separation
R
S
= 0
46
70
-
dB
Input bias current
I
ib
-
0,3
-
A
DC output offset
with respect
voltage
to ground
V
OFF
-
30
200
mV
Input mute mode: symmetrical power supply; test circuit as per Fig.12;
V
P
=
4V; R
L
= 8
; T
amb
= 25
C; f = 1 kHz
Total quiescent current
without R
L
I
tot
9
30
40
mA
Output voltage
V
i
= 600 mV
V
out
-
0,6
1,8
mV
Noise output voltage
(r.m.s. value);
unweighted (20 Hz to 20 kHz)
R
S
= 2 k
V
no(rms)
-
70
140
V
Ripple rejection
note 2
SVRR
35
55
-
dB
DC output offset
with respect
voltage
to ground
V
OFF
-
40
200
mV
July 1994
7
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Notes
1. Power bandwidth at P
o
max
-
3 dB.
2. Ripple rejection at R
S
= 0
, f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or
negative supply rail.
Operating mode: asymmetrical power supply; test circuit as per Fig.13;
V
S
= 24 V; R
L
= 8
; T
amb
= 25
C; f = 1 kHz
Total quiescent current
I
tot
18
40
70
mA
Output power
THD = 0,5%
P
o
5
6
-
W
THD = 10%
P
o
6,5
8
-
W
Total harmonic
distortion
P
O
= 4 W
THD
-
0,13
0,2
%
Power bandwidth
THD = 0,5%
40 to
note 1
B
20k
Hz
Voltage gain
G
V
29
30
31
dB
Gain balance
G
V
-
0,2
1
dB
Noise output voltage
(r.m.s. value);
unweighted (20 Hz to 20 kHz)
R
S
= 2 k
V
no(rms)
-
70
140
V
Input impedance
Z
i
14
20
26
k
Ripple rejection
SVRR
35
44
-
dB
Channel separation
R
S
= 0
-
45
-
dB
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
July 1994
8
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
APPLICATION INFORMATION
Input mute circuit
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1/2 supply
voltage (at pin 3) with an internally fixed reference voltage (V
ref
), derived directly from the supply voltage. When the
voltage at pin 3 is lower than V
ref
the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage
at pin 3 is determined by an internal voltage divider and the external 100
F capacitor.
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the
input terminal is disconnected, (as illustrated in Fig.3).
Fig.3 Input mute circuit; time delay.
July 1994
9
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.4
Output power as a function of supply
voltage; symmetrical supply;
R
L
= 8
; f = 1 kHz.
Fig.5
Distortion as a function of frequency;
symmetrical supply; V
P
=
16 V;
R
L
= 8
; P
o
= 6 W.
Fig.6
Supply voltage ripple rejection;
symmetrical supply; V
P
=
16 V;
V
RR
= 200 mV.
Fig.7
Power dissipation as a function of
output power; symmetrical supply;
V
P
=
16 V; R
L
= 8
; f = 1 kHz.
July 1994
10
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.8
Output power as a function of
supply voltage; asymmetrical
supply; R
L
= 8
; f = 1 kHz.
Fig.9
Distortion as a function of frequency;
asymmetrical supply; V
S
= 24 V;
R
L
= 8
; P
o
= 4 W.
Fig.10 Supply voltage ripple rejection;
asymmetrical supply; V
S
= 24 V;
V
RR
= 200 mV.
Fig.11 Output power as a function of
supply voltage; asymmetrical
supply; R
L
= 4
; f = 1 kHz.
July 1994
11
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
Fig.12 Test and application circuit; symmetrical power supply.
(1) To be connected as close as possible to the IC
Fig.13 Test and application circuit; asymmetrical power supply.
(1) To be connected as close as possible to the IC
July 1994
12
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
PACKAGE OUTLINES
UNIT
A
b
max.
b
p
2
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
j
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
4.6
4.2
1.1
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
2.54
12.2
11.8
3.4
3.1
A
max.
1
2.0
E
h
6
2.00
1.45
2.1
1.8
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
17.2
16.5
SOT131-2
92-11-17
95-03-11
0
5
10 mm
scale
Q
0.25
w
0.03
x
D
L
A
E
c
A 2
Q
w
M
b
p
d
D
Z
e
x
h
1
9
Eh
non-concave
seating plane
1
b
j
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
view B: mounting base side
B
July 1994
13
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
UNIT
A
A
e
1
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
5.08
12.2
11.8
2.54
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
0.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT157-2
0
5
10 mm
scale
v
2.1
1.8
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
L
3
Q
w
M
b
p
1
d
D
Z
e
e
x
h
1
9
j
Eh
non-concave
92-10-12
95-03-11
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
SOT157-2
B
view B: mounting base side
m
2
e
v
M
July 1994
14
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521
TDA1521Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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